KR20170097864A - Coil component and manufacturing method for the same - Google Patents

Abstract

According to one embodiment of the present invention, a coil component comprises: a body having a magnetic material; and a coil portion arranged in the body. The coil portion comprises: an insulation layer; a first coil layer arranged inside the insulation layer and formed to be exposed to one surface of the insulation layer; a second coil layer formed on the one surface of the insulation layer and formed to be in contact with the first coil layer; and a third coil layer formed on the other surface of the insulation layer, thereby minimizing a manufacturing process, reducing costs, and being able to secure low DC resistance (Rdc).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a coil component,

The present disclosure relates to a coil component and a method of manufacturing the same.

With the miniaturization and thinning of electronic devices such as digital TVs, mobile phones, laptops, etc., coil parts applied to such electronic devices are required to be downsized and thinned. In order to meet these demands, various types of winding type or thin film type Research and development of coil parts is actively proceeding.

The major issue of miniaturization and thinning of coil parts is to realize the same characteristics as the existing ones despite this miniaturization and thinning. In order to satisfy such a demand, it is necessary to increase the volume of the magnetic material and minimize the volume of the insulating material to secure a low DC resistance (Rdc).

One of the objects of the present disclosure is to provide a coil component of a new structure capable of reducing the volume of an insulating material in a body, securing a low direct current resistance (Rdc) and reducing the cost, and a manufacturing method thereof.

One of the solutions proposed through the present disclosure includes a body including a magnetic material and a coil portion disposed in the body, wherein the coil portion is disposed inside the insulating layer and the insulating layer, And a third coil layer formed on one surface of the insulating layer and formed in contact with the first coil layer and a third coil layer formed on the other surface of the insulating layer, So that the DC resistance Rdc can be ensured.

The coil component according to an embodiment of the present disclosure can provide a coil component having a novel structure capable of reducing the volume of the insulating material in the body and securing a low direct current resistance (Rdc) and reducing the cost, and a manufacturing method thereof.

1 shows a schematic perspective view of a coil component according to an embodiment of the present disclosure;
Figure 2 shows a schematic cross-sectional view of a coil component in accordance with an embodiment of the present disclosure.
Figure 3 shows a schematic cross-sectional view of a coil part according to another embodiment of the present disclosure.
4A to 4F schematically show a process sectional view for explaining a method of manufacturing a coil component according to an embodiment of the present disclosure.

The present disclosure will now be described in more detail with reference to the accompanying drawings. In the drawings, the shapes and sizes of elements and the like can be exaggerated for clarity.

Hereinafter, a coil component according to the present disclosure will be described with reference to the accompanying drawings. It should be understood that the coil component is exemplified by a structure of an inductor for convenience, but the coil component of the present disclosure can also be applied to other various coil components.

Figure 1 shows a schematic perspective view of a coil component according to one embodiment of the present disclosure, Figure 2 shows a schematic cross-sectional view of a coil component according to one embodiment of the present disclosure, and Figure 3 shows another embodiment Sectional view of a coil component according to an example.

Referring to Figures 1-3, a coil component 100, 200 in accordance with one embodiment of the present disclosure includes a body 50 that includes a magnetic material and a coiled portion disposed within the body, 21, 121), a first coil layer (41, 141) disposed inside the insulating layer and exposed on one surface of the insulating layer, a second coil layer (41, 141) formed on one surface of the insulating layer and contacting the first coil layer (42, 142) and a third coil layer (43, 143) formed on the other side of the insulating layer.

The body 50 forms the appearance of the coil part. L, W and T shown in Fig. 1 indicate the longitudinal direction, the width direction and the thickness direction, respectively. The body has a first surface and a second surface facing each other in the lamination direction (thickness direction) of the coil layer, a third surface facing the longitudinal direction, and a fifth surface and a sixth surface facing the fourth surface in the width direction But it is not limited thereto. The corners where the first to sixth surfaces meet may be rounded by grinding or the like.

The body 50 includes a magnetic material that exhibits magnetic properties.

The magnetic material may be, for example, a resin containing ferrite or metal magnetic particles.

The body 50 may be in the form of ferrite or metal magnetic particles dispersed in a resin.

The ferrite may include a material such as Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Ba ferrite or Li ferrite.

The metal magnetic particles may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), aluminum (Al), and nickel (Ni) B-Cr amorphous metal, but the present invention is not limited thereto. The diameter of the metal magnetic particles may be about 0.1 占 퐉 to 30 占 퐉.

The resin may be a thermosetting resin such as an epoxy resin or a polyimide resin.

The coil part plays a role of performing various functions in the electronic device through the characteristics expressed from the coil of the coil part 100. For example, the coil component 100 may be a power inductor. In this case, the coil part may store the electricity in the form of a magnetic field to maintain the output voltage and stabilize the power supply.

In the case of a conventional coil part, a method of forming a coil layer on both sides with a support member interposed therebetween, and then forming a via in the support member through laser processing to electrically connect the coil layers on both sides. However, in the above method, the inductance is lowered due to the thickness of the non-magnetic support member, and there is a limitation in implementing the structure of the double-sided coil layer by adjusting the thickness or width of the coil. Therefore, there are limitations in implementation of inductance and low direct current resistance (Rdc) due to miniaturization of coil parts.

The coil component according to the present disclosure has a plurality of coil layers 41, 42, 43, 141, 142, and 143 without a supporting member, which is a coil portion of the insulating material, The inductance of the coil component can be improved.

The coil unit includes a first coil layer 41 and a second coil layer 141 disposed inside the insulating layers 21 and 121 and exposed to one surface of the insulating layer, Second coil layers 42 and 142 formed to contact the first coil layers 41 and 141 and third coil layers 43 and 143 formed on the other surface of the insulating layer.

The insulating layers 21 and 121 serve to insulate the first coil layers 41 and 141 and the third coil layers 43 and 143 from each other.

The insulating layers 21 and 121 may be formed by laminating a precursor film including an insulating material on a support member having the first coil layer and curing the precursor film. Thereafter, a third coil layer may be formed on the insulating layer.

The insulating layer 21 and 121 may be a build-up film including an insulating material. For example, a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, or a reinforcement material such as an inorganic filler Resin, for example, ABF (Ajinomoto Build-up Film) or the like can be used. Alternatively, it may be an insulating film containing a known Photo Image Dielectric (PID) resin.

The thickness of the insulating layers 21 and 121 may be greater than the thickness of the first coil layers 41 and 141 so as to cover the first coil layer and insulate it from the third coil layers 43 and 143 It is enough.

The vias 47a, 47b and 147 passing through the insulating layers 21 and 121 may be formed in any shape as long as they can electrically connect the first coil layers 41 and 141 and the third coil layers 43 and 143 The material is not particularly limited.

The vias 47a, 47b, and 147 may be formed by plating a conductive material into through holes formed by using at least one of photolithography, mechanical drilling, and laser drilling.

The vias 47a, 47b, 147 may have any shape known in the art, such as tapered, cylindrical, as described above.

As the material of the vias 47a, 47b and 147, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni) Or a conductive material such as an alloy of copper and iron. The thickness of the insulating layers 213 and 223 is usually thinner than the thickness of the supporting member 230.

The first coil layers 41 and 141 are formed in the insulating layer and are in contact with the third coil layers 43 and 143. The first coil layer and the third coil layer can be brought into close contact so that the boundary between the first coil layer and the third coil layer can not be visually recognized.

In the case of the third coil layers 43 and 143, a coil layer may be formed extending from the first coil layer. Therefore, the first coil layer and the third coil layer may have the same pattern shape.

The second coil layers 42 and 142 are formed on the other surface of the insulating layer.

The thickness of the second coil layer (42, 142) may be equal to the sum of the thicknesses of the first coil layer and the third coil layer.

The first to third coil layers 41, 42, 43, 141, 142, and 143 may be formed using a photolithography process and a plating process.

Referring to Figure 2, the coil component of the present disclosure includes an insulating layer disposed between the first and second coil layers 41, 42 and the third coil layer 43, And a fourth coil layer 44 may be included.

The fourth coil layer 44 may be electrically connected to the first coil layer 41 and the third coil layer 43 through vias 47a and 47b formed in the insulating layer 21, respectively.

The coil pattern of the fourth coil layer 44 may have a single turn number, and the coil patterns of the first to third coil layers may have a plurality of turn numbers. Here, the term " having a single number of turns " means having a number of turns of 1 or less, and having a plurality of turns means that the number of turns is more than one. The number of turns of the coil pattern can be adjusted in accordance with the aspect ratio, and the sectional area of the coil part is reduced, but the number of turns can be increased by that much, which is useful for realizing high inductance of coil parts.

When the aspect ratio of the coil pattern of the fourth coil layer 44 is less than 1, the height and width of the coil pattern can be freely adjusted within a range permitted by the technique of the coil pattern forming process, The cross-sectional area is increased due to the wide width direction, thereby realizing a low DC resistance (Rdc) characteristic.

The aspect ratio (AR) of the final coil pattern of the second and third coil layers 42 and 43 may be more than 1, which is the ratio of the thickness to the width.

In the case of the second and third coil layers 42 and 43, anisotropic plating is performed after the coil pattern plating to increase the coil thickness in order to secure the characteristics of the coil part while increasing the thickness of the coil pattern. As a result, the thickness of the final coil pattern is larger than the width of the second and third coil layers.

Therefore, when the aspect ratio of the coil patterns of the second and third coil layers 42 and 43 is more than 1, the coil patterns of the second and third coil layers 42 and 43 are formed in the same direction as that of the fourth coil layer 44 It is possible to have a larger number of turns in the same plane than the coil pattern. That is, the cross-sectional area of the coil portion is reduced, but it is particularly useful for realizing a high inductance because it can increase the number of turns by as much.

Since the aspect ratio of the second and third coil layers 42 and 43 is greater than 1, the line width of the coil pattern may be thinned Can be implemented.

The plurality of coil layers may be formed to take maximum advantage of the space in the horizontal direction, that is, the longitudinal direction or the width direction, so as to have a sufficient number of turns.

The first and second coil layers and the third coil layer may be stacked on the lower and upper portions, respectively, and have overlapping regions. As a result, the coil component of the present disclosure can achieve sufficient coil characteristics while being thin.

The second and third coil layers 43 and 143 may be covered with an insulating layer 30 or 130. Lt; / RTI >

The insulating layers 30 and 130 serve to protect the second and third coil layers 42, 43, 142, and 143.

The insulating layer 30 and 130 may be made of any material including an insulating material. For example, the insulating layer 30 and 130 may be formed of an insulating material such as an epoxy resin, a polyimide resin, a liquid crystalline polymer resin Etc., and known photo insulator (PID) resin may be used, but the present invention is not limited thereto.

The insulating layers 30 and 130 may be integrated with the insulating layer according to a manufacturing method, but are not limited thereto.

The external electrodes 81 and 82 are electrically connected to the lead-out terminals of the first and second coil layers and the third coil layer, which are exposed on at least one end face of the body.

The external electrodes 81 and 82 serve to electrically connect the coil part in the coil part 10A with the electronic device when the coil part 100 is mounted on the electronic device.

The external electrodes 81 and 82 may be formed using a conductive paste containing a conductive metal and the conductive metal may include at least one of copper (Cu), nickel (Ni), tin (Sn), and silver (Ag) Or alloys thereof.

The external electrode may include a plating layer formed on the paste layer.

The plating layer may include at least one selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn). For example, a nickel (Ni) layer and a tin .

Hereinafter, a method of manufacturing the coil component according to the present disclosure will be described.

4A to 4F schematically show a process sectional view for explaining a method of manufacturing a coil component according to an embodiment of the present disclosure.

The same components as those shown in Figs. 1 to 3 will not be described.

4A through 4F, a method of manufacturing a coil component according to an embodiment of the present disclosure includes forming a coil portion including first to third coil layers, and forming a body accommodating the coil portion Wherein forming the coil portion includes forming a first coil layer on at least one side of the support member, forming an insulating layer to cover the first coil layer, Forming a pattern; Removing the supporting member, and performing anisotropy plating on the first coil layer and the first coil pattern to obtain a second coil layer and a third coil layer, respectively.

Referring to FIG. 4A, a first coil layer 41 is formed on a support member 70. FIG.

The support member 70 may be a copper clad laminate (CCL), a polypropylene glycol (PPG) substrate, a ferrite substrate, a metal soft magnetic substrate, or the like. It may also be an insulating substrate made of an insulating resin. As the insulating resin, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as a glass fiber or an inorganic filler such as prepreg, ABF (Ajinomoto Build- Film, FR-4, bismaleimide triazine (BT) resin, and PID (Photo Imagable Dielectric) resin.

A cavity pattern 60 may be formed together to form the first coil layer 41 on the support member 70 and then separate and separate into a plurality of coil parts.

The first coil layer 41 and the cavity pattern 60 may be formed by plating a metal having excellent electrical conductivity. The metal may be formed of a metal such as silver (Ag), palladium (Pd), aluminum (Al) , Nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), or an alloy thereof.

Next, referring to FIG. 4B, a via 47b is formed on the first coil layer 41. FIG.

The vias 47b may be formed by a photolithography method and a plating method.

The via 47b may be formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pd) Lt; / RTI >

Next, referring to FIG. 4C, an insulating layer 21 is formed to cover the first coil layer 41.

The insulating layer 21 may cover the first coil layer 41 and the vias 47a to expose one surface of the vias 47a.

The insulating layer 21 may be formed by laminating a precursor film including an insulating material on the supporting member having the first coil layer and curing the precursor film.

The insulating layer 21 may be a build-up film including an insulating material, for example, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, a resin impregnated with a reinforcing material such as an inorganic filler, For example, ABF (Ajinomoto Build-up Film) or the like can be used. Alternatively, it may be an insulating film containing a known Photo Image Dielectric (PID) resin.

4D to 4F, after the first coil pattern 43 'is formed on the insulating layer 21, the support member 70 is removed and anisotropic plating is performed.

When the support member is removed, a plurality of coil stacks in which one side of the first coil layer 41 and the first coil pattern 43 'are exposed can be obtained.

The thickness of the coil layer can be secured by performing anisotropic plating on one side of the exposed first coil layer 41 and the first coil pattern 43 '.

The process of forming the coil layer may be repeated one or more times to form a multilayer coil, and the number of layers may be increased or decreased as needed.

The second coil layer 42 is a coil layer formed on one surface of the first coil layer 41 by anisotropic plating and the third coil layer 43 is formed on the first coil pattern 43 ' 1 is a coil layer formed by anisotropic plating on one coil pattern.

At this time, the third coil layer 43 is electrically connected to the first coil layer 41 through the vias 47a and 47b.

The manufacturing method of a coil part according to the present disclosure is a method of forming a via on a coil layer by using a photolithography method and a plating method so that a machining step for forming a through hole in a support member can be omitted, Lt; / RTI >

In addition, since the support member is removed, it is possible to reduce the deflection of the substrate and reduce the thickness of the coil layers, and the size of the vias for interlayer connection can be reduced due to the reduction in thickness between the coil layers. Furthermore, the size of the insulating layer and the via can be easily adjusted as needed.

Forming a fourth coil layer 44 and forming an insulating layer 21 to cover the fourth coil layer 44 prior to forming the first coil pattern.

The fourth coil layer 44 may be formed to be disposed inside the insulating layer 21.

The fourth coil layer 44 may be connected to the first coil layer 41 and the third coil layer 43 by vias 47a and 47b, respectively.

When the fourth coil layer is formed, the coil layer may have a three-layer structure, thereby increasing the number of turns of the coil, thereby improving the inductance.

Then, the cavity pattern 60 is etched and removed.

The removal of the cavity pattern 60 and the removal of the support member 70 can reduce the length deviation of the projecting portion of the support member.

The present disclosure is not limited by the above-described embodiment and the accompanying drawings, but is intended to be limited by the appended claims.

Accordingly, various modifications, substitutions, and alterations can be made by those skilled in the art without departing from the spirit of the present disclosure, which is also within the scope of the present disclosure something to do.

50: Body
41: first coil layer
42: second coil layer
43: third coil layer
44: fourth coil layer
21: Insulating layer
30: Insulating film
47a, 47b, 147: Via
81, 82: external electrode
60: Cavity pattern
70: Support member

Claims (10)

A body comprising a magnetic material; And
And a coil portion disposed within the body,
The coil portion may include an insulating layer, a first coil layer disposed inside the insulating layer and exposed to one surface of the insulating layer, a second coil layer formed on one surface of the insulating layer and contacting the first coil layer, And a third coil layer formed on the other side of the insulating layer.
The method according to claim 1,
Wherein the insulating layer includes a fourth coil layer therein.
3. The method of claim 2,
And the coil pattern of the fourth coil layer has a single turn number.
3. The method of claim 2,
And the fourth coil layer is vias connected to the first coil layer and the third coil layer, respectively.
The method according to claim 1,
Wherein the first coil layer is electrically connected to the third coil layer via a via.
Forming a coil portion including the first to third coil layers; And
Forming a body to receive the coiled portion,
The step of forming the coil portion may include the steps of forming a first coil layer on at least one surface of the support member, forming an insulating layer to cover the first coil layer, ; Removing the support member, and anisotropically plating the first coil layer and the first coil pattern, respectively, to obtain a second coil layer and a third coil layer.
The method according to claim 6,
Before the step of forming the first coil pattern,
Forming a fourth coil layer, and forming an insulating layer to cover the fourth coil layer.
Wherein the coil pattern of the outer layer coil has a plurality of turns.
8. The method of claim 7,
Before the step of forming the fourth coil layer,
And forming a via in the insulating layer to be connected to the first coil layer.
8. The method of claim 7,
And the fourth coil layer is connected to the first coil layer and the third coil layer in vias, respectively.
The method according to claim 1,
Wherein the first coil layer is electrically connected to the third coil layer via a via.

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