KR20170055618A - Elastic contact pins and Test socket including thereof - Google Patents

Elastic contact pins and Test socket including thereof Download PDF

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Publication number
KR20170055618A
KR20170055618A KR1020150158379A KR20150158379A KR20170055618A KR 20170055618 A KR20170055618 A KR 20170055618A KR 1020150158379 A KR1020150158379 A KR 1020150158379A KR 20150158379 A KR20150158379 A KR 20150158379A KR 20170055618 A KR20170055618 A KR 20170055618A
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KR
South Korea
Prior art keywords
pin
contact body
contact
test
elastic
Prior art date
Application number
KR1020150158379A
Other languages
Korean (ko)
Other versions
KR101752468B1 (en
Inventor
전진국
박성규
이용관
Original Assignee
주식회사 오킨스전자
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 오킨스전자 filed Critical 주식회사 오킨스전자
Priority to KR1020150158379A priority Critical patent/KR101752468B1/en
Publication of KR20170055618A publication Critical patent/KR20170055618A/en
Application granted granted Critical
Publication of KR101752468B1 publication Critical patent/KR101752468B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The present invention relates to a contact pin having an elastic portion and a test socket including the contact pin. More particularly, the contact pin is mounted on a base of a semiconductor package test socket, A contact pin having a pin head and a pin leg for contacting the test board, the contact pin being formed integrally with the test board, It not only alleviates the impact but also improves the connecting force by the elastic force.
According to the present invention, when the semiconductor package is mounted on the test socket, the pressing force toward the test board is maintained to improve the contact reliability, thereby improving the test reliability.

Description

Technical Field The present invention relates to a contact pin having an elastic portion and a test socket including the contact pin,

More particularly, the present invention relates to a contact pin which is mounted on a socket for testing a semiconductor package and can maintain the pressing force downward, so that the pressing force toward the test board is maintained during the testing of the semiconductor package, A contact pin having an elastic portion capable of improving test reliability, and a test socket including the contact pin.

Generally, an integrated circuit package in which an integrated circuit is sealed with a sealant such as a resin is subjected to an electric characteristic test and a burn-in test to confirm the reliability of the product before shipment.

Here, the electrical characteristic test is for testing electrical characteristics such as input / output characteristics, pulse characteristics, and noise tolerance by connecting all the input / output terminals of the integrated circuit to a predetermined test signal generating circuit. The burn-in test is an integration The circuit package is tested at a higher temperature than the normal operating environment by applying a voltage higher than the rated voltage for a predetermined period of time.

The burn-in test is carried out with the integrated circuit package mounted on a socket for an integrated circuit arranged in an oven having a predetermined heating means.

The socket for such an integrated circuit package comprises a fixed body of a rectangular top surface which is coupled to a predetermined test substrate and fixed in an upright state so that the contact pin contacts the test substrate and a test body fixedly coupled to the fixed body, An operation body which is coupled to the fixed body at the lower portion of the adapter so as to open and close the pin head of the contact pin fixed to the fixed body while reciprocating along the height direction of the fixed body; A pair of latches coupled to the fixed body so as to prevent the flow of the BGA type integrated circuit package to be tested by applying pressure along the mounting direction to the non-built-in integrated circuit package; And a cover coupled to the fixed body at the top of the adapter to drive the latch Eojinda.

The contact pin 1 according to the prior art is fixed to the fixed body and the upper portion thereof is inserted into the pin head hole formed in the operation body, as shown in the patent document 10-2013-0057351, And a pair of pins which are in contact with the lower terminals and which are formed so as to face each other on the upper side of the contact body 1a and the contact body 1a and whose center portions are narrower than upper and lower intervals, A head 1b and a pin leg 1c extending from the lower side of the contact body 1a.

The operating body is located between the pair of pin heads 1b of the contact pins 1 and is located between the center portions of the pair of pin heads 1b when the operating bodies slide downward As the upper part of the pair of pin heads 1b is widened and when the operating body is restored upward, the pair of pin heads 1b are positioned above the pair of pin heads 1b, And a plurality of actuators for restoring an upper gap of the pair of pin heads.

With this configuration, when the operating body descends, the operator presses the central portion of the pin head to open the upper portion of the pin head. When the package to be measured is mounted on the adapter, and when the operating body rises, The pin head 1b is returned to its original position by the restoring force and brought into contact with the package lower terminal.

