KR20170058123A - Fluorine coating article, method for manufacturing fluorine coating article and apparatus for treating a substrate - Google Patents

Fluorine coating article, method for manufacturing fluorine coating article and apparatus for treating a substrate Download PDF

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Publication number
KR20170058123A
KR20170058123A KR1020150161937A KR20150161937A KR20170058123A KR 20170058123 A KR20170058123 A KR 20170058123A KR 1020150161937 A KR1020150161937 A KR 1020150161937A KR 20150161937 A KR20150161937 A KR 20150161937A KR 20170058123 A KR20170058123 A KR 20170058123A
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KR
South Korea
Prior art keywords
fluorine
substrate
article
coating film
support plate
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Application number
KR1020150161937A
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Korean (ko)
Inventor
유종민
이원준
서승호
김형일
김종환
Original Assignee
세메스 주식회사
세종대학교산학협력단
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Application filed by 세메스 주식회사, 세종대학교산학협력단 filed Critical 세메스 주식회사
Priority to KR1020150161937A priority Critical patent/KR20170058123A/en
Publication of KR20170058123A publication Critical patent/KR20170058123A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • H01L21/02131—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being halogen doped silicon oxides, e.g. FSG
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01009—Fluorine [F]

Abstract

The present invention relates to a fluorine coating article with excellent corrosion resistance, a method for manufacturing a fluorine coating article, and a substrate processing apparatus. According to an embodiment of the present invention, the fluorine coating article comprises: a body; and a coating film formed on the surface of a body. The coating film includes the fluorine coating article formed by coupling fluorine with a covalent bond on the surface of the body.

Description

TECHNICAL FIELD [0001] The present invention relates to a fluorine-coated article, a method of manufacturing a fluorine-coated article,

The present invention relates to a fluorine-coated article having a fluorine-containing coating film, a method of producing the fluorine-coated article, and a substrate processing apparatus.

In general, processes for processing glass substrates and wafers in flat panel display device manufacturing or semiconductor manufacturing processes include a photoresist coating process, a developing process, an etching process, an ashing process, and the like Various processes are performed.

On the other hand, among the parts used in such a substrate processing step, there are parts frequently exposed to chemicals such as chemical liquids, plasma, and process gases that can damage parts.

As the substrate processing process is repeated, the parts are damaged by chemical liquids and gases, and the parts must be replaced periodically.

Particularly, when a component having a low corrosion resistance is used, the replacement cycle is short and the substrate processing apparatus can not be used, which causes a delay in the process.

The present invention is to provide a fluorine-coated article excellent in corrosion resistance, a method of manufacturing a fluorine-coated article, and a substrate processing apparatus.

The present invention also provides a fluorine-coated article, a method of manufacturing a fluorine-coated article, and a substrate processing apparatus capable of minimizing a factor of generating particles during a substrate processing step.

The present invention also provides a fluorine-coated article, a method of manufacturing a fluorine-coated article, and a substrate processing apparatus which can minimize the scattering of liquid during a liquid processing step on a substrate.

The present invention is not limited thereto, and other objects not mentioned may be clearly understood by those skilled in the art from the following description.

The present invention provides a fluorine-coated article wherein the fluorine is coated on the surface.

According to an embodiment of the present invention, the fluorine-coated article includes a body and a coating film formed on the surface of the body, and the coating film may be formed by covalently bonding fluorine to the surface of the body.

According to one embodiment, the coating film may be formed by treating the surface of the body with an acid or an alkali solution, and then supplying fluorine.

According to one embodiment, the body may include a silicon carbide layer on its surface.

The present invention provides a method for producing a fluorine-coated article.

According to an embodiment of the present invention, the fluorine coating material may be formed by forming a fluorine coating on the surface of the body, wherein the fluorine coating is covalently bonded to the surface of the body.

According to an embodiment, a defect may be formed on the surface of the body before forming the fluorine coating layer.

