KR20170084727A - By-directional electrically conductive pattern module and semiconductor test socket using the same - Google Patents

By-directional electrically conductive pattern module and semiconductor test socket using the same Download PDF

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Publication number
KR20170084727A
KR20170084727A KR1020160003544A KR20160003544A KR20170084727A KR 20170084727 A KR20170084727 A KR 20170084727A KR 1020160003544 A KR1020160003544 A KR 1020160003544A KR 20160003544 A KR20160003544 A KR 20160003544A KR 20170084727 A KR20170084727 A KR 20170084727A
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KR
South Korea
Prior art keywords
bracket
elastic
elastic restoring
conductive pattern
semiconductor test
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KR1020160003544A
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Korean (ko)
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KR101801524B1 (en
Inventor
이지형
이은주
Original Assignee
주식회사 이노글로벌
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Priority to KR1020160003544A priority Critical patent/KR101801524B1/en
Priority to TW105101830A priority patent/TWI598592B/en
Publication of KR20170084727A publication Critical patent/KR20170084727A/en
Application granted granted Critical
Publication of KR101801524B1 publication Critical patent/KR101801524B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Environmental & Geological Engineering (AREA)

Abstract

The present invention relates to a bidirectional conductive pattern module for semiconductor testing and a semiconductor test socket using the same. A bidirectional conductive pattern module according to the present invention comprises: an upper bracket made of an insulating material; A lower bracket of an insulating material spaced apart from the upper bracket in the vertical direction; An elastic connecting portion for elastically connecting the upper bracket and the lower bracket in a state where the upper bracket and the lower bracket are spaced apart from each other in the vertical direction; A plurality of conductive upper contacts engaged with one surface of the upper bracket so as to be spaced along the plate surface direction of the upper bracket; A plurality of lower contact portions having conductivity to be coupled to one surface of the lower bracket so as to be spaced along the direction of the surface of the lower bracket; And a plurality of conductive connection portions electrically connecting the upper contact portion and the lower contact portion to each other. Accordingly, the upper bracket and the lower bracket are made independently of each other, and the upper contact pin and the lower contact pin are connected to each other through the conductive connection portion to form a conductive pattern in the vertical direction. Thus, fine pitch can be realized, It is possible to solve the problem of the existing technology which shortens the life due to the same problem.

Description

TECHNICAL FIELD [0001] The present invention relates to a bidirectional conductive pattern module for semiconductor testing and a semiconductor test socket using the same.

The present invention relates to a bidirectional conductive pattern module for semiconductor testing and a semiconductor test socket using the same. More particularly, the present invention relates to a bidirectional conductive pattern module for semiconductor testing, which can overcome the disadvantages of a pogo- To a semiconductor test socket.

The semiconductor device is subjected to a manufacturing process and then an inspection is performed to determine whether the electrical performance is good or not. Inspection is carried out with a semiconductor test socket (or a connector or a connector) formed so as to be in electrical contact with a terminal of a semiconductor element inserted between a semiconductor element and an inspection circuit board. Semiconductor test sockets are used in burn-in testing process of semiconductor devices in addition to final semiconductor testing of semiconductor devices.

The size and spacing of terminals or leads of semiconductor devices are becoming finer in accordance with the development of technology for integrating semiconductor devices and miniaturization trends and there is a demand for a method of finely forming spaces between conductive patterns of test sockets.

However, conventional Pogo-pin type semiconductor test sockets have a limitation in manufacturing semiconductor test sockets for testing integrated semiconductor devices. 1 to 3 are views showing an example of a conventional pogo-pin type semiconductor test socket disclosed in Korean Patent Laid-Open No. 10-2011-0065047.

1 to 3, the conventional semiconductor test socket 100 includes a housing 110 having a through hole 111 formed at a position corresponding to the terminal 131 of the semiconductor device 130 in a vertical direction, A pogo-pin 120 mounted in the through hole 111 of the housing 110 for electrically connecting the terminal 131 of the semiconductor device 130 and the pad 141 of the test apparatus 140, Lt; / RTI >

The configuration of the pogo-pin 120 includes a barrel 124 having a cylindrical shape, which is used as a pogo-pin body and has an empty interior, and a barrel 124 formed below the barrel 124 A contact tip 123 and a spring 122 connected to the contact tip 123 within the barrel 124 for contraction and expansion movement and a spring 122 connected to the contact tip 123, 130 for performing up-and-down movement in accordance with the contact with the contact pins 121.

At this time, the spring 122 contracts and expands while absorbing the mechanical impact transmitted to the contact pin 121 and the contact tip 123, and the pad 131 of the semiconductor device 130 and the pad (141) are electrically connected to check whether there is an electrical failure.

In the conventional pogo-pin type semiconductor test socket, a physical spring is used to maintain the elasticity in the vertical direction, and a spring and a pin are inserted into the barrel, and a barrel It is required to be inserted into the through hole of the housing again, so that the process is complicated and the manufacturing cost increases due to the complexity of the process.

In addition, the physical structure itself for realizing the electrical contact structure having elasticity in the up and down direction has a limitation in realizing the fine pitch, and in recent years, it has already reached a limit to be applied to the integrated semiconductor device.

In order to overcome the limitations of a pogo-pin type semiconductor device, a technique has been proposed in which a perforated pattern is formed in a vertical direction on a silicon body made of a silicone material of elastic material, To form a conductive pattern.

However, the PCR type semiconductor test socket also has a problem due to the structural limitations of the PCR type semiconductor test socket, such as shortening the lifetime due to the disengagement of the conductive powder filled in the inside.

Accordingly, there is a demand for development of other types of semiconductor test sockets after finishing the problems of the height limit and the semiconductor test socket of the other type such as the PCR type semiconductor test socket while enabling the implementation of the fine pitch.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to overcome the disadvantages of the pogo-pin type and the PCR type semiconductor test socket and to realize a fine pitch, And it is an object of the present invention to provide a bidirectional conductive pattern module for semiconductor testing and a semiconductor test socket using the same.

It is also an object of the present invention to provide a semiconductor test socket that can extend the lifetime of a semiconductor test socket by providing a new type of restoring force when the semiconductor element presses the semiconductor test socket downward in a test process of the semiconductor device.

This object is achieved according to the present invention by a bidirectional conductive pattern module for semiconductor testing, comprising: an upper bracket made of an insulating material; A lower bracket of an insulating material spaced apart from the upper bracket in the vertical direction; An elastic connecting portion for elastically connecting the upper bracket and the lower bracket in a state where the upper bracket and the lower bracket are spaced apart from each other in the vertical direction; A plurality of conductive upper contacts engaged with one surface of the upper bracket so as to be spaced along the plate surface direction of the upper bracket; A plurality of lower contact portions having conductivity to be coupled to one surface of the lower bracket so as to be spaced along the direction of the surface of the lower bracket; And a plurality of conductive connection parts electrically connecting the upper contact part and the lower contact part corresponding to each other.

The upper bracket is provided with a plurality of upper partition walls protruding from the plate surface of the upper bracket between the adjacent upper contact portions to spatially separate adjacent upper contact portions, The lower bracket may have a plurality of lower partition walls protruding from the plate surface of the lower bracket between the adjacent lower contact portions to spatially separate adjacent lower contact portions.

The upper bracket is provided with an upper through hole corresponding to each of the upper contact portions. The upper bracket is provided with an upper through-hole corresponding to each of the upper contact portions, To the upper bracket by curing of the bonding material to be bonded; Wherein the lower bracket is provided with a lower through hole corresponding to each of the lower contact portions, and each lower contact portion is disposed on one surface of the lower bracket, and is connected to the lower bracket through the lower through- And can be combined with the lower bracket by curing of the material.

The bonding material may be made of a material including liquid silicon having elasticity.

Each of the upper contact portions may be elastically movable upward and downward independently of each other by the elastic binding material.

Also, the conductive connection portion may be formed by twisting at least one conductive wire or a plurality of conductive wires.

The conductive connection portion may have a shape in which an intermediate region is bent in the direction of the plate surface.

The elastic connection portion may be formed of a material including silicone having elasticity.

The elastic connecting part may be composed of a top elastic part, a middle elastic part and a bottom elastic part, and the middle elastic part may be made of a material having a higher elasticity than the upper elastic part and the lower elastic part.

The elastic connection portion may include a mesh-type base sheet and a silicone-coated elastic layer coated on the base sheet.

The upper contact portion may include an upper conductive sheet having conductivity, and an upper conductive pin attached to the upper conductive sheet, the upper conductive pin protruding to an upper portion of the upper bracket.

