KR20170097438A - Coil component - Google Patents

Abstract

The present invention relates to a coil component with an excellent coil property and a manufacturing method thereof. The coil component has a coil unit arranged in a body unit including a magnetic material. The coil unit comprises: a support member; a first pattern layer in a flat coil shape formed on one surface or both surfaces of the support member; an insulation layer formed on one surface or both surfaces of the support member to cover the first pattern layer; and a second pattern layer in a flat coil shape formed on the insulation layer. An average diameter of a first core formed on an inner side of the first pattern layer is larger than an average diameter of a second core formed on an inner side of the second pattern layer.

Description

Coil Components {COIL COMPONENT}

The present disclosure relates to coil components, such as power inductors.

With the miniaturization and thinning of electronic devices such as digital TVs, mobile phones, laptops, etc., coil parts applied to such electronic devices are required to be downsized and thinned. In order to meet these demands, various types of winding type or thin film type Coil parts and the like are being actively researched and developed.

For example, in order to meet the demands for miniaturization and thinning, a coil component of a conventional thin film type is formed by forming a pattern layer in the form of a plane coil by a so-called MSAP (Modified Semi Additive Process) method on both surfaces of an insulating substrate, And those produced by embedding them in a material.

However, because the gap between the coil patterns of the thin film type coil parts manufactured by this method is narrow, there is a problem that the overexcitation of the pattern due to overetching in the MSAP method may be restricted.

One of the objects of the present disclosure is to provide a coil component having a novel structure which can have excellent coil characteristics despite miniaturization and thinness, and which has a small risk of failure during the process.

One of the solutions proposed through the present disclosure is to form a plurality of pattern layers in the form of plane coils on one surface or both surfaces of the support member so that the diameter of the inner layer core filled with the magnetic material is larger than the diameter of the outer layer core will be.

For example, in the coil component according to the present disclosure, a coil portion is disposed in a body portion including a magnetic material, and the coil portion includes a support member, a first pattern layer in the form of a plane coil formed on one surface or both surfaces of the support member, A second pattern layer formed on one side or both sides of the support member and covering the first pattern layer and a second patterned layer in the form of a plane coil formed on the insulating layer; The average diameter of one core may be larger than the average diameter of the second core formed on the inner side of the second pattern layer.

As one of the effects of the present disclosure, it is possible to provide a coil part having a new structure which can have excellent coil characteristics despite the miniaturization and thinness, and which has a small risk of failure during the process.

For example, it is possible to realize a greater number of coil turns in a limited area by forming a plurality of pattern layers in the form of plane coils, thus facilitating high capacity implementation.

Further, since the inner layer core is made larger in diameter than the outer layer core, the inner layer core area, which is the portion with the highest magnetic flux density, can be sufficiently secured.

Further, since the inner layer core has a diameter larger than that of the outer layer core, the insulation characteristic can be improved, and the breakdown voltage (BDV) value can be increased.

1 schematically shows an example of a coil component applied to an electronic device.
2 is a schematic perspective view showing an example of a coil part.
Figure 3 shows an example of a schematic II 'cross section of the coil part of Figure 2.
4 is a schematic cross-sectional view for explaining the improvement of the insulation property.

Hereinafter, the present disclosure will be described in more detail with reference to the accompanying drawings. The shape and size of elements in the drawings may be exaggerated for clarity.

Electronics

1 schematically shows an example of a coil component applied to an electronic device.

Referring to the drawings, it can be seen that various types of electronic components are used in electronic devices. For example, DC / DC, Comm. Processor, WLAN BT / WiFi FM GPS NFC, PMIC, Battery, SMBC, LCD AMOLED, Audio Codec, USB 2.0 / 3.0 HDMI, CAM can be used. For example, a power inductor (1), a high frequency inductor (2), a high frequency inductor (2), and a high frequency inductor (2) may be used. , General beads (General Bead) 3, beads for high frequency (GHz Bead) 4, common mode filters (5), and the like.

Specifically, the power inductor 1 may be used to stabilize the power source by storing electric power in the form of a magnetic field to maintain an output voltage. Further, the high frequency inductor (HF Inductor) 2 can be used for the purpose of securing a necessary frequency by matching the impedance, blocking the noise and the AC component, and the like. Further, a normal bead (General Bead) 3 can be used for eliminating noise in a power source and a signal line, removing high-frequency ripple, and the like. Further, the high frequency bead (GHz Bead) 4 can be used for eliminating high frequency noise of a signal line and a power supply line associated with audio. Further, the common mode filter (5) can be used for passing the current in the differential mode and removing only the common mode noise.

The electronic device may be a smart phone, but is not limited thereto. For example, the electronic device may be a personal digital assistant, a digital video camera, a digital still camera ), A network system, a computer, a monitor, a television, a video game, a smart watch, and the like. But may be other various electronic devices well known to those skilled in the art.

Coil parts

Hereinafter, the coil component of the present disclosure will be described. However, it is needless to say that the coil component of the present disclosure can be applied to other various types of coil components as described above, as well as the structure of a power inductor .

2 is a schematic perspective view showing an example of a coil part.

Figure 3 shows an example of a schematic II 'cross section of the coil part of Figure 2.

Referring to the drawings, a coil component 100 according to an exemplary embodiment includes a body portion 10, a coil portion 20 disposed in the body portion 10, and an electrode portion 50 disposed on the body portion 10 . The body portion 10 includes a magnetic material. The coil section 20 includes a support member 21, first pattern layers 22a and 22b in the form of plane coils formed on the bottom surface of the support member 21, The insulating layers 23a and 23b covering the layers 22a and 22b, the second pattern layers 24a and 24b in the form of plane coil formed on the insulating layers 23a and 23b, and the second pattern layers 24a and 24b, And an insulating film 25 covering the insulating film 25. The electrode portion 50 includes first and second external electrodes 51 and 52 electrically connected to lead terminals of the coil portions 20, respectively.

The body portion 10 forms an outer appearance of the coil component 100 and includes first and second faces facing in a first direction, third and fourth faces facing in a second direction, 5, and 6, but is not limited thereto. The body portion 10 includes a magnetic material. The magnetic material is not particularly limited as long as it has magnetic properties, and examples thereof include pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy Fe-Ni-Co alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Co alloy powder, Fe-Ni-Co alloy powder, Fe- Based ferrite, Mn-Zn ferrite, Mn-Mg ferrite, Fe-based ferrite, Fe-based ferrite, Ba ferrite, Ba-Ni ferrite, Ba-Ni ferrite, Ba-Co ferrite, Ba-Zn ferrite, Ba-Zn ferrite, Hexagonal ferrite such as Ba-Ni-Co ferrite, and garnet type ferrite such as Y ferrite.

The magnetic material may be one comprising a metal magnetic powder and a resin mixture. The metal magnetic material powder may include iron (Fe), chromium (Cr), or silicon (Si) as a main component. Examples of the metal magnetic powder include iron (Fe) Chromium (Cr) -silicon (Si), and the like. The resin may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, etc., alone or in combination. The metal magnetic body powder may be a metal magnetic body powder having an average particle diameter of 2 or more. In this case, by using a bimodal metal magnetic powder of different sizes, the magnetic resin composite can be filled and the filling rate can be increased.

The coil part 20 functions to perform various functions in the electronic device through the characteristics expressed from the coil of the coil part 100. For example, the coil component 100 may be a power inductor. In this case, the coil portion 20 may store electricity in the form of a magnetic field to maintain the output voltage and stabilize the power supply. As described above, the coil portion 20 includes the support member 21, the first pattern layers 22a and 22b in the form of plane coils formed on the bottom surface of the support member 21, Insulating layers 23a and 23b covering the first pattern layers 22a and 22b, second pattern layers 24a and 24b in the form of plane coils formed on the insulating layers 23a and 23b, 24a, and 24b. However, it is needless to say that the first and second pattern layers 22a and 24a and the insulating layer 23a may be formed only on one side of the support member 21.

The support member 21 is formed to be thinner and easier to form the coil portion 20 and may be made of any material or kind that can support the coil patterns 22a and 22b and the insulating layers 23a and 23b, Is not particularly limited. For example, a copper clad laminate (CCL), a polypropylene glycol (PPG) substrate, a ferrite substrate, a metal soft magnetic substrate, an insulating substrate made of an insulating resin, or the like. As the insulating resin, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as a glass fiber or an inorganic filler such as prepreg, ABF (Ajinomoto Build- Film, FR-4, Bismaleimide Triazine (BT), and Photo Imagable Dielectric (PID). From the standpoint of stiffness maintenance, an insulating substrate including glass fiber and insulating resin, more specifically, an insulating substrate including glass fiber and epoxy resin can be used, but is not limited thereto.

Each of the first and second pattern layers 22a, 22b, 24a, and 24b has a planar coil shape. The first and second pattern layers 22a, 22b, 24a and 24b in the form of a plane coil may be a plating pattern formed by isotropic plating, but the present invention is not limited thereto. In the case of the flat coil shape, since the number of turns can be at least 2 or more, it is advantageous to realize a thin and high inductance. The first and second pattern layers 22a, 22b, 24a and 24b may be composed of a seed layer and a plating layer. The seed layer may comprise a first layer comprising at least one of titanium (Ti), titanium-tungsten (Ti-W), molybdenum (Mo), chrome (Cr), nickel (Ni), and nickel (Ni) Layer and a second layer containing the same material as the plating layer, for example, copper (Cu). The plating layer may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pd) But it is not limited thereto.

