KR20170091887A - Transient voltage suppressor and manufacturing method thereof - Google Patents
Transient voltage suppressor and manufacturing method thereof Download PDFInfo
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- KR20170091887A KR20170091887A KR1020160012714A KR20160012714A KR20170091887A KR 20170091887 A KR20170091887 A KR 20170091887A KR 1020160012714 A KR1020160012714 A KR 1020160012714A KR 20160012714 A KR20160012714 A KR 20160012714A KR 20170091887 A KR20170091887 A KR 20170091887A
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- 238000004519 manufacturing process Methods 0.000 title abstract description 12
- 238000002955 isolation Methods 0.000 claims abstract description 140
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- 238000000034 method Methods 0.000 claims abstract description 19
- 230000015572 biosynthetic process Effects 0.000 claims description 10
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052814 silicon oxide Inorganic materials 0.000 description 8
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- 229910052787 antimony Inorganic materials 0.000 description 6
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- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
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- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0296—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices involving a specific disposition of the protective devices
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Bipolar Integrated Circuits (AREA)
Abstract
A trench process is applied to form a plurality of isolation layers and a double buried layer of a first buried layer of the second conductivity type and a third buried layer of the first conductivity type is formed to reduce the capacitance and to increase the maximum allowable surge current (Ipp) and lowering a clamping voltage, and a method of manufacturing the same.
As an example, a substrate of a first conductivity type; A first epitaxial layer of a first conductivity type formed on the substrate; A first buried layer of a second conductivity type formed inside the first epitaxial layer and formed in a ring shape; a second buried layer of a first conductivity type formed inside the first buried layer; A second epitaxial layer of a first conductivity type formed on the first epitaxial layer and the first and second buried layers; A third buried layer of the first conductivity type formed in the second epitaxial layer and formed on the first buried layer and the second buried layer; A third epitaxial layer of a first conductivity type formed on top of the second epitaxial layer and the third buried layer; A plurality of isolation layers formed from the surface of the third epitaxial layer toward the substrate; And a second conductive type region formed inward from the surface of the third epitaxial layer, the second conductive type region being spaced apart from each other by the isolation layer.
Description
The present invention relates to a transient voltage suppressing element and a method of manufacturing the same.
Referring to FIG. 1, the operation principle and circuit diagram of a conventional transient voltage suppressing element are shown.
A transient voltage suppressing device TVS (for example, varistor, thyristor, diode (rectifier / zener)) is connected in parallel between a power source VG and a load RLOAD as shown in FIG. One side of the transient voltage suppressing element is connected to the ground (GND).
With this configuration, when the transient voltage exceeding the voltage required in the load RLOAD is input, the transient current ITV due to the transient voltage flows to the ground GND via the transient voltage suppressing element TVS, Only the stabilized low voltage is applied to the load RLOAD so that the load RLOAD is safely protected from the transient voltage.
A trench process is applied to form a plurality of isolation layers and a double buried layer of a first buried layer of the second conductivity type and a third buried layer of the first conductivity type is formed to reduce the capacitance and to increase the maximum allowable surge current (Ipp) and lowering the clamping voltage, and a method of manufacturing the same.
A transient voltage suppressor according to the present invention includes: a substrate of a first conductivity type; A first epitaxial layer of a first conductivity type formed on the substrate; A first buried layer of a second conductivity type formed inside the first epitaxial layer and formed in a ring shape; a second buried layer of a first conductivity type formed inside the first buried layer; A second epitaxial layer of a first conductivity type formed on the first epitaxial layer and the first and second buried layers; A third buried layer of the first conductivity type formed in the second epitaxial layer and formed on the first buried layer and the second buried layer; A third epitaxial layer of a first conductivity type formed on top of the second epitaxial layer and the third buried layer; A plurality of isolation layers formed from the surface of the third epitaxial layer toward the substrate; And a second conductive type region formed inward from the surface of the third epitaxial layer and spaced apart from each other by the isolation layer.
The third buried layer may contact the first buried layer and the second buried layer.
Wherein the isolation layer is formed in a circular ring shape and includes a first isolation layer formed at the center, a second isolation layer formed outside the first isolation layer, a third isolation layer formed outside the second isolation layer, And a fourth isolation layer formed outside the third isolation layer.
