KR20180034100A - 다중방향환 유도체로 표면 개질된 실리카를 포함하는 감광성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조방법 - Google Patents

다중방향환 유도체로 표면 개질된 실리카를 포함하는 감광성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조방법 Download PDF

Info

Publication number
KR20180034100A
KR20180034100A KR1020160124205A KR20160124205A KR20180034100A KR 20180034100 A KR20180034100 A KR 20180034100A KR 1020160124205 A KR1020160124205 A KR 1020160124205A KR 20160124205 A KR20160124205 A KR 20160124205A KR 20180034100 A KR20180034100 A KR 20180034100A
Authority
KR
South Korea
Prior art keywords
resin composition
photosensitive resin
formula
silica
present
Prior art date
Application number
KR1020160124205A
Other languages
English (en)
Korean (ko)
Inventor
정회철
정아린
강정규
이하경
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020160124205A priority Critical patent/KR20180034100A/ko
Priority to JP2017172055A priority patent/JP2018055093A/ja
Publication of KR20180034100A publication Critical patent/KR20180034100A/ko

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020160124205A 2016-09-27 2016-09-27 다중방향환 유도체로 표면 개질된 실리카를 포함하는 감광성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조방법 KR20180034100A (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020160124205A KR20180034100A (ko) 2016-09-27 2016-09-27 다중방향환 유도체로 표면 개질된 실리카를 포함하는 감광성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조방법
JP2017172055A JP2018055093A (ja) 2016-09-27 2017-09-07 多重芳香環誘導体により表面改質されたシリカを含む感光性樹脂組成物、これを用いたプリント回路基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160124205A KR20180034100A (ko) 2016-09-27 2016-09-27 다중방향환 유도체로 표면 개질된 실리카를 포함하는 감광성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조방법

Publications (1)

Publication Number Publication Date
KR20180034100A true KR20180034100A (ko) 2018-04-04

Family

ID=61836692

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160124205A KR20180034100A (ko) 2016-09-27 2016-09-27 다중방향환 유도체로 표면 개질된 실리카를 포함하는 감광성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조방법

Country Status (2)

Country Link
JP (1) JP2018055093A (ja)
KR (1) KR20180034100A (ja)

Also Published As

Publication number Publication date
JP2018055093A (ja) 2018-04-05

Similar Documents

Publication Publication Date Title
KR101523134B1 (ko) 광경화성 수지 조성물, 드라이 필름, 경화물 및 인쇄 배선판
JP6177738B2 (ja) 樹脂組成物、これを用いたプリント回路基板およびその製造方法
KR101361753B1 (ko) 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
US9416243B2 (en) Photocurable and thermosetting resin composition, dry film solder resist manufactured therefrom, and circuit board including the solder resist
JP6162775B2 (ja) 光硬化性および熱硬化性を有する樹脂組成物と、ドライフィルムソルダレジスト
KR101256553B1 (ko) 감광성 수지 조성물, 드라이 필름 솔더 레지스트 및 회로 기판
JP6702617B2 (ja) 光硬化性および熱硬化性を有する樹脂組成物およびドライフィルムソルダーレジスト
JP5977361B2 (ja) 光硬化性および熱硬化性を有する樹脂組成物と、ドライフィルムソルダレジスト
CN114867711B (zh) 化合物和其制造方法、树脂组合物、树脂片、多层印刷电路板以及半导体装置
JP2015529844A (ja) 光硬化性及び熱硬化性を有する樹脂組成物と、ドライフィルムソルダーレジスト
KR102053322B1 (ko) 감광성 수지 조성물 및 감광성 절연 필름
TWI700552B (zh) 感光性樹脂組成物、乾膜及印刷線路板
KR101432634B1 (ko) 내열성이 우수한 감광성 수지 조성물 및 이에 의해 형성된 드라이 필름 솔더 레지스트
KR20050044539A (ko) 수지 조성물
KR20180034100A (ko) 다중방향환 유도체로 표면 개질된 실리카를 포함하는 감광성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조방법
JP6172816B2 (ja) 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法
KR101956273B1 (ko) 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조방법
KR101755018B1 (ko) 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
JP2018062570A (ja) 樹脂組成物、樹脂シート、プリント配線板及び半導体装置
CN113423754B (zh) 固化性树脂组合物、固化物、酸改性马来酰亚胺树脂及固化剂
KR101746788B1 (ko) 다관능성 화합물, 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
KR20230120393A (ko) (메타)아크릴레이트계 수지의 제조 방법, 이를 이용하여 제조된 (메타)아크릴레이트 수지 및 이를 포함하는 드라이 필름 솔더 레지스트
JP5268233B2 (ja) エポキシ樹脂、エポキシ樹脂組成物、並びにその硬化物