CN108350335B - 具有改善的耐腐蚀性的结构粘合剂 - Google Patents
具有改善的耐腐蚀性的结构粘合剂 Download PDFInfo
- Publication number
- CN108350335B CN108350335B CN201680066963.9A CN201680066963A CN108350335B CN 108350335 B CN108350335 B CN 108350335B CN 201680066963 A CN201680066963 A CN 201680066963A CN 108350335 B CN108350335 B CN 108350335B
- Authority
- CN
- China
- Prior art keywords
- structural adhesive
- component
- metal
- thermosetting
- adhesive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/223—Di-epoxy compounds together with monoepoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/36—Epoxy compounds containing three or more epoxy groups together with mono-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2451/00—Presence of graft polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2471/00—Presence of polyether
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15195394.0A EP3170860B1 (en) | 2015-11-19 | 2015-11-19 | Structural adhesive with improved corrosion resistance |
| EP15195394.0 | 2015-11-19 | ||
| PCT/US2016/061761 WO2017087295A1 (en) | 2015-11-19 | 2016-11-14 | Structural adhesive with improved corrosion resistance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108350335A CN108350335A (zh) | 2018-07-31 |
| CN108350335B true CN108350335B (zh) | 2022-03-22 |
Family
ID=54704985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680066963.9A Active CN108350335B (zh) | 2015-11-19 | 2016-11-14 | 具有改善的耐腐蚀性的结构粘合剂 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11377576B2 (enExample) |
| EP (1) | EP3170860B1 (enExample) |
| JP (1) | JP7010220B2 (enExample) |
| KR (1) | KR20180083414A (enExample) |
| CN (1) | CN108350335B (enExample) |
| BR (1) | BR112018010312A2 (enExample) |
| CA (1) | CA3005850A1 (enExample) |
| MX (1) | MX2018006037A (enExample) |
| WO (1) | WO2017087295A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10721926B2 (en) * | 2017-01-10 | 2020-07-28 | Windage, Llc | Scrape vines |
| CN108822780B (zh) * | 2018-04-16 | 2021-06-01 | 杭州电子科技大学 | 一种半导体硅片切割用粘结材料 |
| EP3587526B1 (en) | 2018-06-29 | 2022-02-16 | 3M Innovative Properties Company | Both sides coated automotive paint compatible liner for structural adhesive film |
| EP3587527A1 (en) | 2018-06-30 | 2020-01-01 | 3M Innovative Properties Company | Full (per)fluoro polymer liner for adhesive tapes |
| JP2021534266A (ja) | 2018-08-06 | 2021-12-09 | ゼフィロス インコーポレイテッド | 改善された破壊ひずみを有する高弾性率構造発泡体材料 |
| EP3670626A1 (en) | 2018-12-17 | 2020-06-24 | 3M Innovative Properties Company | Thermosettable precursor of a structural adhesive composition with corrosion resistance |
| US10759697B1 (en) | 2019-06-11 | 2020-09-01 | MSB Global, Inc. | Curable formulations for structural and non-structural applications |
| KR102718837B1 (ko) | 2019-08-01 | 2024-10-18 | 삼성전자주식회사 | Euv 마스크용 접착제, 이의 세정 방법 및 이를 이용한 euv 마스크의 재사용 방법 |
| US12060261B2 (en) * | 2019-11-06 | 2024-08-13 | Bvw Holding Ag | Extremal microstructured surfaces |
| CN110903798A (zh) * | 2019-12-23 | 2020-03-24 | 德华兔宝宝装饰新材股份有限公司 | 一种木材金属复合胶粘剂 |
| JP7493347B2 (ja) * | 2020-02-12 | 2024-05-31 | スリーエム イノベイティブ プロパティズ カンパニー | 熱膨張性、且つ熱硬化性の接着シート |
| EP3916065A1 (en) * | 2020-05-25 | 2021-12-01 | 3M Innovative Properties Company | Curable precursor of a structural adhesive composition |
| JP7395088B2 (ja) * | 2020-11-18 | 2023-12-11 | シーカ テクノロジー アクチェンゲゼルシャフト | ウレタン系接着剤組成物 |
| EP4361193A4 (en) * | 2021-06-24 | 2025-05-21 | Adeka Corporation | EPOXY RESIN COMPOSITION |
| DE102024107753A1 (de) | 2024-03-19 | 2025-09-25 | Tesa Se | Reaktives Klebeband |
Family Cites Families (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4846905A (en) | 1988-04-06 | 1989-07-11 | Minnesota Mining And Manufacturing Company | Acid catalyzed, toughened epoxy adhesives |
| EP0591307B1 (de) | 1991-06-26 | 1996-09-18 | Henkel Teroson GmbH | Reaktiver schmelzklebstoff |
| JPH05156226A (ja) * | 1991-12-03 | 1993-06-22 | Ube Ind Ltd | 構造用接着剤組成物 |
| US6000118A (en) | 1998-10-30 | 1999-12-14 | Chrysler Corporation | Method of forming a sealed edge joint between two metal panels |
| JP4536974B2 (ja) | 1999-06-09 | 2010-09-01 | 三洋機工株式会社 | 金属板材のヘミング構造 |
| US6368008B1 (en) | 2000-05-24 | 2002-04-09 | Daimlerchrysler Corporation | Sealed edge joint between two metal panels |
| EP1568749A1 (de) | 2004-02-25 | 2005-08-31 | Sika Technology AG | Zweikomponentiger Klebstoff zur Herstellung von Halbzeugen und Sandwich-Verbundwerkstoffen |
| DE102004050129A1 (de) | 2004-10-14 | 2006-04-20 | Wacker Chemie Ag | Siliconkautschuk Zusammensetzung enthaltend unbehandeltes Aluminiumhydroxid als Füllstoff |
| EP1746119A1 (en) | 2005-07-22 | 2007-01-24 | 3M Innovative Properties Company | Thermally curable precursor of a toughened thermo-expanded film and a film made thereof |
| CA2620028C (en) | 2005-08-24 | 2014-01-28 | Henkel Kommanditgesellschaft Auf Aktien | Epoxy compositions having improved impact resistance |
| PL2049611T3 (pl) | 2006-07-31 | 2019-04-30 | Henkel Ag & Co Kgaa | Utwardzalne kompozycje klejowe oparte na żywicach epoksydowych |
| EP1916272A1 (de) | 2006-10-24 | 2008-04-30 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzung enthaltend ein blockiertes und ein epoxidterminiertes Polyurethanprepolymer |
| EP1916270A1 (de) | 2006-10-24 | 2008-04-30 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzung mit blockiertem Polyurethanprepolymer |
| EP1916269A1 (de) | 2006-10-24 | 2008-04-30 | Sika Technology AG | Blockierte Polyurethanprepolymere und hitzehärtende Epoxidharzzusammensetzungen |
| EP1916285A1 (de) | 2006-10-24 | 2008-04-30 | Sika Technology AG | Derivatisiertes Epoxid-Festharz und dessen Verwendungen |
| KR101467602B1 (ko) | 2007-04-11 | 2014-12-01 | 다우 글로벌 테크놀로지스 엘엘씨 | 내열 구조 에폭시 수지 |
| JP2010536953A (ja) | 2007-08-17 | 2010-12-02 | ダウ グローバル テクノロジーズ インコーポレイティド | 二液型耐衝撃性エポキシ接着剤 |
| GB2455292A (en) | 2007-12-03 | 2009-06-10 | Zephyros Inc | Improvements in or relating to the production of joints |
| GB0724378D0 (en) | 2007-12-14 | 2008-01-23 | 3M Innovative Properties Co | Vibration dampening compositions |
| US7847034B2 (en) | 2008-03-20 | 2010-12-07 | Loctite (R&D) Limited | Adducts and curable compositions using same |
| GB0806434D0 (en) | 2008-04-09 | 2008-05-14 | Zephyros Inc | Improvements in or relating to structural adhesives |
| US20100004369A1 (en) | 2008-07-01 | 2010-01-07 | Ppg Industries Ohio, Inc. | Low density viscoelastic composition having damping properties |
| BRPI0911723A2 (pt) | 2008-07-29 | 2015-10-06 | Dow Global Technologies Llc | painel veicular reforçado, método para preparar um painel veicular reforçado, estrutura de carroceria veicular e método para preparar uma estrutura de carroceria veicular |
| JP5358793B2 (ja) | 2008-08-20 | 2013-12-04 | 東海光学株式会社 | 赤外線通信用光学物品及びその製造方法並びに赤外線通信用受光部 |
