KR20180018708A - 전자파 실드재 - Google Patents

전자파 실드재 Download PDF

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Publication number
KR20180018708A
KR20180018708A KR1020187001066A KR20187001066A KR20180018708A KR 20180018708 A KR20180018708 A KR 20180018708A KR 1020187001066 A KR1020187001066 A KR 1020187001066A KR 20187001066 A KR20187001066 A KR 20187001066A KR 20180018708 A KR20180018708 A KR 20180018708A
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KR
South Korea
Prior art keywords
metal foil
thickness
resin
resin layer
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020187001066A
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English (en)
Korean (ko)
Inventor
가즈키 간무리
고이치로 다나카
Original Assignee
제이엑스금속주식회사
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Application filed by 제이엑스금속주식회사 filed Critical 제이엑스금속주식회사
Publication of KR20180018708A publication Critical patent/KR20180018708A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
KR1020187001066A 2015-06-15 2016-04-07 전자파 실드재 Ceased KR20180018708A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015120679A JP6379071B2 (ja) 2015-06-15 2015-06-15 電磁波シールド材
JPJP-P-2015-120679 2015-06-15
PCT/JP2016/061433 WO2016203825A1 (ja) 2015-06-15 2016-04-07 電磁波シールド材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020197025681A Division KR20190104454A (ko) 2015-06-15 2016-04-07 전자파 실드재

Publications (1)

Publication Number Publication Date
KR20180018708A true KR20180018708A (ko) 2018-02-21

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ID=57545127

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020187001066A Ceased KR20180018708A (ko) 2015-06-15 2016-04-07 전자파 실드재
KR1020217006271A Active KR102297037B1 (ko) 2015-06-15 2016-04-07 전자파 실드재
KR1020197025681A Ceased KR20190104454A (ko) 2015-06-15 2016-04-07 전자파 실드재
KR1020207011716A Ceased KR20200045009A (ko) 2015-06-15 2016-04-07 전자파 실드재

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KR1020217006271A Active KR102297037B1 (ko) 2015-06-15 2016-04-07 전자파 실드재
KR1020197025681A Ceased KR20190104454A (ko) 2015-06-15 2016-04-07 전자파 실드재
KR1020207011716A Ceased KR20200045009A (ko) 2015-06-15 2016-04-07 전자파 실드재

Country Status (7)

Country Link
US (1) US11259449B2 (cg-RX-API-DMAC7.html)
JP (1) JP6379071B2 (cg-RX-API-DMAC7.html)
KR (4) KR20180018708A (cg-RX-API-DMAC7.html)
CN (2) CN107710899B (cg-RX-API-DMAC7.html)
DE (1) DE112016002702T5 (cg-RX-API-DMAC7.html)
TW (1) TWI589449B (cg-RX-API-DMAC7.html)
WO (1) WO2016203825A1 (cg-RX-API-DMAC7.html)

Families Citing this family (15)

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Publication number Priority date Publication date Assignee Title
JP6883449B2 (ja) 2017-03-13 2021-06-09 Jx金属株式会社 電磁波シールド材
JP6883456B2 (ja) 2017-03-31 2021-06-09 Jx金属株式会社 積層体及び成形品の製造方法
KR101912542B1 (ko) 2017-10-25 2019-01-14 (주)크린앤사이언스 타공 금속 박판을 이용한 전자파 차폐재 및 그 제조방법
JP6789437B2 (ja) * 2018-09-25 2020-11-25 積水化学工業株式会社 λ/4型電波吸収体
CN114731776B (zh) * 2019-11-18 2025-07-11 东丽株式会社 层叠片材
JP2021088099A (ja) * 2019-12-03 2021-06-10 Jx金属株式会社 金属樹脂複合材料の成形方法、並びに金属樹脂複合部品及びその製造方法
JP7008121B1 (ja) * 2020-12-09 2022-01-25 Jx金属株式会社 電磁波シールド材
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KR20240060666A (ko) * 2022-03-02 2024-05-08 제이엑스금속주식회사 전자파 차폐 재료, 피복재 또는 외장재 및 전기ㆍ전자 기기
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US11259449B2 (en) 2022-02-22
CN107710899B (zh) 2021-04-06
KR20210025725A (ko) 2021-03-09
KR102297037B1 (ko) 2021-09-01
KR20190104454A (ko) 2019-09-09
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