The average diameter of the first core C1 formed on the inner side of the first pattern layers 22a and 22b and the average diameter of the second core C2 formed on the inner side of the second patterned layers 24a and 24b are different from each other. Specifically, as shown in the figure, the average diameter of the first core (C1) formed inside the first pattern layers (22a, 22b) is larger than the average diameter of the second core (C2 ). ≪ / RTI > That is, the size of the first core C1 may be larger than that of the second core C2. In this case, since the area of the first core (C1), which is the portion with the highest magnetic flux density, can be sufficiently secured, a higher capacity can be realized. In addition, it is possible to improve the insulation characteristics such that the portion where the coating or the like is weak when the insulating film 25 is formed can be eliminated, and the breakdown voltage (BDV) value can be increased. Here, the inside refers to the center side of the coil component 100.

The coil pattern formed on the innermost one of the first pattern layers 22a and 22b may be embedded in the inner walls of the insulating layers 23a and 23b. That is, the coil pattern formed on the innermost of the first pattern layers 22a and 22b is not exposed to the core region by the insulating layers 23a and 23b. Therefore, since the insulating film 25 can be formed flat on the inner walls of the insulating layers 23a and 23b, there may not be a portion where the coating or the like is vulnerable, and as a result, the insulating property can be improved, (BDV: Break Down Voltage) value can be increased.

The coil pattern formed on the innermost of the second pattern layers 24a and 24b may partially protrude inward with respect to the inner wall of the insulating layers 23a and 23b. In this case, when the insulating film 25 formed on the surfaces of the second pattern layers 24a and 24b is subsequently formed on the inner walls of the insulating layers 23a and 23b, a short circuit or the like may not be present between them, It is possible to improve the breakdown voltage (BDV) value.

The first vias 26 passing through the support member 21 can be electrically connected to the upper first pattern layer 22a and the lower first pattern layer 22b formed on both sides of the support member 21, The shape and material thereof are not particularly limited. Here, the upper side and the lower side are judged based on the third direction in the drawing. For example, the shape of the first vias 26 may be a tapered shape in which the diameter becomes smaller or larger toward the lower surface from the upper surface, a cylindrical shape in which the diameter becomes substantially constant from the upper surface to the lower surface, an hourglass shape, Can be applied. As the material of the first via 26, materials for forming the first and second pattern layers 22a, 22b, 24a and 24b may be applied.

The insulating layers 23a and 23b serve to insulate the first pattern layers 22a and 22b and the second pattern layers 24a and 24b. The insulating layers 23a and 23b may be a build-up film comprising an insulating material. For example, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as an inorganic filler, for example, ABF (Ajinomoto Build-up Film) may be used. Alternatively, it may be an insulating film containing a known Photo Image Dielectric (PID) resin. An insulating film including a filler and an insulating resin such as an inorganic filler and an epoxy resin may be used to effectively fill the first pattern layers 22a and 22b while maintaining rigidity. It is not.

The second vias 27a and 27b penetrating the insulating layers 23a and 23b may be formed in any shape and material so long as the first pattern layers 22a and 22b and the second pattern layers 24a and 24b can be electrically connected to each other. Is not particularly limited. For example, the shapes of the second vias 27a and 27b may be any shape known in the art, such as a tapered shape as described above, a cylindrical shape, or the like. The material of the first and second pattern layers 22a, 22b, 24a, and 24b may be applied to the second vias 27a and 27b.

The insulating layer 25 basically protects the second pattern layers 24a and 24b. The insulating film 25 may cover the surfaces of the second pattern layers 24a and 24b. The inner wall of the supporting member 21 and the inner walls of the insulating layers 23a and 23b can also be covered. The material of the insulating film 25 may be any material including an insulating material. For example, the insulating film 25 may include an insulating resin such as an epoxy resin, a polyimide resin, a liquid crystalline polymer resin, etc. can do. For the purpose of forming a thin film, the filler and glass fiber may not be included.

The electrode part 50 serves to electrically connect the coil part 100 to the electronic device when the coil part 100 is mounted on the electronic device. The electrode unit 50 includes a first external electrode 51 and an external second electrode 52 disposed on the body unit 10 and spaced apart from each other. The electrode portion 50 may include a pre-plating layer (not shown) to improve the electrical reliability between the coil portion 20 and the electrode portion 50, if necessary.