According to another aspect of the present invention, the above object can be attained by a main housing having a main housing having a vertically opened shape and having a plurality of slots mutually opposing to each other, a pair of slits A plurality of semiconductor test bidirectional conductive pattern modules respectively inserted into the slots, and a plurality of semiconductor test bidirectional conductive pattern modules inserted into the slots, respectively, of the upper brackets of the semiconductor test bidirectional conductive pattern modules, A first elastic restoring portion elastically supporting the first upper supporting member and the second upper supporting member in an upward direction, and a second elastic restoring portion elastically supporting the first upper supporting member and the second upper supporting member, A restoration part; When the semiconductor test bidirectional conductive pattern module is pressed downward by the semiconductor device to be inspected and the upper bracket moves in the downward direction, the first elastic restoring portion and the second elastic restoring portion return the restoring force in the upward direction .

The apparatus may further include a first lower support member and a second lower support member extending from both sides of the main housing and supporting the lower sides of the first elastic restoration portion and the second elastic restoration portion, respectively; The first elastic restoring portion and the second elastic restoring portion each provide a restoring force in an upward direction between the first upper supporting member and the first lower supporting member and between the second upper supporting member and the second lower supporting member can do.

The first elastic restoring portion and the second elastic restoring portion may each include at least one elastic spring.

The first elastic restoring portion and the second elastic restoring portion may be provided in the form of bars having resiliency in the thickness direction and may be provided between the first upper supporting member and the first lower supporting member, 2 lower support members along the formation direction of the slit.

According to another aspect of the present invention, the above object can be attained by a main housing having a main housing having a vertically opened shape and having a plurality of slots mutually opposing to each other, a pair of slits A plurality of the bidirectional conductive pattern modules for semiconductor testing according to any one of claims 1 to 10 inserted into the first elastic restoration part and the second elastic restoration part respectively provided in the form of bars having elasticity in the thickness direction, Include; The upper bracket and the lower bracket of each of the bidirectional conductive pattern modules for semiconductor testing protrude to the outside of the main housing at both side edge portions when the slit is inserted into the slit; The first elastic restoring portion and the second elastic restoring portion are disposed between the upper bracket and the lower bracket that are disposed along the slit forming direction and protrude outward of the main housing; When the semiconductor test bidirectional conductive pattern module is pressed downward by the semiconductor device to be inspected and the upper bracket moves in the downward direction, the first elastic restoring portion and the second elastic restoring portion return the restoring force in the upward direction And a semiconductor test socket which is characterized in that the semiconductor test socket is provided.

According to the present invention, the upper bracket and the lower bracket are independently manufactured, and the upper contact pin and the lower contact pin are connected to each other through the conductive connection portion to form a conductive pattern in the vertical direction, There is provided a bi-directional conductive pattern module for semiconductor testing and a semiconductor test socket using the bi-directional conductive pattern module, which can solve the problems of the prior art in which life is shortened due to problems such as detachment of conductive powder.

Also provided is a semiconductor test socket that can extend the service life of the semiconductor test socket by separately providing a restoring force by the first elastic restoring portion and the second elastic restoring portion in addition to the restoring force of the bidirectional conductive pattern module for semiconductor testing.

Figs. 1 to 3 are views for explaining a conventional pogo-pin type semiconductor test socket,
4 is a perspective view of a bidirectional conductive pattern module for semiconductor testing according to an embodiment of the present invention,
Fig. 5 is a diagram showing the back surface of the bidirectional conductive pattern module for semiconductor test of Fig. 4,
Fig. 6 is a view showing an upper bracket and a lower bracket of the bidirectional conductive pattern module for semiconductor testing of Fig. 4,
7 to 9 are views for explaining a semiconductor test socket according to the first embodiment of the present invention,
10 and 11 are views for explaining a method of operating the semiconductor test socket according to the first embodiment of the present invention,
12 and 13 are views for explaining a semiconductor test socket according to a second embodiment of the present invention,
14 and 15 are views for explaining a semiconductor test socket according to a third embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 4 is a perspective view of a bidirectional conductive pattern module 1 for semiconductor testing according to an embodiment of the present invention, and FIG. 5 is a rear view of the bidirectional conductive pattern module 1 of FIG. 4 and 5, a bidirectional conductive pattern module 1 according to an embodiment of the present invention includes an upper bracket 10, a lower bracket 20, an elastic connecting portion 30, a plurality of upper contact portions 40 , A plurality of lower contact portions (50), and a plurality of conductive connecting portions (60). Here, one upper contact portion 40, one lower contact portion 50, and one conductive connection portion 60 are electrically connected to each other to form a conductive line in the vertical direction.

The upper bracket 10 is made of an insulating material. In the present invention, the upper bracket 10 is made of stainless steel. However, the upper bracket 10 may be made of a material having a different insulating property.

The lower bracket 20 is disposed in a state of being spaced apart from the upper bracket 10 in the vertical direction. Here, the lower bracket 20 may be made of an insulating material, for example, stainless steel, in the same manner as the upper bracket 10.

The elastic connecting portion 30 connects the upper bracket 10 and the lower bracket 20 such that the upper bracket 10 and the lower bracket 20 are spaced apart from each other in the vertical direction. Here, the elastic connecting portion 30 is made of an elastic material so that the upper bracket 10 and the lower bracket 20 are elastically connected. Accordingly, when the upper bracket 10 is pressed downward, the upper bracket 10 can be moved to the lower side by the tangs of the elastic connection portion 30, and when the downward pressure is removed, To the position of the < / RTI >

In an embodiment of the present invention, it is assumed that the elastic connecting portion 30 is made of a silicone material having elasticity. More specifically, the upper bracket 10 and the lower bracket 20 are inserted into the mold in a state of being spaced apart from each other in the vertical direction, and the liquid silicone is injected and cured to form the upper bracket 10 and the lower bracket 20, The elastic connecting portion 30 can be formed. Alternatively, liquid silicone may be applied to the upper bracket 10 and the lower bracket 20 so that the upper bracket 10 and the lower bracket 20 are spaced apart from each other in the vertical direction, ) Can be formed.

6 (b), the elastic connecting portion 30 according to the embodiment of the present invention includes the upper elastic portion 31, the intermediate elastic portion 32, and the lower elastic portion 33 Lt; / RTI > The intermediate elastic part 32 may be made of a material having a higher elasticity than the upper elastic part 31 and the lower elastic part 33. [

As a result, when the bidirectional conductive pattern module 1 according to the present invention is applied to the semiconductor test socket 100 to test the semiconductor device, the upper elastic portion 31 is pressed against the downward pressure exerted by the semiconductor element And the intermediate elastic part 32 maintains the shape of the bidirectional conductive pattern module 1 in the vertical direction.

The elastic connection portion 30 according to another embodiment of the present invention may include a base sheet in the form of a mesh and an elastic application layer of silicone cured in a state of being applied to the base sheet. The base sheet may be formed of an insulating material, and may be provided to have elasticity by an elastic coating layer of a silicon material.

The upper contact portion 40 is engaged with one surface of the upper bracket 10 so as to be spaced along the plate surface direction of the upper bracket 10. The lower contact portion 50 is coupled to one surface of the lower bracket 20 so as to be spaced along the plate surface direction of the lower bracket 20.

Here, the upper contact portion 40 and the lower contact portion 50 according to an embodiment of the present invention are provided in the form of conductive pins. As another example, the upper contact portion 40 includes an upper conductive sheet having conductivity and an upper conductive pin attached to the upper conductive sheet. Here, the upper conductive pin is attached so that the upper edge portion protrudes to the upper portion of the upper bracket 10, as shown in Figs. 4 and 5.

The upper conductive sheet may be fabricated using a flexible circuit board on which a conductive layer of copper is formed on one side or both sides of the PI film. At this time, nickel plating and gold plating may be sequentially performed to improve the electrical conductivity of the copper conductive layer.

Likewise, the lower contact portion 50 may be composed of the lower conductive sheet and the lower conductive pin, and the lower contact portion 50 may be composed of only the lower conductive sheet.

Meanwhile, in an embodiment of the present invention, a plurality of upper partition walls 11 are formed in the upper bracket 10. The upper partition wall portion 11 is formed protruding from the upper surface of the upper bracket 10 between the adjacent upper contact portions 40, as shown in Figs. Thus, by spatially separating the upper contact portions 40 adjacent to each other, the electrical connection between the adjacent upper contact portions 40 can be cut off.

Similarly, a plurality of lower partition walls 21 may be formed in the lower bracket 20. As shown in Figs. 4 and 6, the lower partition wall portion 21 has a lower bracket 20 between the adjacent lower contact shaft portions. ksaus. Thus, by spatially separating the lower contact shaft portions adjacent to each other, the electrical connection between the adjacent contact shaft contact portions can be cut off.

6, an upper through hole 12 corresponding to each upper contact portion 40 may be formed at a position where the plurality of upper contact portions 40 are engaged with each other in the upper bracket 10 . The curing of the bonding material 71 flowing from the other side of the upper bracket 10 through the upper through hole 12 in a state where the upper contact portion 40 is disposed on one surface of the upper bracket 10, The upper contact portion 40 can be coupled to the upper bracket 10.

