KR20180083414A - 내부식성이 개선된 구조 접착제 - Google Patents
내부식성이 개선된 구조 접착제 Download PDFInfo
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- KR20180083414A KR20180083414A KR1020187017185A KR20187017185A KR20180083414A KR 20180083414 A KR20180083414 A KR 20180083414A KR 1020187017185 A KR1020187017185 A KR 1020187017185A KR 20187017185 A KR20187017185 A KR 20187017185A KR 20180083414 A KR20180083414 A KR 20180083414A
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- 239000012948 isocyanate Chemical group 0.000 description 1
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- 239000004761 kevlar Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
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- 150000004767 nitrides Chemical class 0.000 description 1
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- QQWAKSKPSOFJFF-UHFFFAOYSA-N oxiran-2-ylmethyl 2,2-dimethyloctanoate Chemical compound CCCCCCC(C)(C)C(=O)OCC1CO1 QQWAKSKPSOFJFF-UHFFFAOYSA-N 0.000 description 1
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- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/223—Di-epoxy compounds together with monoepoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/36—Epoxy compounds containing three or more epoxy groups together with mono-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
-
- C09J2201/622—
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2451/00—Presence of graft polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2471/00—Presence of polyether
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15195394.0 | 2015-11-19 | ||
| EP15195394.0A EP3170860B1 (en) | 2015-11-19 | 2015-11-19 | Structural adhesive with improved corrosion resistance |
| PCT/US2016/061761 WO2017087295A1 (en) | 2015-11-19 | 2016-11-14 | Structural adhesive with improved corrosion resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20180083414A true KR20180083414A (ko) | 2018-07-20 |
Family
ID=54704985
Family Applications (1)
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|---|---|---|---|
| KR1020187017185A Withdrawn KR20180083414A (ko) | 2015-11-19 | 2016-11-14 | 내부식성이 개선된 구조 접착제 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11377576B2 (enExample) |
| EP (1) | EP3170860B1 (enExample) |
| JP (1) | JP7010220B2 (enExample) |
| KR (1) | KR20180083414A (enExample) |
| CN (1) | CN108350335B (enExample) |
| BR (1) | BR112018010312A2 (enExample) |
| CA (1) | CA3005850A1 (enExample) |
| MX (1) | MX2018006037A (enExample) |
| WO (1) | WO2017087295A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210016190A (ko) * | 2019-08-01 | 2021-02-15 | 삼성전자주식회사 | Euv 마스크용 접착제, 이의 세정 방법 및 이를 이용한 euv 마스크의 재사용 방법 |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10721926B2 (en) * | 2017-01-10 | 2020-07-28 | Windage, Llc | Scrape vines |
| CN108822780B (zh) * | 2018-04-16 | 2021-06-01 | 杭州电子科技大学 | 一种半导体硅片切割用粘结材料 |
| EP3587526B1 (en) | 2018-06-29 | 2022-02-16 | 3M Innovative Properties Company | Both sides coated automotive paint compatible liner for structural adhesive film |
| EP3587527A1 (en) | 2018-06-30 | 2020-01-01 | 3M Innovative Properties Company | Full (per)fluoro polymer liner for adhesive tapes |
| US12202933B2 (en) | 2018-08-06 | 2025-01-21 | Zephyros, Inc. | High elastic modulus structural foam materials with improved strain to failure |
| EP3670626A1 (en) | 2018-12-17 | 2020-06-24 | 3M Innovative Properties Company | Thermosettable precursor of a structural adhesive composition with corrosion resistance |
| US10759697B1 (en) | 2019-06-11 | 2020-09-01 | MSB Global, Inc. | Curable formulations for structural and non-structural applications |
| US12060261B2 (en) * | 2019-11-06 | 2024-08-13 | Bvw Holding Ag | Extremal microstructured surfaces |
| CN110903798A (zh) * | 2019-12-23 | 2020-03-24 | 德华兔宝宝装饰新材股份有限公司 | 一种木材金属复合胶粘剂 |
| JP7493347B2 (ja) * | 2020-02-12 | 2024-05-31 | スリーエム イノベイティブ プロパティズ カンパニー | 熱膨張性、且つ熱硬化性の接着シート |
| EP3916065A1 (en) * | 2020-05-25 | 2021-12-01 | 3M Innovative Properties Company | Curable precursor of a structural adhesive composition |
| JP7395088B2 (ja) * | 2020-11-18 | 2023-12-11 | シーカ テクノロジー アクチェンゲゼルシャフト | ウレタン系接着剤組成物 |
| US20240301128A1 (en) * | 2021-06-24 | 2024-09-12 | Adeka Corporation | Epoxy resin composition |
| DE102024107753A1 (de) | 2024-03-19 | 2025-09-25 | Tesa Se | Reaktives Klebeband |
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| US4846905A (en) * | 1988-04-06 | 1989-07-11 | Minnesota Mining And Manufacturing Company | Acid catalyzed, toughened epoxy adhesives |
| CA2112410C (en) | 1991-06-26 | 2003-12-09 | Norman E. Blank | Reactive hot-melt adhesive |
| JPH05156226A (ja) | 1991-12-03 | 1993-06-22 | Ube Ind Ltd | 構造用接着剤組成物 |