Wherein the first isolation layer is formed from the surface of the third epitaxial layer to the inside of the third buried layer and the second buried layer and the second isolation layer is formed from the surface of the third epitaxial layer to the inside of the third buried layer and the second buried layer, Wherein the third isolation layer is formed from the surface of the third epitaxial layer to the inside of the third buried layer and the fourth isolation layer is formed from the surface of the third epitaxial layer to the inside of the third epitaxial layer, The third buried layer and the first buried layer.
The second conductive type region may be formed inside the first isolation layer and between the second isolation layer and the third isolation layer.
A first diode may be formed on the junction surface of the second conductive type region and the third epitaxial layer on the inner side of the first isolation layer.
A second diode is formed on a junction surface between the second isolation layer and the third isolation layer, the junction surface of the second conductivity type region and the third epitaxial layer, and a junction between the third and the third isolation layers, And a second zener diode may be formed on a junction surface of the first buried layer and the substrate.
And an upper electrode formed on the third epitaxial layer and electrically connecting the second conductive type region may be further formed.
According to another aspect of the present invention, there is provided a method of fabricating a transient voltage suppressor, including: forming a first epitaxial layer of a first conductivity type on a substrate of a first conductivity type; A first embedding layer forming step of forming a ring-shaped first buried layer of a second conductivity type inside the first epitaxial layer and forming a second buried layer of the first conductivity type inside the first buried layer; A second epitaxial layer forming step of forming a second epitaxial layer of a first conductivity type on the first epitaxial layer and the first and second buried layers; Forming a second buried layer in the second epitaxial layer and forming a third buried layer of the first conductivity type on the first and second buried layers; A third epitaxial layer forming step of forming a third epitaxial layer of the first conductivity type on the second epitaxial layer and the third buried layer; Forming a plurality of spaced apart isolation layers from the surface of the third epitaxial layer toward the substrate; And forming a second conductive type region inwardly from the surface of the third epitaxial layer, the second conductive type region being spaced apart from each other by the isolation layer.
The third buried layer may be formed in contact with the first buried layer and the second buried layer in the second buried layer formation step.
In the isolation layer formation step, the isolation layer is formed in a circular ring shape, and the isolation layer includes a first isolation layer formed at the center, a second isolation layer formed outside the first isolation layer, And a fourth isolation layer formed on the outer side of the third isolation layer.
Wherein the first isolation layer is formed from the surface of the third epitaxial layer to the inside of the third buried layer and the second buried layer and the second isolation layer is formed from the surface of the third epitaxial layer to the inside of the third buried layer and the second buried layer, Wherein the third isolation layer is formed from the surface of the third epitaxial layer to the inside of the third buried layer and the fourth isolation layer is formed from the surface of the third epitaxial layer to the inside of the third epitaxial layer, The third buried layer and the first buried layer.
In the forming of the second conductivity type region, the second conductivity type region may be formed inside the first isolation layer and between the second isolation layer and the third isolation layer.
A first diode may be formed on the junction surface of the second conductive type region and the third epitaxial layer on the inner side of the first isolation layer.
A second diode is formed on a junction surface between the second isolation layer and the third isolation layer, the junction surface of the second conductivity type region and the third epitaxial layer, and a junction between the third and the third isolation layers, And a second zener diode may be formed on a junction surface of the first buried layer and the substrate.
And forming an upper electrode electrically connecting the second conductive type region on the third epitaxial layer after the second conductive type region forming step.
The transient voltage suppressing element and the method of fabricating the same according to the embodiment of the present invention are characterized in that a plurality of isolation layers are formed by applying a trench process, and a first buried layer of the second conductive type and a double layer of the third buried layer of the first conductive type By forming the buried layer, the capacitance can be reduced, the maximum allowable surge current Ipp can be improved, and the clamping voltage can be lowered.
Referring to FIG. 1, the operation principle and circuit diagram of a conventional transient voltage suppressing element are shown.
2 is a flowchart illustrating a method of manufacturing a transient voltage suppressing device according to an embodiment of the present invention.
3A to 3I are sectional views sequentially illustrating a method of manufacturing a transient voltage suppressor according to an embodiment of the present invention.
4 illustrates a transient voltage suppressor according to an embodiment of the present invention and a corresponding equivalent circuit.
5 shows an equivalent circuit using two transient voltage suppressing elements connected in accordance with an embodiment of the present invention.
DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily carry out the present invention.
