KR20170073136A - Coil component and manufacturing method for the same - Google Patents

Abstract

According to the present disclosure, at least one coil is disposed in a body, and the coil includes a structure in which a plurality of coil patterns are stacked, and different coil patterns adjacent to each other in the stacking direction among the plurality of coil patterns, And electrically connected to each other, and a manufacturing method thereof.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a coil component,

The present disclosure relates to a coil component and a method of manufacturing the same.

With the miniaturization and thinning of electronic devices such as digital TVs, mobile phones, laptops, and the like, miniaturization and thinning of coil parts applied to such electronic devices are required. In order to meet such demands, It is actively proceeding.

The laminated coil component in the coil component can be manufactured by, for example, printing a coil pattern on an insulating sheet and laminating them. At this time, in order to electrically connect the coil patterns formed on the different layers, conductive vias are formed between the layers and the coil patterns are electrically connected to constitute one coil.

However, since formation of a via hole and the like is required first in order to form a via, the process is relatively complicated and a high matching accuracy is required.

One of the objects of the present disclosure is to solve such a problem, and to provide a coil component of a new structure capable of electrically connecting a coil pattern without a via, and a method of efficiently manufacturing the coil component.

One of the solutions proposed through this disclosure is to form a coil by stacking a plurality of coil patterns so that the end portions of the coil patterns formed on different layers are in contact with each other so that they are electrically connected without a via.

As one of the effects of the present disclosure, it is possible to provide a coil component of a new structure which is simple in process, has no great difficulty in matching, and can be further miniaturized and thinned, and a method of efficiently manufacturing the coil component.

1 schematically shows an example of a coil component applied to an electronic device.
2 is a schematic perspective view showing an example of a coil part.
3 is a schematic exploded perspective view showing an example of a coil.
4 is a schematic process diagram showing an example of manufacturing a coil component.
5 is a schematic process diagram showing another example of manufacturing a coil part.
6 is a schematic process diagram showing another example of manufacturing a coil component.

Hereinafter, the present disclosure will be described in more detail with reference to the accompanying drawings. The shape and size of elements in the drawings may be exaggerated for clarity.

Electronics

1 schematically shows an example of a coil component applied to an electronic device.

Referring to the drawings, it can be seen that various types of electronic components are used in electronic devices. For example, DC / DC, Comm. Processor, WLAN BT / WiFi FM GPS NFC, PMIC, Battery, SMBC, LCD AMOLED, Audio Codec, USB 2.0 / 3.0 HDMI, CAM can be used. Various types of coil parts may be appropriately applied between the electronic parts for the purpose of noise removal and the like depending on the application. For example, a power inductor (1), a high frequency inductor A general bead 3, a bead for a high frequency band (GHz Bead 4), a common mode filter 5, and the like.

Specifically, the power inductor 1 may be used to stabilize the power source by storing electric power in the form of a magnetic field to maintain an output voltage. Further, the high frequency inductor (HF Inductor) 2 can be used for the purpose of securing a necessary frequency by matching the impedance, blocking the noise and the AC component, and the like. Further, a normal bead (General Bead) 3 can be used for eliminating noise in a power source and a signal line, removing high-frequency ripple, and the like. Further, the high frequency bead (GHz Bead) 4 can be used for eliminating high frequency noise of a signal line and a power supply line associated with audio. Further, the common mode filter (5) can be used for passing the current in the differential mode and removing only the common mode noise.

The electronic device may be a smart phone, but is not limited thereto. For example, the electronic device may be a personal digital assistant, a digital video camera, a digital still camera ), A network system, a computer, a monitor, a television, a video game, or a smart watch. But may be other various electronic devices well known to those skilled in the art.

Coil parts

Hereinafter, the coil component of the present disclosure will be described. However, it is needless to say that the coil component of the present disclosure can be applied to other various types of coil components as described above, as well as the structure of the inductor. In this case, the shape of the outer shape other than the coil pattern can be appropriately modified according to the coil component to be applied. In this case, the outer shape known in the art can be referred to.

2 is a schematic perspective view showing an example of a coil part.

3 is a schematic exploded perspective view showing an example of a coil.

Referring to the drawings, a coil component 10 according to an example is a structure in which a coil 200 is disposed inside a body 100. Electrodes 301 and 302 electrically connected to the coil 200 are disposed outside the body 100. The coil 200 includes a structure in which a plurality of coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228 and 229 are laminated, and the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 are electrically connected to each other at the ends of the coil patterns adjacent to each other in the stacking direction. As a result, one coil 200 that rotates in the stacking direction is formed. Here, the lamination direction means the lamination direction of the coil pattern, that is, the third direction or the opposite direction.

The body 100 is an outer surface of the coil component 10 and has a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface facing each other in the second direction, The viewing includes the fifth and sixth sides. The body 100 may have a hexahedral shape, but the present invention is not limited thereto. The body 100 may include a magnetic material that exhibits magnetic properties. For example, the body 100 may be one in which ferrite or metal magnetic particles are filled in the resin. The ferrite may be made of a material such as Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Ba ferrite or Li ferrite. The metal magnetic particles may include at least one selected from the group consisting of iron (Fe), silicon (Si), chrome (Cr), aluminum (Al), and nickel (Ni) B-Cr amorphous metal, but the present invention is not limited thereto. The diameter of the metal magnetic body particles may be about 0.1 mu m to 30 mu m. The body 100 may be formed by dispersing such ferrite or metal magnetic particles in a thermosetting resin such as an epoxy resin or a polyimide resin.

The magnetic material of the body 100 may be a magnetic resin composite in which a metal magnetic powder and a resin mixture are mixed. The metal magnetic material powder may include iron (Fe), chromium (Cr), or silicon (Si) as a main component. Examples of the metal magnetic powder include iron (Fe) Chromium (Cr) -silicon (Si), and the like. The resin mixture may include, but is not limited to, epoxy, polyimide, Liquid Crystal Polymer (LCP), and the like. The metal magnetic body powder may be filled with a metal magnetic body powder having at least two average particle diameters. In this case, by using a bimodal metal magnetic powder of a different size, the magnetic resin composite can be filled and the filling rate can be increased.

The body 100 is not necessarily made of a magnetic material, but may be made of an insulating material, for example, a photoresist material. In this case, a magnetic substrate or the like may be further disposed on the upper and lower portions of the body 100. That is, the material constituting the body 100 may vary depending on the specific function or type of the coil component, and additional components not shown in the drawings may be added.

The coil 200 allows the coil component 10 to perform a variety of functions within the electronic device through the characteristics manifested thereby. For example, the coil component 10 may be a power inductor. In this case, the coil may store electricity in the form of a magnetic field to maintain the output voltage and stabilize the power supply. The coil 200 includes a structure in which a plurality of coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228 and 229 are laminated, and the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229, the ends of the coil patterns adjacent to each other in the stacking direction are electrically connected to each other. That is, they are electrically connected without a separate via, and therefore the process is simple because a via processing step is unnecessary. Further, since the end portions of the respective coil patterns, that is, the overlapping sections are considerably wide, there is no great difficulty in matching. In addition, since there is no via, it is possible to reduce the size and thickness. A plurality of coils 200 may be present in the body 100, and they may be connected in series or in parallel depending on the function of the coil component. The core 105 of the coil 200 may be filled with the material constituting the body 100.

Each of the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, 229 has a coil turn number of less than 1. At least three of the coil patterns must be connected to realize one coil turn number. Therefore, it is preferable that the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, 229 have at least three coil patterns. The coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228 and 229 may be made of copper, aluminum, silver, tin, gold ), Nickel (Ni), lead (Pd), and alloys thereof, but are not limited thereto.

Each of the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, 229 has an aspect ratio (AR) That is, the ratio of the thickness to the line width may be less than 1, for example, 0.5 or less. Therefore, uniformity of the coils can be ensured while the risk of defects such as shorts is small. Further, since the line width is wide, the cross-sectional area rises and a low direct-current resistance (R _dc ) can be secured. Further, since the magnetic head can be made as thin as it is, the upper and lower magnetic regions can be made wider and, as a result, the inductance L can be improved.

The coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228 and 229 may be surrounded by the magnetic material constituting the body 100 as described above, 217, 218, 219 constituting the insulating layer 210, 211, 212, 213, 214, 215, 216, 217, 218, 219. In this case, each of the insulating layers 210, 211, 212, 213, 214, 215, 216, 217, 218, and 219 constituting the body 100 has coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 may be a photosensitive insulating layer (Photo Imagable Dielectric Layer) including a photosensitive insulating material. Alternatively, each insulating layer 210, 211, 212, 213, 214, 215, 216, 217, 218, 219 constituting the body 100 may be formed of a magnetic material, Or may be an electrically insulating magnetic layer formed in a sheet form, in which case they may be integrated in the sintering process. That is, depending on the material and the forming method, the boundary may become unclear.

The coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228 and 229 may have a larger number of stacked layers as shown in the drawing, or may have fewer stacked layers have. Similarly, the insulating layers 210, 211, 212, 213, 214, 215, 216, 217, 218, and 219 constituting the body 100 may have a larger number of stacked layers than shown in the drawings, It may have a smaller number of stacked layers. In some cases, a plurality of coils 200 having this structure may be arranged in the body 100 instead of one. That is, if the lamination configuration of the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, 229 is as described above, any modification is possible.

The electrodes 301 and 302 serve to electrically connect the coil 200 in the coil component 10 with the electronic device when the coil component 10 is mounted on the electronic device. The electrodes 301, For example, it may include a conductive resin layer and a plating layer formed on the conductive resin layer. The conductive resin layer may include at least one conductive metal selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag) and a thermosetting resin. The plating layer may include at least one selected from the group consisting of nickel (Ni), copper (Cu) and tin (Sn). For example, a nickel (Ni) layer and a tin . The electrodes 301 and 302 may have more numbers depending on the specific type of the coil component 100, and the arrangement thereof may be variously modified. It goes without saying that the materials may also be varied.

4 is a schematic process diagram showing an example of manufacturing a coil component.

Referring to the drawings, in an example of manufacturing a coil component, a coil is formed by laminating a plurality of coil patterns 1121, 1122, and 1123. At this time, among the coil patterns 1121, 1122, and 1123, the coil patterns adjacent to each other in the stacking direction are formed so that their end portions are in contact with each other and electrically connected. As a result, one coil 200 that rotates in the stacking direction is formed. Hereinafter, manufacturing of a coil by stacking a plurality of coil patterns 1121, 1122, and 1123 will be described in more detail, and overlapping contents of the above description will be omitted.

Referring to Step 1001, a first insulating layer 1101 is prepared. The first insulating layer 1101 may be a photoresist. In this case, the first insulating layer 1101 can be used without any particular limitation as long as it includes a photosensitive insulation (PID) material. The photoresist may be of a positive type or of a negative type.

Referring to process 1002, a first opening pattern 1111 is formed in the first insulating layer 1101 by photolithography. The first opening pattern 1111 may be formed to penetrate through the first insulating layer 1101, but the present invention is not limited thereto. The first opening pattern 1111 is formed to have a part of the coil shape and a separate substrate or the like may be disposed on the bottom of the first insulating layer 1101 in order to form the first opening pattern 1111 .

Referring to process 1003, the first opening pattern 1111 is filled with a metal paste and then cured to form a first coil pattern 1121. As the metal paste, a known paste containing a metal may be used. The method of filling the metal paste is also not particularly limited, and for example, a metal mask printing method or the like can be used. When the metal paste is filled and cured, the first coil pattern 1121 is formed, and the description of the coil patterns described above can be applied to the first coil pattern 1121 as well.

Referring to process 1004, a second insulating layer 1102 is formed on the first insulating layer 1101. The second insulating layer 1102 may be formed by a known lamination method. The second insulating layer 1102 may be a photoresist, and in this case, any material including a photosensitive insulation (PID) material may be used without any particular limitation. The photoresist may be of a positive type or of a negative type.

Referring to process 1005, a second opening pattern 1112 is formed in the second insulating layer 1102 by photolithography. The second opening pattern 1112 may be formed to penetrate through the second insulating layer 1102, but the present invention is not limited thereto. The second opening pattern 1112 is formed to have a part of the coil shape and the end portion is formed so as to be in contact with the end portion of the first coil pattern 1121.

Referring to the process 1006, the second opening pattern 1112 is filled with a metal paste and is then cured to form a second coil pattern 1122. As the metal paste, a known paste containing a metal may be used. The method of filling the metal paste is also not particularly limited, and for example, a metal mask printing method or the like can be used. The second coil pattern 1122 is formed by filling and hardening the metal paste, and the description of the coil patterns described above can be applied equally to the second coil pattern 1122. [

Referring to process 1007, a third insulating layer 1103 is formed on the second insulating layer 1102. [ The third insulating layer 1103 may be formed by a known lamination method. The third insulating layer 1103 may be a photoresist. In this case, the third insulating layer 1103 can be used without any particular limitation as long as it includes a photosensitive insulation (PID) material. The photoresist may be of a positive type or of a negative type.

Referring to process 1008, a third opening pattern 1113 is formed in the third insulating layer 1103 by photolithography. The third opening pattern 1113 may be formed to penetrate through the third insulating layer 1103, but the present invention is not limited thereto. The photolithography method may be a known exposure and development method. The third opening pattern 1113 is formed to have a part of the coil shape and the end portion is formed so as to be in contact with the end portion of the second coil pattern 1122.

Referring to step 1109, the third opening pattern 1113 is filled with metal paste and cured to form a third coil pattern 1123. As the metal paste, a known paste containing a metal may be used. The method of filling the metal paste is also not particularly limited, and for example, a metal mask printing method or the like can be used. When the metal paste is filled and cured, the third coil pattern 1123 is formed, and the description of the coil patterns described above can be applied to the third coil pattern 1123.

A single coil having a number of turns of at least one coil and rotating in the stacking direction may be formed through a series of processes. In order to have a larger number of coil turns, the above-described process is repeated. The laminated body manufactured through a series of processes may be a body by itself, or a body may be completed by further laminating a magnetic cover layer or the like on the upper and lower portions thereof, if necessary. When an electrode is formed on a body, a coil component can be manufactured. A plurality of coils may be manufactured at the same time, and the plurality of coils may be included in one body. In the case where a plurality of coils are manufactured at the same time, a cutting process can be further performed. Further, if necessary, it may be further polished to round the corners of the body before forming the electrodes.

5 is a schematic process diagram showing another example of manufacturing a coil part.

Referring to the drawings, in another manufacturing example of the coil component, the coil is formed by stacking a plurality of coil patterns 2121, 2122, and 2123. At this time, among the coil patterns 2121, 2122, and 2123, the coil patterns adjacent to each other in the stacking direction are formed such that their end portions are in contact with each other to be electrically connected. As a result, one coil rotating in the stacking direction is formed. Hereinafter, manufacturing of a coil by stacking a plurality of coil patterns 2121, 2122, and 2123 will be described in more detail, but overlapping contents of the above description will be omitted.

Referring to step 2001, a first insulating layer 2101 having a first opening pattern 2111 is formed. This may be a known coating method, for example, a screen printing method or the like. The first insulating layer 2101 may be an electrically insulating magnetic layer formed of a sheet of the magnetic resin composite including the metal magnetic powder and the resin mixture as described above, but the present invention is not limited thereto. The first opening pattern 2111 may be formed to penetrate through the first insulating layer 2101, but the present invention is not limited thereto. The first opening pattern 2111 is formed to have a part of the coil shape. If necessary, a separate substrate or the like may be disposed on the bottom of the first insulating layer 2101 to form the first insulating layer 2101.

Referring to step 2002, the first opening pattern 2111 is filled with a metal paste and then cured to form a first coil pattern 2121. [ As the metal paste, a known paste containing a metal may be used. The method of filling the metal paste is also not particularly limited, and for example, a metal mask printing method or the like can be used. When the metal paste is filled and cured, the first coil pattern 2121 is formed, and the description of the coil patterns described above can be applied to the first coil pattern 2121 as well.

Referring to Step 2003, a second insulating layer 2102 having a second opening pattern 2112 formed on the first insulating layer 2101 is formed. This may be a known coating method, for example, a screen printing method or the like. The second insulating layer 2101 may be an electrically insulating magnetic layer formed of the magnetic resin composite including the metal magnetic powder and the resin mixture as described above, but is not limited thereto. The second opening pattern 2112 may be formed to penetrate through the second insulating layer 2102, but the present invention is not limited thereto. The second opening pattern 2112 is formed to have a part of the coil shape and the end portion is formed so as to be in contact with the end portion of the first coil pattern 2121.

Referring to Step 2004, the second opening pattern 2112 is filled with a metal paste and then cured to form a second coil pattern 2122. [ As the metal paste, a known paste containing a metal may be used. The method of filling the metal paste is also not particularly limited, and for example, a metal mask printing method or the like can be used. When the metal paste is filled and cured, the second coil pattern 2122 is formed, and the description of the coil patterns described above can be applied to the second coil pattern 2122 as well.

Referring to step 2005, a third insulating layer 2103 having a third opening pattern 2113 formed on the second insulating layer 2102 is formed. This may be a known coating method, for example, a screen printing method or the like. The third insulating layer 2103 may be an electrically insulating magnetic layer formed of the magnetic resin composite including the metal magnetic powder and the resin mixture as described above, but is not limited thereto. The third opening pattern 2113 may be formed to penetrate through the third insulating layer 2103, but the present invention is not limited thereto. The third opening pattern 2113 is formed to have a part of the coil shape and the end portion is formed so as to be in contact with the end portion of the second coil pattern 2122.

Referring to Step 2006, the third opening pattern 2113 is filled with a metal paste and cured to form a third coil pattern 2123. [ As the metal paste, a known paste containing a metal may be used. The method of filling the metal paste is also not particularly limited, and for example, a metal mask printing method or the like can be used. When the metal paste is filled and cured, the third coil pattern 2123 is formed, and the description of the coil patterns described above can be applied to the third coil pattern 2123 as well.

Referring to Step 2007, a step of sintering the first to third insulating layers 2101, 2102, and 2103 may be further performed if necessary. As a result of sintering, the boundaries of the first to third insulating layers 2101, 2102 and 2103 may become unclear. That is, the first to third insulating layers 2101, 2102, and 2103 may be integrated.

A single coil having a number of turns of at least one coil and rotating in the stacking direction may be formed through a series of processes. In order to have a larger number of coil turns, the above-described process before sintering may be repeated. The laminated body manufactured through a series of processes may be a body by itself, or a body may be completed by further laminating a magnetic cover layer or the like on the upper and lower portions thereof, if necessary. When an electrode is formed on a body, a coil component can be manufactured. A plurality of coils may be manufactured at the same time, and the plurality of coils may be included in one body. In the case where a plurality of coils are manufactured at the same time, a cutting process can be further performed. Further, if necessary, it may be further polished to round the corners of the body before forming the electrodes.

6 is a schematic process diagram showing another example of manufacturing a coil component.

Referring to the drawings, in another manufacturing example of the coil component, the coil is formed by laminating a plurality of coil patterns 3121, 3122, and 3123. At this time, among the coil patterns 3121, 3122, and 3123, the coil patterns adjacent to each other in the stacking direction are formed such that their end portions are in contact with each other to be electrically connected. As a result, one coil rotating in the stacking direction is formed. Hereinafter, manufacturing of a coil by stacking a plurality of coil patterns 3121, 3122, and 3123 will be described in more detail, but the overlapping contents of the above description will be omitted.

Referring to Step 3001, a first seed layer 3131 is formed. The first seed layer 3131 can be formed on a known carrier substrate (not shown). The first seed layer 3131 can be formed using an electroless plating method, a sputtering method, or the like. Alternatively, when the carrier substrate (not shown) is a copper clad laminate (CCL), the copper foil may be used as the first seed layer 3131.

Referring to process 3002, a first insulating layer 3101 is formed on the first seed layer 3131. The first insulating layer 3101 may be formed by a known lamination method. The first insulating layer 3101 may be a photoresist. In this case, the first insulating layer 3101 can be used without any particular limitation as long as it includes a photosensitive insulation (PID) material. The photoresist may be of a positive type or of a negative type.

Referring to step 3003, a first opening pattern 3111 is formed in the first insulating layer 3101 by photolithography. The first opening pattern 3111 may be formed to penetrate through the first insulating layer 3101, but the present invention is not limited thereto. The first opening pattern 3111 is formed to have a part of the coil shape.

Referring to the process 3004, the first opening pattern 3111 is filled with metal plating to form the first coil pattern 3121. As the metal plating, known electroplating using a dry film or the like can be used. The first coil pattern 3121 can be equally applied to the coil patterns described above.

Referring to the process 3005, a second seed layer 3132 is formed on the first insulating layer 3101. The second seed layer 3132 may be formed using electroless plating, sputtering, or the like.

Referring to process 3006, a second insulating layer 3102 is formed on the second seed layer 3132. The second insulating layer 3102 may be formed by a known lamination method. The second insulating layer 3102 may be a photoresist, and in this case, any material including a photosensitive insulation (PID) material may be used without any particular limitation. The photoresist may be of a positive type or of a negative type.

Referring to step 3007, a second opening pattern 3112 is formed in the second insulating layer 3102 by photolithography. The second opening pattern 3112 may be formed so as to penetrate through the second insulating layer 3102, but the present invention is not limited thereto. The photolithography method may be a known exposure and development method. The second opening pattern 3112 is formed to have a part of the coil shape.

Referring to the process 3008, the second opening pattern 3112 is filled with a metal plating to form a second coil pattern 3122. As the metal plating, known electroplating using a dry film or the like can be used. The description of the coil patterns described above can be applied to the second coil pattern 3122 as well.

Referring to Step 3009, a third seed layer 3133 is formed on the second insulating layer 3102. [ The third seed layer 3133 may be formed by using electroless plating, sputtering, or the like.

Referring to process 3010, a third insulating layer 3103 is formed on the third seed layer 3133. The third insulating layer 3103 may be formed by a known lamination method. The third insulating layer 3103 may be a photoresist. In this case, the third insulating layer 3103 can be used without any particular limitation as long as it includes a photosensitive insulation (PID) material. The photoresist may be of a positive type or of a negative type.

Referring to step 3011, a third opening pattern 3113 is formed in the third insulating layer 3103 by photolithography. The third opening pattern 3113 may be formed to penetrate through the third insulating layer 3103, but the present invention is not limited thereto. The photolithography method may be a known exposure and development method. The third opening pattern 3113 is formed to have a part of the coil shape.

Referring to the process 3012, the third opening pattern 3113 is filled with a metal plating to form a third coil pattern 3123. As the metal plating, known electroplating using a dry film or the like can be used. The third coil pattern 3123 can be equally applied to the description of the coil patterns described above.

Referring to step 3013, the first to third insulating layers 3101, 3102 and 3103 are stripped and removed as necessary. The stripping method is not particularly limited, and a known stripping solution may be used, or a method of removing by burning may be used.

Referring to step 3014, the first to third seed layers 3131, 3132, and 3133 are partially etched away as needed. That is, other portions except for the first to third seed layers 3131, 3132 and 3133 formed under the first to third coil patterns 3121, 3122 and 3123 can be removed.

Referring to the process 3015, the first to third coil patterns 3121, 3122, and 3123 are surrounded by the magnetic material 3104, if necessary. The magnetic material 3104 may be a magnetic resin composite in which the metal magnetic powder and the resin mixture are mixed as described above. The magnetic material 3104 may be formed into a sheet type and stacked on top and bottom to be integrated. It is needless to say that other magnetic materials may be used.

A single coil having a number of turns of at least one coil and rotating in the stacking direction may be formed through a series of processes. In order to have a larger number of coil turns, the above-described process may be repeated before stripping. The laminated body manufactured through a series of processes may be a body by itself, or a body may be completed by further laminating a magnetic cover layer or the like on the upper and lower portions thereof, if necessary. When an electrode is formed on a body, a coil component can be manufactured. The coil may be one in which a plurality of coils are simultaneously manufactured, and the plurality of coils may be included in one body. In the case where a plurality of coils are manufactured at the same time, a cutting process can be further performed. Further, if necessary, it may be further polished to round the corners of the body before forming the electrodes.

In the present disclosure, the term " electrically connected " means a concept including both a physical connection and a non-connection. Also, the first, second, etc. expressions are used to distinguish one component from another, and do not limit the order and / or importance of the components. In some cases, without departing from the scope of the right, the first component may be referred to as a second component, and similarly, the second component may be referred to as a first component.

Furthermore, the expression " an example used in the present disclosure does not mean the same embodiment but is provided for emphasizing and explaining different unique features. However, the above-mentioned examples do not exclude that they are implemented in combination with the features of other examples. For example, although the description in the specific example is not described in another example, it can be understood as an explanation related to another example, unless otherwise described or contradicted by the other example.

Also, the terms used in the present disclosure are used to illustrate only one example, and are not intended to limit the present disclosure. Wherein the singular expressions include plural expressions unless the context clearly dictates otherwise.

1: Power inductor
2: High frequency inductor
3: Normal bead
4: High frequency beads
5: Common mode filter
10: Coil parts
100: Body
105: Core
200: Coil
210, 211, 212, 213, 214, 215, 216, 217, 218, 219:
220, 221, 222, 223, 224, 225, 226, 227, 228, 229:
301, 302: electrode
1101, 1102, 1103, 2101, 2102, 2103, 2104, 3101, 3102, 3103:
1111, 1112, 1113, 2111, 2112, 2113, 3111, 3112, 3113:
1121, 1122, 1123, 2121, 2122, 2123, 3121, 3122, 3123:
3131, 3132, 3133: seed layer
3104: Magnetic material

Claims (16)

A coil component in which one or more coils are disposed within a body,
Wherein the coil includes a structure in which a plurality of coil patterns are stacked,
The coil patterns adjacent to each other in the stacking direction of the coil patterns are electrically connected to each other at their ends,
Coil parts.
The method according to claim 1,
And the coil patterns are electrically connected to each other to constitute one coil which rotates in the stacking direction,
Coil parts.
The method according to claim 1,
Wherein at least three coil patterns among the coil patterns are connected to implement one coil turn number,
Coil parts.
The method according to claim 1,
The body includes a structure in which a plurality of insulating layers are stacked,
Each of the coil patterns passing through the insulating layers,
Coil parts.
5. The method of claim 4,
Wherein the insulating layers are photosensitive insulating layers,
Coil parts.
5. The method of claim 4,
Wherein the insulating layers are electrically insulating magnetic layers,
Coil parts.
5. The method of claim 4,
The insulating layers are sintered and integrated,
Coil parts.
The method according to claim 1,
Wherein the body comprises a magnetic material surrounding the coil,
Coil parts.
A method of manufacturing a coil component in which one or more coils are disposed in a body,
Wherein the coil is formed by laminating a plurality of coil patterns,
Wherein the coil patterns adjacent to each other in the stacking direction of the coil patterns are formed so that their respective end portions are in contact with each other to be electrically connected to each other.
A method of manufacturing a coil component.
10. The method of claim 9,
The plurality of coil patterns are stacked to form the coil,
Forming a first insulating layer on which a first opening pattern is formed;
Filling the first opening pattern with a metal to form a first coil pattern;
A second insulating layer having a second opening pattern formed on the first insulating layer and having an end portion in contact with an end portion of the first coil pattern is formed or a second insulating layer is formed on the first insulating layer Forming a second opening pattern in which an end portion of the second insulation layer contacts an end portion of the first coil pattern;
Filling the second opening pattern with a metal to form a second coil pattern;
A third insulating layer having a third opening pattern formed on the second insulating layer and having an end portion in contact with an end portion of the second coil pattern is formed or a third insulating layer is formed on the second insulating layer Forming a third opening pattern in which an end portion of the third insulating layer is in contact with an end portion of the second coil pattern; And
Filling the third opening pattern with a metal to form a third coil pattern; ≪ / RTI >
A method of manufacturing a coil component.
11. The method of claim 10,
Wherein the first to third opening patterns are formed by photolithography,
A method of manufacturing a coil component.
11. The method of claim 10,
Wherein the first to third opening patterns are formed by a screen printing method,
A method of manufacturing a coil component.
13. The method of claim 12,
The process may include: sintering the first to third insulating layers after forming the first to third coil patterns; ≪ / RTI >
A method of manufacturing a coil component.
11. The method of claim 10,
Wherein the first to third coil patterns are formed by metal paste printing.
A method of manufacturing a coil component.
11. The method of claim 10,
The first through third coil patterns are formed by metal plating.
A method of manufacturing a coil component.
16. The method of claim 15,
The process may further comprise: forming first to third seed layers, respectively, before preparing or forming the first to third insulating layers; Further comprising:
The step may include: stripping the first to third insulating layers after forming the first to third coil patterns; And partially etching the first to third seed layers; ≪ / RTI >
A method of manufacturing a coil component.

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