According to one embodiment, the bonding may be performed by treating the surface of the body with an acid or an alkali solution, and the fluorine coating film may be formed by supplying fluorine to the surface of the body after the defect treatment.

According to one embodiment, the body may comprise a silicon carbide material.

The present invention provides an apparatus for processing a substrate.

According to an embodiment of the present invention, the substrate processing apparatus includes a container having a processing space therein, a support unit positioned in the processing space, and a liquid supply unit supplying liquid to the substrate supported by the support unit Wherein the support unit comprises a support plate on which the substrate is placed, a chuck pin located on the support plate and supporting the substrate on the side, and a support pin located on the support plate and supporting the substrate from below, And a coating layer formed on the surface of the body, wherein the coating layer is formed by covalent bonding of fluorine to the surface of the body.

According to one embodiment, the article may be the support plate.

According to one embodiment, the article may be the chuck pin.

According to one embodiment, the article may be the support pin.

According to one embodiment, the article is a container, and the coating film may be formed on an inner wall of the container.

According to another embodiment of the present invention, the substrate processing apparatus includes a chamber having a processing space sealed to the outside, a support unit disposed in the processing space, for supporting the substrate, and a processing gas containing fluorine gas Wherein the support unit includes a support plate on which the substrate is placed and a ring member provided to surround the support plate, the article exposed to the process gas includes a body and a coating film formed on a surface of the body, May be formed by covalent bonding of fluorine to the surface of the body.

According to one embodiment, the article may be the support plate.

According to one embodiment, the article may be the ring member.

According to one embodiment, the substrate processing apparatus further includes a showerhead positioned on the upper surface of the support unit, and the article may be the showerhead.

According to an embodiment of the present invention, the corrosion resistance of a component can be improved by providing a fluorine-coated article having a fluorine coating film on its surface and a substrate processing apparatus provided with a fluorine-coated article.

According to an embodiment of the present invention, there is provided a substrate processing apparatus provided with a fluorine-coated article and a fluorine-coated article having a fluorine-coated film on a surface thereof, thereby minimizing the generation of particles during a substrate processing process.

According to an embodiment of the present invention, there is provided a substrate processing apparatus provided with a fluorine-coated article and a fluorine-coated article having a chemically stable fluorine coating film on a surface thereof, have.

The effects of the present invention are not limited to the above-mentioned effects, and the effects not mentioned can be clearly understood by those skilled in the art from the present specification and attached drawings.

1 and 2 are views showing a fluorine-coated article according to an embodiment of the present invention.
3 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention.
4 is a cross-sectional view showing a substrate processing apparatus provided in the process chamber of FIG.
5 to 8 are views showing an example in which a fluorine-coated article is provided in the substrate processing apparatus of FIG.
9 is a sectional view showing a substrate processing apparatus according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.

1 and 2 are views showing a fluorine-coated article according to an embodiment of the present invention. Referring to FIGS. 1 and 2, the fluorine-coated article 30 includes a body 31 and a coating film 31. A coating film (31) is formed on the surface of the body (31). The coating film 31 is provided as a fluorine coating film 31. The fluorine is covalently bonded to the surface of the body 31. For example, the body 31 may include a silicon carbide layer on its surface.

A method of producing the fluorine-coated article 30 is as follows.

The surface of the body 31 is chemically treated. When the surface of the body 31 is not chemically treated, the silicon carbide is chemically stable, so that when the fluorine is supplied without chemical cleaning, the fluorine coating film is not formed. Thereby creating defects in the chemically treated surface on the surface of the body 31. For example, the surface chemical treatment is performed by supplying an acid or an alkali solution to the surface of the body 31. The surface of the body 31 is subjected to surface chemical treatment to cause a defect on the surface. After the surface chemical treatment, the fluorine coating film 31 is formed by supplying fluorine. Fluorine is covalently bound to the surface by surface bonding.

Covalent bonds provide ionic bonds, but stronger bonds than molecular bonds. Fluorine forms a strong bonding force through covalent bonding to the surface, so that the bonding force of the fluorine coating film 31 can be increased. Due to the strong bonding force of the fluorine coating film 31, the fluorine-coated article 30 has improved corrosion resistance and durability. The fluororesin coated article 30 with improved corrosion resistance and durability can be applied to various industrial parts. Hereinafter, the fluorine-coated article 30 provided in the apparatus for processing a substrate will be described as an example.

3 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 3, the substrate processing apparatus 1 includes an index module 10 and a processing module 20. The index module 10 has a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 20 are sequentially arranged in a line. Hereinafter, the direction in which the load port 120, the transfer frame 140, and the process module 20 are arranged is referred to as a first direction 12. A direction perpendicular to the first direction 12 is referred to as a second direction 14 and a direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction (16).

The carrier 130 in which the substrate W is accommodated is mounted on the load port 120. A plurality of load ports 120 are provided, and they are arranged in a line along the second direction 14. In FIG. 1, four load ports 120 are shown. However, the number of load ports 120 may increase or decrease depending on conditions such as process efficiency and footprint of the process module 20. A carrier (130) is provided with a slot (not shown) provided to support the edge of the substrate (W). The slots are provided in a plurality of third directions 16 and the substrates W are positioned in the carrier so as to be stacked on each other along the third direction 16. As the carrier 130, a front opening unified pod (FOUP) may be used.

The process module 20 has a buffer unit 220, a transfer chamber 240, and a process chamber 260. The transfer chamber 240 is disposed such that its longitudinal direction is parallel to the first direction 12. Process chambers 260 are disposed on one side and the other side of the transfer chamber 240 along the second direction 14, respectively. The process chambers 260 located at one side of the transfer chamber 240 and the process chambers 260 located at the other side of the transfer chamber 240 are provided to be symmetrical with respect to the transfer chamber 240. Some of the process chambers 260 are disposed along the longitudinal direction of the transfer chamber 240. In addition, some of the process chambers 260 are stacked together. That is, at one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of A X B (where A and B are each at least one natural number). Where A is the number of process chambers 260 provided in a row along the first direction 12 and B is the number of process chambers 260 provided in a row along the third direction 16. When four or six process chambers 260 are provided on one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of 2 X 2 or 3 X 2. The number of process chambers 260 may increase or decrease. Unlike the above, the process chamber 260 may be provided only on one side of the transfer chamber 240. Also, unlike the above, the process chamber 260 may be provided as a single layer on one side and on both sides of the transfer chamber 240.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space for the substrate W to stay before the transfer of the substrate W between the transfer chamber 240 and the transfer frame 140. [ The buffer unit 220 is provided with a slot (not shown) in which the substrate W is placed, and a plurality of slots (not shown) are provided to be spaced apart from each other in the third direction 16. The surface of the buffer unit 220 opposed to the transfer frame 140 and the surface of the transfer chamber 240 facing each other are opened.

The transfer frame 140 transfers the substrate W between the buffer unit 220 and the carrier 130 that is seated on the load port 120. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided so that its longitudinal direction is parallel to the second direction 14. The index robot 144 is installed on the index rail 142 and is linearly moved along the index rail 142 in the second direction 14. The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed so as to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. Also, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and is provided to be movable forward and backward relative to the body 144b. A plurality of index arms 144c are provided and each is provided to be individually driven. The index arms 144c are stacked in a state of being spaced from each other along the third direction 16. Some of the index arms 144c are used to transfer the substrate W from the processing module 20 to the carrier 130 while the other part is used to transfer the substrate W from the carrier 130 to the processing module 20. [ As shown in Fig. This can prevent the particles generated from the substrate W before the process processing from adhering to the substrate W after the process processing in the process of loading and unloading the substrate W by the index robot 144. [

The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260 and between the process chambers 260. The transfer chamber 240 is provided with a guide rail 242 and a main robot 244. The guide rails 242 are arranged so that their longitudinal directions are parallel to the first direction 12. The main robot 244 is installed on the guide rails 242 and is linearly moved along the first direction 12 on the guide rails 242. The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed so as to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. Body 244b is also provided to be rotatable on base 244a. The main arm 244c is coupled to the body 244b, which is provided for forward and backward movement relative to the body 244b. A plurality of main arms 244c are provided and each is provided to be individually driven. The main arms 244c are stacked in a state of being spaced from each other along the third direction 16. A main arm 244c used when the substrate W is transferred from the buffer unit 220 to the process chamber 260 and a main arm 244b used when the substrate W is transferred from the process chamber 260 to the buffer unit 220 The main arms 244c may be different from each other.

In the process chamber 260, a substrate processing apparatus 300 for performing a cleaning process on the substrate W is provided. The substrate processing apparatus 300 provided in each process chamber 260 may have a different structure depending on the type of the cleaning process to be performed. Alternatively, the substrate processing apparatus 300 in each process chamber 260 may have the same structure. Optionally, the process chambers 260 are divided into a plurality of groups, and the substrate processing apparatuses 300 provided in the process chambers 260 belonging to the same group have the same structure and are provided in the process chambers 260 belonging to different groups The substrate processing apparatuses 300 may have different structures from each other. For example, if the process chambers 260 are divided into two groups, a first group of process chambers 260 is provided on one side of the transfer chamber 240 and a second group of process chambers 260 are provided on the other side of the transfer chamber 240 Process chambers 260 may be provided. Optionally, a first group of process chambers 260 may be provided on the lower layer and a second group of process chambers 260 may be provided on the upper and lower sides of the transfer chamber 240, respectively. The first group of process chambers 260 and the second group of process chambers 260 may be classified according to the type of the chemical used and the type of the cleaning method.

An example of the substrate processing apparatus 300 for cleaning the substrate W by using the process liquid will be described below. 2 is a cross-sectional view showing a substrate processing apparatus provided in the process chamber of FIG. 2, the substrate processing apparatus 300 includes a housing 310, a container 320, a support unit 330, a lift unit 340, a liquid supply unit 350, and a dissolved gas removing unit 400 .

The housing 310 provides space therein. A container 320 is positioned inside the housing 310.

The vessel 320 provides a processing space in which the substrate processing process is performed. The container 320 is provided in an open top shape. The container 320 includes an inner recovery cylinder 322, an intermediate recovery cylinder 324, and an outer recovery cylinder 326. Each of the recovery cylinders 322, 324, and 326 recovers the different treatment liquids among the treatment liquids used in the process. The inner recovery cylinder 322 is provided in an annular ring shape surrounding the support unit 330. The intermediate recovery bottle 324 is provided in an annular ring shape surrounding the inner recovery bottle 322. The outer recovery cylinder 326 is provided in the form of an annular ring surrounding the intermediate recovery cylinder 324. The inner space 322a of the inner recovery cylinder 322 and the space 324a between the inner recovery cylinder 322 and the intermediate recovery cylinder 324 and the space 324 between the intermediate recovery cylinder 324 and the outer recovery cylinder 326 326a function as an inlet through which the processing liquid flows into the inner recovery cylinder 322, the intermediate recovery cylinder 324, and the outer recovery cylinder 326, respectively. Recovery passages 322b, 324b, and 326b extending vertically downward from the bottom of the recovery passages 322, 324, and 326 are connected to the recovery passages 322, 324, and 326, respectively. Each of the recovery lines 322b, 324b, and 326b discharges the processing liquid that has flowed through the respective recovery cylinders 322, 324, and 326. [ The discharged treatment liquid can be reused through an external treatment liquid recovery system (not shown).

The support unit 330 is disposed within the container 320. The support unit 330 supports the substrate W and rotates the substrate W during the substrate processing process. The support unit 330 includes a support plate 332, a support pin 334, a chuck pin 336, and a support shaft 338. The support plate 332 has an upper surface which is generally provided in a circular shape when viewed from above. A support shaft 338 rotatable by a motor 339 is fixedly coupled to the bottom surface of the support plate 332. A plurality of support pins 334 are provided. The support pins 334 are spaced apart from the edge of the upper surface of the support plate 332 by a predetermined distance and project upward from the support plate 332. The support pins 334 are arranged so as to have a generally annular ring shape in combination with each other. The support pin 334 supports the rear edge of the substrate W such that the substrate W is spaced apart from the upper surface of the support plate 332 by a predetermined distance.

A plurality of the chuck pins 336 are provided. The chuck pin 336 is disposed farther away from the center of the support plate 332 than the support pin 334. The chuck pin 336 is provided to protrude upward from the support plate 332. The chuck pin 336 supports the side of the substrate W such that the substrate W is not laterally displaced in place when the support unit 330 is rotated. The chuck pin 336 is provided so as to be linearly movable between a standby position and a supporting position along the radial direction of the support plate 332. The standby position is located away from the center of the support plate 332 relative to the support position. When the substrate W is loaded into or unloaded from the support unit 330, the chuck pin 336 is positioned at the standby position and the chuck pin 336 is positioned at the support position during the process for the substrate. At the support position, the chuck pin 336 contacts the side of the substrate.

The lifting unit 340 moves the container 320 linearly in the vertical direction. As the container 320 is moved up and down, the relative height of the container 320 to the support unit 330 is changed. The lifting unit 340 includes a bracket 342, a moving shaft 344, and a driver 346. [

 The bracket 342 is fixed to the outer wall of the container 320. A moving shaft 344, which is vertically moved by a driver 346, is fixedly coupled to the bracket 342. The container 320 is lowered so that the support unit 330 protrudes to the upper portion of the container 320 when the substrate W is placed on the support unit 330 or is lifted from the support unit 330. [ When the process is performed, the height of the container 320 is adjusted so that the process liquid may flow into the preset recovery containers 322, 324, and 326 depending on the type of the process liquid supplied to the substrate W.

For example, the substrate W is located at a height corresponding to the inner space 322a of the inner recovery cylinder 322 while processing the substrate W with the first processing liquid. During the processing of the substrate W with the second processing solution and the third processing solution, the substrate W is separated into the space 324a between the inner recovery tube 322 and the intermediate recovery tube 324, And may be located at a height corresponding to the space 326a between the cylinder 324 and the outer recovery cylinder 326. [ The elevation unit 340 can move the support unit 330 in the vertical direction instead of the container 320 as described above.

The liquid supply unit 360 supplies the processing liquid to the substrate W during the processing of the substrate W. [

The liquid supply unit 360 includes a nozzle support 362, a nozzle 364, a support shaft 366, and a driver 368.

The support shaft 366 is provided along its lengthwise direction in the third direction 16 and a driver 368 is coupled to the lower end of the support shaft 366. The driver 368 rotates and lifts the support shaft 366. The nozzle support 362 is coupled perpendicular to the opposite end of the support shaft 366 associated with the driver 368. The nozzle 364 is installed at the bottom end of the nozzle support 362. The nozzle 364 is moved by a driver 368 to a process position and a standby position. The process position is that the nozzle 364 is located at the vertically upper portion of the container 320 and the standby position is the position at which the nozzle 364 is away from the vertical upper portion of the container 320. The nozzle 364 receives the liquid from the outside and supplies the liquid onto the substrate W.

One or a plurality of liquid supply units 360 may be provided. When a plurality of liquid supply units 360 are provided, the chemical, rinsing liquid, or organic solvent may be provided through different liquid supply units 360. When the liquid is provided as a chemical liquid, the chemical may be hydrofluoric acid, sulfuric acid, phosphoric acid, or a mixture thereof. The rinsing liquid may be pure, and the organic solvent may be a mixture of an isopropyl alcohol vapor and an inert gas or an isopropyl alcohol liquid.

The article 30 may be provided in one configuration of the substrate processing apparatus 300. [ The article 30 is a constitution of the substrate processing apparatus 300 in which the liquid is exposed. As an example, the article 30 may be provided with the fluorine-coated article 30 described above.

