JP2017112352A - Coil component and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coil component with a new structure capable of electrically connecting coil patterns even without vias, and a method capable of efficiently manufacturing the same.SOLUTION: At least one coil is arranged inside a main body. The coil includes a structure in which a plurality of coil patterns 220-229 are laminated. Coil patterns of the plurality of coil patterns adjacent in the lamination direction to and different from each other are electrically connected such that their end portions are in contact with each other.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a coil component and a manufacturing method thereof.

  As electronic devices such as digital TVs, mobile phones, notebooks, and the like become smaller and thinner, coil parts applied to such electronic devices are also required to be smaller and thinner. In order to meet such needs, research and development of various types of coil parts are being actively conducted.

  Among the coil components, the laminated coil component can be manufactured, for example, by printing a coil pattern on an insulating sheet and laminating them. At this time, in order to electrically connect the coil patterns formed in different layers, a conductive via is formed between the layers, whereby the coil patterns are electrically connected to form one coil. Come to compose.

  However, since the formation of via holes is necessary for the formation of vias, the process is relatively complicated and high alignment accuracy is required.

  One of the various objects of the present invention is to solve such a problem, and a coil component having a new structure capable of electrically connecting coil patterns without vias and the like. It is to provide a method that can be efficiently manufactured.

  One of various solutions proposed through the present invention is to form a coil by laminating a plurality of coil patterns, and end portions of coil patterns formed in different layers are in contact with each other. It is to be electrically connected even if there is no.

  One of the various effects of the present invention is that the process is simple, there is no major problem in alignment, and a coil component having a new structure that can be further reduced in size and thickness, and an efficient manufacturing thereof. A possible method can be provided.

It is drawing which shows schematically the example of the coil components applied to an electronic device. It is a schematic perspective view which shows an example of a coil component. It is a schematic exploded perspective view which shows an example of a coil. It is a schematic process drawing which shows an example of manufacture of coil components. It is a schematic process drawing which shows another example of manufacture of a coil component. It is a schematic process drawing which shows another example of manufacture of a coil component.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for a clearer description.

Electronic Device FIG. 1 is a drawing schematically showing an example of a coil component applied to an electronic device.

  Referring to the drawings, it can be seen that various types of electronic components are used in electronic devices. For example, focusing on application processors, DC / DC, Comm. Processor, WLAN BT / WiFi FM GPS NFC, PMIC, Battery (Battery), SMBC, LCD AMOLED, Audio codec, USB 2.0 / 3.0 HDMI (registered trademark), CAM, etc. may be used it can. At this time, various types of coil components can be appropriately applied between such electronic components for the purpose of noise removal, for example, a power inductor (Power Inductor) 1, Examples thereof include a high-frequency inductor 2, a normal bead 3, a high-frequency bead 4, and a common mode filter 5.

  Specifically, the power inductor 1 can be used for purposes such as storing electricity in the form of a magnetic field and maintaining the output voltage to stabilize the power supply. The high frequency inductor (HF Inductor) 2 can be used for purposes such as securing a necessary frequency by matching impedances and blocking noise and AC components. Moreover, the normal beads (General Bead) 3 can be used for applications such as removing noise from the power supply line and signal line, and removing high-frequency ripple. Further, the high frequency beads (GHz Bead) 4 can be used for removing high frequency noise from signal lines and power supply lines related to audio. Moreover, the common mode filter (Common Mode Filter) 5 can be used for applications such as passing current in the differential mode and removing only common mode noise.

  The electronic device may typically be a smart phone, but is not limited to this. For example, a personal information terminal, a digital video camera, a digital still, It may be a camera (digital still camera), a network system (network system), a computer (computer), a monitor (monitor), a television (television), a video game (video game), or a smart watch (smart watch). In addition to these, it goes without saying that other various electronic devices well known to ordinary engineers may be used.

In the following, in describing the coil component of the present invention, for the sake of convenience, the structure of an inductor will be described as an example. However, the coil component of the present invention may be applied to coil components for various other applications as described above. Of course, parts can be applied. In this case, it is needless to say that other external shapes excluding the coil pattern can be appropriately deformed according to the applied coil component, and refer to external shapes known in the art.

  FIG. 2 is a schematic perspective view showing an example of a coil component, and FIG. 3 is a schematic exploded perspective view showing an example of a coil.

  Referring to the drawings, a coil component 10 according to an example has a structure in which a coil 200 is disposed inside a main body 100. Electrodes 301 and 302 electrically connected to the coil 200 are disposed outside the main body 100. The coil 200 includes a structure in which a plurality of coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 are stacked, and the coil patterns 220, 221, 222, 223, 224, Different coil patterns adjacent to each other in the stacking direction among 225, 226, 227, 228, and 229 are electrically connected with their end portions in contact with each other. As a result, one coil 200 rotating in the stacking direction is configured. Here, the lamination direction means the lamination direction of the coil pattern, that is, the third direction or the opposite direction.

  The main body 100 forms the appearance of the coil component 10, and includes a first surface and a second surface that are opposed to the first direction, a third surface and a fourth surface that are opposed to the second direction, and a first surface that is opposed to the third direction. 5th surface and 6th surface. The main body 100 may be hexahedral as described above, but is not limited thereto. The body 100 may include a magnetic material that exhibits magnetic properties. For example, the main body 100 may be one in which ferrite or metal magnetic particles are filled in a resin. The ferrite can be made of a material such as Mn—Zn ferrite, Ni—Zn ferrite, Ni—Zn—Cu ferrite, Mn—Mg ferrite, Ba ferrite or Li ferrite, for example. The metal magnetic particles may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), aluminum (Al), and nickel (Ni). -Si-B-Cr-based amorphous metal may be used, but is not necessarily limited thereto. The diameter of the metal magnetic particles may be about 0.1 μm to 30 μm. The main body 100 may have a form in which such ferrite or metal magnetic particles are dispersed in a thermosetting resin such as an epoxy resin or a polyimide resin.

  The magnetic substance of the main body 100 can be made of a magnetic resin composite in which a metal magnetic powder and a resin mixture are mixed. The metal magnetic powder may contain iron (Fe), chromium (Cr), or silicon (Si) as a main component. For example, iron (Fe) -nickel (Ni), iron (Fe), iron (Fe) ) -Chrome (Cr) -silicon (Si) and the like, but is not limited thereto. The resin mixture may include, but is not limited to, epoxy, polyimide, liquid crystal polymer (LCP), and the like. The metal magnetic powder may be filled with metal magnetic powder having an average particle size of at least two or more. In this case, since the magnetic resin composite can be fully filled by pressure bonding using bimodal metal magnetic powders having different sizes, the filling rate can be increased.

  The main body 100 is not necessarily made of a magnetic material, and may be made of an insulating material, for example, a photoresist material. In this case, a magnetic substrate or the like may be further disposed on the upper and lower portions of the main body 100. That is, the substance constituting the main body 100 may vary depending on the specific function or type of the coil component. Also, additional components not shown in the drawings can be added.

  The coil 200 allows the coil component 10 to perform various functions in the electronic device through characteristics to be developed. For example, the coil component 10 may be a power inductor. In this case, the coil can perform the role of storing electricity in the form of a magnetic field, maintaining the output voltage, and stabilizing the power source. The coil 200 includes a structure in which a plurality of coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 are stacked, and the coil patterns 220, 221, 222, 223, 224, Different coil patterns adjacent to each other in the stacking direction among 225, 226, 227, 228, and 229 are electrically connected with their end portions in contact with each other. That is, even if there is no separate via, it is electrically connected, so that a via processing step is unnecessary and the process is simple. Further, since the end portions of the respective coil patterns, that is, the overlapping sections are considerably wide, there is no great difficulty in matching. Further, the size and thickness can be reduced by the amount of no via. A plurality of coils 200 may exist inside the main body 100. These can be connected in series or in parallel depending on the function of the coil component. The core 105 of the coil 200 can be filled with a material constituting the main body 100.

  Each of the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 has a coil turn number of less than one. If at least three of these coil patterns are not connected, one coil turn number cannot be realized. Thereby, it is preferable that the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 have at least three coil patterns. The coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 are made of copper (Cu), aluminum (Al), silver (Ag), tin (Sn), and gold (Au). A conductive material such as nickel (Ni), lead (Pb), or an alloy thereof can be used, but is not limited thereto.

Each of the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 has an aspect ratio (AR) of less than 1. That is, the ratio of thickness to line width may be less than 1, for example, 0.5 or less. Therefore, it is possible to ensure the uniformity of the coil while the risk of failure such as occurrence of a short circuit is small. Further, since the line width is wide, the cross-sectional area is increased, and a low DC resistance (R _dc ) can be secured. Moreover, since it can be manufactured as thin as that, the upper and lower magnetic regions can be made wider, and as a result, the inductance (L) can be improved.

  As described above, the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 may be simply surrounded by the magnetic material that constitutes the main body 100. The plurality of insulating layers 210, 211, 212, 213, 214, 215, 216, 217, 218, 219 constituting the 100 may be formed so as to penetrate therethrough. In this case, the respective insulating layers 210, 211, 212, 213, 214, 215, 216, 217, 218, and 219 constituting the main body 100 are coil patterns 220, 221, 222, 223, 224, 225, 226, 227. Depending on the method of forming 228 and 229, a photosensitive insulating layer including a photosensitive insulating material (Photo Imageable Dielectric Layer) may be used. Alternatively, each insulating layer 210, 211, 212, 213, 214, 215, 216, 217, 218, and 219 constituting the main body 100 is formed of a magnetic substance, for example, the above-described magnetic resin composite in the form of a sheet. In this case, they may be integrated in a sintering process. That is, the boundary may be unclear depending on the material and formation method.

  The coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, 229 can have a greater number of laminations than shown in the drawings, or even a smaller number of laminations. Can also have. Similarly, the insulating layers 210, 211, 212, 213, 214, 215, 216, 217, 218, and 219 constituting the main body 100 may have a larger number of layers than shown in the drawings, or It is also possible to have a smaller number of layers. In some cases, a plurality of coils 200 having such a structure may be arranged in the main body 100 instead of one. That is, any modification is possible as long as the laminated form of the coil patterns 220, 221, 222, 223, 224, 225, 226, 227, 228, and 229 is as described above.

  The electrodes 301 and 302 serve to electrically connect the coil 200 in the coil component 10 to the electronic device when the coil component 10 is mounted on the electronic device. The electrodes 301 and 302 can include, for example, a conductive resin layer and a plating layer formed on the conductive resin layer. The conductive resin layer may include any one or more conductive metals and thermosetting resins selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag). The plating layer may include any one or more selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn), such as a nickel (Ni) layer and a tin (Sn) layer, May be formed in order. The number of the electrodes 301 and 302 may be greater depending on the specific type of the coil component 10, and the arrangement form may be variously modified. Of course, the materials can also be different.

  FIG. 4 is a schematic process diagram showing an example of manufacturing a coil component.

  Referring to the drawings, in an example of manufacturing a coil component, a coil is formed by laminating a plurality of coil patterns 1121, 1122, 1123. At this time, different coil patterns adjacent to each other in the stacking direction among the coil patterns 1121, 1122, and 1123 are formed such that their end portions are in contact with each other and are electrically connected. As a result, one coil 200 that rotates in the stacking direction is formed. Hereinafter, manufacturing a coil by laminating a plurality of coil patterns 1121, 1122, and 1123 will be described in more detail, but the contents that overlap with the above contents are omitted.