However, in the conventional contact pins, when there is no member that can mitigate the impact, there is a problem that the contact reliability between the test board and the pin legs 1c is deteriorated and the test reliability is deteriorated.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a semiconductor package test socket having a contact body mounted on a base of a semiconductor package test socket, A contact pin having a pin head and a pin bridge for contacting a test board, the pin bridge being integrally formed with an elastic part to relieve an impact with the test board during testing, Of course, it is an object of the present invention to provide a contact pin having a resilient portion that can maintain the pressing force by the elastic force to improve the connecting force and improve the test reliability, and a test socket including the contact pin.

According to an aspect of the present invention, a contact body is mounted on a base of a socket for testing a semiconductor package, and a pair of contact bodies are formed on the contact body so as to be held on both sides of a semiconductor package lower terminal to be tested, A contact pin having a pin leg for contacting a pin head and a test board, wherein the pin leg is formed integrally with the elastic part, thereby relieving impact on the test board during testing, .

Preferably, the resilient portion is formed between the contact body and the pin leg a plurality of times.

The resilient portion may include a vertical portion located on the center axis of the contact body and the pin leg and connected to the contact body, a vertical portion positioned between the vertical portion and the pin leg, And a connecting portion connecting the ends of two adjacent horizontal portions so as to connect the plurality of horizontal portions together. In the test, each of the connecting portions is a hinge, and the interval between the horizontal portions is displaced Accordingly, the pin legs are elastically displaced.

The width of the resilient portion may be greater than the width of the contact body. The elastic portion may protrude outward beyond the width of the contact body so as not to protrude outward beyond the width of the contact body. , Are further formed.

And a protruding length of the elastic portion bent by the bent portion protrudes higher than a thickness of the contact body but is not protruded higher than the thickness of the contact body so that the elastic portion protruding higher than the thickness of the contact body is bent And a second bent portion formed thereon are further formed.

The test socket according to any one of claims 1 to 5, further comprising a contact pin.

As described above, according to the contact pin having the elastic portion and the test socket including the contact pin according to the present invention, when the semiconductor package is mounted on the test socket, the pressing force toward the test board is maintained to improve the contact force, Which is a very useful and effective invention.

1 is a view showing a contact pin for a conventional semiconductor package test socket,
2 is a view showing a contact pin according to the present invention,
3 is a view showing an elastic part of the contact pin according to the present invention,
4 is a view showing another embodiment of the elastic portion according to the present invention,
5 is a view showing another embodiment of the elastic portion according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

It should be noted that the present invention is not limited to the scope of the present invention but is only illustrative and various modifications are possible within the scope of the present invention.

FIG. 2 is a view showing a contact pin according to the present invention, FIG. 3 is a view showing an elastic part of a contact pin according to the present invention, FIG. 4 is a view showing another embodiment of the elastic part according to the present invention, 5 is a view showing another embodiment of the elastic portion according to the present invention.

As shown in the figure, the contact pin 100 having an elastic portion is composed of the contact body 110, the pin head 120, the pin leg 130, and the elastic portion 140.

The contact body 110 is mounted on a base of a socket for testing a semiconductor package, and the pin head 120 is formed on an upper side of the contact body 110 and contacts a semiconductor package lower terminal to be tested.

These pin heads 120 are formed in pairs in the contact body 110 so as to be held on both sides of the semiconductor package lower terminals.

The pin leg 130 is formed below the contact body 110 and contacts the test board.

Here, the elastic part 140 is integrally formed between the contact body 110 and the pin leg 130, thereby alleviating the shock to the test board during testing, and improving the connecting force by the elastic force.

The elastic portion 140 is formed between the contact body 110 and the pin leg 130 a plurality of times.

3, the elastic part 140 is composed of a vertical part 141, a horizontal part 142, and a connection part 143. [

The vertical portion 141 is positioned on the center axis of the contact body 110 and the pin leg 130 and is connected to the contact body 110.

The plurality of horizontal portions 142 are disposed between the vertical portions 141 and the pin legs 130 and are spaced apart from each other along the central axis of the contact body 110 and the pin legs 130.

The connection portion 143 is formed to connect the ends of two adjacent horizontal portions to connect the plurality of horizontal portions 142 together.

When the elastic portions 140 are tested, the connecting portions 143 are hinged and the distance between the horizontal portions 142 is displaced, the pin legs 130 are elastically displaced.

4, the elastic portion 140 is further formed with a bent portion 144. As shown in Fig.

The bent portion 144 is formed such that the width of the elastic portion 140 is larger than the width of the contact body 110 and protrudes outward beyond the width of the contact body 110 so as not to protrude outward beyond the width of the contact body 110 And the elastic portion is curved forward or backward.

Accordingly, the width of the contact pin 100 can be minimized.

As shown in FIG. 5, the elastic portion 140 is further formed with the second bent portion 145.

The second bent portion 145 is formed when the protruding length of the elastic portion 140 bent by the bent portion 144 protrudes higher than the thickness of the contact body.

