KR20180077722A - Photosensitive resin composition for dry film photoresist - Google Patents

Abstract

The present invention provides a photosensitive resin composition for a dry film photoresist and a dry film photoresist including the same, which are resistant to a developing solution to improve fine line adhesion and resolution, have a high coloring property in order to serve as an UV marker, and have a property that a size of a peeling specimen is rapidly split when peeling off. The photosensitive resin composition for a dry film photoresist comprises: (A) a photopolymerization initiator; (B) an alkali developable binder polymer; and (C) a photopolymerization compound having at least two ethylenically unsaturated bonds in a molecule. The photopolymerization compound has a monofunctional acryl group and has a weight average molecular weight of 150 to 300.

Description

[0001] The present invention relates to a photosensitive resin composition for dry film photoresists,

The present invention relates to a photosensitive resin composition for a dry film photoresist, and more particularly to a photosensitive resin composition for a dry film photoresist comprising a photopolymerization initiator, an alkali developable binder polymer, and a photopolymerizable compound.

The photosensitive resin composition is used in the form of a dry film photoresist (DFR) or a liquid photoresist ink used in a printed circuit board (PCB) or a lead frame.

In addition to the manufacture of printed circuit boards (PCBs) and lead frames, Rib Barriers for plasma display panels (PDP) and ITO electrodes, Bus Address electrodes and Black Matrix for other displays, DFR Is widely used.

In manufacturing a PCB, a lead frame, etc., one of the most important processes is a process of forming a circuit on a copper clad lamination sheet (hereinafter referred to as CCLS) or a copper foil.

The image transfer method used in this process is called photolithography. The original image plate used for this photolithography is called Artwork (a term commonly used in a PCB and a lead frame manufacturing part), Photomask Quot;). ≪ / RTI >

And the image of this artwork is composed of the part where the light passes and the part that does not, and the image is transferred using this part. This image transfer process is called an exposure process.

The image of the artwork is transferred to the CCLS or copper foil by light transmission and non-penetration. At this time, the photoresist is the substance that forms the image by receiving the light. The photoresist should therefore be laminated or coated on the CCLS, copper foil before transferring the image of the artwork.

In the exposure process, usually, the photoresist is exposed to ultra violet (hereinafter referred to as UV) containing i-line (365 nm) emitted from an ultra-high pressure mercury lamp in a printed circuit board or a lead frame maker.

In recent years, direct drawing by laser, that is, maskless exposure which does not require artwork, has been rapidly diffused. As a light source for maskless exposure, light with a wavelength of 350 to 410 nm, particularly i-line (365 nm) or h-line (405 nm) is often used.

However, as compared with the conventional ultra high-pressure mercury lamp exposure, maskless exposure requires a high-sensitivity photoresist that shortens the exposure time because of a long exposure time.

In recent years, the photosensitive resin composition has high sensitivity to ultra-high pressure mercury lamp or Laser Direct exposure, and resistance to a developing solution in a developing process is increased, so that it is possible to form a high density circuit, and a UV marker There is a need for a photosensitive resin composition which is excellent in color development for use, has a shortened peeling time of a cured film, is small in peeling test piece, and is free from clogging in a filter.

With the related art, Korean Patent Laid-Open No. 10-2016-0081747 has proposed a technique using a photopolymerizable compound containing a single functional group, but no improvement in color development degree and peeling time has been disclosed.

It is an object of the present invention to overcome the above-described problems in the prior art, and it is an object of the present invention to provide a silver halide photographic light-sensitive material having resistance to a developing solution to improve fine wire adhesion and resolution, And to provide a photosensitive resin composition for a dry film photoresist having a characteristic that a size of a specimen to be peeled is rapidly reduced.

In order to achieve the above object, a first preferred embodiment of the present invention is a photopolymerizable composition comprising: [A] a photopolymerization initiator; [B] an alkali developable binder polymer; and [C] a photopolymerization initiator having two or more ethylenically unsaturated bonds in the molecule , Wherein the [C] photopolymerizable compound has a monofunctional acryl group and has a weight average molecular weight of 150 to 300. The present invention also provides a photosensitive resin composition for a dry film photoresist.

The [C] photopolymerizable compound may include a compound represented by the following general formula (1).

≪ Formula 1 >

The photosensitive resin composition for a dry film photoresist of the present invention comprises 0.5 to 20% by weight of the photopolymerization initiator [A], 30 to 70% by weight of the alkali-developable binder polymer [B] And 10 to 50% by weight of a photopolymerizable compound having an unsaturated bond.

In the photosensitive resin composition for a dry film photoresist of the present invention, the compound represented by Formula 1 may be contained in an amount of 10 to 50% by weight based on the total weight of the photopolymerizable compound.

In the photosensitive resin composition for a dry film photoresist of the present invention, the photopolymerization initiator [A] may include a 2,4,5-triarylimidazole dimer or an acridine compound.

In the photosensitive resin composition for a dry film photoresist of the present invention, the weight average molecular weight of the alkali developable binder polymer may be 10,000 to 150,000.

In the photosensitive resin composition for a dry film photoresist of the present invention, the glass transition temperature of the alkali developable binder polymer may be 60 to 150 캜.

According to another aspect of the present invention, there is provided a dry film photoresist comprising the composition.

The photosensitive resin composition for a dry film photoresist according to the present invention has resistance to a developing solution to improve fine line adhesion and resolution and is excellent in color development for use as a UV marker for setting exposure positions of a substrate, And the separation specimen is small in size.

In addition, the photosensitive resin composition for a dry film photoresist according to the present invention can be exposed to a small amount of exposure energy, so that the speed of the exposure process determines the overall production speed, or a printed circuit board, a lead frame, (PDP), and other display devices, which can maximize productivity.

According to an embodiment of the present invention, there is provided a photopolymerization initiator comprising a photopolymerization initiator having two or more ethylenically unsaturated bonds in a molecule, wherein the photopolymerization initiator comprises a photopolymerization initiator [A], an alkali developable binder polymer, and [C] The synthetic compound can provide a photosensitive resin composition for a dry film photoresist having a monofunctional acryl group and a weight average molecular weight of 150 to 300.

That is, the composition of the present invention has excellent resistance to developing solution, improves the fine line adhesion and resolution, and is excellent in color development for use as a UV marker for setting the exposure position of the substrate. It is possible to shorten the peeling time of the cured film, It has the advantage of being able to split.

Thus, in the photosensitive resin composition of the present invention, it is preferable that 2,4,5-triarylimidazole dimer or acridine compound is contained as a photopolymerization initiator. The use of the above compound has the effect of enhancing the sensitivity of the photosensitive resin composition to laser direct exposure and improving the resistance to a developing solution in the developing process.

Further, in the photosensitive resin composition of the present invention, the [C] photopolymerizable compound having an ethylenically unsaturated bond in the molecule may include a compound represented by the following formula (1).

≪ Formula 1 >

By using the compound represented by the above formula (1), the sensitivity to the laser direct exposure of the photosensitive resin composition can be further increased, the resistance to the developer in the development step can be further improved, and high- It is possible to perform UV marker function with excellent color development, and it can be advantageous in that the peeling time of the cured film can be shortened and the peeling test piece can be made small.

Hereinafter, the present invention will be described in more detail.

[A] Photopolymerization initiator

The photopolymerization initiator contained in the photosensitive resin composition for a dry film photoresist is a substance that initiates a chain reaction of the photopolymerizable monomer by UV and other radiation and plays an important role in the curing of the dry film photoresist.

In the present invention, it is preferable that 2,4,5-triarylimidazole dimer or acridine compound is contained as a photopolymerization initiator.

Specific examples of the 2,4,5-triarylimidazole dimer include 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4 (Dimethoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenyl imidazole dimer, 2- 2,4,5-triarylimidazole dimer derivatives such as phenylimidazole dimer and 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer. 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenylbisimidazole is used in the embodiment of the present invention, but the present invention is not limited thereto.

The acridine compound may be an acridine derivative such as 9-phenylacridine or 1,7-bis (9,9-acridinyl) heptane, but is not limited thereto.

The amount of the 2,4,5-triarylimidazole dimer or the acridine compound may be 0.05 to 10% by weight based on the total composition. If the amount is less than 0.05% by weight, the reactivity of the initiator becomes weak, About 30 mJ / cm ² Or more), and if it is more than 10% by weight, the cross-section of the post-exposure circuit may have a severe history leg shape, so that it may be difficult to realize a desired circuit width in a circuit after the etching process, ).

The photopolymerization initiator may further include a photopolymerization initiator usually used in addition to 2,4,5-triarylimidazole dimer or an acridine compound.

Examples of the commonly used photopolymerization initiators include 1-hydroxycyclohexyl phenyl ketone, 2,2-dimethoxy 1,2-diphenylethane 1-on, 2-methyl 1 [4 (methylthio) phenyl] 2 benzyl 2 dimethylamino 1 [4-morpholinophenyl) butane 1 on, 2 hydroxy 2 methyl 1 phenylpropane 1 on, 2,4,6 trimethylbenzoyldiphenylphosphine oxide, 1 [4 (2 hydroxymethoxy ) Phenyl] 2 hydroxy 2 methylpropane 1on, 2,4 diethyl thioxanthone, 2 chlorothioxanthone, 2,4 dimethylthioxanthone, 3,3 dimethyl 4 methoxybenzophenone, benzophenone, 1 chloro (4-isopropylphenyl) 2hydroxy 2-methylpropane 1 on, 1 (4 dodecylphenyl) 2 hvdroxy 2 methylpropane 1 on, 4 benzoyl 4 'methyldimethylsulfide, 4 dimethyl Aminobenzoic acid, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, butyl 4-dimethylaminobenzoate, 2-ethylhexyl 4-dimethylaminobenzoate, 2-isoamyl 4-dimethylamino Benzoate, 2,2-diethoxyacetophenone, benzylketone dimethyl acetal, benzyl ketone beta methoxy diethylacetal, 1 phenyl 1,2 propyldioxime o, o '(2 carbonyl) ethoxy ether, methyl o benzoylbenzo (Diethylamino) benzophenone, 4,4'-dichlorobenzophenone, benzyl, benzoin, methoxybenzoin, ethoxybenzoin, isopropoxy Benzoin, n-butoxybenzoin, isobutoxybenzoin, tertbutoxybenzoin, p-dimethylaminoacetophenone, ptert butyltrichloroacetophenone, ptert butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2 A thioxanthone compound, an anthracene compound, a coumarin compound, a pyrazoline compound, N-phenylglycine, N-phenylglycine, N-phenylglycine, Based derivatives, and the like, but the present invention is not limited thereto.

The content of the photopolymerization initiator is contained in the photosensitive resin composition in an amount of 0.5 to 20% by weight. When the content of the photopolymerization initiator is within the above range, sufficient sensitivity can be obtained.

[B] Alkali developing binder polymer

The alkali developable binder polymer of the present invention is preferably a copolymer of (meth) acrylic acid and (meth) acrylic acid ester.

Specific examples of the monomer include methyl acrylate, methyl methacrylate, ethyl acrylate, methyl methacrylate, butyl acrylate, butyl methacrylate, acrylic acid, methacrylic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate A copolymer acrylic acid polymer obtained through copolymerization of two or more monomers selected from linear acrylic acid polymers synthesized from acrylic acid, methacrylic acid, methacrylic acid, methacrylic acid, methacrylic acid, maleic anhydride, to be.

The alkali developable binder polymer of the present invention is a polymer having a weight average molecular weight of 10,000 to 150,000 and a glass transition temperature of 60 to 150 DEG C in consideration of the coating property of the dry film photoresist, As a compound, 30 to 70% by weight in the photosensitive resin composition. When the content of the alkali developable binder polymer is within the above range, the effect of enhancing the fine line adhesion force after the circuit formation can be obtained.

[C] Photopolymerizable compound

The photopolymerizable compound of the present invention may have an ethylenic unsaturated bond in the molecule. Having an ethylenically unsaturated bond as described above has resistance to a developer and can improve the fine line adhesion and resolution.

In particular, the photopolymerizable compound may include a compound having a monofunctional acryl group and a weight average molecular weight of 150 to 300 in order to exhibit a UV marker function and to shorten the peeling time of the cured film and reduce the peeling test piece.

In the present invention, the photopolymerizable compound may include a compound represented by the following formula (1).

≪ Formula 1 >

In the present invention, when the composition of the present invention is applied to a dry film photoresist by using the compound represented by the above formula (1) as a photopolymerizable compound, it is possible to improve the color developing degree and facilitate permeation of the peeling liquid, And there is an effect that the shortening and the small peeling test piece become.

In the present invention, the compound represented by Formula 1 is contained in the photosensitive resin composition in an amount of 1 to 20% by weight, preferably 1.5 to 15% by weight. When the content of the compound represented by Formula 1 is less than 1% by weight, The effect may be insufficient, and if it exceeds 20% by weight, the developing time in the developing step after the exposure may drastically decrease.

The photopolymerizable compound having an ethylenically unsaturated bond in the molecule of the present invention may contain a monomer having at least two ethylene groups at the terminal thereof in addition to the compound represented by the above formula (1).

Examples of the monomer having at least two ethylene groups at the terminal thereof include ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, But are not limited to, propylene glycol dimethacrylate, polypropylene glycol dimethacrylate, butylene glycol dimethacrylate, neopentyl glycol dimethacrylate, 1,6-hexane glycol dimethacrylate, trimethyolpropane trimethacrylate, glycerin dimethacrylate, pentaerythritol dimethacrylate, 1,6-hexane glycol dimethacrylate, (pentaerythritol dimethacrylate), pentaerythritol trimethacrylate Pentaerythritol trimethacrylate, dipentaerythritol pentamethacrylate, 2,2-bis (4-methacryloxydiethoxyphenyl) propane, 2 (2-hydroxy-3-methacryloyloxypropyl methacrylate), ethylene glycol diglycidyl ether dimethacrylate, diethylene glycol diglycidyl ether dimethacrylate, But are not limited to, diethylene glycol diglycidyl ether dimethacrylate, phthalic acid diglycidyl ester dimethacrylate, glycerin polyglycidyl ether polymethacrylate, And polyfunctional (meth) acrylates containing a urethane group.

The content of the photopolymerizable oligomer is preferably 10 to 70% by weight in the photosensitive resin composition. When the content of the photopolymerizable oligomer is within the above range, the effect of enhancing photosensitivity, resolution and adhesion can be obtained.

In the present invention, the compound represented by Formula 1 includes 10 to 50% by weight, preferably 10 to 30% by weight based on the total weight of the photopolymerizable compound. When the content of the compound represented by the formula (1) is less than 10% by weight, the effect thereof may be insufficient. When the content exceeds 50% by weight, the coloring degree may be decreased and the peeling time of the cured film may be prolonged.

[D] Other additives

The photosensitive resin composition of the present invention may further contain other additives as necessary. Examples of other additives include dibutyl phthalate, diheptyl phthalate, dioctyl phthalate, diallyl phthalate, Triethylene glycol diacetate in the glycol ester form, tetraethylene glycol diacetate; P-toluenesulfonamide in the acid amide form, benzenesulfonamide, n-butylbenzenesulfonamide; Triphenyl phosphate and the like can be used.

In the present invention, a leuco dye or a coloring material may be added to improve the handleability of the photosensitive resin composition.

Examples of the leuco dyes include tris (4-dimethylamino-2-methylphenyl) methane, tris (4-dimethylamino-2-methylphenyl) methane and fluororan dyes. Among them, when leuco crystal violet is used, the contrast is preferably good. The content of the leuco dye is preferably 0.1 to 10% by weight in the photosensitive resin composition. From the viewpoint of the appearance of contrast, the content is preferably 0.1% by weight or more, and more preferably 10% by weight or less from the viewpoint of maintaining storage stability.

Examples of the coloring material include fuchsin, phthalocyanine green, aramine base, paramagenta, crystal violet, methyl orange, nile blue 2B, victoria blue, malachite green, diamond green and basic blue 20.

When the coloring material is contained, the amount added is preferably 0.001 to 1% by weight in the photosensitive resin composition. When the content is 0.001% by weight or more, there is an effect of improving the handling property. When the content is 1% by weight or less, the storage stability is maintained.

Other additives may further include heat polymerization inhibitors, dyes, discoloring agents, adhesion promoters, and the like.

In the present invention, a photosensitive resin composition for a dry film photoresist having the above composition is prepared, and a photosensitive resin layer is coated on a conventional base film such as polyethylene terephthalate to a thickness of 10 to 400 μm by a conventional coating method Next, it is dried.

The dried photosensitive resin layer is laminated using a conventional protective film such as polyethylene. Further, the dry film is exposed and developed to evaluate the properties of the respective films. It is preferable to use a laser direct exposure device including UV, visible light laser, etc. for the exposure.

Hereinafter, preferred embodiments of the present invention will be described in order to facilitate understanding of the present invention. However, the following examples are provided only for the purpose of easier understanding of the present invention, and the present invention is not limited by the examples.

≪ Examples 1 to 5 and Comparative Examples 1 to 4 >

Photosensitive resin compositions for dry film photoresists and dry film photoresists were prepared by combining and coating according to the composition shown in Table 1 below.

First, photopolymerization initiators were dissolved in methyl ethyl ketone (MEK) as a solvent. Then, a photopolymerizable monomer and an alkali developable binder polymer were added and mixed for about 1 hour using a mechanical stirrer. Then, a photosensitive resin composition was coated on a PET film The coated layer of the photosensitive resin composition was dried using a hot air oven at a drying temperature of 80 ° C. and a drying time of 5 minutes and a film thickness after drying of 30 μm. The dried film was laminated on the photosensitive resin layer using a protective film (PE).

Component (content:% by weight) Comparative Example Example One 2 3 4 5 One 2 3 4 5 menstruum Methyl ethyl ketone
(MEK) 20 20 20 20 20 20 20 20 20 20 Photopolymerization initiator BCIM ⁽¹⁾ 3.5 3.5 3.5 3.5 3.5 3.5 3.5 - - 3.5 9,10-dibutoxyanthracene 0.5 0.5 0.5 0.5 0.5 0.5 0.5 - - 0.5 9-phenylacridine - - - - - - 1.5 1.5 - BMPS ⁽²⁾ - - 1.0 1.0 1.0 n-phenylglycine - - - - - 0.5 0.5 0.5 coloring agent Luco Crystal Violet 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 Toluenesulfonic acid monohydrate 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 Diamond Green GH 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Photopolymerizable oligomer M2101 ⁽³⁾
(Miwon Company) 9 9 9 9 - 9 9 9 9 9 M281 ⁽⁴⁾
(Miwon Company) 9 6 6 6 6 5 3 6 4 3.5 M241 ⁽⁵⁾
(Miwon Company) 2 2 2 2 - 2 2 2 2 2 A ⁽⁶ ) - - - - - 4 6 4 6 4 B ⁽⁷⁾ (Miwon Company) - 3 - - - - - - - - M280 ⁽⁸⁾
(Miwon Company) - - 3 - - - - - - A-TMPT-3EO ⁽⁹⁾ - - - 3 4 - - - - - BFE-500 ⁽¹⁰⁾ (Shin Nakamura) - - - - 7 - - - - - Blemmer 55PET ⁽¹¹⁾ (NOF) - - - - 3 - - - - - bookbinder
Polymer KOLON BP-1 ⁽¹²⁾
(Solid content 50%) 55 55 55 55 55 55 55 55 55 55

(1) BCIM: 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenylbisimidazole

    (2) BMPS: Tribromomethylphenyl sulfone

(3) M2101: bisphenol A (ethoxylate) ₁₀ dimethacrylate

    (4) M281: polyethylene glycol dimethacrylate

(5) M241: bisphenol A (ethoxylate) ₄ dimethacrylate

    (6) A: The compound of formula

    (7) B: 3,3,5-trimethylcyclohexyl acrylate

    (8) M280: Polyethylene glycol diacrylate

(9) A-TMPT-3E _O : Trimethylpropane triacrylate

    (10) BFE-500: 2,2-bis [4- (methacryloxypolyethoxy) phenyl] propane

    (11) Blemmer 55PET (NOF): Poly (ethylene glycol tetramethylene glycol) methacrylate

    (12) KOLON BP-1: linear polymer of methacrylic acid: acrylic acid: methyl methacrylate = 10: 10: 80 ratio

<Experimental Example>

Using the dry film photoresists prepared in Examples 1 to 5 and Comparative Examples 1 to 4, the exposure amount, photosensitivity, fine line adhesion, resolution, color development degree and peelability of the copper plate were measured in the following manner, The results are shown in Table 2 below.

(1) Exposure amount

And exposed using an exposure apparatus INPREX IP-3600H.

(2) Sensitivity

The sensitivity used as a measure of reactivity was measured on a resist basis using a 21-step tablet of Stouffer Graphic Arts Equipment Co.

(3) Fine wire adhesion

After the polyethylene (PE) film of the prepared photosensitive dry film resist was removed, the film was laminated to a copper plate using a heat press roller. The photoresist having a wiring pattern of 10 to 60 mu m divided into 5 mu m units was exposed to light and developed, and then the adhesion of the resist was measured.

The wiring pattern of adhesion is line / space = x: 400 (unit: 탆), and the minimum value of the straight line excluding the meandering line among independent fine lines is read.

(4) Resolution

The resist was exposed and developed using a phototool having a line / space = 10: 10 to 60: 60 (unit: μm) wiring pattern, and then the resolution of the resist was measured. In the resist pattern formed by the development after exposure, the resolution is the minimum value of the pattern in which the unexposed portion is cleanly removed.

(5) Measurement of color development

Immediately after exposure, the number of colors observed on a 21-step tablet of Stouffer Graphic Arts Equipment Co. was read to determine the contrast of the unexposed and exposed portions.

S: 4-6

A: 7 ~ 10

B: 11-14

C: 14 ~ 16

D: 17 ~ 21

(6) Measurement of peelability

The peelability was evaluated by removing the polyethylene film of the prepared photosensitive dry film resist, laminating it on a copper plate using a heat press roller, and exposing and developing the photosensitive resin composition to prepare a photocured film having a size of 50 mm x 50 mm. Then, peeling was performed using a 3% aqueous solution of sodium hydroxide (temperature: 50 ° C).

The peelability evaluation was determined as the peeling time at which the photocured film fell off the copper plate. The peel specimens were measured for size after completion of peeling, and the results are shown in Table 2 below.

S: Small (lower than 0.5cm)

Medium: Medium (0.5 ~ 2cm)

L: Large (2-5 cm)

division Comparative Example Example One 2 3 4 5 One 2 3 4 5 Exposure dose (mJ / cm 2) 20 20 20 20 20 20 20 14 14 30 Sensitivity (X / 21 step tablet) 5 5 5 5 5 5 5 7 7 6 Fine wire adhesion (탆) 30 25 25 25 25 25 25 25 20 20 Resolution (탆) 35 30 30 25 20 20 25 25 25 20 Color C A C B C S S S S S Peeling time 60 (M) 40 (S) 60 (S) 70 (M) 60 (M) 40 (S) 35 (S) 40 (S) 35 (S) 40 (S) Uniqueness - bubble
Occur - - - - - - - -

As shown in Table 2, when compared with the exposure dose values of 20 and 50 mJ / cm 2 in Examples and Comparative Examples as shown in Table 2, Examples 1 and 2 are equivalent to 20 mJ / cm 2, 3 and 4 exhibit less exposure dose of less than 14 mJ / cm 2. In view of this, when 2,4,5-triarylimidazole dimer or acridine compound is contained as a photopolymerization initiator, the advantage of exposure with a small amount of exposure energy can be obtained. In particular, it can be confirmed that Example 5 exhibits excellent physical properties with a small amount of exposure even when two light curing openings are used at the same time.

As shown in Table 2, the photosensitivity of Examples 1 to 5 and Comparative Examples was comparable or superior to that of Comparative Examples, and the fine line adhesion was 25 m or less in all Examples , And the resolution is equal to or less than 25 μm.

On the basis of the above results, there was no significant correlation between the number of functional groups and the circuit properties, but Comparative Example 4 including monomers of triacrylate showed the same circuit properties as those of the examples, Comparative Example 1, which does not contain acrylate, exhibited poor circuit properties when compared with Example 1. On the contrary, Comparative Example 5 shows excellent circuit properties because it is an optimized composition for circuit properties.

In the case of Comparative Example 2, the experimental values were somewhat similar to those of the experimental example. However, when left at room temperature after coating, bubbles were generated on the bottom surface of the PE film.

Comparing Comparative Examples 3 to 4 and Example 1, it was confirmed that the lower the molecular weight, the longer the peeling time.

Comparing Comparative Example 5 (Example 1 of Korean Patent Laid-open No. 10-2016-0081747 of the prior art) with Example 1, all of the circuit properties have values, but in Comparative Example 5 having a single functional group but having a methacrylate group It was confirmed that Example 1 including an acrylate group having one functional group had an excellent effect on shortening the coloring degree and the peeling time.

From this, it can be understood that not only a photopolymerizable monomer having a monofunctionality but also a monofunctional and acrylate is effective for improving the color development degree and the peeling time.

While the present invention has been particularly shown and described with reference to specific embodiments thereof, those skilled in the art will appreciate that such specific embodiments are merely preferred embodiments and that the scope of the present invention is not limited thereto will be. Accordingly, the actual scope of the present invention will be defined by the appended claims and their equivalents.

Claims (8)

[A] a photopolymerization initiator, [B] an alkali developable binder polymer, and [C] a photopolymerizable compound having two or more ethylenically unsaturated bonds in the molecule, wherein the [C] photopolymerizable compound has a monofunctional acrylic group , And a weight average molecular weight of 150 to 300. The photosensitive resin composition for a dry film photoresist according to claim 1, The method according to claim 1,
Wherein the [C] photopolymerizable compound comprises a compound represented by the following formula (1).
&Lt; Formula 1 >

The method according to claim 1,
A photopolymerizable compound having at least two ethylenically unsaturated bonds in the [C] molecule, and 10 to 50 wt% of a photopolymerizable compound having at least two ethylenically unsaturated bonds in the [B] alkaline developing binder polymer; % Of the photosensitive resin composition for a dry film photoresist. 3. The method of claim 2,
The photosensitive resin composition for a dry film photoresist according to claim 1, wherein the compound represented by the formula (1) is contained in an amount of 10 to 50% by weight based on the total weight of the photopolymerizable compound. The method according to claim 1,
Wherein the photopolymerization initiator [A] comprises 2,4,5-triarylimidazole dimer or an acridine compound. The method according to claim 1,
Wherein the alkali developable binder polymer has a weight average molecular weight of 10,000 to 150,000. The method according to claim 1,
Wherein the alkali developable binder polymer has a glass transition temperature of 60 to 150 캜. A dry film photoresist comprising the composition of any one of claims 1 to 7.