The first external electrode 51 covers the first surface of the body portion 10 and may extend partially to the third surface, the fourth surface, the fifth surface, and the sixth surface. The second outer electrode 52 covers the second surface of the body portion 10 and may extend partially to the third surface, the fourth surface, the fifth surface, and the sixth surface. The first external electrode 51 is connected to a lead-out terminal drawn to the first surface of the body 10. The second external electrode 52 is connected to a lead-out terminal drawn out to the second surface of the body portion 10.

The first and second external electrodes 51 and 52 may include, for example, a conductive resin layer and a conductive layer formed on the conductive resin layer. The conductive resin layer may be formed by paste printing or the like and may include at least one conductive metal selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag) and a thermosetting resin. The conductor layer may include at least one selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn). For example, a nickel layer and a tin As shown in FIG.

The coil component 100 according to the example is formed by forming a plurality of coil parts 20 by using the support member 21 and then accommodating the plurality of coil parts 20 in the magnetic material, By forming the body 10 and then cutting the plurality of body parts 10 and then forming the electrode parts 50 on each of the individual body parts 10.

The coil portion 20 can be manufactured, for example, through the following process. However, the present invention is not limited thereto.

First, the first pattern layers 22a and 22b are formed on one surface or both surfaces of the support member 21. The support member 21 may be of a large size for forming a plurality of coil parts 20. The via hole for forming the first via 26 may be formed in advance in the support member 21 by using a mechanical drill, a laser drill or the like. The first pattern layers 22a and 22b may be formed by sequentially forming a seed layer and a plating layer. Electroplating copper plating or electroless copper plating can be used for the plating method. For example, a chemical vapor deposition (CVD), a physical vapor deposition (PVD), a sputtering, a subtractive, an additive, a semi-additive process, a modified semi- Process) may be used, but the present invention is not limited thereto.

Next, insulating layers 23a and 23b covering the first pattern layers 22a and 22b are formed on one surface or both surfaces of the support member 21, respectively. The method of forming the insulating layers 23a and 23b is not particularly limited. For example, a precursor film including the above-described insulating material is laminated on the supporting member 21 on which the first pattern layers 22a and 22b are formed And can be formed by curing. Alternatively, the above-described insulating material may be coated on the support member 21 on which the first pattern layers 22a and 22b are formed and then cured. As the lamination method, for example, a hot pressing method in which the resin is pressed at a high temperature for a certain period of time and then reduced in pressure to room temperature, and then cooled in a cold press to separate the working tool can be used. As the application method, for example, a screen printing method in which ink is applied by squeezing, a spray printing method in which ink is fogged and applied, and the like can be used.

Next, the second pattern layers 24a and 24b are formed on the insulating layers 23a and 23b. The method for forming the second pattern layers 24a and 24b is also not particularly limited, and known photolithography and plating methods can be used. On the other hand, when the second pattern layers 24a and 24b are formed, through holes passing through the insulating layers 23a and 23b are formed by a known method such as photolithography, mechanical drilling and / or laser drilling The second vias 27a and 27b can be formed by plating.

Next, the inside of the support member 21 and the insulating layers 23a and 23b is perforated using a known trimming method or the like. As a result, a hole for the first core C1 is formed. At this time, the unnecessary area is also selectively removed. As a result, the area where the magnetic material is charged can be further improved.

Next, an insulating film 25 is formed. The method of forming the insulating film 25 is not particularly limited, and a known coating method can be used.

The body part 10 can be formed by embedding the coil part 20 using a magnetic material. It is possible to use a lamination of a magnetic substance sheet or the like. The magnetic sheet may be one comprising a known magnetic material as described above. For example, a slurry may be prepared by mixing metal magnetic particles, a binder resin, and a solvent, and the slurry may be coated on a carrier film film to a thickness of several tens of mu m and then dried to form a sheet. However, the present invention is not limited thereto. When a plurality of body parts 10 are formed, individual body parts 10 having a coil part 20 formed therein can be formed by singulation using a dicing process or the like.

The electrode unit 50 may be formed by forming external electrodes 51 and 52 on the outside of the body 10 so as to be connected to the lead-out end face of the coil unit 20 exposed on one side of the body unit 10 . The external electrodes 51 and 52 may be formed using a paste containing a metal having excellent electrical conductivity as described above. For example, the external electrodes 51 and 52 may be formed of a metal such as nickel (Ni), copper (Cu), tin (Sn) Ag) or the like, an alloy thereof, or the like can be used. The external electrodes 51 and 52 may be formed by further forming a plating layer on these paste layers. The plating layer may include at least one selected from the group consisting of nickel (Ni), copper (Cu) and tin (Sn). For example, a nickel (Ni) layer and a tin .