The resilient portion protruding higher than the thickness of the contact body 110 is bent in the mutual direction so that the protruding portion of the bent elastic portion 140 does not protrude higher than the thickness of the contact body 110.

This second bend 145 is to minimize the thickness of the contact pin 100.

It is a matter of course that a plurality of such contact pins 100 are provided in the test socket, and a contact hole is formed in the socket to correspond to the size of each contact pin 100.

100: contact pin 110: contact body
120: pin head 130: pin bridge
140: Elastic portion 141: Vertical portion
142: horizontal portion 143: connection portion
144: bend 145: second bend

Claims (6)

A semiconductor package comprising: a contact body mounted on a base of a semiconductor package test socket; a pin head formed on the contact body to be paired on both sides of the semiconductor package lower terminal to be tested by an operating body lifted from the base; In a contact pin having a pin leg,
Wherein the pin leg is formed integrally with the elastic member so as to alleviate an impact with the test board at the time of testing and improve the connecting force by the elastic force.
The connector according to claim 1,
Wherein the contact pin is bent several times between the contact body and the pin leg.
The connector according to claim 2,
A vertical portion positioned on a center axis of the contact body and the pin leg and connected to the contact body;
A plurality of horizontal portions positioned between the vertical portion and the pin legs and arranged at regular intervals so as to pass through the central axis of the contact body and the pin legs; And
And a connecting portion connecting ends of two adjacent horizontal portions to connect the plurality of horizontal portions together,
Wherein the pins are elastically displaced as the connecting portions are hinged to displace the respective horizontal portions at the time of testing.
The method of claim 3,
The width of the elastic portion is larger than the width of the contact body,
And a bent portion bent forward or backward to protrude outward beyond the width of the contact body so as not to protrude outward beyond the width of the contact body.
5. The method of claim 4,
The protruding length of the elastic portion bent by the bent portion protrudes higher than the thickness of the contact body,
And a second bend portion formed by bending the elastic portion portions protruding higher than the thickness of the contact body in mutual directions so as not to protrude higher than the thickness of the contact body.
A test socket comprising a contact pin according to any one of claims 1 to 5.
KR1020150158379A 2015-11-11 2015-11-11 Elastic contact pins and Test socket including thereof KR101752468B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150158379A KR101752468B1 (en) 2015-11-11 2015-11-11 Elastic contact pins and Test socket including thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150158379A KR101752468B1 (en) 2015-11-11 2015-11-11 Elastic contact pins and Test socket including thereof

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KR20170055618A true KR20170055618A (en) 2017-05-22
KR101752468B1 KR101752468B1 (en) 2017-07-04

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101944693B1 (en) * 2018-12-04 2019-02-01 황동원 BGA Socket device for testing an BGA IC
KR102166677B1 (en) 2019-08-09 2020-10-16 주식회사 오킨스전자 MEMS pogo pin and testing method using same
KR20200121241A (en) 2019-04-15 2020-10-23 주식회사 오킨스전자 Multi-layer MEMS spring pin
KR102219855B1 (en) * 2020-03-20 2021-02-25 (주)마이크로컨텍솔루션 Test socket

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102091813B1 (en) 2019-03-04 2020-03-20 (주)디팜스테크 Partially heat treated miniature semiconductor burn-in test socket contact pins and mamufacturing method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006242774A (en) 2005-03-03 2006-09-14 Tokyo Electron Ltd Probe and probe card
US7591655B2 (en) 2006-08-02 2009-09-22 Tyco Electronics Corporation Electrical connector having improved electrical characteristics
JP5103566B2 (en) * 2007-11-26 2012-12-19 株式会社コーヨーテクノス Electrical contact and inspection jig having the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101944693B1 (en) * 2018-12-04 2019-02-01 황동원 BGA Socket device for testing an BGA IC
WO2020116709A1 (en) * 2018-12-04 2020-06-11 황동원 Bga socket device for semiconductor element test
US10971843B2 (en) 2018-12-04 2021-04-06 Dong Weon Hwang BGA socket device for testing BGA IC
CN113227797A (en) * 2018-12-04 2021-08-06 黄东源 BGA socket device for testing semiconductor device and contact for BGA socket device
KR20200121241A (en) 2019-04-15 2020-10-23 주식회사 오킨스전자 Multi-layer MEMS spring pin
KR102166677B1 (en) 2019-08-09 2020-10-16 주식회사 오킨스전자 MEMS pogo pin and testing method using same
KR102219855B1 (en) * 2020-03-20 2021-02-25 (주)마이크로컨텍솔루션 Test socket

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Publication number Publication date
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