KR20180017012A - 비대칭 단자들을 갖는 캐패시터 구조 - Google Patents
비대칭 단자들을 갖는 캐패시터 구조 Download PDFInfo
- Publication number
- KR20180017012A KR20180017012A KR1020177035059A KR20177035059A KR20180017012A KR 20180017012 A KR20180017012 A KR 20180017012A KR 1020177035059 A KR1020177035059 A KR 1020177035059A KR 20177035059 A KR20177035059 A KR 20177035059A KR 20180017012 A KR20180017012 A KR 20180017012A
- Authority
- KR
- South Korea
- Prior art keywords
- asymmetric terminal
- discrete device
- asymmetric
- terminal
- manual
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/736,219 US10079097B2 (en) | 2015-06-10 | 2015-06-10 | Capacitor structure for power delivery applications |
| US14/736,219 | 2015-06-10 | ||
| PCT/US2016/033038 WO2016200574A1 (en) | 2015-06-10 | 2016-05-18 | Capacitor structure with asymmetric terminals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20180017012A true KR20180017012A (ko) | 2018-02-20 |
Family
ID=56101792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177035059A Ceased KR20180017012A (ko) | 2015-06-10 | 2016-05-18 | 비대칭 단자들을 갖는 캐패시터 구조 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10079097B2 (https=) |
| EP (1) | EP3308389A1 (https=) |
| JP (1) | JP2018523299A (https=) |
| KR (1) | KR20180017012A (https=) |
| CN (1) | CN107690688A (https=) |
| WO (1) | WO2016200574A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023113335A1 (ko) * | 2021-12-13 | 2023-06-22 | 주식회사 아모텍 | 세라믹 커패시터 및 이의 제조방법 |
| KR20230111850A (ko) * | 2022-01-19 | 2023-07-26 | 주식회사 아모텍 | 세라믹 커패시터 및 그 제조방법 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023210465A1 (ja) * | 2022-04-27 | 2023-11-02 | 株式会社村田製作所 | 積層セラミックコンデンサ及び積層セラミックコンデンサの実装方法 |
| WO2025142270A1 (ja) * | 2023-12-29 | 2025-07-03 | パナソニックIpマネジメント株式会社 | 抵抗器 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60190063U (ja) * | 1984-05-28 | 1985-12-16 | 関西日本電気株式会社 | 角チツプ部品 |
| JPS61144812A (ja) * | 1984-12-19 | 1986-07-02 | 株式会社村田製作所 | 積層セラミツクコンデンサの容量調整方法 |
| JPH06260377A (ja) * | 1993-02-12 | 1994-09-16 | Sumitomo Metal Ind Ltd | チップ形電子部品の端子電極形成方法 |
| JP3771308B2 (ja) * | 1996-02-13 | 2006-04-26 | コーア株式会社 | チップインダクタの製造方法 |
| JPH11204367A (ja) * | 1998-01-19 | 1999-07-30 | Murata Mfg Co Ltd | チップ状電子部品およびその製造方法 |
| JP2000049038A (ja) | 1998-07-31 | 2000-02-18 | Kyocera Corp | 積層セラミックコンデンサ |
| EP1179826A1 (en) | 2000-07-12 | 2002-02-13 | Littelfuse Ireland Development Company Limited | An integrated passive device and a method for producing such a device |
| JP4187184B2 (ja) * | 2002-02-28 | 2008-11-26 | Tdk株式会社 | 電子部品 |
| JP3885938B2 (ja) * | 2002-03-07 | 2007-02-28 | Tdk株式会社 | セラミック電子部品、ペースト塗布方法及びペースト塗布装置 |
| JP2004039937A (ja) * | 2002-07-04 | 2004-02-05 | Tdk Corp | セラミック電子部品 |
| KR100843434B1 (ko) * | 2006-09-22 | 2008-07-03 | 삼성전기주식회사 | 적층형 칩 커패시터 |
| DE102007044604A1 (de) | 2007-09-19 | 2009-04-09 | Epcos Ag | Elektrisches Vielschichtbauelement |
| JP4370352B2 (ja) | 2007-10-31 | 2009-11-25 | Tdk株式会社 | 積層コンデンサ |
| JP4752901B2 (ja) * | 2008-11-27 | 2011-08-17 | 株式会社村田製作所 | 電子部品及び電子部品内蔵基板 |
| DE102011014965B4 (de) | 2011-03-24 | 2014-11-13 | Epcos Ag | Elektrisches Vielschichtbauelement |
| KR101462767B1 (ko) * | 2013-03-14 | 2014-11-20 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판 |
-
2015
- 2015-06-10 US US14/736,219 patent/US10079097B2/en not_active Expired - Fee Related
-
2016
- 2016-05-18 CN CN201680033348.8A patent/CN107690688A/zh active Pending
- 2016-05-18 WO PCT/US2016/033038 patent/WO2016200574A1/en not_active Ceased
- 2016-05-18 KR KR1020177035059A patent/KR20180017012A/ko not_active Ceased
- 2016-05-18 EP EP16727263.2A patent/EP3308389A1/en not_active Withdrawn
- 2016-05-18 JP JP2017563315A patent/JP2018523299A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023113335A1 (ko) * | 2021-12-13 | 2023-06-22 | 주식회사 아모텍 | 세라믹 커패시터 및 이의 제조방법 |
| KR20230111850A (ko) * | 2022-01-19 | 2023-07-26 | 주식회사 아모텍 | 세라믹 커패시터 및 그 제조방법 |
| WO2023140501A1 (ko) * | 2022-01-19 | 2023-07-27 | 주식회사 아모텍 | 세라믹 커패시터 및 그 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016200574A1 (en) | 2016-12-15 |
| CN107690688A (zh) | 2018-02-13 |
| JP2018523299A (ja) | 2018-08-16 |
| US20160365196A1 (en) | 2016-12-15 |
| US10079097B2 (en) | 2018-09-18 |
| EP3308389A1 (en) | 2018-04-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20171205 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| A302 | Request for accelerated examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20181018 Comment text: Request for Examination of Application |
|
| PA0302 | Request for accelerated examination |
Patent event date: 20181018 Patent event code: PA03022R01D Comment text: Request for Accelerated Examination |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20190219 Patent event code: PE09021S01D |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20190626 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20191016 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20190626 Comment text: Notification of reason for refusal Patent event code: PE06011S01I Patent event date: 20190219 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |