KR20170082357A - Jig apparatus using for LED chip test - Google Patents

Jig apparatus using for LED chip test Download PDF

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Publication number
KR20170082357A
KR20170082357A KR1020160001652A KR20160001652A KR20170082357A KR 20170082357 A KR20170082357 A KR 20170082357A KR 1020160001652 A KR1020160001652 A KR 1020160001652A KR 20160001652 A KR20160001652 A KR 20160001652A KR 20170082357 A KR20170082357 A KR 20170082357A
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KR
South Korea
Prior art keywords
led chip
groove
holder
guide groove
seating portion
Prior art date
Application number
KR1020160001652A
Other languages
Korean (ko)
Inventor
박형배
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020160001652A priority Critical patent/KR20170082357A/en
Publication of KR20170082357A publication Critical patent/KR20170082357A/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • G01R1/06738Geometry aspects related to tip portion
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2607Circuits therefor
    • G01R31/2632Circuits therefor for testing diodes
    • G01R31/2635Testing light-emitting diodes, laser diodes or photodiodes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889Interfaces, e.g. between probe and tester
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Abstract

One embodiment of a jig device for inspecting an LED chip includes a seating part on which the LED chip is seated; A holder disposed in the guide groove formed in the seating portion, the holder being guided by the guide groove and movable on the seating portion; And a contact pin coupled to the holder and electrically connected to the LED chip.

Description

 [0001] The present invention relates to a jig apparatus for LED chip testing,

The embodiment relates to a jig device for inspecting an LED chip capable of performing a characteristic inspection of an LED chip having various shapes and sizes without changing the size or structure.

The contents described in this section merely provide background information on the embodiment and do not constitute the prior art.

LED (Light Emitting Diode) has various advantages such as making light with high brightness compared to power consumption, making various colors of light, and downsizing.

Due to these advantages of LEDs, LEDs are widely used in lighting, display and other various sales.

The LEDs may be fabricated from, for example, LED chips, and the LED chips may be electrically connected to each other to perform various functions.

The manufactured LED chip may include an LED and a terminal for electrical connection to an external power source. It is necessary to check the electrical characteristics, optical characteristics and other characteristics of the manufactured LED chip to determine whether or not the LED chip is defective.

The characteristic inspection of the LED chip may be performed in a jig device for conducting the inspection after the LED chip is operated by energizing the terminal and the external power source.

The size and shape of the LED chip may vary, and thus the position of the terminal formed on the LED chip may be varied. Therefore, in order to inspect LED chips having various shapes and sizes, it is necessary to individually manufacture and use jig devices corresponding to the shape and size of each LED chip in order to energize the terminals of LED chips disposed at various positions .

Therefore, the embodiment relates to a jig device for inspecting an LED chip capable of performing characteristic inspection of LED chips having various shapes and sizes without changing the size or structure.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.

One embodiment of a jig device for inspecting an LED chip includes a seating part on which the LED chip is seated; A holder disposed in the guide groove formed in the seating portion, the holder being guided by the guide groove and movable on the seating portion; And a contact pin coupled to the holder and electrically connected to the LED chip.

The seating portion may be formed in a plate shape, and a through-hole through which the LED chip is disposed may be formed at a central portion.

The guide grooves may be provided in pairs in positions symmetrical to each other with respect to the center of the through-hole, and the holder may be provided in each of the pair of guide grooves.

The seat portion may be provided with a connector for electrical connection with an external device on a side surface thereof.

The holder may be configured to be electrically connected to the connector and receive an electrical signal from an external device through the connector.

The holder may be provided to move up and down with respect to the seating part.

Wherein the guide groove includes a first groove provided in a slit shape in the x-axis direction that is away from or closer to the LED chip mounted on the seating portion; And a second groove communicating with the first groove and provided in a slit shape in a y-axis direction orthogonal to the x-axis.

The guide groove may be formed by combining the first groove and the second groove in a T-shape.

The contact pin may be formed by bending the end portion in the downward direction.

Another embodiment of a jig device for inspecting an LED chip includes a seating part on which the LED chip is seated; A first groove formed in a pair in the seating portion and provided in a slit shape in the x-axis direction to be distant from or close to the LED chip mounted on the seating portion; and a first groove communicating with the first groove, a guide groove including a second groove provided in a slit shape in the y-axis direction; A pair of holders disposed in the pair of guide grooves and guided by the guide grooves to be movable on the seating portion; And a pair of contact pins, which are respectively coupled to the pair of holders, and which are in electrical contact with the LED chip.

In the embodiment, since the guide groove is formed in the seating portion and the holder can move along the guide groove, even when the characteristics of the LED chips having various sizes and shapes are examined, individual jig devices It is possible to proceed with the characteristic inspection using one jig device.

Therefore, since the characteristic inspection of the LED chips having various sizes and shapes can be performed by using one jig device, the characteristic inspection process of the LED chips can be shortened and the cost can be reduced.

1 is a plan view showing a jig for testing an LED chip according to an embodiment.
2 is a side sectional view showing a jig for testing an LED chip according to an embodiment.
3 is an enlarged cross-sectional view showing part A of Fig.
4 is a view for explaining the operation of the LED chip inspection jig apparatus according to one embodiment.
5 is a side sectional view for explaining the operation of a jig for testing an LED chip according to an embodiment.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The embodiments are to be considered in all aspects as illustrative and not restrictive, and the invention is not limited thereto. It is to be understood, however, that the embodiments are not intended to be limited to the particular forms disclosed, but are to include all modifications, equivalents, and alternatives falling within the spirit and scope of the embodiments. The sizes and shapes of the components shown in the drawings may be exaggerated for clarity and convenience.

The terms "first "," second ", and the like can be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. In addition, terms specifically defined in consideration of the constitution and operation of the embodiment are only intended to illustrate the embodiments and do not limit the scope of the embodiments.

In the description of the embodiments, when it is described as being formed on the "upper" or "on or under" of each element, the upper or lower (on or under Quot; includes both that the two elements are in direct contact with each other or that one or more other elements are indirectly formed between the two elements. Also, when expressed as "on" or "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

It is also to be understood that the terms "top / top / top" and "bottom / bottom / bottom", as used below, do not necessarily imply nor imply any physical or logical relationship or order between such entities or elements, But may be used only to distinguish one entity or element from another entity or element. Further, in the drawings, an orthogonal coordinate system (x, y, z) can be used.

1 is a plan view showing a jig device for inspecting an LED chip 10 according to an embodiment. 2 is a side sectional view showing a jig device for inspecting an LED chip 10 according to an embodiment. 3 is an enlarged cross-sectional view showing part A of Fig. The jig device of the embodiment may include a seating part 100, a holder 200, and a contact pin 300.

The jig device of the embodiment can inspect the characteristics of the LED chip 10 by applying a current to the manufactured LED chip 10. The characteristics of the LED chip 10 that can be inspected in the jig device of the embodiment include, for example, electrical characteristics, that is, whether there is an electrical short or a short in the LED chip 10, Whether or not the resistance value of the resistor 31 matches the design value, and the like.

In addition, the characteristics of the LED chip 10 may be, for example, whether the light has an optical characteristic, that is, light having a luminance, a luminance and a color matching the design value when the LED chip 10 is supplied with electric current. In addition, various characteristics of the LED chip 10 may be inspected in the jig device in addition to the above-described characteristics.

The LED chip 10 may be seated on the seating part 100. As shown in FIGS. 1 and 2, the seating portion 100 may be formed in a plate shape, and a through hole 120 through which the LED chip 10 is disposed may be formed at a central portion thereof.

The seating part 100 may include a guide groove 110, a through hole 120, and a connector 130. The through hole 120 is formed in the center of the seating part 100 through the seating part 100 and the LED chip 10 to be inspected may be disposed thereon.

The guide groove 110 may be formed in the seating part 100 and the lower part of the holder 200 is inserted into the guide groove 110. The holder 200 is guided by the guide groove 110 And can move on the seating part 100. The structure and role of the guide groove 110 will be described in detail below with reference to Figs. 1 to 3. Fig.

The seating part 100 may be provided with a connector 130 for electrical connection with an external device on a side surface thereof. The connector 130 is provided on a side surface of the seating part 100 and may serve to electrically connect the external device and the seating part 100.

At this time, the external device may be, for example, a power source. The seating part 100 receives current from an external power source through the connector 130 and the current is supplied through the holder 200 and the contact pin 300 which are electrically connected to the seating part 100 again And may be applied to the LED chip 10.

By applying a current to the LED chip 10, various characteristics of the LED chip 10 can be inspected. The connector 130 may be provided in a socket shape having a plurality of connection terminals, for example, as shown in FIG.

However, the present invention is not limited thereto, and the socket may be provided in various shapes and systems in consideration of the shape, size, and the like of the seating part 100.

The holder 200 may be disposed in a guide groove 110 formed in the seating portion 100 and may be guided by the guide groove 110 to be movable on the seating portion 100.

The lower portion of the holder 200 may be inserted into the guide groove 110 and move two-dimensionally on the seating portion 100 along the guide groove 110. That is, as shown in FIG. 1, since the guide grooves 110 can be formed in the x-axis direction and the y-axis direction orthogonal to each other, the holder 200 can be moved along the guide grooves 110 100). ≪ / RTI >

The holder 200 is electrically connected to the connector 130 so that an electrical signal, for example, current can be received from an external device through the connector 130. The lower portion of the holder 200 may be inserted into the guide groove 110 of the seating portion 100 and electrically connected to the seating portion 100 and the connector 130.

The holder 200 may be electrically connected to the contact pin 300. The current supplied from the external power supply to the jig device can be applied to the LED chip 10 to be inspected through the connector 130, the mount 100, the holder 200 and the contact pin 300. [

In addition, the holder 200 may be provided to move up and down with respect to the seating part 100. As shown in FIG. 1, the holder 200 may be provided to move in a z-axis direction perpendicular to the x-y plane.

As the holder 200 moves in the vertical direction, the contact pins 300 can also move up and down. The contact pins 300 are moved in the vertical direction to come in contact with the chip terminals 11 of the LED chip 10 disposed in the seating portion 100, And the LED chip 10 can be easily energized.

The contact pin 300 may be coupled to the holder 200 and may be in contact with the LED chip 10 so as to be energized. The contact pin 300 is electrically connected to the LED chip 10, so that a current can be applied to the LED chip 10.

The LED chip 10 is provided with at least two chip terminals 11 and at least two of the chip terminals 11 must be electrically connected to the external power source so that the contact pins 300 are provided in pairs, So that the holder 200 and the guide groove 110 can also be provided as a pair, respectively.

Of course, the guide groove 110, the holder 200, and the contact pin 300, which are provided as a pair, are formed in the mounting part 100 so that a pair of pieces are not electrically short- It is necessary to constitute a circuit which is energized with the respective pieces and is not short-circuited with each other.

As shown in FIG. 2, the contact pin 300 may be formed by bending the end portion 310 in the downward direction. This is because the end portion 310 of the contact pin 300 can accurately and precisely contact the chip terminal 11 of the LED chip 10.

Hereinafter, the structure of the guide groove 110 will be described in detail with reference to FIGS. 1 to 3. FIG. As shown in FIG. 3, the guide groove 110 may be formed to have an opening on the upper surface of the seating part 100.

The holder 200 may be inserted into the guide groove 110 so that the holder 200 can be smoothly moved in the guide groove 110.

The width of the guide groove 110 may be determined in consideration of the diameter of the holder 200. That is, the holder 200 can be inserted into the guide groove 110 to move in the x-axis, y-axis, and z-axis directions, and the holder 200 does not descend itself downward due to the load, It may be appropriate to set the width of the guide groove 110 so that the guide groove 110 can be maintained.

Meanwhile, the holder 200 needs to be electrically connected to the connector 130. Accordingly, the seating part 100 may be provided with a conductive wire to be electrically connected to the connector 130, and the conductive wire may be electrically connected to the holder 200. [

For example, a terminal connected to the lead wire in the guide groove 110 is formed by plating or the like so that the lead wire and the guide groove 110 are electrically connected to each other, .

However, the present invention is not limited thereto, and the holder 200 can move in the x-axis, y-axis, and z-axis directions along the guide groove 110, and can move the holder 200 and the connector 130 The lead wire and the holder 200 may be electrically connected to each other in any manner.

As shown in FIGS. 1 and 2, the guide grooves 110 are provided at a pair of positions symmetrical to each other with respect to the center of the through hole 120, and the pair of guide grooves 110 The holder 200 may be provided.

As described above, since the LED chip 10 is provided with at least two chip terminals 11 and each of the at least two chip terminals 11 must be electrically connected to the external power source, the guide groove 110, (200) and the contact pins (300) may be provided as a pair, respectively.

The guide groove 110 may include a first groove 111 and a second groove 112. 1, the first groove 111 may guide the movement of the guide groove 110 in the x-axis direction, and the second groove 112 may guide the movement of the guide groove 110 in the x- it is possible to guide movement in the y-axis direction.

1 and 2, the first groove 111 is formed in a slit shape in the x-axis direction which is distant from or close to the LED chip 10 mounted on the seating part 100 . The second grooves 112 may be formed in a slit shape in a y-axis direction that is in communication with the first grooves 111 and orthogonal to the x-axis.

The determination of the width of the first groove 111 and the second groove 112 has already been described above. The length of the first groove 111 and the length of the second groove 112 are determined by a length corresponding to the moving distance in consideration of the design moving distance of the holder 200 that is guided by the guide groove 110 .

As shown in FIG. 1, the guide groove 110 may be formed in a T shape, for example, by combining the first groove 111 and the second groove 112. The guide groove 110 is formed in a T shape so that the holder 200 inserted into the guide groove 110 can move on the xy plane on the seating part 100.

In another embodiment, the guide groove 110 may be formed by a combination of the first groove 111 and the second groove 112 to have a ten-sided shape. In another embodiment, the guide grooves 110 are spaced apart from each other in a plurality of first grooves 111 in a longitudinal direction of the one second grooves 112, and the second grooves 112, The plurality of first grooves 111 may be formed so as to communicate with each other.

1, the pair of guide grooves 110 are provided at positions symmetrical to each other with respect to the center of the through hole 120, but this is only an example. In another embodiment, the pair of guide grooves 110 are disposed adjacent to the through-hole 120 and may be provided at asymmetrical positions with respect to each other.

It goes without saying that the above-described embodiments can be combined with each other. According to various embodiments, the guide groove 110 can be arranged in various shapes and various positions, and accordingly, the LED chip 10 having chip terminals 11 formed in various shapes and various positions can be provided with contact pins 300 can be easily brought into contact with the LED chip 10 to inspect the characteristics of the LED chip 10.

4 is a view for explaining the operation of a jig device for inspecting an LED chip 10 according to an embodiment. 5 is a side cross-sectional view for explaining the operation of the jig device for inspecting the LED chip 10 according to the embodiment.

4, chip terminals 11 are formed in asymmetrical positions with respect to the center of the LED chip 10 in the LED chip 10 to be inspected in the embodiment. That is, the chip terminals 11 shown on the left side in FIG. 4 are formed at the edge portions of the LED chip 10.

Therefore, when the end 310 of the contact pin 300 is brought into contact with the chip terminal 11 on the left side in the drawing, the following method can be used.

First, the LED chip 10 is disposed in a through hole 120 formed in the seating part 100. At this time, in order to stably support the LED chip 10, a support 20 on which the LED chip 10 is placed may be used. At this time, the support base 20 can be maintained in position by another mechanism, apparatus, or the like. Other apparatuses and apparatuses shown for the sake of simplicity are omitted.

Next, each of the pair of holders 200 is lowered to bring the end 310 of the contact pin 300 into contact with the chip terminal 11. However, the holder 200 needs to move in the y-axis direction in order to contact the contact pin 300 with the chip terminal 11 shown on the left side of the drawing.

That is, the holder 200 shown on the left side in the drawing first moves in the y-axis direction and is disposed at a position shown by a dotted line. At this time, the holder 200, 200 ', and the contact pins 300 and 300' are moved so that the ends 310 of the contact pins 300 and 300 'contact the chip terminals 11 on the xy plane You will be in a position where you can.

Next, the holders 200 and 200 'are lowered to bring the end portions 310 of the contact pins 300 and 300' into contact with the chip terminals 11.

After the contact between the contact pin 300 and the chip terminal 11 is completed according to the above procedure, electric current, optical characteristic and various other characteristics of the LED chip 10 to be inspected are inspected by applying a current to the jig device .

On the other hand, the size of the LED chip 10 may vary, but the size of the jig device may be constant. Therefore, if the LED chip 10 of various sizes is disposed on the seating part 100, the holder 200 is moved in the x-axis direction along the first groove 111, The contact pin 300 can be brought into contact with the chip terminal 11 whose position is changed on the seating part 100 according to the size.

The x-axis, y-axis and z-axis movement of the holder 200 can be performed manually, for example, by an operator. That is, the operator can manually move the holder 200 to bring the contact pin 300 into contact with the chip terminal 11. [

In another embodiment, the jig device includes a position sensor for sensing the position of the chip terminal 11, a driving device for driving the holder 200, and a control device for controlling the position sensor and the driving device The holder 200 can be automatically moved in the x-axis, y-axis, and z-axis directions.

In the case of a jig device in which the guide groove 110 of the embodiment is not formed, the holder is fixed at a specific position on the seat, so that the contact pin that engages with the holder also has to be fixed at a specific position on the seat.

As the LED chips have various sizes and shapes, it is impossible to test the characteristics of the LED chips by contacting the contact pins with all the chip terminals of the LED chips formed at various positions.

Accordingly, since the size and shape of the LED chips are different from each other in the jig device having such a structure, it is inevitable to individually test the characteristics of the LED chip by making individual jig devices. As a result, the time, cost, It can increase effort.

The LED chip 10 having various sizes and shapes can be formed by providing the guide groove 110 in the seating part 100 and allowing the holder 200 to move along the guide groove 110. [ It is possible to perform the characteristic inspection using a single jig device without providing individual jig devices for each of the LED chips 10.

Therefore, since the characteristic inspection of the LED chips 10 having various sizes and shapes can be performed using one jig device, the process of inspecting the characteristics of the LED chips 10 can be shortened and the cost can be reduced.

While only a few have been described above with respect to the embodiments, various other forms of implementation are possible. The technical contents of the embodiments described above may be combined in various forms other than the mutually incompatible technologies, and may be implemented in a new embodiment through the same.

10: LED chip
11: chip terminal
20: Support
100:
110: guide groove
111: 1st home
112: 2nd home
120: Through hole
130: Connector
200: Holder
300: contact pin
310: end

Claims (10)

A seating portion on which the LED chip is seated;
A holder disposed in the guide groove formed in the seating portion, the holder being guided by the guide groove and movable on the seating portion; And
A contact pin coupled to the holder and electrically connected to the LED chip,
And a jig device for inspecting the LED chip.
The method according to claim 1,
The seat (1)
And a through-hole through which the LED chip is disposed is formed at a central portion of the jig.
3. The method of claim 2,
The guide groove
Wherein the pair of the through holes are symmetrical with respect to the center of the through hole,
And the holder is provided in each of the pair of guide grooves.
The method according to claim 1,
The seat (1)
And a connector for electrical connection to an external device is provided on a side surface of the jig.
5. The method of claim 4,
Wherein the holder comprises:
And an electric signal is applied from an external device through the connector.
The method according to claim 1,
Wherein the holder comprises:
The jig for inspecting an LED chip is provided to move vertically with respect to the seating part.
The method according to claim 1,
The guide groove
A first groove provided in a slit shape in an x-axis direction that is distant or close to the LED chip mounted on the seating portion; And
A second groove communicating with the first groove and provided in a slit shape in a y-axis direction orthogonal to the x-
And a jig device for inspecting the LED chip.
8. The method of claim 7,
The guide groove
Wherein the first groove and the second groove are combined to form a T-shape.
The method according to claim 1,
The contact pin
And the end portion is bent in the downward direction.
A seating portion on which the LED chip is seated;
A first groove formed in a pair in the seating portion and provided in a slit shape in the x-axis direction to be distant from or close to the LED chip mounted on the seating portion; and a first groove communicating with the first groove, a guide groove including a second groove provided in a slit shape in the y-axis direction;
A pair of holders disposed in the pair of guide grooves and guided by the guide grooves to be movable on the seating portion; And
A pair of contact pins which are respectively coupled to the pair of holders and are brought into electrical contact with the LED chip,
And a jig device for inspecting the LED chip.
KR1020160001652A 2016-01-06 2016-01-06 Jig apparatus using for LED chip test KR20170082357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160001652A KR20170082357A (en) 2016-01-06 2016-01-06 Jig apparatus using for LED chip test

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160001652A KR20170082357A (en) 2016-01-06 2016-01-06 Jig apparatus using for LED chip test

Publications (1)

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KR20170082357A true KR20170082357A (en) 2017-07-14

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108508341A (en) * 2018-03-08 2018-09-07 佛山市顺德区蚬华多媒体制品有限公司 LED ageing testers
CN115993469A (en) * 2023-03-22 2023-04-21 深圳市鲁光电子科技有限公司 Diode device self-test device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108508341A (en) * 2018-03-08 2018-09-07 佛山市顺德区蚬华多媒体制品有限公司 LED ageing testers
CN108508341B (en) * 2018-03-08 2020-11-24 佛山市顺德区蚬华多媒体制品有限公司 LED aging test device
CN115993469A (en) * 2023-03-22 2023-04-21 深圳市鲁光电子科技有限公司 Diode device self-test device

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