  Referring to step 1001, a first insulating layer 1101 is provided. The first insulating layer 1101 may be a photoresist. In this case, the first insulating layer 1101 can be used without any limitation as long as it includes a photosensitive insulating (PID) material. The photoresist may be of a positive type or a negative type.

  Referring to Step 1002, a first opening pattern 1111 is formed in the first insulating layer 1101 by a photolithography method. A known exposure and development method is used for the photolithography method. At this time, the first opening pattern 1111 may be formed to penetrate the first insulating layer 1101, but is not limited thereto. The first opening pattern 1111 is formed to have a part of a coil shape, and a separate substrate or the like is disposed on the floor of the first insulating layer 1101 to form the first opening pattern 1111 as necessary. You can also.

  Referring to step 1003, the first opening pattern 1111 is filled with a metal paste and then cured to form a first coil pattern 1121. As the metal paste, a known paste containing a metal can be used. Moreover, the method in particular of filling a metal paste is not restrict | limited, For example, a metal mask printing method etc. can be used. When the metal paste is filled and cured, the first coil pattern 1121 is formed, and the description of the coil pattern described above can be applied to the first coil pattern 1121 in the same manner.

  Referring to step 1004, a second insulating layer 1102 is formed on the first insulating layer 1101. The second insulating layer 1102 can be formed by a known lamination method. The second insulating layer 1102 may be a photoresist. In this case, the second insulating layer 1102 can be used without particular limitation as long as it includes a photosensitive insulating (PID) material. The photoresist may be of a positive type or a negative type.

  Referring to Step 1005, a second opening pattern 1112 is formed in the second insulating layer 1102 by a photolithography method. A known exposure and development method is used for the photolithography method. At this time, the second opening pattern 1112 may be formed so as to penetrate the second insulating layer 1102, but is not limited thereto. The second opening pattern 1112 is formed so as to have a part of the coil shape, and is formed so that the end portion is in contact with the end portion of the first coil pattern 1121.

  Referring to step 1006, the second opening pattern 1112 is filled with a metal paste and then cured to form a second coil pattern 1122. As the metal paste, a known paste containing a metal can be used. Moreover, the method in particular of filling a metal paste is not restrict | limited, For example, a metal mask printing method etc. can be used. When the metal paste is filled and cured, the second coil pattern 1122 is formed, and the description of the coil pattern described above can be applied to the second coil pattern 1122 in the same manner.

  Referring to step 1007, a third insulating layer 1103 is formed on the second insulating layer 1102. The third insulating layer 1103 can be formed by a known lamination method. The third insulating layer 1103 may be a photoresist. In this case, the third insulating layer 1103 can be used without particular limitation as long as it includes a photosensitive insulating (PID) material. The photoresist may be of a positive type or a negative type.

  Referring to Step 1008, a third opening pattern 1113 is formed in the third insulating layer 1103 by photolithography. A known exposure and development method is used for the photolithography method. At this time, the third opening pattern 1113 may be formed to penetrate the third insulating layer 1103, but is not limited thereto. The third opening pattern 1113 is formed so as to have a part of the coil shape, and is formed so that the end portion is in contact with the end portion of the second coil pattern 1122.

  Referring to step 1009, the third opening pattern 1113 is filled with a metal paste and then cured to form a third coil pattern 1123. As the metal paste, a known paste containing a metal can be used. Moreover, the method in particular of filling a metal paste is not restrict | limited, For example, a metal mask printing method etc. can be used. When the metal paste is filled and cured, a third coil pattern 1123 is formed, and the description of the above coil pattern can be applied to the third coil pattern 1123 in the same way.

