KR20170055251A - Integrated Circuit Mount Press Device - Google Patents

Integrated Circuit Mount Press Device Download PDF

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Publication number
KR20170055251A
KR20170055251A KR1020150158192A KR20150158192A KR20170055251A KR 20170055251 A KR20170055251 A KR 20170055251A KR 1020150158192 A KR1020150158192 A KR 1020150158192A KR 20150158192 A KR20150158192 A KR 20150158192A KR 20170055251 A KR20170055251 A KR 20170055251A
Authority
KR
South Korea
Prior art keywords
press
chip
socket
fixing
air cylinder
Prior art date
Application number
KR1020150158192A
Other languages
Korean (ko)
Inventor
장원봉
Original Assignee
장원봉
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 장원봉 filed Critical 장원봉
Priority to KR1020150158192A priority Critical patent/KR20170055251A/en
Publication of KR20170055251A publication Critical patent/KR20170055251A/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Abstract

In the present invention, an IC mount press device capable of applying an automatic pressing system to compensate for each disadvantage is disclosed. The IC mount press device is equipment for actuating a mechanical valve (34) after mounting a burning board, lowering an air cylinder (25) by pneumatic pressure, and unclamping a tester socket. As a result, the time of a work process is shortened, the occurrence of defects is reduced by correct loading and unloading, and the working environment of a worker is improved. The IC mount press device includes a manual lever loading part and a press part.

Description

[0001] The present invention relates to an IC mounting press device,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a press device for mounting an IC chip (integrated circuit chip), and more particularly to a press device for loading and unloading a test socket to automatically test a plurality of IC chips prior to using a main memory device in a computer, Unloading press to mount the IC chip, thereby shortening the time required for the work process, as well as to improve work efficiency and work defects.

Integrated circuit ICs are manufactured intensively from the insertion of semiconductor components to wiring on a substrate. The semiconductor substrate thus manufactured (also referred to as a chip) is an electronic component called an IC chip. The semiconductor substrate, which is the core of the IC chip, is usually very small, about 3mm ~ 5mm in each side. Up to 1,000 transistors are wired together with other electronic components to enable high speed signal processing. By using this IC chip, it is possible to manufacture pocket TV in general TV composed of 80 transistors, and it is possible to miniaturize electronic devices like portable TV and personal computer. The use of such an integrated circuit can reduce the number of wirings connecting the components and shorten the length thereof, so that the integrated circuit can operate at a low electric power, thereby enhancing electrical reliability.

Conventionally, since a plurality of IC chips are manually inserted into and removed from a test socket to test an IC chip, an IC chip is defective due to an operator's mistake when inserting or removing the IC chip, and the operation time is prolonged according to proficiency, It is difficult to work for a long time.

 The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to reduce the occurrence of defects by applying an IC chip sustaining pushing device during IC chip testing, shorten the working time for testing, The purpose is to make sure there is no crowd.

Ultimately, it is aimed to improve working environment by reducing work time by automation of work process and automation of work process by providing press device for automatic IC chip mounting.

In order to achieve the above object, the IC mounting press apparatus of the present invention includes a first base {base} and an electromagnet guide {LM Guide} on both sides thereof, and the first lever and the second lever are pushed And a pushing unit for pushing a plurality of test sockets.

According to the IC mounting press apparatus of the present invention,

First, IC chip test, which had previously been performed manually, is loaded and unloaded into a test socket with an automatic device, and mounted quickly and accurately.

Second, there is an advantage that it can provide the improved working environment to the workers by eliminating the handful of the skeleton coming by hand.

Third, by providing an automated IC mounting press apparatus, it is possible to shorten the time required for the work process and increase the production efficiency of the operator.

1, a test socket mounted on a burning board, and an IC chip loaded on a test socket.
2 is a front view, a right side view, and a bottom view of the IC mounting press apparatus.

An embodiment of the IC chip press apparatus of the present invention will be described with reference to FIG. 2 attached hereto. The main base 20 is provided to support the IC mounting press apparatus of the present invention as a whole. A plurality of first LM guides 40A are installed on the main base 20 so as to face each other on both sides and a height guide block 35 is assembled to the LM guide so as to face each other on both sides. Assemble the slide plate (22) to the positioning pin so that the left and right sides can be fixed to the height guide block (35). The heat treatment round bar 31 (30) and the press fixing plate 27 are assembled to the slide plate 22. The air cylinder fixing plates 24 (25) and 26 and the position fixing LM guide 43B are assembled to the press fixing plate 27. After fixing the air cylinder 41B to the air cylinder fixing plates 24, 25 and 26, assemble the press JIG guide plate 23 to the rod portion of the air cylinder 41B. The linear bushes 42B and 44B are assembled to the press JIG guide plate 23. The springs 45B and 46B are inserted into the heat treatment round rods 31 and 30 and then the press fixing plate 27 and the press JIG plate 23 are assembled and fixed with the fixing holder 36. [ Assemble the mechanical valve 47A after assembling the plate 34, 33 for assembling the mechanical valve into the profile 48A. Assemble the test socket pressing JIG (21) on the slide plate (22).

Claims (4)

A height block component for fixing the air cylinder
A bracket for fixing the pneumatic hose
Wherein the IC chip is mounted by manually pressing the circuit board and automatically pressing the circuit board with a jig having a socket shape.
The method according to claim 1,
And a sliding unit mounted on the mounting guide surface, wherein the press unit includes a pressing portion on which the pressing portion fitting jig is mounted on the IC chip mounting guide surface,
And an upper end of the loading part is located at one side of the loading part and is located at one side of the IC socket press and the IC socket press and is provided with the air cylinder height block component and a mold spring press plate attached to the air cylinder mounting surface, And an IC socket fitting jig facing the shaft and the fixed shaft.
The IC chip socket as claimed in claim 1, further comprising: a stationary block which prevents the press from being pressed beyond a predetermined distance in front of the IC chip socket press; a fixing block for fixing a mechanical valve for driving the press in front of the IC chip socket press; And a work piece for fixing the pneumatic robotic chain to the side surface of the press, and a fitting handle for manually raising the IC chip socket press.
KR1020150158192A 2015-11-11 2015-11-11 Integrated Circuit Mount Press Device KR20170055251A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150158192A KR20170055251A (en) 2015-11-11 2015-11-11 Integrated Circuit Mount Press Device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150158192A KR20170055251A (en) 2015-11-11 2015-11-11 Integrated Circuit Mount Press Device

Publications (1)

Publication Number Publication Date
KR20170055251A true KR20170055251A (en) 2017-05-19

Family

ID=59049615

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150158192A KR20170055251A (en) 2015-11-11 2015-11-11 Integrated Circuit Mount Press Device

Country Status (1)

Country Link
KR (1) KR20170055251A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102088701B1 (en) * 2019-12-03 2020-03-13 장병철 Manufacturing system of test socket for small outline package ic

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102088701B1 (en) * 2019-12-03 2020-03-13 장병철 Manufacturing system of test socket for small outline package ic

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Legal Events

Date Code Title Description
A201 Request for examination
E601 Decision to refuse application
E601 Decision to refuse application