Likewise, the lower bracket 20 may be provided with a lower through hole 22 corresponding to each lower contact portion 50 at a position where a plurality of lower contact portions 50 are engaged, as shown in FIG. 6 . The curing of the bonding material 72 flowing from the other side of the lower bracket 20 through the lower through-hole 22 in a state where the lower contact portion 50 is disposed on one surface of the lower bracket 20, The lower contact portion 50 can be coupled to the lower bracket 20. [

Here, it is exemplified that the bonding materials 71 and 72 are made of a material containing liquid silicon having elasticity. As a result, the elastic bonding materials 71 and 72 elastically support the upper contact portion 40 and the lower contact portion 50 in the upward and downward directions, respectively, so that the test process of the semiconductor device using the semiconductor test socket 100 The upper contact portion 40 and the lower contact portion 50 can be moved independently and elastically in the vertical direction, so that more stable contact is possible.

Referring again to FIG. 4, each of the conductive connection portions 60 connects the upper contact portion 40 and the lower contact portion 50, which correspond to each other, with each other. Thus, one upper contact portion 40, one conductive connection portion 60, and one lower contact portion 50 form one conductive line in the vertical direction from the upper portion. In the present invention, it is assumed that the conductive connection portion 60 is composed of one strand or a plurality of strands of conductive wires, or a plurality of strands of conductive wires are twisted.

Here, when the conductive connection portion 60 is provided in the form of a conductive wire, one side is attached to the upper contact portion 40 (for example, the upper conductive sheet) through soldering and the other side is connected to the lower contact portion 50 , The lower conductive sheet).

In addition, as shown in FIG. 4, the conductive connecting portion 60 is provided such that the intermediate region has a shape bent in the direction of the sheet surface. As a result, it is possible to prevent the conductive connecting portion 60 from being broken by the pressure applied in the downward direction during the testing process of the semiconductor device.

Through the above-described structure, the upper bracket 10 and the lower bracket 20 are independently manufactured, and the upper contact pin and the lower contact pin are connected to each other through the conductive connection portion 60 to form a conductive pattern in the vertical direction , It is possible to solve the problems of the conventional technology in which the lifetime can be shortened due to the problems such as the disconnection of the conductive powder while the fine pitch can be realized.

Hereinafter, the semiconductor test socket 100 according to the first embodiment of the present invention will be described in detail with reference to FIGS. 7 to 9. FIG.

7 to 9, the semiconductor test socket 100 according to the first embodiment of the present invention includes a main housing 110, a plurality of bidirectional conductive pattern modules 1 for semiconductor testing, A first elastic restoring portion 131, and a second elastic restoring portion 132. The first elastic restoring portion 131 and the second elastic restoring portion 132 are provided with a supporting member 121, a second lower supporting member 142,

Here, the bidirectional conductive pattern module 1 for semiconductor testing will not be described in detail as described above, and the reference numerals of the bidirectional conductive pattern module 1 for semiconductor testing shown in Figs. 7 to 9 are partially omitted Respectively.

The main housing 110 has an open shape in the up and down direction. In the first embodiment of the present invention, the main housing 110 has a substantially rectangular shape. A plurality of slits 111 are formed on the pair of opposite sides of the main housing 110 to correspond to each other.

Each of the bidirectional conductive pattern modules 1 for semiconductor test is inserted into a pair of slits 111 facing each other. That is, the two side edge portions of the lower bracket 20 of the bidirectional conductive pattern module 1 for semiconductor test are inserted into the pair of slits 111, and both side edge portions of the upper bracket 10 are connected to the slit 111 And is installed in the main housing 110.

Here, a cover (not shown) having a hollow frame is coupled to an upper portion of the main housing 110, so that a plurality of semiconductor test bidirectional conductive pattern modules 1 are exposed to the inside of the main housing 110 . At this time, when the cover is pressed down and fixed to the test apparatus, the lower contact portion 50 of the bidirectional conductive pattern module 1 is kept in contact with the pad of the test apparatus.

Here, the configuration in which the lower contact portion 50 maintains stable contact with the pad of the test apparatus may be provided in various forms. For example, a structure in which the cover is coupled to the test apparatus while the main housing 110 is pressed downward in a state where the bidirectional conductive pattern module 1 is fixed in the main housing 110 may be applied. As another example, the lower bracket 20 of the bidirectional conductive pattern module 1 may be configured to protrude from both sides of the main housing 110 more than the upper bracket 10, while the cover presses the lower bracket 20 downward A structure for coupling to a test apparatus may also be applicable.

9, the first upper support member 121 and the second upper support member 122 are arranged in a state in which the semiconductor test bidirectional conductive pattern module 1 is inserted into the slot, To the both sides in the direction of the plate surface of the upper brackets 10 of the module 1, respectively. The first upper support member 121 and the second upper support member 122 are brought into contact with the bottom surface of the upper bracket 10 in the first embodiment of the present invention.

The first elastic restoring portion 131 elastically supports the first upper support member 121 in the upward direction. The second elastic restoring portion 132 elastically supports the second upper support member 122 in the upward direction.

In the present invention, the first elastic restoring portion 131 and the second elastic restoring portion 132 are formed as elastic springs made of metal, as shown in FIG. 8, each of the first elastic restoring portion 131 and the second elastic restoring portion 132 is constituted by a pair of elastic springs, and the longitudinal direction of the first upper supporting member 121 And on both sides in the longitudinal direction of the second upper support member 122, as an example.

7, the semiconductor test socket 100 according to the first embodiment of the present invention includes a first lower support member 141 extending from both sides of the main housing 110, Member 142 as shown in FIG. The first lower support member 141 supports the lower side of the first elastic restoration portion 131 and the second lower support member 142 supports the lower side of the second elastic restoration portion 132. The first elastic restoring portion 131 provides a restoring force to the first upper supporting member 121 in an upward direction between the first upper supporting member 121 and the first lower supporting member 141, The restoring portion 132 provides a restoring force to the second upper support member 122 in an upward direction between the second upper support member 122 and the second lower support.

Hereinafter, a method of operating the semiconductor test socket 100 in the process of testing a semiconductor device using the semiconductor test socket 100 according to the first embodiment of the present invention will be described with reference to FIGS. 10 and 11. FIG.

First, a terminal such as a ball grid formed in a semiconductor device may have a constant size, but may be different as shown in FIG. 10 (a). When the semiconductor device is lowered for testing, the upper contact portion 40 of the bidirectional conductive pattern module 1, which contacts the terminal projecting further toward the semiconductor test socket 100, as shown in FIG. 10 (b) As described above, each of the upper contact portions 40 can be independently movably provided and can be lowered independently of the other upper contact portions 40.

11 (a), all the terminals of the semiconductor element are lowered in contact with the upper contact portion 40, and a certain pressure is applied to the lower side The upper bracket 10 presses the first upper support member 121 and the second upper support member 122 in the downward direction so that the upper bracket 10 10) is lowered. 10 (b), 11 (a) and 11 (b), the elastic connecting portion 30 is also in a state of elastically supporting the upper bracket 10 against the pressure in the downward direction .

10 (a)) due to the elastic restoring force of the first elastic restoring portion 131 and the second elastic restoring portion 132 when the semiconductor device is removed after the test is completed, ).

The pressure generated in the lower direction in the test process of the semiconductor device is applied to each of the upper contact portion 40, the elastic connecting portion 30, the first elastic restoring portion 131 and the second elastic restoring portion 132 So that more stable contact can be achieved.

The first elastic restoring portion 131 and the second elastic restoring portion 132 may be formed in the same manner even if the elastic force of the bonding material 71 or the elastic connecting portion 30 supporting the upper contact portion 40 is lowered by the continuous testing process. The life of the semiconductor test socket 100 can be extended by restoring the upper bracket 10 to its original position.

Hereinafter, a semiconductor test socket 100a according to a second embodiment of the present invention will be described with reference to FIGS. 12 and 13. FIG. Here, the configuration of the semiconductor test socket 100a according to the second embodiment of the present invention is a modified example of the first embodiment, and the configurations of the first elastic restoring portion 131a and the second elastic restoring portion 132a are different .

The first elastic restoring portion 131a and the second elastic restoring portion 132a according to the second embodiment of the present invention may be provided in the shape of a thin strip having elasticity in the thickness direction. For example, the first elastic restoring portion 131a and the second elastic restoring portion 132a may be made of a silicone material.

The first elastic restoring portion 131a may be disposed between the first upper supporting member 121 and the first lower supporting member 141 along the forming direction of the slit 111. [ The second elastic restoring portion 132a may be disposed between the second upper support member 122 and the second lower support member 142 along the direction in which the slit 111 is formed.

According to the above configuration, the semiconductor test socket 100 according to the second embodiment of the present invention provides the same functions and effects as those of the first embodiment.

Hereinafter, a semiconductor test socket 100b according to a third embodiment of the present invention will be described with reference to FIGS. 14 and 15. FIG. Here, the configuration of the semiconductor test socket 100b according to the third embodiment of the present invention is a modification of the second embodiment.

14 and 15, the semiconductor test socket 110b according to the third embodiment of the present invention includes a main housing 110, a bidirectional conductive pattern module 1, a first elastic restoring portion 131b, And a second elastic restoring portion 132b. Here, the structures of the main housing 110 and the bidirectional conductive pattern module 1 correspond to the first and second embodiments, and a description thereof will be omitted.

As in the second embodiment, the first elastic restoring portion 131b and the second elastic restoring portion 132b are provided in the shape of bars having elasticity in the thickness direction. As shown in Figs. 14 and 15, As shown in Fig.

When the upper bracket 10 and the lower bracket 20 of each bidirectional conductive pattern module 1 are inserted into the slit 111, both side edge portions protrude out of the main housing 110. [

15, the first elastic restoring portion 131b and the second elastic restoring portion 132b may be formed in the shape of a slit 111 protruding to the outside of the main housing 110 along the forming direction of the slit 111 Is disposed between the bracket (10) and the lower bracket (20).

That is, in the third embodiment of the present invention, the first upper support member 121, the second upper support member 122, the first lower support member 141, and the second lower support member 142 of the second embodiment And the first elastic restoring portion 131b and the second elastic restoring portion 132b provide a restoring force between the upper bracket 10 and the lower bracket 20. [ This allows the first elastic restoring portion 131b and the second elastic restoring portion 132b to contact the upper bracket 10 when the bi-directional conductive pattern module 1 is pressed downward and the upper bracket 10 moves downward. 10 in the upward direction.

Although several embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various modifications may be made without departing from the principles and spirit of the invention . The scope of the invention will be determined by the appended claims and their equivalents.

1: bidirectional conductive pattern module 10: upper bracket
11: upper partition wall portion 12: upper through hole
20: lower bracket 21: lower partition wall
22: lower through hole 30: elastic connection part
31: upper elastic part 32: intermediate elastic part
33: lower elastic portion 40: upper contact portion
50: lower contact portion 60:
71,72: bonding material 100,100a: semiconductor test socket
110: main housing 111: slit
121: first upper support member 122: second upper support member
131, 131a: first elastic restoring portion 132, 132a: second elastic restoring portion
141: first lower support member 142: second lower support member

Claims (16)

A bidirectional conductive pattern module for semiconductor testing,
An upper bracket made of an insulating material;
A lower bracket of an insulating material spaced apart from the upper bracket in the vertical direction;
An elastic connecting portion for elastically connecting the upper bracket and the lower bracket in a state where the upper bracket and the lower bracket are spaced apart from each other in the vertical direction;
A plurality of conductive upper contacts engaged with one surface of the upper bracket so as to be spaced along the plate surface direction of the upper bracket;
A plurality of lower contact portions having conductivity to be coupled to one surface of the lower bracket so as to be spaced along the direction of the surface of the lower bracket;
And a plurality of conductive connection parts electrically connecting the upper contact part and the lower contact part to each other electrically corresponding to each other. The method according to claim 1,
Wherein the upper bracket is provided with a plurality of upper partition portions protruding from the plate surface of the upper bracket between the adjacent upper contact portions and spatially separating adjacent upper contact portions;
Wherein the lower bracket is formed with a plurality of lower partition walls protruding from the plate surface of the lower bracket between adjacent lower contact portions and spatially separating adjacent lower contact portions. The method according to claim 1,
Wherein the upper bracket is provided with an upper through hole corresponding to each of the upper contact portions, and the upper bracket is provided with an upper through hole corresponding to each of the upper and lower brackets, Engages the upper bracket by curing the material;
Wherein the lower bracket is provided with a lower through hole corresponding to each of the lower contact portions, and each lower contact portion is disposed on one surface of the lower bracket, and is connected to the lower bracket through the lower through- Wherein the lower bracket is bonded to the lower bracket by curing of the material. The method of claim 3,
Wherein the bonding material is made of a material including liquid silicone having elasticity. The method of claim 3,
Wherein each of the upper contact portions is provided so as to be elastically movable upward and downward independently of each other by the bonding material having elasticity. The method according to claim 1,
Wherein the conductive connection portion is formed by at least one conductive wire or a plurality of conductive wires are twisted. The method according to claim 6,
Wherein the conductive connection portion has a shape in which an intermediate region is bent in the direction of the plate surface. The method according to claim 1,
Wherein the elastic connecting portion is made of a material containing silicon having elasticity. 9. The method of claim 8,
Wherein the elastic connecting portion is composed of a top elastic portion, an intermediate elastic portion, and a bottom elastic portion, and the intermediate elastic portion is formed of a material having stronger elasticity than the upper elastic portion and the lower elastic portion. module. The method according to claim 1,
The elastic connection portion
A mesh-type base sheet,
And an elastic coating layer of a silicone material cured in a state of being applied to the base sheet. The method according to claim 1,
The upper contact
An upper conductive sheet having conductivity,
And an upper conductive pin attached to the upper conductive sheet and having an upper edge projecting to an upper portion of the upper bracket. A main housing having a shape opened in a vertical direction and having a plurality of slots mutually corresponding to a pair of opposite sides,
A plurality of bidirectional conductive pattern modules for semiconductor testing according to any one of claims 1 to 10 inserted into a pair of mutually opposing slits,
A first upper support member and a second upper support member which are respectively in contact with both sides of the upper brackets of the upper side brackets of the semiconductor test bidirectional conductive pattern module in a state where a plurality of the semiconductor test bidirectional conductive pattern modules are inserted into the slots, ,
And a first elastic restoring portion and a second elastic restoring portion that elastically support the first upper support member and the second upper support member in an upward direction, respectively;
When the semiconductor test bidirectional conductive pattern module is pressed downward by the semiconductor device to be inspected and the upper bracket moves in the downward direction, the first elastic restoring portion and the second elastic restoring portion return the restoring force in the upward direction Wherein said semiconductor test socket is a semiconductor test socket. 13. The method of claim 12,
Further comprising a first lower support member and a second lower support member extending from both sides of the main housing and supporting the lower sides of the first elastic restoration portion and the second elastic restoration portion, respectively;
The first elastic restoring portion and the second elastic restoring portion each provide a restoring force in an upward direction between the first upper supporting member and the first lower supporting member and between the second upper supporting member and the second lower supporting member Wherein said semiconductor test socket is a semiconductor test socket. 14. The method of claim 13,
Wherein the first elastic restoring portion and the second elastic restoring portion each include at least one elastic spring. 14. The method of claim 13,
Wherein the first elastic restoring portion and the second elastic restoring portion are provided in the form of bars having resiliency in the thickness direction and are provided between the first upper supporting member and the first lower supporting member, And the support member is disposed between the support members along the formation direction of the slit. A main housing having a shape opened in a vertical direction and having a plurality of slots mutually corresponding to a pair of opposite sides,
A plurality of bidirectional conductive pattern modules for semiconductor testing according to any one of claims 1 to 10 inserted into a pair of mutually opposing slits,
A first elastic restoring portion and a second elastic restoring portion provided in a bar shape having elasticity in the thickness direction;
The upper bracket and the lower bracket of each of the bidirectional conductive pattern modules for semiconductor testing protrude to the outside of the main housing at both side edge portions when the slit is inserted into the slit;
The first elastic restoring portion and the second elastic restoring portion are disposed between the upper bracket and the lower bracket that are disposed along the slit forming direction and protrude outward of the main housing;
When the semiconductor test bidirectional conductive pattern module is pressed downward by the semiconductor device to be inspected and the upper bracket moves in the downward direction, the first elastic restoring portion and the second elastic restoring portion return the restoring force in the upward direction Wherein said semiconductor test socket is a semiconductor test socket.
KR1020160003544A 2016-01-12 2016-01-12 By-directional electrically conductive pattern module and semiconductor test socket using the same KR101801524B1 (en)

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CN112041689A (en) * 2018-04-13 2020-12-04 黄东源 Contact for testing semiconductor device and test socket
CN112041689B (en) * 2018-04-13 2024-03-12 黄东源 Contact and test socket for testing semiconductor device
KR102266367B1 (en) * 2020-11-13 2021-06-17 주식회사 프로이천 Probe Pin Block
KR102607955B1 (en) * 2023-07-14 2023-12-01 미르텍알앤디 주식회사 Test socket having mesh type fin and blade fin

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KR101801524B1 (en) 2017-11-28
TWI598592B (en) 2017-09-11

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