Here, parts having similar configurations and operations throughout the specification are denoted by the same reference numerals. In addition, when a part is electrically connected to another part, it includes not only a direct connection but also a case where the other part is connected to the other part in between.
2 is a flowchart illustrating a method of manufacturing a transient voltage suppressing device according to an embodiment of the present invention. 3A to 3I are sectional views sequentially illustrating a method of manufacturing a transient voltage suppressor according to an embodiment of the present invention.
Referring to FIG. 2, a method of fabricating a transient voltage suppressor according to an exemplary embodiment of the present invention includes forming a first epitaxial layer (S1), a first buried layer (S2), a second epitaxial layer The isolation layer formation step S6, the second conductivity type region formation step S7, and the electrode formation step S8 are performed. .
3A, in the first epitaxial layer forming step S1, a
For example, the first
3B and 3C, in the first embedding layer forming step S2, a
The first buried
On the other hand, a bottom insulating film may be formed on the bottom surface of the
3D, a second
3E, a third buried
The third
The
The
The
The
The
The
3H, in the second conductive type region forming step S7, the second
More specifically, the second
The second
The second
3I, in the electrode forming step S8, the
The insulating
The
In addition, the
4 illustrates a transient voltage suppressor according to an embodiment of the present invention and a corresponding equivalent circuit. 5 shows an equivalent circuit using two transient voltage suppressing elements connected in accordance with an embodiment of the present invention.
On the other hand, the P-type and N-type junctions of the transient voltage suppressor have characteristics of a diode and a capacitor. That is, although the junctions of the P-type and N-type are shown as diodes in the drawing, they may be represented by capacitors. In the transient voltage suppressor, the
4, the transient voltage suppressor according to the embodiment of the present invention is located inside the
Further, as shown in FIG. 5, it is possible to implement a bidirectional transient voltage suppressor having low capacitance by connecting two transient voltage suppressing elements as described above in parallel. In addition, such a bidirectional transient voltage suppressing element can improve the maximum allowable surge current (Ipp) characteristic and realize a low limiting voltage (clamping voltage). For example, the present invention is a bidirectional transient voltage suppressing element of 5V / 0.5 pF class, having an ESD of 30KV or more and an Ipp value of 12A or more.
The transient voltage suppressor according to the present invention has a low capacitance and a high Ipp and a low limiting voltage (Vpp) by forming a first buried layer of the second conductivity type and a third buried layer of the first conductivity type on the first buried layer, (TVS with Clamping Voltage).
It is to be understood that the present invention is not limited to the above-described embodiment, and various modifications and changes may be made by those skilled in the art without departing from the scope of the present invention. It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
110: substrate 120: epitaxial layer
121: first epitaxial layer 122: second epitaxial layer
123: third epitaxial layer 131: first buried layer
132: second buried layer 133: third buried layer
140:
160: insulating film 170: upper electrode
180: lower electrode
Claims (16)
A first epitaxial layer of a first conductivity type formed on the substrate;
A first buried layer of a second conductivity type formed inside the first epitaxial layer and formed in a ring shape; a second buried layer of a first conductivity type formed inside the first buried layer;
A second epitaxial layer of a first conductivity type formed on the first epitaxial layer and the first and second buried layers;
A third buried layer of the first conductivity type formed in the second epitaxial layer and formed on the first buried layer and the second buried layer;
A third epitaxial layer of a first conductivity type formed on top of the second epitaxial layer and the third buried layer;
A plurality of isolation layers formed from the surface of the third epitaxial layer toward the substrate; And
And a second conductivity type region formed inward from the surface of the third epitaxial layer and spaced apart from each other by the isolation layer.
And the third buried layer is in contact with the first buried layer and the second buried layer.
Wherein the isolation layer is formed in a circular ring shape,
A second isolation layer formed on the outer side of the first isolation layer, a third isolation layer formed on the outer side of the second isolation layer, and a fourth isolation layer formed on the outer side of the third isolation layer, And wherein the transient voltage suppressing element comprises:
The first isolation layer is formed from the surface of the third epitaxial layer to the inside of the third buried layer and the second buried layer,
The second isolation layer is formed from the surface of the third epitaxial layer to the inside of the third buried layer and the first buried layer,
The third isolation layer is formed from the surface of the third epitaxial layer to the inside of the third buried layer,
Wherein the fourth isolation layer is formed from the surface of the third epitaxial layer to the inside of the third buried layer and the first buried layer.