| US6000118A (en) | 1998-10-30 | 1999-12-14 | Chrysler Corporation | Method of forming a sealed edge joint between two metal panels |
| WO2000074872A1 (fr) | 1999-06-09 | 2000-12-14 | Sanyo Machine Works, Ltd. | Structure de pli rabattu sur feuille metallique |
| US6368008B1 (en) | 2000-05-24 | 2002-04-09 | Daimlerchrysler Corporation | Sealed edge joint between two metal panels |
| EP1568749A1 (de) | 2004-02-25 | 2005-08-31 | Sika Technology AG | Zweikomponentiger Klebstoff zur Herstellung von Halbzeugen und Sandwich-Verbundwerkstoffen |
| DE102004050129A1 (de) | 2004-10-14 | 2006-04-20 | Wacker Chemie Ag | Siliconkautschuk Zusammensetzung enthaltend unbehandeltes Aluminiumhydroxid als Füllstoff |
| EP1746119A1 (en) | 2005-07-22 | 2007-01-24 | 3M Innovative Properties Company | Thermally curable precursor of a toughened thermo-expanded film and a film made thereof |
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| EP1916270A1 (de) | 2006-10-24 | 2008-04-30 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzung mit blockiertem Polyurethanprepolymer |
| EP1916285A1 (de) | 2006-10-24 | 2008-04-30 | Sika Technology AG | Derivatisiertes Epoxid-Festharz und dessen Verwendungen |
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| GB0806434D0 (en) | 2008-04-09 | 2008-05-14 | Zephyros Inc | Improvements in or relating to structural adhesives |
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| EP2468792A1 (en) | 2010-12-23 | 2012-06-27 | 3M Innovative Properties Company | Curable adhesive composition |
| GB201102672D0 (en) * | 2011-02-15 | 2011-03-30 | Zephyros Inc | Improved structural adhesives |
| EP2710049B2 (en) | 2011-05-19 | 2020-05-27 | Dow Global Technologies LLC | Structural adhesive and use thereof |
| GB201119287D0 (en) | 2011-11-08 | 2011-12-21 | Zephyros Inc | Improvements in or relating to structrual adhesives |
| US8895148B2 (en) | 2011-11-09 | 2014-11-25 | Cytec Technology Corp. | Structural adhesive and bonding application thereof |
| JP6105063B2 (ja) * | 2012-08-03 | 2017-03-29 | エルジー・ケム・リミテッド | 接着フィルム及びこれを利用した有機電子装置の封止製品 |
| ES2588362T3 (es) | 2012-08-23 | 2016-11-02 | 3M Innovative Properties Company | Película adhesiva estructural |
| EP2727664B1 (en) | 2012-11-05 | 2015-06-10 | 3M Innovative Properties Company | Method for making a hemmed structure of metal panels |
| BR112015010088A2 (pt) | 2012-11-05 | 2017-07-11 | 3M Innovative Properties Co | adesivo termofixo, componente automotivo que usa adesivo termofixo e método de fabricação do mesmo |
| US10577522B2 (en) | 2013-07-26 | 2020-03-03 | Zephyros, Inc. | Thermosetting adhesive films including a fibrous carrier |
| WO2015064561A1 (ja) * | 2013-10-29 | 2015-05-07 | 株式会社カネカ | 貯蔵安定性の改善されたポリマー微粒子含有硬化性樹脂組成物 |
| EP3170877B1 (en) | 2015-11-19 | 2020-11-18 | 3M Innovative Properties Company | Structural adhesive with improved failure mode |
-
2015
- 2015-11-19 EP EP15195394.0A patent/EP3170860B1/en not_active Revoked
-
2016
- 2016-11-14 WO PCT/US2016/061761 patent/WO2017087295A1/en not_active Ceased
- 2016-11-14 MX MX2018006037A patent/MX2018006037A/es unknown
- 2016-11-14 CA CA3005850A patent/CA3005850A1/en not_active Abandoned
- 2016-11-14 US US15/775,190 patent/US11377576B2/en active Active
- 2016-11-14 CN CN201680066963.9A patent/CN108350335B/zh active Active
- 2016-11-14 JP JP2018526101A patent/JP7010220B2/ja active Active
- 2016-11-14 BR BR112018010312-8A patent/BR112018010312A2/pt not_active Application Discontinuation
- 2016-11-14 KR KR1020187017185A patent/KR20180083414A/ko not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210016190A (ko) * | 2019-08-01 | 2021-02-15 | 삼성전자주식회사 | Euv 마스크용 접착제, 이의 세정 방법 및 이를 이용한 euv 마스크의 재사용 방법 |
| US12281243B2 (en) | 2019-08-01 | 2025-04-22 | Samsung Electronics Co., Ltd. | Method of removing an adhesive for an EUV mask and method of reusing an EUV mask |
Also Published As
| Publication number | Publication date |
|---|---|
| US20180282592A1 (en) | 2018-10-04 |
| JP7010220B2 (ja) | 2022-01-26 |
| CN108350335B (zh) | 2022-03-22 |
| US11377576B2 (en) | 2022-07-05 |
| CN108350335A (zh) | 2018-07-31 |
| EP3170860A1 (en) | 2017-05-24 |
| EP3170860B1 (en) | 2020-07-29 |
| WO2017087295A1 (en) | 2017-05-26 |
| JP2019504903A (ja) | 2019-02-21 |
| MX2018006037A (es) | 2018-08-01 |
| CA3005850A1 (en) | 2017-05-26 |
| BR112018010312A2 (pt) | 2018-12-04 |
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| PA0105 | International application |
Patent event date: 20180618 Patent event code: PA01051R01D Comment text: International Patent Application |
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| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination |