KR20170066959A - Base film for fpcb and manufacturing method for the same - Google Patents

Base film for fpcb and manufacturing method for the same Download PDF

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Publication number
KR20170066959A
KR20170066959A KR1020150173234A KR20150173234A KR20170066959A KR 20170066959 A KR20170066959 A KR 20170066959A KR 1020150173234 A KR1020150173234 A KR 1020150173234A KR 20150173234 A KR20150173234 A KR 20150173234A KR 20170066959 A KR20170066959 A KR 20170066959A
Authority
KR
South Korea
Prior art keywords
film
polyimide film
copper foil
silicone adhesive
fpcb
Prior art date
Application number
KR1020150173234A
Other languages
Korean (ko)
Inventor
김유신
김영래
신대현
Original Assignee
(주)티디엘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)티디엘 filed Critical (주)티디엘
Priority to KR1020150173234A priority Critical patent/KR20170066959A/en
Priority to PCT/KR2016/014014 priority patent/WO2017099415A1/en
Publication of KR20170066959A publication Critical patent/KR20170066959A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to a base film for FPCB and a method of manufacturing the same, and more particularly, to a polyimide film used as a substrate as a heat resistant plastic film, a copper foil film which is attached to the upper and lower portions of the polyimide film, And a silicone adhesive for bonding the polyimide film and the copper foil film, wherein the silicone adhesive comprises 35 to 45 wt% of liquid silicon, 5 to 15 wt% of aluminum powder, and 50 wt% of organic solvent, The polyimide film having excellent heat resistance can be easily adhered to the polyimide film by a silicone adhesive having excellent heat resistance and durability without plating the copper foil. Thus, production efficiency can be improved while forming a base film for FPCB which is excellent in heat resistance and durability.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a base film for FPCB,

The present invention relates to a base film for FPCB and a method for manufacturing the base film. More particularly, the present invention relates to a base film used for manufacturing an FPCB used for an LED lighting module such as automobile lighting and the like using a polyimide film and a silicone adhesive without plating or soldering To a base film excellent in heat resistance and a manufacturing method thereof.

LED, which is widely used for backlight for LCD-TV, automobile head lamp, general lighting, etc., is manufactured in the form of one lighting module and is applied to the lighting device. In the COF (Chip On Flexible Printed Circuit) A direct mounting method has been developed and applied.

In the flexible substrate applied to the LED lighting module, expensive metal thin films of Ag, Au and Cu are used as the printed circuit, and the electrical connection between the LED chip and the metal thin film is also made of the expensive metal. There is a problem in that an LED lighting module implemented by the COF method has a high manufacturing cost.

As shown in FIG. 1, a conventional flexible radiator plate is made of a flexible radiator plate made of an Al or Al-based alloy and formed of an Al film patterned on the radiating film, One or more joining portions made of Ni or a Ni-based alloy may be formed in the corresponding region so that connection terminals made of Cu or Cu-based alloy can be stably connected. Is formed on one surface or both surfaces and further comprises a protective film made of a heat-resistant resin.

However, since the conventional flex sub-radiator plate has been formed by plating without attaching the copper foil to the aluminum panel, there is a problem that a high cost is required to form the copper foil and the production yield is poor.

[Prior Art Literature]

[Patent Literature]

Korean Patent No. 10-1363070 (LED lighting module)

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems of the prior art, and it is an object of the present invention to provide a method for manufacturing a copper foil, which is capable of easily attaching a copper foil to a base film without using a plating method, And a method for producing the base film.

In order to achieve the above-mentioned object, a base film for FPCB according to the present invention comprises: a polyimide film used as a base material as a heat-resistant plastic film; and a base film formed on the upper and lower portions of the polyimide film and patterned by etching to form a wiring circuit Wherein the silicone adhesive comprises 35 to 45% by weight of liquid silicone, 5 to 15% by weight of an aluminum powder, and 50% by weight of an organic solvent, .

Here, the silicone adhesive is characterized in that a catalyst and a curing agent containing 3 wt% of a platinum solute component are added.

A method for producing a base film for FPCB according to the present invention comprises the steps of: preparing a polyimide film used as a base material as a heat-resistant plastic film; and mixing the polyimide film with 35 to 45% by weight of liquid silicone and 5 to 15% And 50 wt% of an organic solvent; and pressing the copper foil film on the polyimide film to which the silicone adhesive is adhered; pressing the polyimide film to which the copper foil is adhered, The film is pressed at a pressure of 1 to 2 kgf at a pressure of 1 to 2 kgf to subject the film to a primary thermal coating and then a secondary thermal coating is performed at a pressure of 1 to 2 kgf at 120 to 150 ° C, And winding the polyimide film coated with heat.

According to the present invention having the above-described constitution, since a polyimide film having excellent heat resistance can be easily attached by a silicone adhesive excellent in heat resistance and durability without plating a copper foil, a base film for FPCB which is economically excellent in heat resistance and durability The production efficiency can be improved.

1 is a view showing a conventional flexible radiator plate.
2 is a view showing an example of a base film for FPCB of the present invention.
3 is a view showing another example of the base film for FPCB of the present invention.
Fig. 4 is a view for explaining the method of manufacturing the base film for FPCB of Fig. 2;
Fig. 5 is a view for explaining the method of manufacturing the base film for FPCB of Fig. 3;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a base film for an FPCB according to the present invention and a method of manufacturing the same will be described in detail with reference to the accompanying drawings.

2 and 3, the base film for FPCB 1 according to the present invention comprises a polyimide film 10, a silicone adhesive 20, and a copper foil film 30. As shown in Fig.

The polyimide film 10 is used as a substrate as a plastic film having excellent heat resistance. In this embodiment, the polyimide film 10 having a thickness of 20 to 50 mu m is used. Since the polyimide film itself is already known, a detailed description thereof will be omitted.

A copper foil film (30) is provided on the polyimide film (10). The copper foil film 30 is attached to the upper and lower portions of the polyimide film, and is patterned by etching to form a wiring circuit. In this embodiment, the copper foil film forming the copper-clad wiring circuit is one having a thickness of 1 to 2 oz. Although the copper foil film 30 is bonded only to the upper portion of the polyimide film 10, the present invention is not limited thereto. As shown in Fig. 3, the copper foil may be bonded to the upper and lower portions of the polyimide film 10 It is of course possible to form a double-sided copper-clad wiring circuit.

The polyimide film (10) and the copper foil film (30) are bonded by a silicone adhesive (20). The silicone adhesive 20 comprises liquid silicone, an aluminum powder, and an organic solvent. The silicone adhesive 20 is excellent in adhesion and can be easily adhered to the polyimide film and the copper foil film, and is excellent in thermal stability at a high temperature.

The silicone adhesive 20 comprises 35 to 45% by weight, preferably 40% by weight, of liquid silicone. In addition, the silicone adhesive 20 comprises 5 to 15% by weight, preferably 10% by weight, of aluminum powder. Further, the silicone adhesive 20 contains 50% by weight of an organic solvent as a diluent.

In the present embodiment, it is preferable that the silicone adhesive 20 is applied in an amount of about 100 to 200 g per 1 m < 2 > of the polyimide film 10.

The silicone adhesive 20 may further include an organic peroxide as a crosslinking agent and a curing agent.

In addition, the silicone adhesive 20 may further include a catalyst. As the catalyst used in the present embodiment, an appropriate amount of a catalyst containing 3 wt% of a platinum solid component may be used.

Hereinafter, a method for producing a base film for FPCB according to the present invention will be described with reference to Figs. 4 and 5. Fig. 4 is a view showing a method for producing a base film to which the copper foil film is adhered on the polyimide film and FIG. 5 is a view showing a method for producing a base film to which the copper foil film is adhered on the upper and lower portions of the polyimide film The manufacturing method of the present invention will be described with reference to FIG. 4, and a duplicate description will be omitted.

As shown in Fig. 4 and Fig. 5, in the method for producing a base film for FPCB according to the present invention, first, a polyimide film used as a substrate as a heat-resistant plastic film is prepared. The polyimide film (10) is fed from the polyimide film winding roll (11).

Then, the above silicone adhesive structured as described above is applied to the polyimide film and adhered thereto. The attachment of the silicone adhesive is performed by immersing the polyimide film in a silicone adhesive water bath. In this case, it is preferable that the silicone adhesive 20 is applied in an amount of 100 to 200 g per 1 m < 2 > of the polyimide film 10.

Then, the copper foil film 30 is supplied to the polyimide film 10 to which the silicone adhesive 20 is adhered.

Then, the copper foil film 30 is subjected to primary thermal coating while being pressed on the polyimide film. At this time, the primary thermal coating is performed by heating in a temperature range of 50 to 80 ° C, and the primary thermal coating is pressed while pressurizing with a pressure of 1 to 2 kgf using a pressing roller (4).

Then, after the first heat coating, the copper foil film 30 is thermally compressed by pressing at a pressure of 1 to 2 kgf at a temperature of 120 to 150 ° C., which is higher than the first heat coating temperature, 20 to the polyimide film 10 stably.

Then, the polyimide film (10) coated with the secondary coat film (30) is wound up by the winding roller (5).

This makes it possible to easily attach the polyimide film having excellent heat resistance by a silicone adhesive having excellent heat resistance and durability without plating the copper foil film.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions. It will be apparent to those of ordinary skill in the art.

1: Base film for FPCB
10: polyimide film
20: Silicone adhesive
30: Copper foil film

Claims (3)

A polyimide film used as a substrate as a heat-resistant plastic film,
A copper foil film attached to the upper and lower portions of the polyimide film and patterned by etching to form a wiring circuit;
And a silicone adhesive for bonding the polyimide film and the copper foil film,
Wherein the silicone adhesive comprises 35 to 45 wt% of liquid silicone, 5 to 15 wt% of aluminum powder, and 50 wt% of organic solvent.
The method according to claim 1,
Characterized in that a catalyst and a curing agent containing 3% by weight of a platinum solute component are added to the silicone adhesive.
Preparing a polyimide film to be used as a substrate as a heat resistant plastic film,
Immersing the polyimide film in a silicone adhesive water tank comprising 35 to 45% by weight of liquid silicone, 5 to 15% by weight of aluminum powder, and 50% by weight of organic solvent,
Pressing the copper foil film on the polyimide film to which the silicone adhesive is adhered,
The polyimide film to which the copper foil film is adhered is pressed at a pressure of 1 to 2 kgf at a temperature of 50 to 80 캜 and subjected to primary thermal coating and then pressed at a pressure of 1 to 2 kgf at 120 to 150 캜 to form a secondary thermal coating , ≪ / RTI &
And winding the polyimide film coated with the copper foil film with the secondary coating.
KR1020150173234A 2015-12-07 2015-12-07 Base film for fpcb and manufacturing method for the same KR20170066959A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020150173234A KR20170066959A (en) 2015-12-07 2015-12-07 Base film for fpcb and manufacturing method for the same
PCT/KR2016/014014 WO2017099415A1 (en) 2015-12-07 2016-12-01 Base film for fpcb and method for manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150173234A KR20170066959A (en) 2015-12-07 2015-12-07 Base film for fpcb and manufacturing method for the same

Publications (1)

Publication Number Publication Date
KR20170066959A true KR20170066959A (en) 2017-06-15

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WO (1) WO2017099415A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200100319A (en) * 2019-02-18 2020-08-26 주식회사 아이씨에이치 Adhesive tape used in the transfer process of copper-clad laminate for printed circuit board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112930106B (en) * 2021-01-22 2022-11-22 杭州唯灵医疗科技有限公司 Flexible electronic device and assembling method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10126035A (en) * 1996-10-24 1998-05-15 Arisawa Mfg Co Ltd Flexible printed board and its manufacture
JP3195277B2 (en) * 1997-08-06 2001-08-06 信越化学工業株式会社 Thermal conductive silicone composition
JP5926986B2 (en) * 2012-03-05 2016-05-25 株式会社朝日ラバー White reflective sheet roll with circuit and manufacturing method thereof
JP2014130739A (en) * 2012-12-28 2014-07-10 Hitachi Metals Ltd Flexible flat cable and method for producing the same
KR101482707B1 (en) * 2013-02-27 2015-01-14 한국과학기술원 Method of surface planarization of colorless and transparent polyimide films impregnated with glass fabric for display substrates and cover window

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200100319A (en) * 2019-02-18 2020-08-26 주식회사 아이씨에이치 Adhesive tape used in the transfer process of copper-clad laminate for printed circuit board

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