KR20170097445A - Coil component - Google Patents

Abstract

The present invention relates to a coil component which can reduce a defect risk such as a short and secure coil uniformity and low direct current resistance. The coil component has a coil unit arranged in a body unit including a magnetic material. The coil unit comprises: a support member; a first coil layer formed on one surface or both surfaces of the support member; an insulation layer formed on one surface or both surfaces of the support member to cover the first coil layer; and a second coil layer formed on the insulation layer. The first and the second coil layer have different numbers of turns of coil patterns.

Description

Coil Components {COIL COMPONENT}

The present disclosure relates to coil components, such as power inductors.

With the miniaturization and thinning of electronic devices such as digital TVs, mobile phones, laptops, etc., coil parts applied to such electronic devices are required to be downsized and thinned. In order to meet these demands, various types of winding type or thin film type Research and development of coil parts is actively proceeding.

The major issue of miniaturization and thinning of coil parts is to realize the same characteristics as the existing ones despite this miniaturization and thinning. In order to satisfy such a demand, it is necessary to secure the size of the core charged with the magnetic material and the low DC resistance (R _dc ). For this purpose, there has been an increasing number of products that can increase the aspect ratio of the coil pattern and the cross-sectional area of the coil portion, for example, anisotropic plating technology.

On the other hand, when the coil part is manufactured by applying the anisotropic plating technique in a limited space in accordance with the downsizing and thinning, the risk of badness such as lowered uniformity of plating growth and occurrence of short-circuit between the coil part is increasing with increasing aspect ratio.

One of the objects of the present invention is to solve such a problem, and to provide a coil component with a new structure which can reduce the unevenness of the coil, such as occurrence of a short circuit, and ensure the uniformity of the coil and the low DC resistance (R _dc ).

One of various solutions proposed through the present disclosure is to form a plurality of coil layers stably by using an insulating layer on a supporting member so that the number of turns of the coil patterns of the plurality of coil layers is different from each other.

For example, the coil part is arranged in a body part including a magnetic substance, and the coil part is composed of a support member, a first coil layer formed on one or both surfaces of the support member, An insulating layer formed on the insulating layer and covering the first coil layer, and a second coil layer formed on the insulating layer, wherein the first and second coil layers have different numbers of turns of the coil pattern.

As one of the various effects of the present disclosure, it is possible to provide a coil component of a new structure which is capable of ensuring uniformity of a coil and securing a low DC resistance (R _dc ) while reducing defective risks such as short- have.

1 schematically shows an example of a coil component applied to an electronic device.
2 is a schematic perspective view showing an example of a coil part.
FIG. 3 is a schematic II 'cross-sectional view of the coil component of FIG. 2;
4 is a schematic enlarged cross-sectional view of the A region of the coil component of Fig.
5 is a schematic sectional elevation II-II 'cross-sectional view of the coil component of FIG. 2;
6 is a schematic cross-sectional view in the B direction of the body portion of the coil component of Fig.
Fig. 7 is a schematic cross-sectional view showing the electrical connection of the coil portion of Fig. 2;

Hereinafter, the present disclosure will be described in more detail with reference to the accompanying drawings. The shape and size of elements in the drawings may be exaggerated for clarity.

Electronics

1 schematically shows an example of a coil component applied to an electronic device.

Referring to the drawings, it can be seen that various types of electronic components are used in electronic devices. For example, DC / DC, Comm. Processor, WLAN BT / WiFi FM GPS NFC, PMIC, Battery, SMBC, LCD AMOLED, Audio Codec, USB 2.0 / 3.0 HDMI, CAM can be used. For example, a power inductor (1), a high frequency inductor (2), a high frequency inductor (2), and a high frequency inductor (2) may be used. , General beads (General Bead) 3, beads for high frequency (GHz Bead) 4, common mode filters (5), and the like.

Specifically, the power inductor 1 may be used to stabilize the power source by storing electric power in the form of a magnetic field to maintain an output voltage. Further, the high frequency inductor (HF Inductor) 2 can be used for the purpose of securing a necessary frequency by matching the impedance, blocking the noise and the AC component, and the like. Further, a normal bead (General Bead) 3 can be used for eliminating noise in a power source and a signal line, removing high-frequency ripple, and the like. Further, the high frequency bead (GHz Bead) 4 can be used for eliminating high frequency noise of a signal line and a power supply line associated with audio. Further, the common mode filter (5) can be used for passing the current in the differential mode and removing only the common mode noise.

The electronic device may be a smart phone, but is not limited thereto. For example, the electronic device may be a personal digital assistant, a digital video camera, a digital still camera ), A network system, a computer, a monitor, a television, a video game, a smart watch, and the like. But may be other various electronic devices well known to those skilled in the art.

Coil parts

Hereinafter, the coil component of the present disclosure will be described. However, it is needless to say that the coil component of the present disclosure can be applied to other various coil components as described above, as well as the structure of the inductor.

2 is a schematic perspective view showing an example of a coil part.

3 is a schematic cross-sectional view taken on line I-I 'of the coil component of FIG.

4 is a schematic enlarged cross-sectional view of the A region of the coil component of Fig.

5 is a schematic sectional elevation II-II 'cross-sectional view of the coil component of FIG. 2;

6 is a schematic cross-sectional view in the B direction of the body portion of the coil component of Fig.

Fig. 7 is a schematic cross-sectional view showing the electrical connection of the coil portion of Fig. 2;

Referring to the drawings, a coil component 10 according to an example is a structure in which a coil part 200 is disposed inside a body part 100 including a magnetic material. An electrode unit 300 electrically connected to the coil unit 200 is disposed outside the body 100. The coil portion 200 includes a support member 230 and a plurality of coil layers 211, 212, 221 and 222 disposed on both sides of the support member 230. [ The first coil layer 221 and the second coil layer 222 are disposed on both sides of the support member 230 between the upper and lower first and second coil layers 211 and 212 and the lower first and second coil layers 221 and 222, Insulating layers 213 and 223 covering the first and second electrodes 211 and 221, respectively.

The body part (100) forms the appearance of the coil part (10). The body 100 has a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface facing each other in the second direction, and a fifth surface and a sixth surface facing the third direction, . The body 100 may have a substantially hexahedral shape, but the present invention is not limited thereto. The six corners where the first to sixth surfaces meet can be rounded by grinding or the like. The body portion 100 includes a magnetic material that exhibits magnetic properties. For example, the body part 100 may be one in which ferrite or metal magnetic particles are filled in the resin. The ferrite may be made of a material such as Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Ba ferrite or Li ferrite. The metal magnetic particles may include at least one selected from the group consisting of iron (Fe), silicon (Si), chrome (Cr), aluminum (Al), and nickel (Ni) B-Cr amorphous metal, but the present invention is not limited thereto. The diameter of the metal magnetic body particles may be about 0.1 mu m to 30 mu m. The body part 100 may be formed by dispersing such ferrite or metal magnetic particles in a thermosetting resin such as an epoxy resin or a polyimide resin. The thickness of the body part 100 may vary depending on the electronic device to be applied, and may be about 500 μm to 900 μm, but is not limited thereto.

The magnetic material of the body 100 may be a magnetic resin composite in which a metal magnetic powder and a resin mixture are mixed. The metal magnetic material powder may include iron (Fe), chromium (Cr), or silicon (Si) as a main component. Examples of the metal magnetic powder include iron (Fe) Chromium (Cr) -silicon (Si), and the like. The resin mixture may include, but is not limited to, epoxy, polyimide, Liquid Crystal Polymer (LCP), and the like. The metal magnetic body powder may be filled with a metal magnetic body powder having at least two average particle sizes. Alternatively, the metal magnetic powder may be a metal magnetic powder having an average particle diameter of at least three. In this case, by using the metal magnetic powder powders of different sizes, the magnetic resin composite can be filled, thereby increasing the filling rate. As a result, the capacity of the coil component can be increased.