| ATE468344T1 (de) | 2008-08-27 | 2010-06-15 | Sika Technology Ag | Silan-/harnstoff-verbindung als hitzeaktivierbarer härter für epoxidharzzusammensetzungen |
| GB0817795D0 (en) | 2008-09-30 | 2008-11-05 | 3M Innovative Properties Co | Fast curing oil-uptaking epozxy-based structural adhesives |
| EP2365046A1 (de) | 2010-03-02 | 2011-09-14 | Sika Technology AG | Schlagzäher bei Raumtemperatur härtender zwei-komponentiger Strukturklebstoff |
| DE102010028586A1 (de) | 2010-05-05 | 2011-11-10 | Henkel Ag & Co. Kgaa | 1K-Epoxidharzzusammensetzung mit verringerter Toxizität |
| GB201007793D0 (en) | 2010-05-10 | 2010-06-23 | Zephyros Inc | Improvements in or relating to structural adhesives |
| GB201012595D0 (en) | 2010-07-27 | 2010-09-08 | Zephyros Inc | Oriented structural adhesives |
| EP2468792A1 (en) | 2010-12-23 | 2012-06-27 | 3M Innovative Properties Company | Curable adhesive composition |
| GB201102672D0 (en) | 2011-02-15 | 2011-03-30 | Zephyros Inc | Improved structural adhesives |
| KR101992831B1 (ko) | 2011-05-19 | 2019-06-25 | 다우 글로벌 테크놀로지스 엘엘씨 | 신규 구조 접착제 및 그의 용도 |
| GB201119287D0 (en) | 2011-11-08 | 2011-12-21 | Zephyros Inc | Improvements in or relating to structrual adhesives |
| US8895148B2 (en) | 2011-11-09 | 2014-11-25 | Cytec Technology Corp. | Structural adhesive and bonding application thereof |
| TWI558787B (zh) | 2012-08-03 | 2016-11-21 | Lg化學股份有限公司 | 黏合膜及使用彼之有機電子裝置的包封產品 |
| EP2700683B1 (en) | 2012-08-23 | 2016-06-08 | 3M Innovative Properties Company | Structural adhesive film |
| JP6006087B2 (ja) * | 2012-11-05 | 2016-10-12 | スリーエム イノベイティブ プロパティズ カンパニー | 熱硬化性接着剤、熱硬化性接着剤を用いた自動車用部材およびその製造方法 |
| ES2546993T3 (es) | 2012-11-05 | 2015-09-30 | 3M Innovative Properties Company | Método para fabricar una estructura en forma de dobladillo para paneles metálicos |
| US10577522B2 (en) | 2013-07-26 | 2020-03-03 | Zephyros, Inc. | Thermosetting adhesive films including a fibrous carrier |
| EP3428214B1 (en) | 2013-10-29 | 2019-09-04 | Kaneka Corporation | Polymer fine particle-containing curable resin composition having improved storage stability |
| EP3170877B1 (en) | 2015-11-19 | 2020-11-18 | 3M Innovative Properties Company | Structural adhesive with improved failure mode |
-
2015
- 2015-11-19 EP EP15195394.0A patent/EP3170860B1/en not_active Revoked
-
2016
- 2016-11-14 WO PCT/US2016/061761 patent/WO2017087295A1/en not_active Ceased
- 2016-11-14 KR KR1020187017185A patent/KR20180083414A/ko not_active Withdrawn
- 2016-11-14 BR BR112018010312-8A patent/BR112018010312A2/pt not_active Application Discontinuation
- 2016-11-14 CA CA3005850A patent/CA3005850A1/en not_active Abandoned
- 2016-11-14 MX MX2018006037A patent/MX2018006037A/es unknown
- 2016-11-14 JP JP2018526101A patent/JP7010220B2/ja active Active
- 2016-11-14 CN CN201680066963.9A patent/CN108350335B/zh active Active
- 2016-11-14 US US15/775,190 patent/US11377576B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US11377576B2 (en) | 2022-07-05 |
| BR112018010312A2 (pt) | 2018-12-04 |
| EP3170860B1 (en) | 2020-07-29 |
| MX2018006037A (es) | 2018-08-01 |
| CN108350335A (zh) | 2018-07-31 |
| JP7010220B2 (ja) | 2022-01-26 |
| KR20180083414A (ko) | 2018-07-20 |
| WO2017087295A1 (en) | 2017-05-26 |
| US20180282592A1 (en) | 2018-10-04 |
| JP2019504903A (ja) | 2019-02-21 |
| CA3005850A1 (en) | 2017-05-26 |
| EP3170860A1 (en) | 2017-05-24 |
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