4 is a schematic cross-sectional view for explaining the improvement of the insulation property.

Referring to the drawings, a coil component 100 'is fabricated similar to the coil component 100 according to the example, except that the average of the first cores C1' formed inside the first pattern layers 22a ', 22b' And the average diameter of the second core (C2 ') formed on the inner side of the second pattern layers (24a', 24b ') were made equal to each other. In this case, the coil pattern formed on the innermost one of the first pattern layers 22a 'and 22b' is exposed in the core region. Therefore, there is a curvature in which the insulation coating is weak between the first pattern layers 22a 'and 22b' formed on the innermost side and the second pattern layers 24a 'and 24b' formed on the innermost side. Therefore, the insulating property may be deteriorated. As a result, the breakdown voltage (BDV) value may be lowered.

On the other hand, in the coil component 100 according to the example, the average diameter of the first core C1 formed on the inner side of the first pattern layers 22a and 22b is larger than the average diameter of the second pattern layers 24a and 24b Is larger than the average diameter of the formed second core (C2). The coil pattern formed on the innermost one of the first pattern layers 22a and 22b may be embedded in the inner walls of the insulating layers 23a and 23b. The coil patterns formed on the innermost of the second pattern layers 24a and 24b may partially protrude inward with respect to the inner walls of the insulating layers 23a and 23b. Therefore, since the insulating film 25 can be formed flat on the inner walls of the insulating layers 23a and 23b, there may not be a portion where the coating or the like is vulnerable, and as a result, the insulating property can be improved, (BDV: Break Down Voltage) value can be increased.

In the present disclosure, the term " electrically connected " means a concept including both a physical connection and a non-connection. Also, the first, second, etc. expressions are used to distinguish one component from another, and do not limit the order and / or importance of the components. In some cases, without departing from the scope of the right, the first component may be referred to as a second component, and similarly, the second component may be referred to as a first component.

Furthermore, the expression " an example used in the present disclosure does not mean the same embodiment but is provided for emphasizing and explaining different unique features. However, the above-mentioned examples do not exclude that they are implemented in combination with the features of other examples. For example, although the description in the specific example is not described in another example, it can be understood as an explanation related to another example, unless otherwise described or contradicted by the other example.

Also, the terms used in the present disclosure are used to illustrate only one example, and are not intended to limit the present disclosure. Wherein the singular expressions include plural expressions unless the context clearly dictates otherwise.

1: Power inductor
2: High frequency inductor
3: Normal bead
4: High frequency beads
5: Common mode filter
100: Coil parts
10: Body part
20: coil part
50:
21: Support member
22a and 22b: a first pattern layer
23a, 23b: insulating layer
24a, 24b: a second pattern layer
25: Insulating film
51, 52: first and second outer electrodes

Claims (10)

1. A coil component in which a coil portion is disposed in a body portion including a magnetic material,
The coil portion includes a support member,
A first pattern layer of a plane coil shape formed on one or both surfaces of the support member,
An insulating layer formed on one or both surfaces of the support member and covering the first pattern layer,
And a second pattern layer in the form of a plane coil formed on the insulating layer,
The average diameter of the first core formed on the inner side of the first pattern layer is larger than the average diameter of the second core formed on the inner side of the second patterned layer,
Coil parts.
The method according to claim 1,
Wherein a coil pattern formed on the innermost one of the first pattern layers is embedded in an inner wall of the insulating layer,
Coil parts.
3. The method of claim 2,
Wherein a coil pattern formed on the innermost portion of the second pattern layer is formed by partially protruding inward with respect to an inner wall of the insulating layer,
Coil parts.
The method according to claim 1,
Wherein the coil portion further comprises an insulating film covering a surface of the second pattern layer,
Coil parts.
5. The method of claim 4,
Wherein the insulating film covers an inner wall of the supporting member and an inner wall of the insulating layer,
Coil parts.
The method according to claim 1,
Wherein the magnetic material comprises two or more metal magnetic powder powders and a resin mixture having different average particle diameters,
Coil parts.
The method according to claim 1,
Wherein the support member comprises glass fibers and an insulating resin.
Coil parts.
The method according to claim 1,
Wherein the insulating layer comprises a filler and an insulating resin.
Coil parts.
5. The method of claim 4,
Wherein the insulating film comprises an insulating resin,
Without glass fibers and fillers,
Coil parts.
The method according to claim 1,
And an electrode portion electrically connected to the coil portion is disposed on the body portion,
Coil parts.

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