And the second conductive type region is formed between the second isolation layer and the third isolation layer, inside the first isolation layer.
And a first diode is formed on a junction surface of the second conductivity type region and the third epitaxial layer on the inner side of the first isolation layer.
Between the second isolation layer and the third isolation layer,
A second diode is formed on a junction surface between the second conductive type region and the third epitaxial layer, a first Zener diode is formed on a junction surface between the third and the third buried layers, Wherein a second zener diode is formed on a junction surface of the second transistor.
And an upper electrode formed on the third epitaxial layer and electrically connecting the second conductive type region.
A first embedding layer forming step of forming a ring-shaped first buried layer of a second conductivity type inside the first epitaxial layer and forming a second buried layer of the first conductivity type inside the first buried layer;
A second epitaxial layer forming step of forming a second epitaxial layer of a first conductivity type on the first epitaxial layer and the first and second buried layers;
Forming a second buried layer in the second epitaxial layer and forming a third buried layer of the first conductivity type on the first and second buried layers;
A third epitaxial layer forming step of forming a third epitaxial layer of the first conductivity type on the second epitaxial layer and the third buried layer;
Forming a plurality of spaced apart isolation layers from the surface of the third epitaxial layer toward the substrate; And
And forming a second conductive type region inwardly from the surface of the third epitaxial layer and spaced apart from each other by the isolation layer.
Wherein the third buried layer is formed in contact with the first buried layer and the second buried layer in the second buried layer formation step.
In the isolation layer formation step, the isolation layer is formed in a circular ring shape,
Wherein the isolation layer comprises a first isolation layer formed at the center, a second isolation layer formed outside the first isolation layer, a third isolation layer formed outside the second isolation layer, and a second isolation layer formed outside the third isolation layer 4 isolating layer. ≪ RTI ID = 0.0 > 5. < / RTI >
The first isolation layer is formed from the surface of the third epitaxial layer to the inside of the third buried layer and the second buried layer,
The second isolation layer is formed from the surface of the third epitaxial layer to the inside of the third buried layer and the first buried layer,
The third isolation layer is formed from the surface of the third epitaxial layer to the inside of the third buried layer,
Wherein the fourth isolation layer is formed from the surface of the third epitaxial layer to the inside of the third buried layer and the first buried layer.
Wherein the second conductivity type region is formed in the first isolation layer and between the second isolation layer and the third isolation layer in the second conductivity type region formation step.
Wherein a first diode is formed on a junction surface of the second conductive type region and the third epitaxial layer on the inner side of the first isolation layer.
Between the second isolation layer and the third isolation layer,
A second diode is formed on a junction surface between the second conductive type region and the third epitaxial layer, a first Zener diode is formed on a junction surface between the third and the third buried layers, Wherein a second Zener diode is formed on a junction surface of the second Zener diode.
And forming an upper electrode electrically connecting the second conductive type region to the upper portion of the third epitaxial layer after the forming of the second conductive type region. / RTI >
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KR101951195B1 (en) * | 2017-08-22 | 2019-02-25 | 주식회사 시지트로닉스 | Bi-directional ULC-TVS semiconductor device and manufacturing method thereof |
US20230253397A1 (en) * | 2022-02-09 | 2023-08-10 | Semiconductor Components Industries, Llc | Semiconductor devices and methods of manufacturing semiconductor devices |
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DE102007024355B4 (en) | 2007-05-24 | 2011-04-21 | Infineon Technologies Ag | Method for producing a protective structure |
JP2012182381A (en) | 2011-03-02 | 2012-09-20 | Panasonic Corp | Semiconductor device |
KR101570217B1 (en) | 2014-07-09 | 2015-11-18 | 주식회사 케이이씨 | transient voltage suppressor and manufacturing method thereof |
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KR101951195B1 (en) * | 2017-08-22 | 2019-02-25 | 주식회사 시지트로닉스 | Bi-directional ULC-TVS semiconductor device and manufacturing method thereof |
US20230253397A1 (en) * | 2022-02-09 | 2023-08-10 | Semiconductor Components Industries, Llc | Semiconductor devices and methods of manufacturing semiconductor devices |
US11948933B2 (en) * | 2022-02-09 | 2024-04-02 | Semiconductor Components Industries, Llc | Semiconductor devices and methods of manufacturing semiconductor devices |
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