  Through a series of processes, one coil having one or more coil turns and rotating in the stacking direction can be formed. In order to have a larger number of coil turns, the above process may be repeated. The laminate manufactured through a series of processes can itself be a main body. Alternatively, the main body can be completed by further laminating a magnetic cover layer or the like on the upper and lower portions as necessary. When an electrode is formed on the main body, a coil component can be manufactured. A plurality of coils may be manufactured simultaneously, and a plurality of such coils may be included in one main body. When a plurality of coils are manufactured at the same time, a cutting step can be further included. In addition, if necessary, it may further include a polishing step for rounding the corners of the main body before forming the electrodes.

  FIG. 5 is a schematic process diagram showing another example of manufacturing the coil component.

  Referring to the drawings, in another example of manufacturing a coil component, a coil is formed by stacking a plurality of coil patterns 2121, 2122, 2123. At this time, different coil patterns adjacent to each other in the stacking direction among the coil patterns 2121, 2122, and 2123 are formed such that their end portions are in contact with each other and are electrically connected. As a result, one coil that rotates in the stacking direction is formed. Hereinafter, manufacturing a coil by laminating a plurality of coil patterns 2121, 2122, and 2123 will be described in more detail, but the content that overlaps the content described above is omitted.

  Referring to step 2001, a first insulating layer 2101 having a first opening pattern 2111 is formed. For this, a known coating method such as a screen printing method can be used. The first insulating layer 2101 may be an electrically insulating magnetic layer in which a magnetic resin composite containing the above-described metal magnetic powder and resin mixture is formed in the form of a sheet, but is not limited thereto. . The first opening pattern 2111 may be formed to penetrate the first insulating layer 2101, but is not limited thereto. The first opening pattern 2111 is formed to have a part of a coil shape. If necessary, a separate substrate or the like may be disposed on the floor of the first insulating layer 2101 to form the first insulating layer 2101.

  Referring to step 2002, the first opening pattern 2111 is filled with a metal paste and then cured to form a first coil pattern 2121. As the metal paste, a known paste containing a metal can be used. Moreover, the method in particular of filling a metal paste is not restrict | limited, For example, a metal mask printing method etc. can be used. When the metal paste is filled and cured, a first coil pattern 2121 is formed, and the description of the coil pattern described above can be applied to the first coil pattern 2121 in the same way.

  Referring to step 2003, a second insulating layer 2102 having a second opening pattern 2112 formed on the first insulating layer 2101 is formed. For this, a known coating method such as a screen printing method can be used. The second insulating layer 2102 may be an electrically insulating magnetic layer in which a magnetic resin composite containing the above-described metal magnetic powder and resin mixture is formed in the form of a sheet, but is not limited thereto. . The second opening pattern 2112 may be formed to penetrate the second insulating layer 2102, but is not limited thereto. The second opening pattern 2112 is formed so as to have a part of the coil shape, and is formed so that the end portion is in contact with the end portion of the first coil pattern 2121.

  Referring to step 2004, the second opening pattern 2112 is filled with a metal paste and then cured to form a second coil pattern 2122. As the metal paste, a known paste containing a metal can be used. Moreover, the method in particular of filling a metal paste is not restrict | limited, For example, a metal mask printing method etc. can be used. When the metal paste is filled and cured, a second coil pattern 2122 is formed, and the description of the coil pattern described above can be applied to the second coil pattern 2122 in the same manner.

  Referring to Step 2005, a third insulating layer 2103 having a third opening pattern 2113 formed on the second insulating layer 2102 is formed. For this, a known coating method such as a screen printing method can be used. The third insulating layer 2103 may be an electrically insulating magnetic layer in which a magnetic resin composite containing the metal magnetic powder and the resin mixture as described above is formed in the form of a sheet, but is not limited thereto. is not. The third opening pattern 2113 may be formed to penetrate the third insulating layer 2103, but is not limited thereto. The third opening pattern 2113 is formed so as to have a part of the coil shape, and is formed so that the end portion is in contact with the end portion of the second coil pattern 2122.

  Referring to step 2006, the third opening pattern 2113 is filled with a metal paste and then cured to form a third coil pattern 2123. As the metal paste, a known paste containing a metal can be used. Moreover, the method in particular of filling a metal paste is not restrict | limited, For example, a metal mask printing method etc. can be used. When the metal paste is filled and cured, a third coil pattern 2123 is formed, and the description of the coil pattern can be applied to the third coil pattern 2123 in the same manner.

  Referring to step 2007, a step of sintering the first to third insulating layers 2101, 2102, and 2103 may be further performed as necessary. As a result of sintering, the boundaries between the first to third insulating layers 2101, 2102 and 2103 may be unknown. That is, the first to third insulating layers 2101, 2102, and 2103 can be integrated to form the insulating layer 2104.

  Through a series of processes, one coil having one or more coil turns and rotating in the stacking direction can be formed. In order to have a larger number of coil turns, the above-described process before sintering may be repeated. A laminate manufactured through a series of processes can itself be a main body. Alternatively, the main body can be completed by further laminating a magnetic cover layer or the like on the upper and lower portions as necessary. When an electrode is formed on the main body, a coil component can be manufactured. A plurality of coils may be manufactured simultaneously, and a plurality of such coils may be included in one main body. When a plurality of coils are manufactured at the same time, a cutting step can be further included. In addition, if necessary, it may further include a polishing step for rounding the corners of the main body before the electrode formation.

  FIG. 6 is a schematic process diagram showing still another example of manufacturing the coil component.

  Referring to the drawings, in still another example of manufacturing a coil component, the coil is formed by stacking a plurality of coil patterns 3121, 3122, 3123. At this time, different coil patterns adjacent to each other in the stacking direction among the coil patterns 3121, 3122, and 3123 are formed such that their end portions are in contact with each other and are electrically connected. As a result, one coil that rotates in the stacking direction is formed. Hereinafter, manufacturing a coil by stacking a plurality of coil patterns 3121, 3122, and 3123 will be described in more detail, but the contents that overlap the above contents are omitted.

  Referring to step 3001, a first seed layer 3131 is formed. The first seed layer 3131 can be formed on a known carrier substrate (not shown). The first seed layer 3131 can be formed using electro-less plating, sputtering, or the like. Alternatively, when the carrier substrate (not shown) is a copper clad laminate (CCL), the copper foil can be used as the first seed layer 3131.

  Referring to step 3002, a first insulating layer 3101 is formed on the first seed layer 3131. The first insulating layer 3101 can be formed by a known lamination method. The first insulating layer 3101 may be a photoresist. In this case, the first insulating layer 3101 can be used without any limitation as long as it includes a photosensitive insulating (PID) material. The photoresist may be of a positive type or a negative type.

  Referring to Step 3003, a first opening pattern 3111 is formed in the first insulating layer 3101 by a photolithography method. A known exposure and development method is used for the photolithography method. At this time, the first opening pattern 3111 may be formed to penetrate the first insulating layer 3101, but is not limited thereto. The first opening pattern 3111 is formed so as to have a part of a coil shape.

  Referring to step 3004, the first opening pattern 3111 is filled with metal plating to form a first coil pattern 3121. As the metal plating, known electroplating using a dry film or the like can be used. The description of the above coil pattern can be equally applied to the first coil pattern 3121.

  Referring to step 3005, a second seed layer 3132 is formed on the first insulating layer 3101. The second seed layer 3132 can be formed using electro-less plating, sputtering, or the like.

  Referring to step 3006, a second insulating layer 3102 is formed on the second seed layer 3132. The second insulating layer 3102 can be formed by a known lamination method. The second insulating layer 3102 may be a photoresist. In this case, the second insulating layer 3102 can be used without particular limitation as long as it includes a photosensitive insulating (PID) material. The photoresist may be of a positive type or a negative type.

  Referring to Step 3007, a second opening pattern 3112 is formed in the second insulating layer 3102 by a photolithography method. A known exposure and development method is used for the photolithography method. At this time, the second opening pattern 3112 may be formed to penetrate the second insulating layer 3102, but is not limited thereto. The second opening pattern 3112 is formed to have a part of a coil shape.

  Referring to step 3008, the second opening pattern 3112 is filled with metal plating to form a second coil pattern 3122. As the metal plating, known electroplating using a dry film or the like can be used. The description of the above coil pattern can be applied to the second coil pattern 3122 in the same manner.

  Referring to step 3009, a third seed layer 3133 is formed on the second insulating layer 3102. The third seed layer 3133 can be formed using electro-less plating, sputtering, or the like.

  Referring to step 3010, a third insulating layer 3103 is formed on the third seed layer 3133. The third insulating layer 3103 can be formed by a known lamination method. The third insulating layer 3103 may be a photoresist. In this case, the third insulating layer 3103 can be used without any limitation as long as it includes a photosensitive insulating (PID) material. The photoresist may be of a positive type or a negative type.

  Referring to Step 3011, a third opening pattern 3113 is formed on the third insulating layer 3103 by photolithography. A known exposure and development method is used for the photolithography method. At this time, the third opening pattern 3113 may be formed to penetrate the third insulating layer 3103, but is not limited thereto. The third opening pattern 3113 is formed to have a part of a coil shape.

  Referring to step 3012, the third opening pattern 3113 is filled with metal plating to form a third coil pattern 3123. As the metal plating, known electroplating using a dry film or the like can be used. The description of the above coil pattern can be applied to the third coil pattern 3123 in the same manner.

  Referring to step 3013, the first to third insulating layers 3101, 3102, and 3103 are removed by stripping as necessary. The stripping method is not particularly limited, and a known stripping solution can be used, or a method of removing by burning can also be used.

  Referring to step 3014, the first to third seed layers 3131, 3132, and 3133 are partially removed by etching as necessary. That is, the remaining portions excluding the first to third seed layers 3131, 3132, 3133 formed under the first to third coil patterns 3121, 3122, 3123 can be removed.

  Referring to step 3015, the first to third coil patterns 3121, 3122, and 3123 are surrounded by the magnetic material 3104 as necessary. As described above, the magnetic substance 3104 may be a magnetic resin composite in which a metal magnetic powder and a resin mixture are mixed. This may be formed by a sheet mold and laminated and integrated on the upper part and the lower part, respectively. Of course, other magnetic materials can be used.

  Through a series of processes, one coil having one or more coil turns and rotating in the stacking direction can be formed. In order to have a larger number of coil turns, the above-described process may be repeated before stripping. The laminate manufactured through a series of processes can itself be a main body. Alternatively, the main body can be completed by further laminating a magnetic cover layer or the like on the upper and lower portions as necessary. When an electrode is formed on the main body, a coil component can be manufactured. A plurality of coils may be manufactured at the same time, and such a plurality of coils may be included in one main body. When a plurality of coils are manufactured at the same time, a cutting step can be further included. In addition, if necessary, it may further include a polishing step for rounding the corners of the main body before the electrode formation.

  On the other hand, in the present invention, “electrically connected” is a concept including both a case of being physically connected and a case of being not connected. The first and second expressions are used to distinguish one component from another component, and do not limit the order and / or importance of the corresponding component. In some cases, the first component may be named the second component, and similarly, the second component may be named the first component without departing from the scope of the present invention.

  Further, the expression “example” used in the present invention does not mean the same embodiment, but is provided to emphasize and explain different and unique features. However, the presented example does not exclude being realized in combination with other example features. For example, even if a matter described in a specific example is not explained in another example, the explanation is related to the other example as long as there is no explanation contrary to or contradicting the matter in another example. Can be understood.

  Note that the terms used in the present invention are merely used to describe an example, and are not intended to limit the present invention. At this time, the singular includes the plural unless the context clearly indicates otherwise.

DESCRIPTION OF SYMBOLS 1 Power inductor 2 High frequency inductor 3 Normal bead 4 High frequency bead 5 Common mode filter 10 Coil component 100 Main body 105 Core 200 Coil 210, 211, 212, 213, 214, 215, 216, 217, 218, 219 Insulating layer 220, 221, 222, 223, 224, 225, 226, 227, 228, 229 Coil pattern 301, 302 Electrode 1101, 1102, 1103, 2101, 2102, 2103, 2104, 3101, 3102, 3103 Insulating layer 1111, 1112, 1113, 2111, 1122, 2113, 3111, 3112, 3113 Opening pattern 1121, 1122, 1123, 2121, 2122, 2123, 3121, 3122, 3123 Coil pattern 3131, 132,3133 seed layer 3104 magnetic substance

Claims (16)

In a coil component in which one or more coils are arranged inside the main body,
The coil includes a structure in which a plurality of coil patterns are laminated,
Coil parts in which different end portions of the plurality of coil patterns adjacent to each other in the stacking direction are in contact with each other and are electrically connected.   The coil component according to claim 1, wherein the coil pattern is electrically connected to constitute one coil that rotates in a stacking direction.   The coil component according to claim 1 or 2, wherein at least three coil patterns among the coil patterns are connected to realize one coil turn number. The main body includes a structure in which a plurality of insulating layers are laminated,
Each of the said coil pattern is a coil component as described in any one of Claims 1-3 which each penetrates these insulation layers.   The coil component according to claim 4, wherein the plurality of insulating layers are photosensitive insulating layers.   The coil component according to claim 4, wherein the plurality of insulating layers are electrically insulating magnetic layers.   The coil component according to claim 4, wherein the plurality of insulating layers are sintered and integrated.   The coil component according to any one of claims 1 to 7, wherein the main body includes a magnetic substance surrounding the coil. In the manufacturing method of the coil component in which one or more coils are arranged inside the main body,
The coil is formed by laminating a plurality of coil patterns,
Different coil patterns adjacent to each other in the stacking direction among the plurality of coil patterns are formed such that their end portions are in contact with each other and are electrically connected to each other. Forming the coil by laminating the plurality of coil patterns,
Forming a first insulating layer having a first opening pattern;
Filling the first opening pattern with metal to form a first coil pattern;
On the first insulating layer, a second insulating layer having a second opening pattern in which an end portion is in contact with the end portion of the first coil pattern is formed, or a second insulating layer is formed on the first insulating layer. Forming a second opening pattern in the second insulating layer with an end portion in contact with the end portion of the first coil pattern;
Filling the second opening pattern with metal to form a second coil pattern;
On the second insulating layer, a third insulating layer having a third opening pattern in which an end portion is in contact with the end portion of the second coil pattern is formed, or a third insulating layer is formed on the second insulating layer. Forming a third opening pattern in the third insulating layer, the end portion of which is in contact with the end portion of the second coil pattern;
The method for manufacturing a coil component according to claim 9, wherein the third opening pattern is filled with metal to form a third coil pattern.   The method of manufacturing a coil component according to claim 10, wherein the first to third opening patterns are formed by a photolithography method.   The method for manufacturing a coil component according to claim 10, wherein the first to third opening patterns are formed by a screen printing method.   The method of manufacturing a coil component according to claim 12, wherein the step further includes sintering the first to third insulating layers after forming the first to third coil patterns.   The method of manufacturing a coil component according to claim 10, wherein the first to third coil patterns are formed by metal paste printing.   The method of manufacturing a coil component according to claim 10, wherein the first to third coil patterns are formed by metal plating. The step further includes forming first to third seed layers before providing or forming the first to third insulating layers, respectively.
The step includes forming the first to third coil patterns, stripping the first to third insulating layers, and partially etching the first to third seed layers. Furthermore, the manufacturing method of the coil components of Claim 15 further included.

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