KR20180005243A - 기판 처리 시스템 - Google Patents

기판 처리 시스템 Download PDF

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Publication number
KR20180005243A
KR20180005243A KR1020177035667A KR20177035667A KR20180005243A KR 20180005243 A KR20180005243 A KR 20180005243A KR 1020177035667 A KR1020177035667 A KR 1020177035667A KR 20177035667 A KR20177035667 A KR 20177035667A KR 20180005243 A KR20180005243 A KR 20180005243A
Authority
KR
South Korea
Prior art keywords
substrate processing
substrate
foup
processing apparatus
carrier
Prior art date
Application number
KR1020177035667A
Other languages
English (en)
Korean (ko)
Inventor
야스히코 오하시
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Priority to KR1020207014692A priority Critical patent/KR102271107B1/ko
Publication of KR20180005243A publication Critical patent/KR20180005243A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020177035667A 2015-09-30 2016-08-04 기판 처리 시스템 KR20180005243A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020207014692A KR102271107B1 (ko) 2015-09-30 2016-08-04 기판 처리 시스템

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015193460A JP6562803B2 (ja) 2015-09-30 2015-09-30 基板処理システム
JPJP-P-2015-193460 2015-09-30
PCT/JP2016/072878 WO2017056710A1 (ja) 2015-09-30 2016-08-04 基板処理システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020207014692A Division KR102271107B1 (ko) 2015-09-30 2016-08-04 기판 처리 시스템

Publications (1)

Publication Number Publication Date
KR20180005243A true KR20180005243A (ko) 2018-01-15

Family

ID=58423226

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177035667A KR20180005243A (ko) 2015-09-30 2016-08-04 기판 처리 시스템
KR1020207014692A KR102271107B1 (ko) 2015-09-30 2016-08-04 기판 처리 시스템

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020207014692A KR102271107B1 (ko) 2015-09-30 2016-08-04 기판 처리 시스템

Country Status (5)

Country Link
JP (1) JP6562803B2 (ja)
KR (2) KR20180005243A (ja)
CN (1) CN107710396B (ja)
TW (1) TWI612607B (ja)
WO (1) WO2017056710A1 (ja)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10144765A (ja) * 1996-11-11 1998-05-29 Canon Sales Co Inc 基板処理システム
US6435330B1 (en) 1998-12-18 2002-08-20 Asyai Technologies, Inc. In/out load port transfer mechanism
JP2001189363A (ja) * 2000-01-04 2001-07-10 Mitsubishi Electric Corp 半導体装置製造設備およびその制御方法
JP2004327575A (ja) * 2003-04-23 2004-11-18 Renesas Technology Corp 半導体製造設備の稼働制御方法
JP4280159B2 (ja) * 2003-12-12 2009-06-17 東京エレクトロン株式会社 基板処理装置
JP4376072B2 (ja) * 2004-01-16 2009-12-02 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2006237559A (ja) * 2005-01-28 2006-09-07 Dainippon Screen Mfg Co Ltd 基板処理装置
CN100413047C (zh) * 2005-01-28 2008-08-20 大日本网目版制造株式会社 基板处理装置
JP5461760B2 (ja) * 2006-07-26 2014-04-02 株式会社カネカ 半導体製造装置及び半導体製造方法
JP4891199B2 (ja) * 2006-11-27 2012-03-07 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
KR101226954B1 (ko) * 2008-08-06 2013-01-28 세메스 주식회사 기판 처리장치 및 이의 기판 이송 방법
JP5392190B2 (ja) 2010-06-01 2014-01-22 東京エレクトロン株式会社 基板処理システム及び基板処理方法
JP6045946B2 (ja) * 2012-07-13 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、プログラムおよび記録媒体

Also Published As

Publication number Publication date
JP2017069393A (ja) 2017-04-06
TWI612607B (zh) 2018-01-21
TW201724330A (zh) 2017-07-01
JP6562803B2 (ja) 2019-08-21
CN107710396A (zh) 2018-02-16
WO2017056710A1 (ja) 2017-04-06
CN107710396B (zh) 2021-12-03
KR102271107B1 (ko) 2021-06-29
KR20200063251A (ko) 2020-06-04

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E902 Notification of reason for refusal
E601 Decision to refuse application
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