KR102262905B1 - Coil component - Google Patents

Abstract

A coil component according to an aspect of the present invention includes a body having one surface and the other facing each other; an insulating substrate having one side of the body perpendicular to one side of the body and embedded in the body; a coil part disposed on one surface of the insulating substrate and including a coil pattern and a coil pattern layer extending from the coil pattern and having a lead-out pattern exposed to one surface of the body; an insulating layer disposed on one surface of the insulating substrate to cover the coil pattern layer; and first and second external electrodes spaced apart from each other on one surface of the body and connected to the drawing pattern, respectively. including, wherein each of the coil pattern, the drawing pattern and the insulating layer has one surface in contact with one surface of the insulating substrate and the other surface facing the one surface, and the distance from one surface of the drawing pattern to the other surface (B) is greater than the distance (A) from one surface to the other surface of the coil pattern, and is smaller than the distance (C) from one surface to the other surface of the insulating layer.

Description

Coil Component {COIL COMPONENT}

The present invention relates to a coil component.

An inductor, one of the coil components, is a representative passive electronic component used in electronic devices along with a resistor and a capacitor.

As electronic devices become increasingly high-performance and thin, coil components are also becoming thinner.

On the other hand, as the coil component becomes thinner, the bonding area between the end of the coil unit and the external electrode may gradually decrease, so that bonding reliability between the two may be a problem.

Korean Patent Publication No. 10-2018-0071644

SUMMARY OF THE INVENTION It is an object of the present invention to provide a coil component capable of improving the reliability of bonding between a lead-out pattern of a coil pattern layer and an external electrode while being able to achieve a low profile.

According to an aspect of the present invention, a body having one surface and the other facing each other; an insulating substrate having one side of the body perpendicular to one side of the body and embedded in the body; a coil part disposed on one surface of the insulating substrate and including a coil pattern and a coil pattern layer extending from the coil pattern and having a lead-out pattern exposed to one surface of the body; an insulating layer disposed on one surface of the insulating substrate to cover the coil pattern layer; and first and second external electrodes spaced apart from each other on one surface of the body and connected to the drawing pattern, respectively. including, wherein each of the coil pattern, the drawing pattern and the insulating layer has one surface in contact with one surface of the insulating substrate and the other surface facing the one surface, and the distance from one surface of the drawing pattern to the other surface (B) is greater than the distance (A) from one surface to the other surface of the coil pattern, and smaller than the distance (C) from one surface to the other surface of the insulating layer, a coil component is provided.

According to the present invention, it is possible to improve the reliability of bonding between the lead-out pattern of the coil pattern layer and the external electrode while reducing the thickness of the coil component (low-profile).

1 is a view schematically showing a coil component according to a first embodiment of the present invention;
FIG. 2 is a view showing a cross-section taken along line I-I' of FIG. 1;
FIG. 3 is a view showing a cross-section taken along line II-II' of FIG. 1;
4 is a view schematically showing a coil component according to a second embodiment of the present invention.
FIG. 5 is a view showing a cross-section taken along line III-III' of FIG. 4;
FIG. 6 is a view showing a cross section taken along line IV-IV' of FIG. 4;
7 is a view schematically showing a coil component according to a third embodiment of the present invention.
FIG. 8 is a view showing a cross-section taken along line V-V' of FIG. 7;

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof. And, throughout the specification, "on" means to be located above or below the target part, and does not necessarily mean to be located above the direction of gravity.

In addition, in the contact relationship between each component, the term "coupling" does not mean only the case where each component is in direct physical contact with each other, but another component is interposed between each component, so that the component is in the other component. It should be used as a concept that encompasses even the cases in which each is in contact.

Since the size and thickness of each component shown in the drawings are arbitrarily indicated for convenience of description, the present invention is not necessarily limited to the illustrated bar.

In the drawings, the L direction may be defined as a first direction or length direction, the W direction may be defined as the second direction or width direction, and the T direction may be defined as a third direction or thickness direction.

Hereinafter, a coil component according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings, and in the description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and overlapping descriptions thereof is to be omitted.

Various types of electronic components are used in electronic devices, and among these electronic components, various types of coil components may be appropriately used for the purpose of removing noise and the like.

That is, in electronic devices, the coil component is used as a power inductor, a high frequency inductor, a general bead, a high frequency bead (GHz Bead), a common mode filter, etc. can be

(Example 1)

1 is a view schematically showing a coil component according to a first embodiment of the present invention. FIG. 2 is a view showing a cross-section taken along line I-I' of FIG. 1 . FIG. 3 is a view showing a cross-section taken along line II-II' of FIG. 1 .

1 to 3 , a coil component 1000 according to an embodiment of the present invention includes a body 100 , an insulating substrate 200 , a coil unit 300 , insulating layers 410 and 420 , and an external electrode. (500, 600).

The body 100 forms the overall appearance of the coil component 1000 according to the present embodiment, and the insulating substrate 200 and the coil unit 300 are embedded therein.

The body 100 may be formed in a hexahedral shape as a whole.

1 to 3, the body 100, the first surface 101 and the second surface 102 facing each other in the longitudinal direction (L), the third surface facing each other in the width direction (W) 103 and a fourth surface 104 , and a fifth surface 105 and a sixth surface 106 facing each other in the thickness direction T. Each of the first to fourth surfaces 101 , 102 , 103 and 104 of the body 100 is a wall surface of the body 100 connecting the fifth surface 105 and the sixth surface 106 of the body 100 . corresponds to Hereinafter, both cross-sections of the body 100 mean the first surface 101 and the second surface 102 of the body 100, and both sides of the body 100 are the third surface ( 103) and the fourth surface 104, one surface of the body 100 means the sixth surface 106 of the body 100, and the other surface of the body 100 is the fifth surface of the body 100 (105) may mean. In addition, in the following, the upper and lower surfaces of the body 100 may mean the fifth surface 105 and the sixth surface 106 of the body 100, respectively, determined based on the directions of FIGS. 1 to 3 . have.

The body 100 may be formed such that the coil component 1000 according to this embodiment in which the external electrodes 500 and 600 to be described later are formed has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, However, the present invention is not limited thereto. Alternatively, the body 100 may be formed such that the coil component 1000 according to the present embodiment in which the external electrodes 500 and 600 are formed has a length of 2.0 mm, a width of 1.6 mm, and a thickness of 0.55 mm. Alternatively, the body 100 may be formed such that the coil component 1000 according to the present embodiment in which the external electrodes 500 and 600 are formed has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.55 mm. Alternatively, the body 100 may be formed such that the coil component 1000 according to the present embodiment in which the external electrodes 500 and 600 are formed has a length of 1.0 mm, a width of 0.6 mm, and a thickness of 0.8 mm. Alternatively, the body 100 may be formed such that the coil component 1000 according to the present embodiment in which the external electrodes 500 and 600 are formed has a length of 1.4 mm, a width of 1.2 mm, and a thickness of 0.65 mm. Alternatively, the body 100 may be formed such that the coil component 1000 according to the present embodiment in which the external electrodes 500 and 600 are formed has a length of 1.2 mm, a width of 1.0 mm, and a thickness of 0.55 mm. However, since the above-described size of the coil component 1000 according to the present embodiment is merely exemplary, a case in which the size is smaller than or equal to the above-described size is not excluded from the scope of the present invention.

The body 100 may include a magnetic powder and an insulating resin. Specifically, the body 100 may be formed by laminating at least one magnetic composite sheet including an insulating resin and magnetic powder dispersed in the insulating resin and then curing the magnetic composite sheet. However, the body 100 may have a structure other than the structure in which the magnetic powder is dispersed in an insulating resin. For example, the body 100 may be made of a magnetic material such as ferrite.

The magnetic powder may be, for example, ferrite or metal magnetic powder.

Ferrite powder is, for example, spinel-type ferrites such as Mg-Zn, Mn-Zn, Mn-Mg, Cu-Zn, Mg-Mn-Sr, Ni-Zn, Ba-Zn, Ba It may be at least one of hexagonal ferrites such as -Mg-based, Ba-Ni-based, Ba-Co-based, and Ba-Ni-Co-based ferrites, garnet-type ferrites such as Y-based ferrites and Li-based ferrites.

Metal magnetic powder is made of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu) and nickel (Ni). It may include any one or more selected from the group consisting of. For example, the magnetic metal powder includes pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo- Cu alloy powder, Fe-Co alloy powder, Fe-Ni-Co alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Si-Cu-Nb alloy powder, Fe- It may be at least one of Ni-Cr-based alloy powder and Fe-Cr-Al-based alloy powder.

The metallic magnetic powder may be amorphous or crystalline. For example, the magnetic metal powder may be an Fe-Si-B-Cr-based amorphous alloy powder, but is not necessarily limited thereto.

The ferrite and the magnetic metal powder may each have an average diameter of about 0.1 μm to 30 μm, but is not limited thereto.

The body 100 may include two or more types of magnetic powder dispersed in an insulating resin. Here, the different types of magnetic powder means that the magnetic powder dispersed in the insulating resin is distinguished from each other by any one of diameter, composition, crystallinity, and shape. For example, the body 100 may include two or more magnetic powders having different diameters. The diameter of the magnetic powder may mean a diameter according to a particle size distribution expressed as _{D 50} or D _{90 .}

The insulating resin may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, etc. alone or in combination.

The body 100 includes an insulating substrate 200 to be described later and a core 110 penetrating the coil unit 300 . In the process of laminating and curing the magnetic composite sheet, the core 110 may be formed by filling at least a portion of the magnetic composite sheet by filling the through holes of the insulating substrate 200 and the coil unit 300, but is not limited thereto. .

The insulating substrate 200 is embedded in the body 100 with one surface perpendicular to the fifth and sixth surfaces 105 and 106 of the body 100 . The insulating substrate 200 is configured to support the coil unit 300 to be described later, and coil pattern layers 310 and 320 are disposed on one and the other surfaces of the insulating substrate 200 facing each other. The portion 300 is disposed perpendicular to the fifth and sixth surfaces 105 and 106 of the body 100 .

The insulating substrate 200 is formed of an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or the insulating resin is impregnated with a reinforcing material such as glass fiber or an inorganic filler. It may be formed of an insulating material. For example, the insulating substrate 200 may be formed of an insulating material such as prepreg, Ajinomoto build-up film (ABF), FR-4, bismaleimide triazine (BT) film, and photo imaginable dielectric (PID) film. However, the present invention is not limited thereto.

As inorganic fillers, silica (SiO ₂ ), alumina (Al ₂ O ₃ ), silicon carbide (SiC), barium sulfate _{(BaSO 4} ), talc, mud, mica powder, aluminum hydroxide (AlOH ₃ ), magnesium hydroxide (Mg ( OH) ₂ ), calcium carbonate (CaCO ₃ ), magnesium carbonate (MgCO ₃ ), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO ₃ ), barium titanate (BaTiO ₃ ) and calcium zirconate (CaZrO) ₃ ) at least one selected from the group consisting of may be used.

When the insulating substrate 200 is formed of an insulating material including a reinforcing material, the insulating substrate 200 may provide more excellent rigidity. When the insulating substrate 200 is formed of an insulating material that does not include glass fibers, the insulating substrate 200 is advantageous in reducing the overall thickness of the coil unit 300 . That is, in the present embodiment, since the insulating substrate 200 and the coil unit 300 are disposed in a stacked form in the width direction W of the component, the width of the entire component can be minimized. When the insulating substrate 200 is formed of an insulating material including a photosensitive insulating resin, the number of processes for forming the coil unit 300 is reduced, which is advantageous in reducing production costs and forming fine vias.

The thickness of the insulating substrate 200 may be formed to be less than 30 μm. When the thickness T1 of the insulating substrate 200 is formed to be 30 μm or more, it is disadvantageous in reducing the width of the coil component.

The coil unit 300 is embedded in the body 100 to express the characteristics of the coil component. For example, when the coil component 1000 of the present embodiment is used as a power inductor, the coil unit 300 stores an electric field as a magnetic field to maintain an output voltage, thereby stabilizing the power of the electronic device.

The coil unit 300 includes coil pattern layers 310 and 320 and a through via 330 . Specifically, the insulating substrate 200 and the coil unit 300 of this embodiment are formed along the width direction W from the third surface 103 to the fourth surface 104 of the body 100 of FIG. 1 . The first coil pattern layer 310 , the insulating substrate 200 , and the second coil pattern layer 320 are sequentially disposed. The through via 330 penetrates through the insulating substrate 200 in the width direction W to the first coil pattern 311 of the first coil pattern layer 310 and the second coil pattern of the second coil pattern layer 320 . 321 are respectively contact-connected. By doing so, the coil unit 300 may function as a single coil in which one or more turns are formed around the core 110 as a whole.

Each of the coil pattern layers 310 and 320 includes coil patterns 311 and 321 and lead patterns 312 and 322 . Specifically, the first coil pattern layer 310 disposed on one surface of the insulating layer 200 facing the third surface 103 of the body 100 includes a first coil pattern 311 and a first coil pattern ( A first drawing pattern 312 extending from 311 and exposed to the sixth surface 106 of the body 100 is included. The second coil pattern layer 320 disposed on the other surface of the insulating layer 200 facing the fourth surface 104 of the body 100 is formed from the second coil pattern 321 and the second coil pattern 321 . It includes a second drawing pattern 322 that is extended and exposed to the sixth surface 106 of the body 100 . Each of the first and second coil patterns 311 and 321 may have a planar spiral shape in which at least one turn is formed about the core 110 as an axis.

The first drawing pattern 312 applied to this embodiment is continuously exposed to the first surface 101 and the sixth surface 106 of the body 100 , and the second drawing pattern 322 is the body 100 . The second surface 102 and the sixth surface 106 are continuously exposed. In this case, the drawing patterns 312 and 322 exposed to the first to sixth surfaces 101 , 102 , 103 , 104 , 105 , and 106 of the body 100 along the length direction L and the thickness direction T along the length direction (L) and the thickness direction (T). area can be increased. Accordingly, the contact area and coupling force between the drawing patterns 312 and 322 and the external electrodes 500 and 600 may increase, and the contact resistance may decrease.

At least one of the coil patterns 311 and 321 , the lead patterns 312 and 322 , and the through via 330 may include one or more conductive layers. For example, when the second coil pattern 321 , the second lead-out pattern 322 , and the through-via 330 are formed on the other side of the insulating substrate 200 by plating, the second coil pattern 312 and the through-via Reference numeral 330 may include a seed layer and an electrolytic plating layer, respectively. Here, the electroplating layer may have a single-layer structure or a multi-layer structure. The electrolytic plating layer having a multilayer structure may be formed in a conformal film structure in which one electroplating layer is covered by the other electroplating layer, and the other electroplating layer is laminated on only one surface of one electroplating layer. It may be formed in a shape. The seed layer may be formed by an electroless plating method or a vapor deposition method such as sputtering. In the former case, the seed layer may be formed of an electroless copper plating solution, but is not limited thereto. In the latter case, the seed layer may include at least one of titanium (Ti), chromium (Cr), nickel (Ni), and copper (Cu). The seed layer of the second coil pattern 321 and the seed layer of the through-via 330 may be integrally formed so that a boundary may not be formed between them, but is not limited thereto. The electroplating layer of the second coil pattern 321 and the electroplating layer of the through-via 330 may be integrally formed so that a boundary may not be formed between them, but is not limited thereto.

Each of the coil patterns 311 and 321 , the lead patterns 312 and 322 , and the through via 330 is copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), and nickel. It may be formed of a conductive material such as (Ni), lead (Pb), titanium (Ti), or an alloy thereof, but is not limited thereto.

The insulating layers 410 and 420 are respectively disposed on one side and the other side of the insulating substrate 200 to cover the coil pattern layers 310 and 320 . Specifically, the first insulating layer 410 is disposed on one surface of the insulating substrate 200 to cover the first coil pattern layer 310 , and the second insulating layer 420 forms the second coil pattern layer 320 . It is disposed on the other surface of the insulating substrate 200 so as to cover it.

The insulating layers 410 and 420 are for insulating the coil unit 300 from the body 100, and may be formed by laminating an insulating film on both sides of the insulating substrate 200 on which the coil pattern layers 310 and 320 are formed. have. The insulating film may be a conventional non-photosensitive insulating film such as Ajinomoto Build-up Film (ABF), or a photosensitive insulating film such as PID.

Each of the coil patterns 311 and 321 , the lead patterns 312 and 322 , and the insulating layers 410 and 420 has one surface in contact with the insulating substrate 200 and the other surface facing the first surface. Here, the distance (B) from one surface to the other surface of the lead-out patterns (312, 322) is greater than the distance (A) from one surface to the other surface of the coil patterns (311, 321), and one surface of the insulating layers (410, 420) is smaller than the distance (C) from to the riding surface. That is, based on the cross-section (W-L cross-section) along the width-length direction of FIG. 1 , the thickness B of the lead-out patterns 312 and 322 is greater than the thickness A of the coil patterns 311 and 321 . By forming the thickness B of the drawing patterns 312 and 322 thicker than the thickness A of the coil patterns 311 and 321 , the area of the drawing patterns 312 and 322 exposed to the surface of the body 100 is increased. can By forming the thickness C of the insulating layers 410 and 420 thicker than the thickness B of the drawing patterns 312 and 322 , the exposed surface of the body 100 among the surfaces of the drawing patterns 312 and 322 is exposed. A surface other than the surface may be electrically insulated from the body 100 .

The external electrodes 500 and 600 are disposed to be spaced apart from each other on the sixth surface of the body 100 , and are connected to the lead-out patterns 312 and 322 of the coil unit 300 , respectively. Specifically, the first external electrode 500 is disposed on the sixth surface 106 of the body 100 and is the first of the first coil pattern layer 310 exposed to the sixth surface 106 of the body 100 . A second coil pattern connected to the drawing pattern 312 in contact with the second external electrode 600 is disposed on the sixth surface 106 of the body 100 and exposed to the sixth surface 106 of the body 100 . It is connected to the second lead-out pattern 322 of the layer 320 in contact.

The external electrodes 500 and 600 applied to this embodiment may be continuously formed on the first and second surfaces 101 and 102 and the sixth surface 106 of the body 100 . That is, as described above, since the drawing patterns 312 and 322 applied in this embodiment are continuously formed on the first and second surfaces 101 and 102 and the sixth surface 106 of the body 100 , the external The electrodes 500 and 600 may be continuously formed on the first and second surfaces 101 and 102 and the sixth surface 106 of the body 100 to cover the drawing patterns 312 and 322 . Accordingly, the external electrodes 500 and 600 are formed from the pad parts 510 and 610 disposed on the sixth surface 106 of the body 100 , and the first and the first parts of the body 100 from the pad parts 510 and 610 . It has extensions 520 and 620 extending to the second surfaces 101 and 102, respectively.

The external electrodes 500 and 600 are copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or these It may be formed of a conductive material such as an alloy of, but is not limited thereto.

The external electrodes 500 and 600 may be formed in a single-layer or multi-layer structure. For example, the first external electrode 500 may include a first layer including nickel (Ni) and a second layer disposed on the first layer and including tin (Sn). Here, each of the first to second layers may be formed by plating, but is not limited thereto. As another example, the first external electrode 500 may include a first layer including copper (Cu), a second layer disposed on the first layer, and a second layer including nickel (Ni) and tin (Sn) disposed on the second layer. ) may be composed of a third layer comprising Here, each of the first to third layers may be formed by plating, but is not limited thereto. As another example, the first external electrode 500 may include a resin electrode including conductive powder and a resin, and a plating layer formed by plating on the resin electrode. In the first and second examples, the first layer may be formed on the surface of the body 100 and contact the drawing patterns 312 and 322 . The first layer in contact with the drawing patterns 312 and 322 and formed by electroplating can be distinguished by the presence or absence of a resin component in relation to the resin electrode and the difference in concentration of organic matter in the same volume, and in relation to the electrode formed by sputtering, etc. It can be distinguished by whether or not at least a portion of the material constituting the electrode penetrates into the body 100, and can be distinguished by the difference in metal density within the same volume in relation to the electrode formed by electroless plating.

Meanwhile, although not shown, an external insulating layer may be formed on the surface of the body 100 except for the region where the external electrodes 500 and 600 are formed. The external insulating layer may function as a plating resist in forming the external electrodes 500 and 600 on the surface of the body 100 by electroplating, but is not limited thereto.

In the coil component 1000 according to the present invention, the sixth surface 106 of the body 100 on which the external electrodes 500 and 600 are disposed is mounted on a printed circuit board, etc., and the area of the surface of the insulating substrate 200 is The largest surface and the other surface are arranged to be perpendicular to the sixth surface 106 of the body 100 . For this reason, it is possible to minimize the area occupied by the coil component 1000 on the mounting surface of the printed circuit board, and as a result, a relatively large number of coil components 1000 are mounted on the printed circuit board having the mounting surface of the same area. can do. In addition, the coil pattern layers 310 and 320 are also disposed in a shape perpendicular to the sixth surface 106 of the body 100, respectively, so that noise induced to the printed circuit board due to a change in magnetic flux can be minimized.

(Second embodiment)

4 is a view schematically showing a coil component according to a second embodiment of the present invention. FIG. 5 is a view showing a cross-section taken along line III-III′ of FIG. 4 . FIG. 6 is a view showing a cross-section taken along line IV-IV' of FIG. 4 .

1 to 6 , the coil part 2000 according to the present embodiment is different from the coil part 2000 according to the first embodiment of the present invention in that the coil part 300 is different. Therefore, in describing the present embodiment, only the coil unit 300 that is different from the first embodiment of the present invention will be described. The same or similar description in the first embodiment of the present invention may be applied to the rest of the configuration of the present embodiment.

4 to 6 , the coil unit 300 applied to the present embodiment further includes dummy lead-out patterns 313 and 323 . Specifically, the first coil pattern layer 310 further includes a first dummy lead-out pattern 313 spaced apart from each of the first coil pattern 311 and the first lead-out pattern 312, and the second coil pattern layer ( 320 further includes a second dummy lead-out pattern 323 spaced apart from each of the second coil pattern 321 and the second lead-out pattern 322 .

The first dummy lead-out pattern 313 may be continuously exposed to the second surface 102 and the sixth surface 106 of the body 100 , and the second dummy lead-out pattern 323 is the body 100 . The first surface 101 and the sixth surface 106 may be continuously exposed. The first dummy lead-out pattern 313 may be connected to the second lead-out pattern 322 by a connection via (not shown) penetrating the insulating substrate 200, and the second dummy lead-out pattern 323 may be connected to the insulating substrate ( It may be connected to the first lead-out pattern 312 by a connection via (not shown) passing through the 200 , but is not limited thereto.

The dummy lead-out patterns 313 and 323 have one surface in contact with the insulating substrate 200 and the other surface facing the first surface, and the distance from one surface of the dummy lead-out patterns 313 and 323 to the other surface is the extraction patterns 312 and 322 . ) may be substantially the same as the distance (B) from one surface to the other surface.

In the present embodiment, since the coil unit 300 further includes the dummy lead-out patterns 313 and 323 , the contact area between the coil unit 300 and the external electrodes 500 and 600 increases, so that the coupling force between the two can be improved. have.

(Example 3)

7 is a view schematically showing a coil component according to a third embodiment of the present invention. FIG. 8 is a view showing a cross-section taken along line V-V' of FIG. 7 .

1 to 8 , the coil part 3000 according to the present embodiment is compared with the coil parts 100 and 2000 according to the first and second embodiments of the present invention, the coil part 300 and The insulating layers 410, 410', 420, and 420' are different. Therefore, in describing the present embodiment, only the coil unit 300 and the insulating layers 410, 410', 420, and 420' that are different from the first and second embodiments of the present invention will be described. The same or similar descriptions in the first and/or second embodiments of the present invention may be applied to the remaining components of the present embodiment.

7 and 8 , the first and second coil pattern layers 310 , 310 ′, 320 and 320 ′ of the coil unit 300 are formed in plurality. That is, the first coil pattern layers 310 and 310 ′ disposed on one surface of the insulating substrate 200 are formed of two or more layers, and the second coil pattern layers 320 and 320 disposed on the other surface of the insulating substrate 200 . ') is formed in two or more layers. In addition, the first insulating layers 410 and 410' and the second insulating layers 420 and 420' are formed in plurality, respectively, so that the first insulating layers 410 and 410' are adjacent to the first coil pattern layer 310, 310') and disposed on the first coil pattern layer 310' of the outermost layer, and the second insulating layers 420 and 420' are disposed between the adjacent second coil pattern layers 320 and 320' and between the outermost layer. It is disposed on the second coil pattern layer 310 ′. That is, the insulating layers 410 , 410 ′, 420 , and 420 ′ formed of a plurality of layers cover the coil unit 300 together with the insulating substrate 200 .

In the present embodiment, since a plurality of first and second coil pattern layers are formed, each coil pattern layer may be formed to have a smaller distance from one surface to the other than the coil pattern layer in the above-described embodiments. For example, in the present embodiment, the thickness (A) of the first coil pattern may be smaller than the thickness (A) of the actual first coil pattern in the above-described embodiments. Accordingly, in the present embodiment, the coil pattern layer may have a relatively low aspect ratio (AR), and thus may be formed in the shape of a flat coil as a whole. In the case of this embodiment, since the aspect ratio of the coil pattern layer is relatively low, the defect rate when forming the coil pattern layer can be reduced and cost can be minimized. It is also possible to reduce the width of the part.

On the other hand, if the area of the thickness-lengthwise cross-section (TL cross-section) of the body 100 is the same and the cross-sectional area of each turn of the coil pattern layer is the same, the number of turns of the coil pattern layer decreases when the aspect ratio of the coil pattern layer is low As a result, the properties of the parts are bound to deteriorate. In the present embodiment, for this purpose, a plurality of coil pattern layers are formed and connected to each other.

As described above, the thickness B of the lead-out patterns 312 and 322 and the dummy lead-out pattern is thicker than the thickness A of the coil patterns 311 and 321 . Accordingly, in the present embodiment, the distance between adjacent lead-out patterns, the distance between adjacent dummy lead-out patterns, and/or the distance between the adjacent lead-out patterns and the dummy lead-out pattern are smaller than the distance between adjacent coil patterns. As a result, the external electrode can be more easily formed by plating, and the coupling force between the external electrode and the drawing pattern can be improved.

In the above, although an embodiment of the present invention has been described, those of ordinary skill in the art can add, change or delete components within the scope that does not depart from the spirit of the present invention described in the claims. Various modifications and variations of the present invention will be possible, and this will also be included within the scope of the present invention.

100: body
110: core
200: insulating substrate
300: coil unit
310, 320: coil pattern layer
311, 321: coil pattern
312, 322: withdrawal pattern
313, 323: dummy withdrawal pattern
330: via
410: 420: insulating layer
500, 600: external electrode
510, 610: pad part
520, 620: extension
1000, 2000, 3000: coil parts

Claims (11)

a body having one surface and one surface and the other end connected to the one surface and facing each other;
a coil unit disposed in the body and including a plurality of coil pattern layers spaced apart from each other; and
an insulating layer disposed between the plurality of coil pattern layers; including,
Each of the plurality of coil pattern layers, a coil pattern disposed perpendicular to one surface of the body, is electrically connected to the coil pattern, and is exposed to any one of one end surface and the other end surface of the body and one surface of the body. including patterns;
In at least one coil pattern layer among the plurality of coil pattern layers, a thickness (B) of the outgoing pattern is thicker than a thickness (A) of the coil pattern,
The drawing patterns of the plurality of coil pattern layers are connected to each other by a connection via passing through the insulating layer,
coil parts.
According to claim 1,
The plurality of coil pattern layers are spaced apart from each other in one direction,
The distance between the coil patterns adjacent in the one direction is longer than the distance between the drawing patterns adjacent in the one direction,
coil parts.
delete delete According to claim 1,
The coil unit,
Further comprising a through-via penetrating the insulating layer to connect the coil patterns of the plurality of coil pattern layers,
coil parts.
According to claim 1,
The drawing pattern includes a first drawing pattern exposed to one end surface of the body and one surface of the body, and a second drawing pattern exposed to the other end surface of the body and one surface of the body,
coil parts.
7. The method of claim 6,
first and second external electrodes spaced apart from each other on one surface of the body and connected to the first and second lead-out patterns, respectively;
further comprising,
coil parts.
8. The method of claim 7,
The first external electrode has a first pad portion disposed on one surface of the body, and a first extension portion extending from the first pad portion to one end surface of the body;
The second external electrode has a second pad portion disposed on one surface of the body, and a second extension portion extending from the second pad portion to the other end surface of the body,
coil parts.
8. The method of claim 7,
Each of the first and second external electrodes includes a plating layer in contact with the first and second lead-out patterns.
According to claim 1,
The body is a coil component comprising an insulating resin and magnetic powder.
a body having one surface and one surface and the other end connected to the one surface and facing each other;
a coil unit disposed in the body and including a plurality of coil pattern layers spaced apart from each other in one direction parallel to each of one surface, one end surface, and the other end surface of the body; and
an insulating layer disposed between the plurality of coil pattern layers; including,
Each of the plurality of coil pattern layers includes a coil pattern disposed perpendicular to one surface of the body, and a drawing pattern exposed to either one of one end surface and the other end surface of the body and one surface of the body,
A thickness (B) of at least one of the drawing patterns along the one direction is thicker than a thickness (A) of at least one of the coil patterns along the one direction,
The plurality of coil pattern layers include first and second coil pattern layers spaced apart from each other in the one direction,
The first coil pattern layer includes a first coil pattern disposed perpendicular to one surface of the body, a first drawing pattern connected to the first coil pattern and exposed to one surface of the body and one surface of the body, and the a first coil pattern and a first dummy draw-out pattern spaced apart from the first draw-out pattern and exposed to the other end surface of the body and one surface of the body;
The second coil pattern layer includes a second coil pattern disposed perpendicular to one surface of the body, a second drawing pattern connected to the second coil pattern and exposed to the other end surface of the body and one surface of the body, and the a second coil pattern and a second dummy draw-out pattern spaced apart from the second draw-out pattern and exposed to one end surface of the body and one surface of the body;
the first lead-out pattern and the second dummy lead-out pattern are connected to each other by a connection via passing through the insulating layer;
coil parts.

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