The coil part 200 functions to perform various functions in the electronic device through the characteristics expressed from the coil of the coil part 10. For example, the coil component 10 may be a power inductor. In this case, the coil part 200 may store electricity in the form of a magnetic field to maintain the output voltage and stabilize the power supply. A plurality of coil layers 211, 212, 221 and 222 stacked on both sides of the support member 230 are electrically connected through a via 243 passing through the support member 230. The coil layers 211 and 221 disposed on the inner side and the coil layers 212 and 222 disposed on the outer side of the plurality of coil layers 211, 212, 221, and 222 have insulating layers 213 and 223 disposed therebetween, Via vias 214 and 224, which extend through the vias 214 and 224, respectively. As a result, the plurality of coil layers 211, 212, 221, and 222 are electrically connected to form one coil. A through hole 105 is formed in the center of the coil part 200 and the through hole 105 is filled with a magnetic material constituting the body part 100. The coil part 200 includes first coil layers 211 and 221 formed on both sides of the support member 230, that is, laminated on the inner side, and second coil layers 211 and 221 formed on the insulating layers 213 and 223, Coil layers 212 and 222, respectively. Insulating layers 213 and 223 are disposed between the first coil layers 211 and 221 and the second coil layers 212 and 222. The second coil layers 212 and 222 are covered by the insulating films 215 and 225.

The coil patterns of the first coil layers 211 and 221 and the second coil layers 221 and 222 all have a plurality of turns. At this time, the first coil layers 211 and 221 and the second coil layers 221 and 222 have different coil pattern turns. For example, the number of turns of the coil patterns of the outer layers of the second coil layers 221 and 222 may be larger than the number of turns of the coil patterns of the inner layers of the first coil layers 211 and 221. In this case, it is possible to reduce the risk of failure and uniformity through the first coil layers 211 and 221 and to realize a high inductance through the second coil layers 221 and 222. In addition, they are mostly constituted by a coil pattern having a thin line width, and can basically have a large number of turns in the horizontal direction, that is, the first direction and / or the second direction. The coil layers 211, 212, 221 and 222 may have the same rotational direction and they may be electrically connected through the vias 214, 224 and 234 so that the coil layers 211, 212, The effect of increasing the number of turns is obtained. It is to be understood that the number of turns may be greater than that shown in the drawings, or may have a smaller number of turns than those shown in the drawings, which will be apparent to those of ordinary skill in the art.

The first coil layers 211 and 221 and the second coil layers 221 and 222 have different coil patterns. For example, the gap L ₂ between the coil patterns of the second coil layers 212 and 222 may be narrower than the gap L ₁ between the coil patterns of the first coil layers 211 and 221. That is, the first coil layers 211 and 221 formed on the inner side relatively increase the interval L ₁ of the coil patterns, thereby reducing the risk of poor overall occurrence such as short-circuiting and preventing the insulation layers 213 and 223 The coil uniformity of the second coil layers 221 and 222 formed on the outer side can be improved. In addition, the second coil layers 221 and 222 formed on the outer side can relatively reduce the interval L ₂ of the coil patterns so that the coil part 200 can have a large number of turns as a whole. The first coil layers 211 and 221 may be wider than the line width w ₁ of the coil pattern in which the line width w ₂ of the coil pattern disposed on the outermost side is disposed on the inner side. That is, the coil patterns disposed on the inner side is to have a number of turns with a relatively thin implement a line width (w _1), and at the same time, the coil patterns disposed on the outer side by a relatively thick implement a line width (w ₂₎ low DC resistance (R _dc ) characteristics can be ensured.

The coil patterns of the first coil layers 211 and 221 and the second coil layers 221 and 222 have different aspect ratios AR. For example, the aspect ratio AR of the coil patterns of the second coil layers 221 and 222 may be larger than the aspect ratio AR of the coil patterns of the first coil layers 211 and 221. In this case, it is possible to reduce the risk of failure and uniformity through the first coil layers 211 and 221 and to lower the DC resistance Rdc through the high aspect ratio AR of the second coil layers 221 and 222 . Claim the aspect ratio (AR) is about 1 less than that the width (w _2), one coil layer ratio (h ₁ / w ₁₎ of the thickness (h ₁₎ of the coil pattern has a width (w ₁₎ of 211 and 221 (H ₁ / w ₂ ) of the thickness (h ₁ ) is greater than 1. The coil pattern of the second coil layers 212 and 222 has an aspect ratio (AR) which is a ratio of the ratio (h ₂ / w ₃ ) of the thickness (h ₂ ) to the width (w ₃ ) For example, a first coil layer 211 and 221 the coil pattern can be on the order of about 30㎛ to 50㎛ width (w ₁₎ of width (w ₂₎ may be the order of about 90㎛ to 150㎛, thickness (h ₁ ) may be about 40 μm to 60 μm. The coil patterns of the second coil layers 212 and 222 may have a width w ₃ of about 40 μm to 60 μm and a thickness h ₂ of about 40 μm to 70 μm.

Since the coil layers 211, 221, 212, and 222 are formed by coil patterns having a thin line width, the thickness of the coil portion is thin. At this time, in order to have a sufficient number of turns, each of the coil layers 211, 221, 212, and 222 is formed to utilize the space in the horizontal direction, that is, in the first direction and / or the second direction. That is, the first coil layers 211 and 221 and the second coil layers 212 and 222 stacked one above the other have overlapping regions. Therefore, it is useful for realizing a coil part having a thin and sufficient coil characteristic.

Although only the first coil layers 211 and 221 and the second coil layers 212 and 222 are shown in the drawing, it is understood that further coil layers may be further formed on the second coil layers 212 and 222, And an insulating layer having a via formed therebetween may be disposed and electrically connected to each other. In addition, a coil layer may be further formed between the first coil layers 221 and 221 and the second coil layers 212 and 222, and an insulating layer having a via formed therebetween may be disposed and electrically connected to each other Of course.

The support member 230 is not particularly limited as long as it can support a plurality of coil layers 211, 212, 221 and 222. For example, the support member 230 may be made of a copper clad laminate (CCL), polypropylene glycol ) Substrate, a ferrite substrate, a metal-based soft magnetic substrate, or the like. It may also be an insulating substrate made of an insulating resin. As the insulating resin, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as a glass fiber or an inorganic filler such as prepreg, ABF (Ajinomoto Build- Film, FR-4, bismaleimide triazine (BT) resin, and PID (Photo Imagable Dielectric) resin. From the standpoint of stiffness maintenance, an insulating substrate including glass fiber and epoxy resin can be used, but the present invention is not limited thereto. The thickness of the support member 230 may be 80 占 퐉 or less, preferably 60 占 퐉 or less, more preferably 40 占 퐉 or less, but is not limited thereto.

The vias 234 penetrating through the support member 230 can only electrically connect the upper first coil layer 211 and the lower first coil layer 221 disposed on both sides of the support member 230, The shape and material thereof are not particularly limited. Here, the upper side and the lower side are judged based on the third direction in the drawing. For example, the shape of the via 234 may be any shape known in the art, such as a tapered shape whose diameter becomes smaller or larger toward the lower surface from the upper surface, a cylindrical shape whose diameter becomes substantially constant from the upper surface to the lower surface, . As the material of the via 234, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pd) Of a conductive material can be used.

The insulating layers 213 and 223 serve to insulate the first coil layers 211 and 221 and the second coil layers 212 and 222 from each other. The insulating layer 213, 223 may be a build-up film comprising an insulating material. For example, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as an inorganic filler, for example, ABF (Ajinomoto Build-up Film) may be used. Alternatively, it may be an insulating film containing a known Photo Image Dielectric (PID) resin. The thickness of the insulating layers 213 and 223 is thicker than the thickness of the first coil layers 211 and 221 and is sufficient to cover the insulating layers 213 and 223 and to insulate them from the second coil layers 212 and 222. The insulating distance between the first coil layers 211 and 221 and the second coil layers 212 and 222 by the insulating layers 213 and 223 may be, for example, about 3 mu m to 20 mu m, no.

The vias 214 and 224 passing through the insulating layers 213 and 223 are not limited to the shape and material of the first coil layers 211 and 221 and the second coil layers 212 and 222 It is not limited. For example, the shapes of the vias 214 and 224 may be any shape known in the art, such as a tapered shape as described above, a cylindrical shape, and the like. The vias 214 and 224 may be formed of a material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pd) A conductive material such as an alloy may be used. The thickness of the insulating layers 213 and 223 is usually thinner than the thickness of the supporting member 230.

The insulating films 215 and 225 serve to protect the second coil layers 221 and 222. The material of the insulating films 215 and 225 may be any material including an insulating material. For example, it may include an insulating material used for a normal insulating coating such as an epoxy resin, a polyimide resin, a liquid crystal crystalline polymer resin, or the like, and a known photo insulator (PID) resin may be used However, the present invention is not limited thereto. The insulating films 215 and 225 may be integrated with the insulating layers 213 and 223 according to a manufacturing method, but are not limited thereto.

The right-side drawing end surface of the coil portion 200 is connected to the leading end surface of the supporting member 230, the drawing-out end surface of the upper and lower insulating layers 213 and 223 disposed on the drawing-out end surface of the supporting member 230, And a lead-out end face of the upper second coil layer 212 disposed on the lead-out end face of the insulating layer 213. The leftward drawing-out end face of the coil portion 200 is connected to the leading end face of the supporting member 230, the drawing end face of the upper and lower insulating layers 213 and 223 disposed on the drawing end face of the supporting member 230, And a drawing-out end face of the lower second coil layer 222 disposed on the drawing-out end face of the lower insulating layer 213. That is, the lead-out terminal of the coil pattern drawn out to be connected to the external electrode is supported by the supporting member and the insulating layer. Therefore, the lead-out terminal of the coil pattern can be stably formed, and can have a good connecting force with the external electrode. Here, the left and right are determined based on the first direction of the drawing. Further, it is judged based on the third direction in the drawing. Although the insulating film 215 is omitted in the drawing, the insulating film 215 may also be drawn out. Alternatively, the insulating film 215 may not remain in the drawing section.

The right-side drawing end surface of the coil section 200 may have a tapered shape whose width becomes narrower from the upper side to the lower side. Although not shown in the drawings, similarly, the left-side drawing section may also have a tapered shape whose width becomes narrower from the lower side toward the upper side. Here, it is judged based on the third direction in the drawing. This is because in the manufacturing step of the coil component 10, a region other than the region for supporting the coil layer 211, 221, 212, 222 of the support member 230 and the insulating layers 213, 223 by a trimming process or the like The supporting member 230 including the insulating material and the insulating layers 213 and 223 may be removed more toward the center thereof during the removing process. The coil layers 211, 221, 212, and 222 are hardly affected. The reason for having such a shape of the drawing section is that the insulating layers 213 and 223 are laminated on the supporting member 230 and the second coil layers 212 and 222 are formed thereon in a stable manner, Means that the body part 100 is formed by forming a coil part 200 having an increased number of teeth and then filling a maximum space with a magnetic material through a trimming process or the like. Accordingly, uniformity of the coil and low DC resistance (R _dc ) can be ensured while the risk of defects such as short-circuit is small, and it is possible to manufacture the device with a thin shape.

The electrode unit 300 includes first and second external electrodes 301 and 302 that are disposed on the body 100 and are spaced apart from each other and are electrically connected to the lead terminals of the second coil layers 212 and 222 do. The external electrodes 301 and 302 serve to electrically connect the coil portion 200 in the coil component 10 with the electronic device when the coil component 10 is mounted on the electronic device. The external electrodes 301 and 302 may include, for example, a conductive resin layer and a plating layer formed on the conductive resin layer. The conductive resin layer may include at least one conductive metal selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag) and a thermosetting resin. The plating layer may include at least one selected from the group consisting of nickel (Ni), copper (Cu) and tin (Sn). For example, a nickel (Ni) layer and a tin .

A plurality of coil parts 200 are formed by using a support member 230 and then a magnetic sheet is stacked on upper and lower parts of the plurality of coil parts 200 A plurality of body parts 100 may be formed by stacking a plurality of body parts 100, and then the plurality of body parts 100 may be cut and then the electrode part 300 may be formed on each individual body part 100 .

By using the support member 230, a plurality of coil parts 200 can be simultaneously formed, and a plurality of body parts 100 can be formed at the same time. Thereafter, a plurality of coil parts can be simultaneously manufactured by a singulation process such as dicing. That is, it is advantageous for mass production. The plurality of coil parts 200 may be formed using one or both surfaces of the support member 230. When the coil part 200 is formed using both surfaces, the through hole passing through the support member 230 may be formed by a mechanical drill and / The via 234 can be formed by a known method such as drilling or the like and then filling with a plating method.

More specifically, the first coil layers 211 and 221 are formed on both surfaces of the support member 230, respectively. The method of forming the first coil layers 211 and 221 is not particularly limited, and known photolithography and plating methods can be used. For example, the photolithography method may be one which uses exposure and development using a photoresist. In addition, the plating method may be an electrolytic copper plating or an electroless copper plating. More specifically, it is possible to use a chemical vapor deposition (PVD), a physical vapor deposition (PVD), a sputtering, a subtractive, an additive, a semi-additive process, Additive process), but the present invention is not limited thereto. On the other hand, when the first coil layers 211 and 221 are formed, a through hole passing through the support member 230 is formed by a known method such as a mechanical drill and / or a laser drill, The upper and lower first coil layers 211 and 221 formed on both surfaces of the support member 230 may be electrically connected to each other through the upper and lower first coil layers 211 and 221, respectively.

Next, the insulating layers 213 and 223 are laminated on both surfaces of the support member 230 so as to cover the first coil layers 211 and 221. The method of forming the insulating layers 213 and 223 is not particularly limited. For example, a precursor film containing the above-described insulating material may be laminated on a support member 230 on which the first coil layers 211 and 221 are formed Followed by post-curing. Alternatively, the above-described insulating material may be applied on the support member 230 on which the first coil layers 211 and 221 are formed, and then cured. As the lamination method, for example, a hot pressing method in which the resin is pressed at a high temperature for a certain period of time and then reduced in pressure to room temperature, and then cooled in a cold press to separate the working tool can be used. As the application method, for example, a screen printing method in which ink is applied by squeezing, a spray printing method in which ink is fogged and applied, and the like can be used.

Next, the second coil layers 212 and 222 are formed on the insulating layers 213 and 223, respectively. The method of forming the second coil layers 212 and 222 is also not particularly limited, and the known photolithography method and plating method as described above can be used. Although not shown in the drawing, when forming the second coil layers 212 and 222, the through holes passing through the insulating layers 213 and 223 are formed in a known manner such as a photolithography method, a mechanical drill, and / The first and second coil layers 211 and 221 and the second coil layers 212 and 222 may be electrically connected to each other through the via holes 214 and 224 .

Next, insulating films 215 and 225 covering the second coil layers 212 and 222 are formed. The method of forming the insulating films 215 and 225 is not particularly limited, and a known coating method can be used. The insulating films 215 and 225 may include the same materials as the insulating layers 213 and 223, but may be integrated after curing, but are not limited thereto.

Next, regions other than the regions where the coil layers 211, 212, 221, and 222 of the coil portion 200 are formed are selectively removed by using a known trimming method or the like. In this process, the center portion of the coil portion 200 is removed, and the through hole 105 can be formed. Thereafter, the body part 100 for accommodating the coil part 200 is formed by lamination of a magnetic material sheet or the like and singulated by a dicing process or the like, Thereby forming the body portion 100.

The plurality of body parts 100 may be formed by forming a plurality of coil parts 200, stacking the magnetic substance sheets on the upper and lower parts thereof, and then pressing and curing the magnetic substance sheets. The magnetic sheet may be one comprising a known magnetic material as described above. For example, a slurry may be prepared by mixing metal magnetic particles, a binder resin, and a solvent, and the slurry may be coated on a carrier film film to a thickness of several tens of mu m and then dried to form a sheet.

The electrode unit 300 may be formed by forming external electrodes 301 and 302 on the outside of the body 100 so as to be connected to the lead-out end face of the coil unit 200 exposed on one side of the body unit 100 . The external electrodes 301 and 302 may be formed using a paste containing a metal having excellent electrical conductivity as described above. For example, the external electrodes 301 and 302 may be formed of a metal such as nickel (Ni), copper (Cu), tin (Sn) Ag) or the like, an alloy thereof, or the like can be used. The external electrodes 301 and 302 may be formed by further forming a plating layer on these paste layers. The plating layer may include at least one selected from the group consisting of nickel (Ni), copper (Cu) and tin (Sn). For example, a nickel (Ni) layer and a tin .

In the present disclosure, the term " electrically connected " means a concept including both a physical connection and a non-connection. Also, the first, second, etc. expressions are used to distinguish one component from another, and do not limit the order and / or importance of the components. In some cases, without departing from the scope of the right, the first component may be referred to as a second component, and similarly, the second component may be referred to as a first component.

Furthermore, the expression " an example used in the present disclosure does not mean the same embodiment but is provided for emphasizing and explaining different unique features. However, the presented examples do not exclude that they are implemented in combination with the features of other examples. For example, although the description in the specific example is not described in another example, it can be understood as an explanation related to another example, unless otherwise described or contradicted by the other example.

Also, the terms used in the present disclosure are used to illustrate only one example, and are not intended to limit the present disclosure. Wherein the singular expressions include plural expressions unless the context clearly dictates otherwise.

1: Power inductor
2: High frequency inductor
3: Normal bead
4: High frequency beads
5: Common mode filter
10: Coil parts
100: Body part
105: Through hole
200: coil part
211, 212, 221, 222: coil layer
213, 223: insulating layer
214, 224, 234: Via
215, 225: insulating film
230: Support member
300:
301, 302: external electrode

Claims (10)

1. A coil component in which a coil portion is disposed in a body portion including a magnetic material,
The coil portion includes a support member,
A first coil layer formed on one or both surfaces of the support member,
An insulating layer formed on one or both surfaces of the support member to cover the first coil layer,
And a second coil layer formed on the insulating layer,
Wherein the first and second coil layers have different numbers of turns of the coil pattern,
Coil parts.
The method according to claim 1,
The number of turns of the coil pattern of the second coil layer is larger than the number of turns of the coil pattern of the first coil layer,
Coil parts.
The method according to claim 1,
Wherein the first and second coil layers have different coil patterns,
Coil parts.
The method of claim 3,
Wherein an interval between the coil patterns of the second coil layer is smaller than an interval between the coil patterns of the first coil layer,
Coil parts.
The method according to claim 1,
Wherein the first coil layer and the second coil layer have different aspect ratios (AR) of coil patterns,
Coil parts.
6. The method of claim 5,
The aspect ratio AR of the coil pattern of the second coil layer is larger than the aspect ratio AR of the coil pattern of the first coil layer,
Coil parts.
The method according to claim 1,
Wherein at least one lead-out end surface of the coil portion has a lead-out end surface of the support member, a lead-out end surface of the insulation layer disposed on the lead-out end surface of the support member, Layer, < / RTI >
Coil parts.
8. The method of claim 7,
Wherein at least one leading end surface of the coil section has a tapered shape,
Coil parts.
The method according to claim 1,
Wherein the coil portion further comprises an insulating film covering the second coil layer,
Coil parts.
The method according to claim 1,
And an electrode portion electrically connected to the coil portion is disposed on the body portion,
Coil parts.

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