The article (30) includes a body (31) and a coating film (33). A coating film (33) is formed on the surface of the body (31). The coating film 33 is provided as a fluorine coating film 33. The fluorine is covalently bonded to the surface of the body 31. For example, the material of the body 31 may include a silicon carbide material.

Figs. 5 to 8 are views showing an example in which a fluorine-coated article is provided in the substrate processing apparatus of Fig. 5 to 8, the article 30 may be provided in an arrangement of the substrate processing apparatus 300. [ For example, the article 30 may be provided on the support plate 332 as shown in Fig. A coating film 33 may be formed on the upper surface of the support plate 332.

Alternatively, the article 30 may be provided with a chuck pin 336 as shown in FIG. A coating film 33 may be formed on the surface of the chuck pin 336.

Optionally, the article 30 may be provided as a support pin 334, as shown in FIG. A coating film 33 may be formed on the surface of the support pin 334.

Optionally, the article 30 may be provided in the container 320, as shown in FIG. A coating film 33 may be formed on the inner wall of the container 320.

5 to 8, a coating film 33 is formed on the inner wall of the chuck pin 336, the support pin 334, the support plate 332 and the container 320 to form a substrate processing apparatus (for example, 300 can be improved in corrosion resistance.

In the above example, the article 30 is provided on the support plate 332, the chuck pin 336, the support pin 334 and the container 320. Alternatively, the inner wall of the nozzle, But also on the inner wall of the liquid supply line.

In the above-described example, the parts provided to the substrate processing apparatus 300 are provided with the fluorine-coated article having the fluorine-containing coating film, thereby improving the corrosion resistance of the parts. In addition, the corrosion resistance of the parts is improved, so that the particles that can be generated during the substrate processing process can be minimized. In addition, since the fluorine coating film forms a chemically stable surface, it is possible to minimize the scattering of the liquid during the liquid processing process, thereby improving the efficiency of the substrate processing process.

9 is a sectional view showing a substrate processing apparatus according to another embodiment of the present invention. 9, the substrate processing apparatus 800 includes a chamber 810, a support unit 830, a gas supply unit 870, and a showerhead 850.

The chamber 810 is provided so that the space therein is sealed with respect to the outside. The chamber 810 has a processing space therein. An entrance (not shown) for entering and exiting the substrate W is formed in the chamber 810.

The support unit 830 supports the substrate W. [ The support unit 830 includes a support plate 831 and a ring member 833.

A substrate W is placed on the upper surface of the support plate 831. The support plate 831 is provided in a circular shape when viewed from above. The upper surface of the support plate 831 may be provided with a size corresponding to or smaller than that of the substrate W. [

The ring member 833 is provided so as to surround the support plate 831. When viewed from above, the ring member 833 is provided in a ring shape. For example, the ring member 833 may be provided as a focus ring.

The gas supply unit 870 supplies gas into the chamber 810. The gas supply unit 870 includes a gas supply line 871 and a valve 873.

The gas supply line 871 is connected to the upper wall of the chamber 810. The gas supply line 871 supplies the gas supplied from the outside to the inside of the chamber 810. As an example, the supplied gas may be a process gas containing fluorine. The valve 873 is installed in the gas supply line 871. The valve 873 regulates the flow rate of the gas. For example, the valve 873 may be provided with an on-off valve 873. [

The showerhead 850 supplies gas to the substrate W. [ The showerhead 850 is connected to the upper wall of the chamber 810. The showerhead 850 is located above the support plate 831. A plurality of holes are formed in the shower head 850. The process gas is supplied to the upper portion of the substrate W through the plurality of holes. When viewed from above, the showerhead 850 may be provided with a size corresponding to the substrate W. [

The above-described article can be provided as a component to a zipper processing apparatus. As an example, the article may be provided as a support plate 831. Alternatively, the article may be provided with a ring member 833. Optionally, the article may be a showerhead 850. A coating film may be formed on the surfaces of the support plate 831, the ring member 833, and the shower head 850. A coating film may be formed on the support plate 831, the ring member 833 and the shower head 850 to improve the corrosion resistance of the support plate 831, the ring member 833, and the shower head 850. In addition, the generation of particles generated during the substrate processing process can be minimized by improving the corrosion resistance.

In the above-described example, the substrate processing apparatus for performing the cleaning process and the apparatus for processing the substrate by supplying the process gas containing fluorine gas are described as an example. However, the present invention is not limited to this, A metal organic chemical vapor deposition apparatus for manufacturing LEDs, and a chemical vapor deposition apparatus for semiconductor chip fabrication.

The foregoing detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and explain the preferred embodiments of the present invention, and the present invention may be used in various other combinations, modifications, and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, within the scope of the disclosure, and / or within the skill and knowledge of the art. The embodiments described herein are intended to illustrate the best mode for implementing the technical idea of the present invention and various modifications required for specific applications and uses of the present invention are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. It is also to be understood that the appended claims are intended to cover such other embodiments.

30: fluorine-coated article 31: body
33: coating film 320: container
330: support unit 332:
334: Support pin 336:

Claims (16)

In a fluorine-coated article wherein fluorine is coated on the surface,
A body;
And a coating film formed on a surface of the body,
Wherein the coating film is formed by covalent bonding of fluorine to the surface of the body.
The method according to claim 1,
Wherein the coating film is formed by treating the surface of the body with an acid or an alkali solution and then supplying fluorine.
3. The method according to claim 1 or 2,
Wherein the body comprises a silicon carbide layer on its surface.
A method of producing a fluorine-coated article,
A fluorine coating film is formed on the surface of the body,
Wherein the fluorine coating film is formed by covalent bonding of fluorine to the surface of the body.
5. The method of claim 4,
Wherein a defect is formed on a surface of the body before forming the fluorine coating film.
6. The method of claim 5,
Wherein the bonding is performed by treating the surface of the body with an acid or alkali solution,
Wherein the fluorine coating film is formed by supplying fluorine to the surface of the body after the defect treatment.
7. The method according to any one of claims 4 to 6,
Wherein the body comprises a silicon carbide material.
An apparatus for processing a substrate,
A vessel having a processing space therein;
A support unit located in the processing space; And
And a liquid supply unit for supplying the liquid to the substrate supported by the support unit,
The support unit includes:
A support plate on which the substrate is placed;
A chuck pin located on the support plate and supporting the substrate on the side;
And a support pin located at the support plate and supporting the substrate at the bottom,
The article to which the liquid is exposed,
Body and
And a coating film formed on a surface of the body,
Wherein the coating film is formed by covalent bonding of fluorine to the surface of the body.
9. The method of claim 8,
Wherein the article is the support plate.
9. The method of claim 8,
Wherein the article is the chuck pin.
9. The method of claim 8,
Wherein the article is the support pin.
9. The method of claim 8,
Wherein the article is a container, and the coating film is formed on an inner wall of the container.
An apparatus for processing a substrate,
A chamber having an enclosed processing space outside;
A support unit located in the processing space and supporting the substrate; And
And a supply unit for supplying a process gas containing fluorine gas into the processing space,
The support unit includes:
A support plate on which the substrate is placed;
And a ring member provided around the support plate,
The article to be exposed to the process gas,
A body;
And a coating film formed on a surface of the body,
Wherein the coating film is formed by covalent bonding of fluorine to the surface of the body.
14. The method of claim 13,
Wherein the article is the support plate.
14. The method of claim 13,
Wherein the article is the ring member.
14. The method of claim 13,
Wherein the substrate processing apparatus further comprises a showerhead located on an upper surface of the supporting unit,
Wherein the article is the showerhead.
KR1020150161937A 2015-11-18 2015-11-18 Fluorine coating article, method for manufacturing fluorine coating article and apparatus for treating a substrate KR20170058123A (en)

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