KR20170042513A - 연성 기판 상의 mems 디바이스 - Google Patents

연성 기판 상의 mems 디바이스 Download PDF

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Publication number
KR20170042513A
KR20170042513A KR1020167036085A KR20167036085A KR20170042513A KR 20170042513 A KR20170042513 A KR 20170042513A KR 1020167036085 A KR1020167036085 A KR 1020167036085A KR 20167036085 A KR20167036085 A KR 20167036085A KR 20170042513 A KR20170042513 A KR 20170042513A
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South Korea
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major surface
metallic layer
layer
metallic
region
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Korean (ko)
Inventor
필립 제이 베르게론
브렌트 디 런스포드
존 디 가이스싱어
더글라스 비 군델
저스틴 에이 무니
라비 팔라니스와미
시앙 신 포
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쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20170042513A publication Critical patent/KR20170042513A/ko
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/05—Arrays
    • B81B2207/053—Arrays of movable structures

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
KR1020167036085A 2014-05-28 2015-07-10 연성 기판 상의 mems 디바이스 Withdrawn KR20170042513A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462004016P 2014-05-28 2014-05-28
US62/004,016 2014-05-28
PCT/US2015/030158 WO2015183534A1 (en) 2014-05-28 2015-05-11 Mems devices on flexible substrate

Publications (1)

Publication Number Publication Date
KR20170042513A true KR20170042513A (ko) 2017-04-19

Family

ID=53181375

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167036085A Withdrawn KR20170042513A (ko) 2014-05-28 2015-07-10 연성 기판 상의 mems 디바이스

Country Status (7)

Country Link
US (2) US10207916B2 (OSRAM)
EP (1) EP3148924A1 (OSRAM)
JP (1) JP2017524542A (OSRAM)
KR (1) KR20170042513A (OSRAM)
CN (1) CN106536403B8 (OSRAM)
TW (1) TW201607880A (OSRAM)
WO (1) WO2015183534A1 (OSRAM)

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US10611628B2 (en) * 2016-12-29 2020-04-07 Epack, Inc. MEMS isolation platform with three-dimensional vibration and stress isolation
IT201700091226A1 (it) 2017-08-07 2019-02-07 St Microelectronics Srl Dispositivo mems comprendente una membrana ed un attuatore per controllare la curvatura della membrana e compensare deformazioni indesiderate della membrana
JP7195082B2 (ja) * 2017-08-22 2022-12-23 株式会社 大昌電子 静電駆動アクチュエータ組み込みプリント配線板装置およびその製造方法
FR3072445B1 (fr) * 2017-10-16 2020-11-13 Valeo Vision Module lumineux pour vehicule automobile
CN108996465A (zh) * 2018-08-14 2018-12-14 苏州纽劢特新材料科技有限公司 一种量子传输型高性能薄膜感知材料及其制备方法
KR102831948B1 (ko) * 2019-04-12 2025-07-09 주식회사 기가레인 수직구간 및 수평구간이 형성된 연성회로기판
US12185459B2 (en) 2019-04-12 2024-12-31 Gigalane Co., Ltd. Flexible printed circuit board having vertical section and horizontal section
US11757378B1 (en) * 2022-06-06 2023-09-12 Taiwan Semiconductor Manufacturing Company, Ltd. Micromechanical arm array in micro-electromechanical system (MEMS) actuators

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EP1245528A1 (en) 2001-03-27 2002-10-02 Delta Danish Electronics, Light & Acoustics A unitary flexible microsystem and a method for producing same
US20040258885A1 (en) * 2002-09-05 2004-12-23 Kreutter Nathan P. Etched dielectric film in microfluidic devices
KR100512960B1 (ko) 2002-09-26 2005-09-07 삼성전자주식회사 플렉서블 ｍｅｍｓ 트랜스듀서와 그 제조방법 및 이를채용한 플렉서블 ｍｅｍｓ 무선 마이크로폰
KR100512988B1 (ko) 2002-09-26 2005-09-07 삼성전자주식회사 플렉서블 ｍｅｍｓ 트랜스듀서 제조방법
US6943448B2 (en) * 2003-01-23 2005-09-13 Akustica, Inc. Multi-metal layer MEMS structure and process for making the same
US6845670B1 (en) 2003-07-08 2005-01-25 Freescale Semiconductor, Inc. Single proof mass, 3 axis MEMS transducer
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US7318349B2 (en) 2005-06-04 2008-01-15 Vladimir Vaganov Three-axis integrated MEMS accelerometer
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US8102638B2 (en) * 2007-06-13 2012-01-24 The University Court Of The University Of Edinburgh Micro electromechanical capacitive switch
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JP5355957B2 (ja) * 2008-07-31 2013-11-27 住友化学株式会社 積層体及びその製造方法並びに回路基板用部材
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Also Published As

Publication number Publication date
CN106536403A (zh) 2017-03-22
JP2017524542A (ja) 2017-08-31
US20170073215A1 (en) 2017-03-16
US10207916B2 (en) 2019-02-19
CN106536403B8 (zh) 2019-08-20
EP3148924A1 (en) 2017-04-05
CN106536403B (zh) 2019-07-02
TW201607880A (zh) 2016-03-01
WO2015183534A1 (en) 2015-12-03
US20190135611A1 (en) 2019-05-09

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Date Code Title Description
PA0105 International application

Patent event date: 20161223

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination