JP6962640B2 - Coil parts and their manufacturing methods - Google Patents

Description

The present invention relates to coil parts and methods for manufacturing the same.

With the miniaturization and thinning of electronic devices such as digital TVs, mobile phones, and notebook computers, the coil components applied to such electronic devices are also required to be miniaturized and thinned. In order to meet such demands, research and development of various types of winding type or thin film type coil parts are being actively carried out.

The main issue due to the miniaturization and thinning of coil parts is to realize the same characteristics as the existing ones in spite of such miniaturization and thinning. In order to satisfy such a requirement, it is necessary to secure the size of the core filled with the magnetic substance and the low DC resistance R _dc. For this reason, the number of products to which a technique capable of increasing the aspect ratio of the pattern and the cross-sectional area of the coil, for example, an anisotropic plating technique is applied is increasing.

When coil parts are manufactured by applying anisotropic plating technology, the increase in aspect ratio increases the risk of defects such as a decrease in the uniformity of plating growth and the occurrence of short circuits between coils. Also, the support members used to apply the anisotropic plating technique need to have a certain thickness to maintain rigidity, which reduces the thickness of the magnetic material that covers the coil. , There is a limit to the realization of high magnetic permeability Ls.

One of the various objects of the present invention is to solve such a problem, a new structure capable of ensuring a sufficient thickness of the magnetic substance covering the coil and realizing a high inductance. Is to provide coil parts for.

One of the various solutions proposed through the present invention is to manufacture a coil component by using a coreless method and a batch lamination method.

As one of the various effects of the present invention, it is possible to efficiently manufacture a coil component having a new structure capable of ensuring a sufficient thickness of a magnetic substance covering the coil and realizing a high inductance. Method can be provided.

An example of a coil component applied to an electronic device is shown schematically. It is a schematic perspective view which shows an example of a coil component. It is a schematic cut sectional view of the I-I'plane of the coil component of FIG. It is a schematic enlarged cross-sectional view of the Q1 region of the coil component of FIG. It is a cut sectional view of another schematic I-I'plane of the coil component of FIG. It is a schematic enlarged cross-sectional view of the Q2 region of the coil component of FIG. An example of a schematic manufacturing process of the coil component of FIG. 2 is shown. An example of a schematic manufacturing process of the coil component of FIG. 2 is shown. An example of a schematic manufacturing process of the coil component of FIG. 2 is shown. An example of a schematic manufacturing process of the coil component of FIG. 2 is shown. An example of a coil component to which the anisotropic plating technique is applied is shown schematically.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. The shape and size of the elements in the drawings may be exaggerated for a clearer explanation.

Electronic Equipment FIG. 1 schematically shows an example of a coil component applied to an electronic equipment. With reference to the drawings, it can be seen that various types of electronic components are used in electronic devices. For example, mainly application processors, DC / DC, communication processors, WLAN BT / WiFi FM GPS NFC, PMIC, battery, SMBC, LCD AMOLED, audio codec, USB 2.0 / 3.0 HDMI (registered trademark), CAM Etc. can be used. At this time, various types of coil components can be appropriately applied between such electronic components for the purpose of noise removal and the like, and for example, a power inductor 1 and a high frequency inductor can be applied. (HF Inductor) 2, a normal bead (General Bead) 3, a high frequency bead (GHz Bead) 4, a common mode filter (Common Mode Filter) 5, and the like can be mentioned.

Specifically, the power inductor 1 can be used for applications such as storing electricity in the form of a magnetic field, maintaining an output voltage, and stabilizing a power source. Further, the high frequency inductor (HF Inductor) 2 can be used for applications such as matching impedances to secure a required frequency and blocking noise and AC components. Further, the ordinary bead 3 can be used for applications such as removing noise in a power supply and a signal line, and removing high-frequency ripple. Further, the high frequency bead (GHz Bead) 4 can be used for applications such as removing high frequency noise of a signal line and a power supply line related to audio. Further, the common mode filter (Comon Mode Filter) 5 can be used for purposes such as passing a current in the differential mode and removing only the noise in the common mode.

A typical electronic device is a smartphone (Smart Phone), but is not limited to this, for example, a personal information terminal (personal digital camera), a digital video camera (digital video camera), and a digital still camera (digital video camera). It may be a digital still camera, a network system, a computer, a monitor, a television, a video game, or a smart watch. Needless to say, in addition to these, various other electronic devices familiar to ordinary engineers may be used.

Coil components The coil components of the present invention will be described below. For convenience, the structure of the inductor will be described as an example, but it goes without saying that the coil component of the present invention can be applied to coil components for other various uses as described above. Further, the side part used below is used for convenience in the direction toward the first direction or the second direction, the upper part is used for convenience in the direction toward the third direction, and the lower part is used for convenience. It is used to mean the direction opposite to the third direction. Furthermore, being located on the side, top, or bottom means not only when the target component comes into direct contact with the reference component in that direction, but also when it is located in that direction but does not come into direct contact. Used as a concept to include. However, it goes without saying that this defines the direction for convenience of explanation, and the scope of rights of the claims is not particularly limited by the description in such a direction.

FIG. 2 is a schematic perspective view showing an example of a coil component. With reference to the drawings, the coil component 100 according to the example includes a main body 10 and an electrode 50 arranged on the main body 10. The coil 20 is arranged inside the main body 10. The coil 20 arranged inside the main body 10 is embedded in a magnetic substance. The electrode 50 includes a first electrode 51 and a second electrode 52 arranged apart from each other on the main body 10. The first electrode 51 and the second electrode 52 are connected to different terminals of the coil 20, respectively.

The main body 10 has the appearance of the coil component 100, and has the first and second surfaces facing the first direction, the third and fourth surfaces facing the second direction, and the fifth and fifth surfaces facing the third direction. Includes 6 faces. The main body 10 is hexahedral in this way, but is not limited thereto. The main body 10 contains a magnetic substance, and a coil 20 is arranged inside the main body 10. This will be described later.

The electrode 50 serves to electrically connect the coil component 100 to the electronic device when the coil component 100 is mounted on the electronic device. The electrode 50 includes a first electrode 51 and a second electrode 52 arranged apart from each other on the main body 10. The electrode 50 can include, for example, a conductive resin layer and a conductor layer formed on the conductive resin layer. The conductive resin layer can contain any one or more conductive metals selected from the group consisting of copper (Cu), nickel (Ni) and silver (Ag) and a thermosetting resin. The conductor layer can include any one or more selected from the group consisting of nickel (Ni), copper (Cu) and tin (Sn), for example, the nickel (Ni) layer and the tin (Sn) layer. It can be formed sequentially.

FIG. 3 is a schematic cut cross-sectional view of the I-I'plane of the coil component of FIG. FIG. 4 is a schematic enlarged cross-sectional view of the Q1 region of the coil component of FIG. With reference to the drawings, the main body 10 has the first to third conductor layers 21, 22, 23, 24 arranged between the first to fourth conductor layers 21, 22, 23, 24, and the first to third conductor layers 21, 22, 23, 24, respectively. It penetrates the insulating layers 31, 32, 33, and the first to third insulating layers 31, 32, 33, respectively, and is arranged between the first to fourth conductor layers 21, 22, 23, 24, respectively, and connects them. Includes first to third via layers 41, 42, 43, and first to fourth magnetic layers 11, 12, 13, 14 surrounding first to fourth conductor layers 21, 22, 23, 24. Further, it penetrates the fourth insulating layer 34 and the fourth insulating layer 34 arranged between the fifth conductor layer 25, the fourth and fifth conductor layers 24, 25 arranged below the fourth conductor layer 24. , A fourth via layer 44 arranged between the fourth and fifth conductor layers 24 and 25 and connecting them, and a fifth magnetic layer 15 surrounding the fifth conductor layer 25. It also includes sixth and seventh magnetic layers 16 and 17 covering the upper and lower portions of the first to fifth conductor layers 21, 22, 23, 24 and 25.

The first to fourth conductor layers 21, 22, 23, and 24 each have a planar spiral pattern. The first to third via layers 31, 32, and 33 also have a planar spiral pattern, respectively. These form a coil 20 that is connected vertically, rotates in the same direction, and increases the number of turns in the horizontal direction. Therefore, as shown in the drawing, the coil 20 has a high aspect ratio (Aspect Ratio: AR), which is a ratio of the thickness to the line width, of, for example, 2 or more (for example, about 2 to 10). Therefore, it is advantageous for maintaining the fine line width and realizing a high inductance. One side portions of the first to fourth conductor layers 21, 22, 23, 24 and the first to third via layers 31, 32, 33 are vertically connected and connected to the first electrode 51. That is, the first terminal 27a is arranged on one side of the coil 20. The fifth conductor layer 25 and the fourth via layer 44 are arranged below the first to fourth conductor layers 21, 22, 23, 24 and the first to third via layers 31, 32, 33, and the second electrode 52 Is connected with. That is, the second terminal 27b is arranged below the coil 20. However, the present invention is not limited to this, and the second terminal 26b may be arranged on the upper portion of the coil 20. The coil component 100 can perform various functions in the electronic device through the characteristics developed from the coil 20. For example, the coil component 100 may be a power inductor, and the coil can play a role of storing electricity in the form of a magnetic field, maintaining an output voltage, and stabilizing a power source. Further, the line width means the width of the pattern in the cross sections in the first and third directions, and the thickness means the thickness of the pattern in the cross sections in the first and third directions.

Each of the patterns of the first to fourth conductor layers 21, 22, 23, 24 has an aspect ratio (Aspect Ratio: AR) of 0.5, which is the ratio of the thickness H _{1 to the line width W 1 H 1} / W _1. It can be about 1.5. Therefore, there is little risk of defects such as short circuit occurrence, and it is possible to secure _{coil uniformity and low DC resistance R dc.} The fifth conductor layer 25 has a long plate shape, but is not limited thereto. The first to fifth conductor layers 21, 22, 23, 24, 25 do not have a separate seed layer. That is, as can be seen from the steps described later, the metal layer that acts as a seed layer is removed. The materials of the first to fifth conductor layers 21, 22, 23, 24, 25 are copper (Cu), aluminum (Al), silver (Ag), tin (Sn), and gold (Au), which are ordinary plating materials. ), Nickel (Ni), lead (Pd), or conductive materials such as alloys thereof.

The cross-sectional shape of the first to fourth via layers 41, 42, 43, 44 is not particularly limited as long as the first to fifth conductor layers 21, 22, 23, 24, and 25 can be electrically connected. For example, the shapes of the first to third via layers 41, 42, and 43 are known in the art such as a tapered shape in which the diameter decreases toward the lower surface, a reverse taper shape in which the diameter increases toward the lower surface, and a cylindrical shape. All the shapes made are applicable. The first to fourth via layers 31, 32, 33, 34 also do not have a separate seed layer. That is, as can be seen from the steps described later, these are formed of an intermetallic compound IMC (Inter Metallic Compound). In this case, the connecting force of the first to fifth conductor layers 21, 22, 23, 24, 25 can be increased. The intermetallic compound IMC can be formed by known metal paste printing, for example, copper Cu-tin Sn, silver Ag / tin Sn, copper Cu / tin Sn coated with silver Ag, copper Cu / tin Sn, copper Cu / tin Sn. -Can include, but is not limited to, Bismus Bi. The intermetallic compound IMC may be formed by a known metal plating, and includes, for example, tin Sn or copper Cu-tin Sn, but is not limited thereto.

The first to fourth insulating layers 31, 32, 33, and 34 serve to selectively insulate the first to fifth conductor layers 21, 22, 23, 24, and 25. The materials of the first to fourth insulating layers 31, 32, 33, and 34 can be applied as long as they contain an insulating substance. For example, a known photosensitive insulating (Photo Image Dielectric, PID) resin or the like can be used. Further, the first to fourth insulating layers 31, 32, 33, 34 may contain an insulating resin and a magnetic filler. In this case, the resistance of the interlayer magnetic field can be eliminated. _{The thickness h 1} of the first to fourth insulating layers 31, 32, 33, 34 is preferably thin, for example, the thickness of each pattern of the first to fifth conductor layers 21, 22, 23, 24, 25. and it may be smaller than _{H 1.} As a result, the thickness of the magnetic substance covering the coil 20 can be secured to the maximum, and as a result, the inductance can be improved. Further, since the first to fourth via layers 41, 42, 43, 44 formed in the first to fourth insulating layers 31, 32, 33, 34 can be finely formed, the coil 20 through which the current flows can be formed. The thickness can be kept constant.

An example of an insulating resin is an epoxy resin. Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol epoxy resin, naphthol novolac epoxy resin, and phenol novolac. Type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin , Linear aliphatic epoxy resin, epoxy resin having butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiro ring-containing epoxy resin, cyclohexanedimethanol type epoxy resin, naphthylene ether type epoxy resin and trimethylol type Epoxy resin and the like can be mentioned. The epoxy resin may be used alone or in combination of two or more.

The material of the magnetic filler is not particularly limited, and for example, pure iron powder, Fe—Si alloy powder, Fe—Si—Al alloy powder, Fe—Ni alloy powder, Fe—Ni—Mo alloy powder, Fe. −Ni—Mo—Cu alloy powder, Fe—Co alloy powder, Fe—Ni—Co alloy powder, Fe—Cr alloy powder, Fe—Cr—Si alloy powder, Fe—Ni—Cr alloy powder , Fe alloys such as Fe-Cr-Al alloy powder, amorphous alloys such as Fe-based amorphous and Co-based amorphous, Mg-Zn-based ferrite, Mn-Zn-based ferrite, Mn-Mg Spinnel-type ferrites such as based ferrite, Cu-Zn-based ferrite, Mg-Mn-Sr-based ferrite, Ni-Zn-based ferrite, Ba-Zn-based ferrite, Ba-Mg-based ferrite, Ba-Ni-based ferrite, Ba-Co Examples thereof include hexagonal ferrites such as based ferrite and Ba-Ni—Co ferrite, and garnet-type ferrite such as Y-based ferrite.

The first to seventh magnetic layers 11, 12, 13, 14, 15, 16, and 17 play a role of improving the magnetic characteristics of the coil 20. The first to fifth magnetic layers 11, 12, 13, 14, and 15 are present in the same plane as the first to fifth conductor layers 21, 22, 23, 24, and 25, respectively, and the first to fourth insulating layers 31 are present. , 32, 33, 34. Since the first to fifth magnetic layers 11, 12, 13, 14, and 15 surround the first to fifth conductor layers 21, 22, 23, 24, and 25, respectively, the first to fifth conductor layers 21, 22, 22 and The sides of 23, 24, and 25 come into contact with the first to fifth magnetic layers 11, 12, 13, 14, and 15. The sixth and seventh magnetic layers 16 and 17 cover the upper and lower parts of the first conductor layer 21 and the fifth conductor layer 25, respectively. As described above, in the coil component 100, since the thicknesses of the first to fourth insulating layers 31, 32, 33, and 34 are thin, the thicknesses of the sixth and seventh magnetic layers 16 and 17 should be sufficiently secured. As a result, it is advantageous to realize a high inductance. The materials of the first to seventh magnetic layers 11, 12, 13, 14, 15, 16 and 17 can be applied as long as they contain a magnetic substance. For example, the resin may be filled with ferrite or metallic magnetic particles. Further, similarly to the first to fourth insulating layers 31, 32, 33, 34, the first to seventh magnetic layers 11, 12, 13, 14, 15, 16, and 17 contain an insulating resin and a magnetic filler. It may be. That is, in some cases, the same substance may be contained. In this case, the boundaries between the first to fourth insulating layers 31, 32, 33, 34 and the first to seventh magnetic layers 11, 12, 13, 14, 15, 16, and 17 may be unclear. That is, all of the first to fourth insulating layers 31, 32, 33, 34 and the first to seventh magnetic layers 11, 12, 13, 14, 15, 16, and 17 can be integrated. This will be described later.

In the drawings, the first to fifth conductor layers 21, 22, 23, 24, 25, the first to fourth insulating layers 31, 32, 33, 34, and the first to fourth via layers 41, 42, 43, 44, Only the first to seventh magnetic layers 11, 12, 13, 14, 15, 16, and 17 are shown, but more layers may be formed depending on the aspect ratio of the coil 20 to be embodied, the thickness of the coil component 100, and the like. It may have or may have fewer layers. Since the above-mentioned contents can be applied to the added layer in the same manner, detailed contents will be omitted.

FIG. 5 is a cut sectional view of another schematic I-I'plane of the coil component of FIG. FIG. 6 is a schematic enlarged cross-sectional view of the Q2 region of the coil component of FIG. With reference to the drawings, the main body 10 is an electrically insulating magnetic material in which the first to fifth conductor layers 21, 22, 23, 24, 25, and the first to fifth conductor layers 21, 22, 23, 24, 25 are embedded. Includes 18. The electrically insulating magnetic material 18 is arranged between the first to fifth conductor layers 21, 22, 23, 24, 25, and connects the first to fifth conductor layers 21, 22, 23, 24, 25. The first to fourth via layers 41, 42, 43, 44 are formed. Similarly, the first to fourth conductor layers 21, 22, 23, 24 and the first to third via layers 41, 42, 43 form one coil 20 that is connected and rotates in the same direction, and the first coil 20 is formed. The fourth conductor layers 21, 22, 23, 24 and one side of the first to third via layers 41, 42, 43 form the first terminal 27a of the coil 20, and the fifth conductor layers 25 and the fourth. The via layer 44 constitutes the second terminal 27b of the coil 20. In the following, the description overlapping with the above-mentioned contents will be omitted, and the electrically insulating magnetic material 18 will be described in more detail.

The electrically insulating magnetic material 18 is a combination of the first to fourth insulating layers 31, 32, 33, 34 and the first to seventh magnetic layers 11, 12, 13, 14, 15, 16, and 17. .. That is, as described above, the first to fourth insulating layers 31, 32, 33, 34 and the first to seventh magnetic layers 11, 12, 13, 14, 15, 16, 17 are made of the same material, for example, the same. Insulating resin and magnetic filler may be contained, but in this case, depending on the forming method, these boundaries may be integrated so as not to be separated. That is, one electrically insulating magnetic material 18 can be formed. The electrically insulating magnetic material 18 selectively insulates the first to fifth conductor layers 21, 22, 23, 24, and 25 to improve the magnetic characteristics.

7 to 10 show an example of a schematic manufacturing process of the coil component of FIG. In the following, explanations that overlap with the above contents will be omitted, and each step will be described in more detail.

With reference to FIG. 7, the core substrate 200 is prepared. The core substrate 200 includes a support member 201, a first metal layer 202 arranged on both sides of the support member 201, and a second metal layer 203 arranged on the first metal layer 202. Of course, the first metal layer 202 and the second metal layer 203 may be arranged on only one surface, and in some cases, only the second metal layer 203 may be arranged. The support member 201 may be an insulating substrate made of an insulating resin. As the insulating resin, a thermocurable resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as a glass fiber or an inorganic filler, for example, prepreg, ABF (Ajinomoto Built-up Film), FR-4, BT (Bismaleimide Triazine) resin, PID (Photo Image Dailectric) resin and the like can be used. The first metal layer 202 and the second metal layer 203 are generally thin copper foils, but the present invention is not limited to this, and other metal layers may be used. That is, the core substrate 200 is a known copper foil laminate (CCL: Copper Clad Laminate) well known in the art, but is not limited thereto. Next, the first and second conductor layers 21 and 22 are formed on the second metal layer 202 of the core substrate 200. After forming the dry films 210 and 220 on the second metal layer 202, the first and second conductor layers 21 and 22 are patterned 21P and 22P so as to have a flat spiral shape by a known photolithography method. , Can be formed by filling with a known plating method. As the plating method, electrolytic copper plating, electroless copper plating, or the like can be used. More specifically, CVD (chemical vapor deposition), PVD (Physical Vapor Deposition), sputtering (sputtering), subtractive (Subtractive), adaptive (Adaptive), SAP (Sediactive), SAP (Sedi-Assist) It is a plating method that uses a method such as Process), but is not limited to this.

With reference to FIG. 8, the dry films 210 and 220 are stripped. Known etching methods are applied to the strips, but the strips are not limited thereto. After that, the first and second magnetic layers 11 and 12 are formed so as to surround the first and second conductor layers 21 and 22. The first and second magnetic layers 11 and 12 can be formed by a known laminating method, coating method, or the like. At this time, the protruding portions of the first and second magnetic layers 11 and 12 are flattened by a known etching method or the like so as to exist in the same plane as the first and second conductor layers 21 and 22. After that, as a method of separating the first metal layer 202 and the second metal layer 203, the first and second conductor layers 21 and 22 on which the first and second magnetic layers 11 and 12 are formed are separated from the support member 201, respectively. do. The sequence of processes is not limited to that order. For example, the separation may be performed first, and then the dry films 210 and 220 may be stripped to form the magnetic layers 11 and 12.

7 and 8 show that the first and second conductor layers 21, 22 and the first and second magnetic layers 11, 12 are formed, but the third to fifth conductor layers 23, 24, 25 and The same method can be used as the method for forming the third to fifth magnetic layers 13, 14 and 15, and specific description thereof will be omitted.

Referring to FIG. 9, the first to fourth insulating layers 31, 32, 33, 34 are formed on the second to fifth conductor layers 22, 23, 24, 25. The first to fourth insulating layers 31, 32, 33, 34 can also be formed by a known laminating method, coating method, or the like. After that, the first to fourth via layer holes 41H, 42H, 43H, and 44H are formed in the first to fourth insulating layers 31, 32, 33, and 34. The first to fourth via layer holes 41H, 42H, 43H, 44H can be formed by using laser and / or mechanical drilling, a photolithography method, or the like. Then, the intermetallic compound IMC is filled in the first to fourth via layer holes 41H, 42H, 43H, 44H by using a known paste printing method or plating method, and the first to fourth via layers 41, 42, 43, Form 44. Again, the sequence of processes is not limited to that order. For example, the second metal layer 202, which will be described later, may be etched first. Further, the second metal layer 202 may be etched immediately after the separation.

With reference to FIG. 10, the second metal layer 202 remaining in the first to fifth conductor layers 21, 22, 23, 24, 25 is removed by a known etching method. First to fifth conductor layers 21, 22, 23, 24, 25, first to fifth magnetic layers 11, 12, 13, 14, 15, first to fourth insulating layers 31, formed through a series of processes. The sixth and seventh magnetic layers 16, 17 laminated on the upper and lower parts of 32, 33, 34, the first to third via layers 41, 42, 43 44, and the first and fifth conductor layers 21, 25, respectively. Are collectively laminated to form the main body 10. A matched lamination method is used for batch lamination, and since the intermetallic compound IMC is finally formed under the high temperature conditions of the matched lamination, the interlayer connection force can be increased, the conduction resistance is lowered, and smooth electrons can be generated. Enable the flow. Further, the interlayer connection can be precisely performed by the matching lamination, and since a large number of layers are laminated at one time, it is advantageous in simplifying the process as compared with the sequential lamination. After forming the main body 10, the first and second electrodes 51 and 52 are formed. The first and second electrodes 51 and 52 can be formed by using a paste containing a metal having excellent conductivity, and a conductor layer can be further formed on the paste layer.

FIG. 11 schematically shows an example of a coil component to which the anisotropic plating technique is applied. Coil parts to which the isotropic plating technology is applied include, for example, flat coil-shaped patterns 21a', 21b', 21c', 22a', 22b', 22c' and via layers on both sides of the support member 201'. After forming 41', this is embedded with a magnetic substance to form a main body 10', which is electrically connected to patterns 21a', 21b', 21c', 22a', 22b', and 22c' on the outside of the main body 10'. The external electrodes 51'and 52'to be formed can be formed and manufactured. However, when the heterogeneous plating technique is applied, a high aspect ratio can be realized, but the uniformity of plating growth can decrease due to the increase in the aspect ratio, and the dispersion of the plating thickness is large, so that the pattern is still inter-pattern. Short circuit is likely to occur. Further, since the thickness h _{3 of the support member 201'is very thick, the thickness h d of the} magnetic material arranged above and below the patterns 21a', 21b', 21c', 22a', 22b', 22c'. It turns out that there are restrictions on.

In the present invention, the meaning of being electrically connected is a concept including both a physically connected case and a non-connected case. Further, the first and second expressions are used to distinguish one component from another component, and do not limit the order and / or importance of the corresponding components. In some cases, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component.

In addition, the expression "one example" used in the present invention does not mean the same embodiment, but is provided to emphasize and explain unique features that are different from each other. However, the example presented above does not preclude being embodied in combination with the features of another example. For example, even if it is not explained in a specific example, it can be understood as an explanation related to the other example unless there is an explanation that is opposite or inconsistent with the matter in the other example.

It should be noted that the terms used in the present invention are used only for explaining an example, and are not intended to limit the present invention. At this time, the singular expression includes the plural unless it has a clearly different meaning in the context.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited to this, and various modifications and modifications are made within the scope of the technical idea of the present invention described in the claims. It is clear to those with ordinary knowledge in the art that this is possible.
[Item 1]
Multiple conductor layers with a planar spiral pattern,
One or more insulating layers arranged between the plurality of conductor layers and
A coil component including a main body including the insulating layer, connecting the plurality of conductor layers, and one or more via layers having a plane spiral pattern, and electrodes arranged on the main body.
[Item 2]
The coil component according to item 1, wherein the plurality of conductor layers and the via layer are connected to form one coil that rotates in the same direction.
[Item 3]
The coil component according to item 2, wherein the coil has an aspect ratio of 2 or more.
[Item 4]
The coil has a first terminal and a second terminal connected to the electrode.
The first terminal is arranged on the side of the coil.
The coil component according to item 2 or 3, wherein the second terminal is arranged above or below the coil.
[Item 5]
The coil component according to any one of items 1 to 4, wherein the main body further includes a plurality of magnetic layers surrounding the plurality of conductor layers.
[Item 6]
The insulating layer and the magnetic layer contain an insulating resin and a magnetic filler, and contain an insulating resin and a magnetic filler.
The coil component according to item 5, wherein the insulating layer and the magnetic layer are all integrated.
[Item 7]
The coil component according to any one of items 1 to 6, wherein the plurality of conductor layers are those from which the seed layer has been removed.
[Item 8]
The coil component according to any one of items 1 to 7, wherein the via layer contains an intermetallic compound (IMC).
[Item 9]
The coil component according to any one of items 1 to 8, wherein the thickness of each conductor layer is thicker than the thickness of the insulating layer.
[Item 10]
Multiple conductor layers with a planar spiral pattern,
One or more via layers arranged between the plurality of conductor layers, connecting the plurality of conductor layers, and having a plane spiral pattern,
A coil component including a main body including the plurality of conductor layers and an electrically insulating magnetic material embedding the via layer, and electrodes arranged on the main body.
[Item 11]
The coil component according to item 10, wherein the plurality of conductor layers and the via layer are connected to form one coil that rotates in the same direction.
[Item 12]
The coil component according to item 11, wherein the coil has an aspect ratio of 2 or more.
[Item 13]
A step of preparing a support member and one or more core substrates in which a metal layer is arranged on at least one surface of the support member, and
The stage of forming a conductor layer having a flat spiral pattern on the metal layer of the core substrate, and
At the stage of separating the conductor layer from the support member to obtain a plurality of conductor layers,
The stage of removing the metal layer remaining on the conductor layer and
At the stage of forming an insulating layer on any one or more of the above conductor layers,
At the stage of forming a via layer having a flat spiral pattern on the insulating layer, and
A step of laminating a main body precursor containing a plurality of conductor layers, one or more insulating layers, and one or more via layers formed through the above steps to form a main body.
A method for manufacturing a coil component including a step of forming an electrode on the main body.
[Item 14]
The method for manufacturing a coil component according to item 13, further comprising a step of forming a magnetic layer surrounding the conductor layer before the step of laminating the insulating layer.
[Item 15]
The metal layer includes a first metal layer arranged on at least one surface of the support member and a second metal layer arranged on the first metal layer.
The method for manufacturing a coil component according to item 13, wherein the step of separating the conductor layer is to separate the first metal layer and the second metal layer.

1 Power inductor 2 High frequency inductor 3 Normal bead 4 High frequency bead 5 Common mode filter 100, 100B Coil component 10 Main body 20 Coil 50 Electrode 11, 12, 13, 14, 15, 16, 17 1st to 7th magnetic layers 18 Electrically insulating magnetic material 21, 22, 23, 24, 25 1st to 5th conductor layers 26 Part of coil pattern 27a, 27b 1st and 2nd terminals 31, 32, 33, 34 1st to 4th insulation Layers 41, 42, 43, 44 1st to 4th via layers 51, 52 1st and 2nd electrodes 200 Core substrate 201 Support member 202, 203 Metal layer 210, 220 Dry film

Claims (14)

Multiple conductor layers with a planar spiral pattern,
With one or more insulating layers arranged between the plurality of conductor layers,
It penetrates the insulating layer, connects the plurality of conductor layers, has a planar spiral pattern, and is formed at an interface existing in each of the regions where the plurality of conductor layers and one or more via layers are in contact with each other. A coil component including a main body including one or more via layers containing an intermetallic compound (IMC), and electrodes arranged on the main body. The coil component according to claim 1, wherein the plurality of conductor layers and the via layer are connected to form one coil that rotates in the same direction. The coil component according to claim 2, wherein the coil has an aspect ratio of 2 or more. The coil has a first terminal and a second terminal connected to the electrode.
The first terminal is arranged on the side of the coil.
The coil component according to claim 2 or 3, wherein the second terminal is arranged at an upper portion or a lower portion of the coil. The coil component according to any one of claims 1 to 4, wherein the main body further includes a plurality of magnetic layers surrounding the plurality of conductor layers. The insulating layer and the magnetic layer contain an insulating resin and a magnetic filler, and contain an insulating resin and a magnetic filler.
The coil component according to claim 5, wherein the insulating layer and the magnetic layer are all integrated. The coil component according to any one of claims 1 to 6, wherein the thickness of each conductor layer is thicker than the thickness of the insulating layer. Multiple conductor layers with a planar spiral pattern,
It is arranged between the plurality of conductor layers, connects the plurality of conductor layers, has a planar spiral pattern, and exists in each of the regions where the plurality of conductor layers and one or more via layers are in contact with each other. One or more via layers containing an intermetallic compound (IMC) formed at the interface
A coil component including a main body including the plurality of conductor layers and an electrically insulating magnetic material embedding the via layer, and electrodes arranged on the main body. The coil component according to claim 8, wherein the plurality of conductor layers and the via layer are connected to form one coil that rotates in the same direction. The coil component according to claim 9, wherein the coil has an aspect ratio of 2 or more. One of the plurality of conductor layers and the other conductor layer are connected by one via layer in the direction in which the plurality of conductor layers are laminated.
At one end of one via layer in the direction in which the plurality of conductor layers are laminated, the intermetallic compound (IMC) and the one conductor layer are in contact with each other.
At the other end of one via layer in the direction in which the plurality of conductor layers are laminated, the intermetallic compound (IMC) and the other conductor layer come into contact with each other.
The coil component according to any one of claims 1 to 10. A step of preparing a support member and one or more core substrates in which a metal layer is arranged on at least one surface of the support member, and
The stage of forming a conductor layer having a flat spiral pattern on the metal layer of the core substrate, and
The step of separating the conductor layer from the support member to obtain a plurality of conductor layers, and
The step of removing the metal layer remaining on the conductor layer and
At the stage of forming an insulating layer on any one or more of the conductor layers,
The stage of forming a via layer having a flat spiral pattern on the insulating layer, and
A step of laminating a main body precursor containing a plurality of conductor layers, one or more insulating layers, and one or more via layers formed through the above steps to form a main body.
A method for manufacturing a coil component including a step of forming an electrode on the main body. The method for manufacturing a coil component according to claim 12, further comprising a step of forming a magnetic layer surrounding the conductor layer before the step of laminating the insulating layer. The metal layer includes a first metal layer arranged on at least one surface of the support member and a second metal layer arranged on the first metal layer.
The method for manufacturing a coil component according to claim 12, wherein the step of separating the conductor layer is to separate the first metal layer and the second metal layer.

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