KR102404312B1 - Coil component - Google Patents

Abstract

According to the present disclosure, a coil unit is disposed in a body portion including a magnetic material, and the coil unit is formed on a support member, a first coil layer formed on one or both surfaces of the support member, and one or both surfaces of the support member. An insulating layer covering the first coil layer, and a second coil layer formed on the insulating layer, wherein the first and second coil layers have a different number of turns of the coil pattern.

Description

Coil Component {COIL COMPONENT}

The present disclosure relates to coil components, such as power inductors.

Along with the miniaturization and thinning of electronic devices such as digital TVs, mobile phones, and notebook computers, the coil parts applied to these electronic devices are also required to be miniaturized and thinner. The research and development of coil parts is actively progressing.

A major issue due to the miniaturization and thinning of coil parts is to realize the same characteristics as the existing ones despite the miniaturization and thinning. In order to satisfy these requirements, it is necessary to secure the size of the core in which the magnetic material is charged and the low direct current resistance (R _dc ). For this purpose, a technology capable of increasing the aspect ratio of the coil pattern and the cross-sectional area of the coil portion, for example, an anisotropic plating technology is applied to products are increasing.

On the other hand, in the case of manufacturing coil parts by applying anisotropic plating technology in a limited space due to miniaturization and thinning, the risk of defects such as a decrease in the uniformity of plating growth and the occurrence of short circuits between coil parts is increasing as the aspect ratio rises.

JP Laid-open Patent Publication No. 2007-067214 (2007.03.15.)

One of the several objects of the present disclosure is to solve this problem, and while the risk of defects such as short circuit is small, the uniformity of the coil and low DC resistance (R _dc ) It is to provide a coil component of a new structure capable of securing.

One of the various solutions proposed through the present disclosure is to stably form a plurality of coil layers using an insulating layer on a support member, but to form a plurality of coil layers so that the number of turns of the coil patterns is different from each other.

For example, in the coil component, a coil part is disposed in a body part including a magnetic material, and the coil part includes a support member, a first coil layer formed on one or both surfaces of the support member, and one or both surfaces of the support member. An insulating layer formed thereon to cover the first coil layer, and a second coil layer formed on the insulating layer, wherein the first and second coil layers may have a different number of turns of the coil pattern.

As one effect among the various effects of the present disclosure, it is possible to secure the uniformity of the coil and low direct current resistance (R _dc ) while having a small risk of defects such as short circuit, and to provide a coil component with a new structure that can be manufactured in a thin shape. have.

1 schematically shows an example of a coil component applied to an electronic device.
2 is a schematic perspective view showing an example of a coil component.
FIG. 3 is a schematic cross-sectional view of the coil part of FIG. 2 taken along II′;
4 is a schematic enlarged cross-sectional view of a region A of the coil component of FIG. 3 .
5 is a schematic cross-sectional view taken along the II-II' plane of the coil component of FIG. 2 .
6 is a schematic cross-sectional view in the B direction of the body portion of the coil component of FIG. 5 .
7 is a schematic cross-sectional view illustrating an electrical connection of the coil unit of FIG. 2 .

Hereinafter, the present disclosure will be described in more detail with reference to the accompanying drawings. The shapes and sizes of elements in the drawings may be exaggerated for clearer description.

Electronics

1 schematically shows an example of a coil component applied to an electronic device.

Referring to the drawings, it can be seen that various types of electronic components are used in electronic devices, for example, DC/DC, Comm. Processor, WLAN BT / WiFi FM GPS NFC, PMIC, Battery, SMBC, LCD AMOLED, Audio Codec, USB 2.0 / 3.0 HDMI, CAM, etc. can be used. At this time, among these electronic components, various types of coil components may be appropriately applied according to the purpose for the purpose of noise removal, etc. For example, a power inductor (Power Inductor, 1), a high frequency inductor (HF Inductor, 2) , a general bead (General Bead, 3), a high frequency bead (GHz Bead, 4), a common mode filter (Common Mode Filter, 5), and the like.

Specifically, the power inductor 1 may be used for stabilizing power by storing electricity in the form of a magnetic field to maintain an output voltage. Also, the high frequency inductor 2 may be used for purposes such as securing a required frequency by matching impedance, or blocking noise and AC components. In addition, the general bead (General Bead, 3) may be used for the purpose of removing noise of power and signal lines, or removing a high-frequency ripple. In addition, the high-frequency bead (GHz Bead, 4) may be used for purposes such as removing high-frequency noise from signal lines and power lines related to audio. In addition, the common mode filter (Common Mode Filter, 5) may be used for purposes such as passing a current in the differential mode and removing only common mode noise.

The electronic device may typically be a smart phone, but is not limited thereto. For example, a personal digital assistant, a digital video camera, and a digital still camera. ), a network system, a computer, a monitor, a television, a video game, a smart watch, and the like. In addition to these, of course, it may be other various electronic devices well known to those skilled in the art.

coil parts

Hereinafter, the coil component of the present disclosure will be described. For convenience, the structure of an inductor will be described as an example, but as described above, the coil component of the present disclosure may also be applied to coil components for various other uses.

2 is a schematic perspective view showing an example of a coil component.

FIG. 3 is a schematic cross-sectional view taken along line II′ of the coil component of FIG. 2 .

4 is a schematic enlarged cross-sectional view of a region A of the coil component of FIG. 3 .

5 is a schematic cross-sectional view taken along the II-II' plane of the coil component of FIG. 2 .

6 is a schematic cross-sectional view in B direction of a body portion of the coil component of FIG. 5 .

7 is a schematic cross-sectional view illustrating an electrical connection of the coil unit of FIG. 2 .

Referring to the drawings, the coil part 10 according to an example has a structure in which the coil part 200 is disposed inside the body part 100 including a magnetic material. The electrode part 300 electrically connected to the coil part 200 is disposed outside the body part 100 . The coil unit 200 includes a support member 230 and a plurality of coil layers 211 , 212 , 221 , and 222 disposed on both surfaces of the support member 230 . Between the first and second coil layers 211 and 212 on the upper side and the first and second coil layers 221 and 222 on the lower side, respectively, the first coil layer is disposed on both surfaces of the support member 230 and formed inside Insulating layers 213 and 223 covering the 211 and 221 are respectively disposed.

The body part 100 forms the exterior of the coil component 10 . The body part 100 includes a first surface and a second surface facing in the first direction, a third surface and a fourth surface facing in the second direction, and a fifth surface and a sixth surface facing in the third direction. include The body part 100 may have a substantially hexahedral shape as described above, but is not limited thereto. Six corners where the first to sixth surfaces meet may be rounded by grinding or the like. The body part 100 includes a magnetic material exhibiting magnetic properties. For example, the body part 100 may be one in which ferrite or magnetic metal particles are filled in resin. The ferrite may be made of, for example, a material such as Mn-Zn-based ferrite, Ni-Zn-based ferrite, Ni-Zn-Cu-based ferrite, Mn-Mg-based ferrite, Ba-based ferrite, or Li-based ferrite. The magnetic metal particles may include any one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), aluminum (Al), and nickel (Ni), for example, Fe-Si- It may be a B-Cr-based amorphous metal, but is not necessarily limited thereto. The diameter of the magnetic metal particles may be about 0.1 μm to 30 μm. The body part 100 may be in a form in which such ferrite or magnetic metal particles are dispersed in a thermosetting resin such as an epoxy resin or a polyimide resin. The thickness of the body part 100 may vary depending on an applied electronic device, and may be approximately 500 μm to 900 μm, but is not limited thereto.

The magnetic material of the body part 100 may be made of a magnetic resin composite in which a magnetic metal powder and a resin mixture are mixed. The magnetic metal powder may include iron (Fe), chromium (Cr), or silicon (Si) as a main component, for example, iron (Fe)-nickel (Ni), iron (Fe), iron (Fe) -chromium (Cr) - may include silicon (Si), but is not limited thereto. The resin mixture may include, but is not limited to, epoxy, polyimide, liquid crystal polymer (LCP), and the like. The magnetic metal powder may be filled with a magnetic metal powder having at least two or more average particle diameters. Alternatively, the magnetic metal powder may be filled with a magnetic metal powder having at least three or more average particle diameters. In this case, by compressing using magnetic metal powders of different sizes, it is possible to fill the magnetic resin composite to increase the filling rate. As a result, it is possible to increase the capacity of the coil component.

The coil unit 200 serves to perform various functions in the electronic device through characteristics expressed from the coil of the coil component 10 . For example, the coil component 10 may be a power inductor, and in this case, the coil unit 200 may store electricity in the form of a magnetic field to maintain an output voltage to stabilize power. The plurality of coil layers 211 , 212 , 221 , and 222 respectively stacked on both surfaces of the support member 230 are electrically connected through a via 243 passing through the support member 230 . Among the plurality of coil layers 211, 212, 221, and 222, the coil layers 211 and 221 disposed on the inner side and the coil layers 212 and 222 disposed on the outside are the insulating layers 213 and 223 disposed therebetween. It is electrically connected through vias 214 and 224 passing through. As a result, the plurality of coil layers 211 , 212 , 221 , and 222 are electrically connected to form one coil. A through hole 105 is formed in the center of the coil unit 200 , and the through hole 105 is filled with a magnetic material constituting the body unit 100 . The coil unit 200 includes a first coil layer 211 and 221 formed on both sides of the support member 230 , that is, stacked on the inside, and a second coil layer 211 and 221 formed on the insulating layers 213 and 223 , that is, stacked on the outside. and coil layers 212 and 222 . Insulating layers 213 and 223 are disposed between the first coil layers 211 and 221 and the second coil layers 212 and 222 . The second coil layers 212 and 222 are covered by the insulating layers 215 and 225 .

The coil patterns of the first coil layers 211 and 221 and the second coil layers 221 and 222 all have a plurality of turns. In this case, the first coil layers 211 and 221 and the second coil layers 221 and 222 have a different number of turns of the coil pattern. For example, the number of turns of the coil pattern of the second coil layers 221 and 222 as the outer layer may be greater than the number of turns of the coil pattern of the first coil layers 211 and 221 as the inner layer. In this case, it is possible to reduce the risk of failure and improve the uniformity through the first coil layers 211 and 221 , and realize high inductance through the second coil layers 221 and 222 . In addition, since most of them are composed of a coil pattern having a thin line width, the number of turns may be basically large in the horizontal direction, that is, in the first direction and/or the second direction. In addition, the coil layers 211 , 212 , 221 , and 222 may have the same rotation direction, and they may be electrically connected through the vias 214 , 224 , 234 , so that the coils may also be stacked in the stacking direction, that is, in the third direction. It has the effect of increasing the number of turns. Of course, it will be apparent to those skilled in the art that the number of turns may be greater than that shown in the drawings, or the number of turns may be less than this.

The first coil layers 211 and 221 and the second coil layers 221 and 222 have different intervals of coil patterns. For example, the spacing L ₂ between the coil patterns of the second coil layers 212 and 222 may be narrower than the spacing L ₁ between the coil patterns of the first coil layers 211 and 221 . That is, the first coil layers 211 and 221 formed on the inside reduce the risk of defects such as short circuit as a whole by making the interval L ₁ between the coil patterns relatively wide, and the insulating layers 213 and 223 covering them. By making it flat, the coil uniformity of the second coil layers 221 and 222 formed outside can be improved. In addition, the second coil layers 221 and 222 formed on the outside can make the coil unit 200 have a large number of turns as a whole by making the interval L ₂ between the coil patterns relatively narrow. In the first coil layers 211 and 221 , the line width w ₂ of the coil pattern disposed on the outermost side may be wider than the line width w ₁ of the coil pattern disposed on the inner side. That is, the coil pattern disposed on the inside has a relatively thin line width w ₁ to have a large number of turns, while the coil pattern disposed on the outside has a relatively thick line width w ₂ , resulting in low direct current resistance. (R _dc ) characteristics can be secured.

The coil patterns of the first coil layers 211 and 221 and the second coil layers 221 and 222 have different aspect ratios AR. For example, the aspect ratio AR of the coil patterns of the second coil layers 221 and 222 may be greater than the aspect ratio AR of the coil patterns of the first coil layers 211 and 221 . In this case, it is possible to reduce the risk of failure and improve the uniformity through the first coil layers 211 and 221 , and it is possible to decrease the DC resistance Rdc through the high aspect ratio AR of the second coil layers 221 and 222 . . The coil patterns of the first coil layers 211 and 221 have an aspect ratio AR, which is a ratio (h ₁ /w ₁ ) of a thickness h ₁ to a width w ₁ , greater than 1 and a width w ₂ . The aspect ratio (AR), which is the ratio (h ₁ /w ₂ ) of the thickness (h ₁ ) to the thickness (h 1 ), is less than 1. Most of the coil patterns of the second coil layers 212 and 222 have an aspect ratio (AR), which is a ratio of a ratio (h ₂ /w ₃ ) of a thickness h ₂ to a width w ₃ , greater than 1. For example, the coil pattern of the first coil layers 211 and 221 may have a width w ₁ of about 30 μm to 50 μm, a width w ₂ of about 90 μm to 150 μm, and a thickness (h ₁ ) may be about 40 μm to about 60 μm. The coil pattern of the second coil layers 212 and 222 may have a width w ₃ of about 40 μm to 60 μm and a thickness h ₂ of about 40 μm to about 70 μm.

The coil layers 211 , 221 , 212 , and 222 are mostly composed of a coil pattern having a thin line width, and thus the thickness of the coil part is thin. At this time, in order to have a sufficient number of turns, each of the coil layers 211 , 221 , 212 , and 222 is formed to maximize the space in the horizontal direction, that is, in the first direction and/or the second direction. That is, the first and second coil layers 211 and 221 and the second coil layers 212 and 222 stacked up and down have overlapping regions. Therefore, it is useful for realizing a coil component having sufficient coil characteristics while being thin.

Although only the first coil layers 211 and 221 and the second coil layers 212 and 222 are shown in the drawing, it goes without saying that more coil layers may be further formed on the second coil layers 212 and 222, Of course, an insulating layer having vias formed therebetween may be disposed to be electrically connected to each other. In addition, of course, a coil layer may be further formed between the first coil layers 221 and 221 and the second coil layers 212 and 222, and an insulating layer having a via formed therebetween is disposed to be electrically connected to each other. Of course you can.

The support member 230 is not particularly limited in material or type as long as it can support the plurality of coil layers 211, 212, 221, 222. For example, copper clad laminate (CCL), polypropylene glycol (PPG) ) may be a substrate, a ferrite substrate, or a metal-based soft magnetic substrate. In addition, it may be an insulating substrate made of an insulating resin. Examples of the insulating resin include a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as glass fiber or inorganic filler therein, for example, prepreg, Ajinomoto build-up (ABF). Film), FR-4, BT (Bismaleimide Triazine) resin, PID (Photo Imagable Dielectric) resin, etc. may be used. In view of maintaining rigidity, an insulating substrate including glass fibers and an epoxy resin may be used, but the present invention is not limited thereto. The thickness of the support member 230 may be 80 μm or less, preferably 60 μm or less, and more preferably 40 μm or less, but is not limited thereto.

As long as the via 234 passing through the support member 230 can electrically connect the upper first coil layer 211 and the lower first coil layer 221 disposed on both surfaces of the support member 230, respectively, The shape and material are not particularly limited. Here, the upper and lower sides are determined based on the third direction of the drawing. For example, as for the shape of the via 234, all shapes known in the art, such as a tapered shape with a smaller or larger diameter from the top to the bottom, a cylindrical shape with an almost constant diameter from the top to the bottom, an hourglass shape, etc. may be applied. can In addition, the material of the via 234 may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pd), or an alloy thereof. of conductive material can be used.

The insulating layers 213 and 223 insulate the first coil layers 211 and 221 and the second coil layers 212 and 222 . The insulating layers 213 and 223 may be a build-up film including an insulating material. For example, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin in which a reinforcing material such as an inorganic filler is impregnated therein, for example, Ajinomoto Build-up Film (ABF), etc. may be used. Alternatively, it may be an insulating film including a known photo imageable dielectric (PID) resin. The thickness of the insulating layers 213 and 223 is thicker than that of the first coil layers 211 and 221 , and it is sufficient to insulate them from the second coil layers 212 and 222 while covering them. The insulating distance between the first coil layers 211 and 221 and the second coil layers 212 and 222 by the insulating layers 213 and 223 may be, for example, about 3 μm to 20 μm, but is limited thereto. not.

As long as the vias 214 and 224 penetrating the insulating layers 213 and 223 can electrically connect the first coil layers 211 and 221 and the second coil layers 212 and 222, the shape or material of the vias is particularly special. not limited For example, the vias 214 and 224 may have any shape known in the art, such as a tapered shape or a cylindrical shape as described above. In addition, as a material of the vias 214 and 224 , copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pd), or these A conductive material such as an alloy may be used. The thickness of the insulating layers 213 and 223 is generally smaller than the thickness of the support member 230 .

The insulating layers 215 and 225 serve to protect the second coil layers 221 and 222 . Any material including an insulating material may be applied to the insulating layers 215 and 225 . For example, an insulating material used for a conventional insulating coating, such as an epoxy resin, a polyimide resin, a liquid crystal crystalline polymer resin, etc. may be included, and a known photo imageable dielectric (PID) resin may be used. However, the present invention is not limited thereto. The insulating layers 215 and 225 may be integrated with the insulating layers 213 and 223 according to a manufacturing method, but are not limited thereto.

The right side outgoing section of the coil unit 200 includes a drawing out end surface of the support member 230 , an outgoing end surface of the upper and lower insulating layers 213 and 223 disposed on the outgoing end of the supporting member 230 , and an upper side drawing out end surface. and the lead-out end face of the upper second coil layer 212 disposed on the lead-out end face of the insulating layer 213 . In addition, the left-out cross-section of the coil unit 200 includes the lead-out end face of the support member 230 , the lead-out cross-section of the upper and lower insulating layers 213 and 223 disposed on the lead-out end face of the support member 230 , and and a lead-out end surface of the lower second coil layer 222 disposed on the lead-out end surface of the lower insulating layer 213 . That is, the lead-out terminal of the coil pattern drawn out to be connected to the external electrode is supported by the support member and the insulating layer. Accordingly, the lead-out terminal of the coil pattern can be formed stably, and can have excellent connection force with the external electrode. Here, left and right are determined based on the first direction of the drawing. In addition, the upper and lower sides are determined based on the third direction of the drawing. Meanwhile, although the insulating film 215 is omitted from the drawings, the insulating film 215 may also be drawn out. Alternatively, the insulating film 215 may hardly remain in the drawn end face.

The right side outgoing cross-section of the coil unit 200 may have a tapered shape in which the width is substantially narrowed from the upper side to the lower side. Although not shown in the drawing, similarly, the left-out cross-section may also have a tapered shape in which the width is approximately narrowed from the lower side to the upper side. Here, the upper and lower sides are determined based on the third direction of the drawing. This is a region other than the region supporting the coil layers 211 , 221 , 212 , and 222 of the support member 230 and the insulating layers 213 and 223 by a trimming process or the like in the manufacturing stage of the coil component 10 . This can be selectively removed, because in the process of removal, the support member 230 and the insulating layers 213 and 223 including the insulating material can be removed more and more toward the center thereof. The coil layers 211 , 221 , 212 and 222 are hardly affected. Having such a shape of the drawn cross-section means that the insulating layers 213 and 223 are stacked on the support member 230 and the second coil layers 212 and 222 are stably formed thereon by turning the coil in the stacking direction. It means to form the coil parts 200 having an increasing number, and then fill the maximum space with a magnetic material through a trimming process or the like to form the body part 100 . Therefore, through this, it is possible to secure the uniformity of the coil and low direct current resistance (R _dc ) while reducing the risk of defects such as short circuit, and it is possible to manufacture in a thin form.

The electrode part 300 includes first and second external electrodes 301 and 302 disposed on the body part 100 to be spaced apart from each other and electrically connected to the lead terminals of the second coil layers 212 and 222, respectively. do. The external electrodes 301 and 302 serve to electrically connect the coil unit 200 in the coil component 10 to the electronic device when the coil component 10 is mounted on the electronic device. The external electrodes 301 and 302 may include, for example, a conductive resin layer and a plating layer formed on the conductive resin layer. The conductive resin layer may include at least one conductive metal selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag) and a thermosetting resin. The plating layer may include any one or more selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn), for example, a nickel (Ni) layer and a tin (Sn) layer may be sequentially formed. can

In the coil component 10 according to an example, for example, a plurality of coil units 200 are formed using a support member 230 , and then magnetic sheets are formed on the upper and lower portions of the plurality of coil units 200 . It can be manufactured by stacking to form a plurality of body parts 100 , then cutting the plurality of body parts 100 , and then forming the electrode parts 300 on each individual body part 100 . .

If the support member 230 is used, a plurality of coil parts 200 may be simultaneously formed, and a plurality of body parts 100 may be simultaneously formed using the support member 230 . Thereafter, a plurality of coil components may be simultaneously manufactured by a singulation process such as dicing. That is, it is advantageous for mass production. The plurality of coil units 200 may be formed using one or both surfaces of the support member 230 , and when formed using both surfaces, a through hole passing through the support member 230 may be drilled using a mechanical drill and/or a laser beam. After forming by a known method such as drilling, the via 234 may be formed by filling it with plating.

More specifically, the first coil layers 211 and 221 are respectively formed on both surfaces of the support member 230 . A method of forming the first coil layers 211 and 221 is not particularly limited, and a known photolithography method and a plating method may be used. For example, the photolithography method may use exposure and development using a photo resist. In addition, the plating method may be using electrolytic copper plating or electroless copper plating. More specifically, CVD (chemical vapor deposition), PVD (Physical Vapor Deposition), sputtering, subtractive (Subtractive), additive (Additive), SAP (Semi-Additive Process), MSAP (Modified Semi- It may be a plating method using a method such as Additive Process), but is not limited thereto. On the other hand, when forming the first coil layers 211 and 221, a through hole passing through the support member 230 is formed by a known method such as mechanical drilling and/or laser drilling, and then the via (via) is filled with plating. 234) may be formed, and the upper and lower first coil layers 211 and 221 respectively formed on both surfaces of the support member 230 may be electrically connected therethrough.

Next, insulating layers 213 and 223 are stacked on both surfaces of the support member 230 to cover the first coil layers 211 and 221 . The method of forming the insulating layers 213 and 223 is not particularly limited, and for example, a precursor film including the above-described insulating material is laminated on the support member 230 on which the first coil layers 211 and 221 are formed. It can be formed after curing. Alternatively, the above-described insulating material may be coated on the support member 230 on which the first coil layers 211 and 221 are formed, and then cured to form it. As the lamination method, for example, a method of separating a work tool by cooling in a cold press after hot pressing in which pressure is applied at a high temperature for a certain period of time and then reduced pressure to cool to room temperature may be used. As a coating method, the screen printing method which apply|coats ink with a squeeze, the spray printing method of the system which apply|coats ink by mist, etc. can be used, for example.

Next, second coil layers 212 and 222 are formed on the insulating layers 213 and 223 . A method of forming the second coil layers 212 and 222 is also not particularly limited, and a known photolithography method and a plating method as described above may be used. Meanwhile, although not shown in the drawings, when the second coil layers 212 and 222 are formed, a through hole penetrating each of the insulating layers 213 and 223 is formed by a photolithography method, a mechanical drill and/or a laser drill, etc. After forming by the method of .

Next, insulating films 215 and 225 covering the second coil layers 212 and 222 are formed. A method of forming the insulating layers 215 and 225 is not particularly limited, and a known coating method may be used. The insulating layers 215 and 225 may include the same material as the insulating layers 213 and 223, and in this case, they may be integrated after curing, but are not limited thereto.

Next, regions other than the regions in which the coil layers 211 , 212 , 221 , and 222 of the coil unit 200 are formed are selectively removed using a known trimming method or the like. In this process, the central portion of the coil unit 200 may be removed to form the through hole 105 . After that, if the body part 100 accommodating the coil part 200 is formed by lamination of magnetic sheets, etc., and singulated using a dicing process, etc., the coil part 100 is formed inside the individual The body part 100 is formed.

The plurality of body parts 100 may be formed by forming the plurality of coil parts 200, laminating magnetic sheets on the upper and lower portions thereof, and compressing and curing the magnetic sheets. The magnetic sheet may include a known magnetic material as described above. For example, a slurry is prepared by mixing magnetic metal particles, a binder resin and a solvent, and the slurry is subjected to a doctor blade method to form a carrier film (carrier). film) to a thickness of several tens of μm and then dried to produce a sheet form.

The electrode part 300 may be formed by forming external electrodes 301 and 302 on the outside of the body part 100 so as to be connected to the lead-out end surface of the coil part 200 exposed to one surface of the body part 100 . . The external electrodes 301 and 302 may be formed using a paste containing a metal having excellent electrical conductivity as described above, for example, nickel (Ni), copper (Cu), tin (Sn) or silver ( Ag) or the like can be formed using a conductive paste containing alone or an alloy thereof. In addition, the external electrodes 301 and 302 may be formed by further forming a plating layer on these paste layers. The plating layer may include any one or more selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn), for example, a nickel (Ni) layer and a tin (Sn) layer may be sequentially formed. can

On the other hand, in the present disclosure, the meaning of electrically connected is a concept that includes both a physically connected case and a non-connected case. In addition, expressions such as first, second, etc. are used to distinguish one component from another, and do not limit the order and/or importance of the corresponding components. In some cases, without departing from the scope of rights, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component.

In addition, the expression "an example" used in the present disclosure does not mean the same embodiment as each other, and is provided to emphasize and explain different unique features. However, the examples presented above are not excluded from being implemented in combination with features of other examples. For example, even if a matter described in one specific example is not described in another example, it may be understood as a description related to another example unless a description contradicts or contradicts the matter in another example.

In addition, the terminology used in the present disclosure is used to describe an example only, and is not intended to limit the present disclosure. In this case, the singular expression includes the plural expression unless the context clearly indicates otherwise.

1: Power inductor
2: high frequency inductor
3: Normal bead
4: Bead for high frequency
5: Common mode filter
10: coil parts
100: body part
105: through hole
200: coil unit
211, 212, 221, 222: coil layer
213, 223: insulating layer
214, 224, 234: via
215, 225: insulating film
230: support member
300: electrode part
301, 302: external electrode

Claims (10)

In the coil part in which the coil part is disposed in the body part including a magnetic material,
The coil unit, a support member,
a first coil layer formed on one or both surfaces of the support member;
An insulating layer formed on one or both surfaces of the support member to cover the first coil layer, and
a second coil layer formed on the insulating layer;
The number of turns of the coil pattern of the first coil layer is different from the number of turns of the coil pattern of the second coil layer;
The spacing between the coil patterns of the first coil layer and the spacing between the coil patterns of the second coil layer are different from each other,
coil parts.
The method of claim 1,
The number of turns of the coil pattern of the second coil layer is greater than the number of turns of the coil pattern of the first coil layer,
coil parts.
delete The method of claim 1,
The interval between the coil patterns of the second coil layer is narrower than the interval between the coil patterns of the first coil layer,
coil parts.
The method of claim 1,
The aspect ratio (AR) of the coil pattern of the first coil layer is different from the aspect ratio (AR) of the coil pattern of the second coil layer,
coil parts.
6. The method of claim 5,
The aspect ratio (AR) of the coil pattern of the second coil layer is greater than the aspect ratio (AR) of the coil pattern of the first coil layer,
coil parts.
The method of claim 1,
The at least one outgoing end face of the coil part may include an outgoing end face of the support member, an outgoing end face of the insulating layer disposed on the outgoing end face of the support member, and the second coil disposed on the outgoing end of the insulating layer. comprising the withdrawal cross-section of the layer,
coil parts.
8. The method of claim 7,
At least one lead-out cross-section of the coil part has a tapered shape,
coil parts.
The method of claim 1,
The coil unit, further comprising an insulating film covering the second coil layer,
coil parts.
The method of claim 1,
An electrode part electrically connected to the coil part is disposed on the body part,
coil parts.

Images