JPH1012455A - Lamination type coil component and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamination type coil component and its manufacturing method wherein density difference between magnetic material or insulator and conductor, pattern deviation, pattern deformation, pattern disconnection, etc., can be prevented, difference of partial shrinkage ratio in firing can be eliminated, crack is not developed, reliability is high, and cost reduction and miniaturization can be realized. SOLUTION: Substrate layers 2 constituting component substratum and conductor patterns 4 turning to coils are alternately laminated in such a manner that the conductor patterns of adjacent layers are mutually connected. The substrate layer 2 has a punched trench 3 which is formed as the shape of the conductor pattern 4. Conductor 4 is buried in the trench 3. A plurality of substrate layers 2 having conductor 4 are so laminated that each end of each conductor pattern 4 buried in the trenches 3 of adjacent substrate layers 2 overlaps with each other, and the conductor patterns 4 are connected in series.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency laminated coil component and a method of manufacturing the same.

[0002]

2. Description of the Related Art FIGS. 5A and 5B are Japanese Patent Publication No. 63-44.
FIG. 1 is a side cross-sectional view and a perspective view illustrating a conventional laminated coil component disclosed in Japanese Patent Publication No. 286 and a method of manufacturing the same. When manufacturing conventional coil parts,
A conductor pattern 4 is formed on the surface of a magnetic or insulator green sheet 2 (1 is also a base sheet made of a magnetic or insulator), and one end of the conductor pattern 4 is formed in the green sheet 4 ( While filling the through holes 2x and connecting the conductor patterns 4, the green sheets 1 and 2 on which the conductor patterns 4 are printed are laminated, molded and fired, and as shown in FIG. To form a laminated coil component.

In Japanese Patent Publication No. 57-39521, a conductor pattern is printed on a green sheet, and a magnetic or insulating paste is partially applied so as to cover a portion of the conductor pattern excluding the end. Printed and printed on the surface of the green sheet so that the beginning of the conductor pattern for the next half turn is laminated and connected to the end of the conductor pattern, and the magnetic material or The operation of laminating insulators is repeated, and a laminated coil component is manufactured by molding, firing, and forming terminal electrodes.

[0004]

According to the above prior arts, the conductor patterns 4 are all provided on the surface of the green sheet 2.
Therefore, as shown in FIG. 5C, not only unevenness occurs in the portion of the green sheet 2 and the portion of the conductive pattern 4 but also a difference in density occurs. When these are fired, cracks occur in the laminated body 5 due to the difference in the partial shrinkage of the laminated body 5, and the reliability is deteriorated. In the worst case, the conductor pattern 4 is disconnected, and the predetermined characteristics are deteriorated. I can't get it.

Further, a laminated coil component using a method in which sheets on which a conductor pattern is printed and laminated by thermocompression bonding is compared with a laminated coil component formed by printing a magnetic or insulating paste. However, pattern displacement, pattern deformation, disconnection of the conductor pattern, and the like are likely to occur during thermocompression bonding. Furthermore, the difference in the partial shrinkage ratio of the laminate during firing is remarkable, and cracks are liable to occur, which leads to poor reliability, poor production yield, and difficulty in reducing cost. In particular, the unevenness and the density difference hinder miniaturization of the laminated coil component.

In view of the above-mentioned problems, the present invention prevents a density difference between a magnetic substance or an insulator and a conductor, a pattern shift, a pattern deformation, a disconnection of a conductor pattern, and the like, and a difference in partial shrinkage during firing. It is an object of the present invention to provide a laminated coil component which can eliminate cracks, has high reliability without cracks, can be reduced in cost, and can be reduced in size, and a method for manufacturing the same.

[0007]

In order to achieve this object, a laminated electronic component according to the present invention is characterized in that a substrate layer constituting a component substrate and a conductor pattern serving as a coil are formed by connecting conductor patterns of adjacent layers. In a laminated coil component which is alternately laminated so as to be connected, a plurality of substrate layers each having a cutout groove formed in a conductor pattern shape in a substrate layer, the cutout groove being filled with a conductor, and having the conductor The conductor patterns are stacked so that one end of each conductor pattern filled in the groove of the adjacent substrate layer overlaps and the conductor patterns are connected in series (claim 1).

Further, the laminated electronic component of the present invention has a groove formed in the substrate layer in a conductor pattern shape, a part of the conductor is filled in the groove, and the remainder of the conductor is formed on the substrate layer. A conductor is formed so as to be overlapped on the substrate layer, and is stacked so that one end of the conductor filled in the groove of the adjacent substrate layer overlaps with the conductor formed so as to be connected in series with the conductor pattern. (Claim 2).

Further, according to the method of manufacturing a multilayer electronic component of the present invention, when manufacturing the multilayer coil component of claim 1, a groove corresponding to the conductor pattern is provided in the green sheet, and a conductive paste is provided in the groove. To form a green sheet having a conductor pattern, and connect these green sheets to a part of the conductor in the groove of the next green sheet on a part of the conductor in the groove of the next layer. (Claim 3).

In the method of manufacturing a multilayer electronic component according to the present invention, when manufacturing the multilayer coil component of claim 2, a cutout groove corresponding to the conductor pattern is provided in the green sheet, and the cutout is formed in the cutout groove. The conductor paste is filled to a depth within the depth of the cutout groove, and the connection conductor paste is continuously applied to the green sheet adjacent to the cutout groove to form a connection conductor. Are laminated so that the connection conductor on a certain green sheet overlaps the conductor in the groove of the next green sheet (claim 4).

Further, in the manufacturing method according to claim 4,
The filling depth of the conductive paste to be filled in the groove of the green sheet and the thickness of the conductive paste formed on the green sheet are set to about half of the thickness of the green sheet.

[0012]

According to the first and third aspects, the substrate layer (green sheet) is provided with a groove, the conductor is filled therein, and the substrate layer filled with the conductor is superposed, so that the substrate layer does not have irregularities. Even if this occurs, the unevenness is small, and even if the substrate layers are stacked by thermocompression bonding, the difference in density between the conductor and the base in the inside becomes small, and cracks and disconnections can be prevented.

According to the second, fourth and fifth aspects of the present invention, the substrate layer (green sheet) is provided with a groove, a conductor is printed in the groove and on the surface of the substrate layer. In order to insert the connection conductor protruding from the groove in the next layer, the unevenness is reduced or eliminated in a state where a plurality of substrate layers are stacked, and even if the substrate layers are stacked by thermocompression bonding, the The density difference between the conductor and the base is reduced, and the occurrence of cracks, disconnection, and the like can be prevented.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION

(Embodiment 1) An embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1A, a ferrite paint is applied to a thickness of, for example, 30 μm on a base sheet 1 and dried to form a substrate layer 2 to be a green sheet. Next, as shown in (b) and (c) of FIG. 1A, the ferrite green sheet 2 at a portion where the conductor pattern 4 is provided is provided.
A groove 3 is formed by using a YAG laser or the like so as to have the same shape as the conductor pattern 4. There are various methods for forming the cutout groove 3 other than the laser, such as etching by photolithography or cutting out with a mold.

Next, as shown in (d) and (e) of FIG. 1 (A), a conductive paste 4 is filled into the cutout groove 3 formed in the green sheet 2 by a printing method. As a method for filling the conductive paste 4, there are, for example, injection using a dispenser, press-fitting using a mask, and a transfer method.

FIGS. 1B and 2A show green sheets 2 in which conductive patterns 4a to 4e formed by filling a conductive paste are provided in the cutout grooves 3a to 3e manufactured as shown in FIG. 1A, respectively. It is a top view and a perspective view. This green sheet 2 or base sheet 1 is shown in FIG.
(A) The layers shown in the lower part are sequentially superposed.

That is, as shown in the process diagram of FIG. 2D, the lowermost portion of the green sheet 1 without the conductor pattern 4
(S1), and the green sheet 2 having the terminal conduction pattern 4e is placed thereon (S2). Next, the green sheets 2 having the coil patterns 4d, 4c, 4b are sequentially placed (S3, S4), and then the green sheets 2 having the terminal conduction patterns 4a are placed (S3, S4).
5) The green sheet 1 having no conductor pattern is placed on the top (S6). When the number of turns is increased, steps S3 and S4 are repeated a number of times corresponding to the number of turns.

In the laminating step, the shaded portions of the conductor patterns 4a to 4e in FIG. 1B are superimposed on the conductor patterns of the adjacent green sheets. That is, one end d1 of the conductor pattern 4d of the next layer overlaps the inner end d2 of the conductor pattern 4e, and one end c1 of the conductor pattern 4c of the next layer overlaps the other end c2 of the conductor pattern 4d. The other end b2 of the conductor pattern 4b of the next layer is superimposed on the other end b2 of the conductor pattern 4b.
The inner end part a1 of the terminal conduction pattern 4a is overlaid on the upper part.

The laminate thus formed is thermocompression-bonded at a temperature of 80 ° C. and a pressure of 750 kg / cm ² to form an integrated laminate of the conductor patterns 4a to 4e and the green sheet 2 (FIG. 2). (D) Step S7), then 870 ° C
(Step S8 in FIG. 2D).

A large number of laminates are cut out after molding or firing, and each of the chips is cut, and the cut and fired products are laminated and sintered as shown in FIG. 2 (B). The terminal electrode 6 was formed on the end of the body 5 by baking or plating (Step S9) to produce a laminated coil component.

(Embodiment 2) Another embodiment of the present invention is shown in FIG.
This will be described with reference to FIG. As shown in FIG. 3A, a groove 3 similar to that of the above-described embodiment is applied to the base sheet 1 by a laser or the like to apply a ferrite paint to a thickness of, for example, 30 μm, and dried to form a substrate layer that becomes a green sheet. Form 2 Next, as shown in FIGS. 3A and 3B, a groove 3 is formed in a portion of the ferrite green sheet 2 where the conductor pattern 4 is provided so as to have the same shape as the conductor pattern 4.
Is provided by etching using a YAG laser, photolithography, a mold, or the like as described above.

Next, as shown in FIG. 3A, a conductive paste 4 is applied to the groove 3 of the green sheet 2 by a printing method so as to have a thickness t2 equal to or smaller than the thickness t1 of the green sheet 2. , Preferably about half the depth, and at the same time, a portion X to be a connection portion of the conductor pattern 4.
On the surface of the green sheet 2 adjacent to the groove 3,
It is formed by continuously printing on the conductor pattern 4 filled in the groove 3.

FIGS. 3 (C) and 4 (A) show the grooves 3a to 3-3 formed as shown in FIGS. 3 (A) and 3 (B), respectively.
5A and 5B are a plan view and a perspective view, respectively, showing a green sheet 2 in which conductor patterns 4a to 4e formed by filling a conductor paste with e are provided. These green sheets 2 or base sheets 1 are sequentially stacked from those shown in the lower part of FIG. That is, the lowermost portion is a green sheet 1 having no conductor pattern 4, and a green sheet 2 having a terminal conduction pattern 4e is placed thereon. Next, the green sheets 2 having the coil patterns 4d, 4c, and 4b are sequentially placed, and then the green sheets 2 having the terminal conduction patterns 4a are placed. Place.

In the above laminating step, as shown in a developed view of FIG. 4B, connection portions X1 to X4 on the surface of the green sheet 2 indicated by hatched portions of the conductor patterns 4a to 4e in FIG. In the removal grooves 3a to 3d, a part of each of 4a to 4d is overlapped and connected.

FIGS. 3 and 4 show the connection conductors X1 to X1.
Although X4 is provided, even if the thickness of the conductor pattern 4 is the same as that of the groove 3, the conductor is formed on the green sheet 2 as compared with the conventional configuration in which the entire conductor is formed on the surface of the green sheet 2. Since the amount of the conductor is significantly reduced, the unevenness as a laminate can be significantly reduced.

As in the present embodiment, when the thickness of the conductor paste printed on the cutout groove 3 and the like is set to about half of the thickness of the green sheet 2, it is most preferable because there is no portion where the conductor projects from the green sheet. . In this case, as illustrated by a two-dot chain line, the connection portion X4
If it is configured such that 0 fills the entire lower surface of the extraction groove 4d, it is possible to prevent the generation of a gap in the extraction grooves 4a to 4d.

The laminate thus formed is thermocompression-bonded at a temperature of 80 ° C. and a pressure of 750 kg / cm ² to form an integrated laminate of the conductor patterns 4 a to 4 e and the green sheet 2. At 870 ° C. for 2 hours.

Here, the formed laminate is cut into individual chips after forming or firing, and the cut product is cut into the laminated sintered body 5 as shown in FIG. 2 (B). The terminal electrode 6 was formed on the portion by baking or plating to produce a laminated coil component.

Table 1 shows the occurrence of cracks and the variation in inductance between the laminated coil components according to the first and second embodiments and the conventional product.

[0030]

[Table 1]

As can be seen from Table 1, according to Examples 1 and 2, almost no cracks were observed. An example in which cracks were observed was sample 6 of Example 1. In this case, the number of turns was nine, but the crack occurrence rate was 0.1.
%, Which is as low as 1/10 or less of that of the comparative example. As described above, according to the present invention, it is possible to provide a high-quality, highly-reliable laminated coil component having a very low crack generation rate. Further, in the variation of the inductance, the variations in Examples 1 and 2 are 1/3 or less as compared with the comparative example, and the manufacturing method of the present invention can improve the accuracy of the inductance and improve the yield. Quality products can be provided.

The present invention can be applied to a case where the coil component is configured as a transformer, or a case where the coil component is configured as a chip component that is integrally fired with a capacitor or a resistor.
It is included in the technical scope of the present invention.

[0033]

According to the present invention, by forming a groove in the substrate layer and filling and forming a conductive pattern in the groove, a structure without unevenness of the substrate layer is realized and laminated.
Even if the substrate layers are stacked and thermocompression-bonded, the density difference does not occur inside or becomes smaller than before, and since the conductor pattern is held in the cutout groove, pattern shift, pattern deformation,
Disclosed is a laminated coil component that can prevent disconnection of a conductive pattern and the like, can eliminate a difference in partial shrinkage ratio during firing, and can achieve high reliability, low cost, and small size without cracks. Can be.

[Brief description of the drawings]

FIG. 1A shows a basic configuration of an embodiment of a laminated coil component according to the present invention, and FIG. 1A is a side view showing a green sheet obtained by applying a ferrite paint on a base sheet and drying it. (B) and (c) are a cross-sectional view and a perspective view, respectively, showing a state in which a green sheet is provided with a groove.
(D) and (e) are a sectional view and a perspective view, respectively, showing a state in which a conductive pattern is filled and printed in the cutout groove.
(B) (a)-(e) are each a plan view showing each example of the conductor pattern of the present embodiment.

2A is a perspective view showing the stacking order of the green sheets of FIG. 1B, FIGS. 2B and 2C are a cross-sectional view and a perspective view of the laminated coil component of the present embodiment, respectively, and FIG. () Is a manufacturing process diagram of the present embodiment.

3A is a cross-sectional view showing a basic configuration of another embodiment of the laminated coil component according to the present invention, FIG. 3B is a perspective view of a green sheet of the embodiment, and FIGS. (E) is a plan view showing each example of the conductor pattern of the present embodiment.

4A is a perspective view showing the order of stacking green sheets of the embodiment of FIG. 3, and FIG. 4B is a developed view showing a state in which green sheets are stacked.

5A and 5B are a side view and a perspective view, respectively, showing the configuration of each layer of a conventional laminated coil component, and FIG. 5C is a cross-sectional view thereof.

[Explanation of symbols]

1: Base sheet, 2: Green sheet, 3, 3a-3
e: cutout groove, 4, 4a-4e: conductor pattern, 5: laminated body, 6: terminal electrode, X, X1-X4, X40: connection part

Claims (5)

[Claims] 1. A laminated coil component in which a substrate layer constituting a component substrate and a conductor pattern to be a coil are alternately laminated so that conductor patterns of adjacent layers are connected to each other. Each of the plurality of substrate layers having a conductor is filled with a groove formed in a conductor pattern shape, and one end of each conductor pattern filled in the groove of an adjacent substrate layer. Are laminated so that the conductor patterns overlap and are connected in series. 2. A laminated coil component in which a substrate layer constituting a component substrate and a conductor pattern serving as a coil are alternately laminated such that conductor patterns of adjacent layers are connected to each other. A groove formed in a conductor pattern shape, a part of the conductor is filled in the groove, and the rest of the conductor is formed on the substrate layer; and formed on the substrate layer. A laminated coil component comprising a conductor and one end of a conductor filled in a cutout groove of an adjacent substrate layer overlapped so that conductor patterns are connected in series. 3. When manufacturing the laminated coil component according to claim 1, a green sheet having a conductor pattern is provided by providing a cutout groove corresponding to the conductor pattern in the green sheet and filling the cutout groove with a conductive paste. Manufacturing a laminated coil component characterized in that these green sheets are connected to a part of the conductor in the groove of a certain green sheet so as to overlap with a part of the conductor of the groove of the next green sheet. Method. 4. The method of manufacturing a laminated coil component according to claim 2, wherein a cutout groove corresponding to the conductor pattern is provided in the green sheet, and the conductive paste is formed in the cutout groove to a depth within the depth of the cutout groove. And the connection conductor paste is continuously applied also on the green sheet adjacent to the cutout groove to form a connection conductor. A method for manufacturing a laminated coil component, comprising laminating the green sheet of the next layer so as to overlap the conductor in the groove of the next layer. 5. The method according to claim 4, wherein the filling depth of the conductive paste filled in the groove of the green sheet and the thickness of the conductive paste formed on the green sheet are set to about half of the thickness of the green sheet. A method for producing a laminated coil component.