JP2017524542A - 可撓性基板上のｍｅｍｓデバイス - Google Patents

可撓性基板上のｍｅｍｓデバイス Download PDF

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Publication number
JP2017524542A
JP2017524542A JP2016569050A JP2016569050A JP2017524542A JP 2017524542 A JP2017524542 A JP 2017524542A JP 2016569050 A JP2016569050 A JP 2016569050A JP 2016569050 A JP2016569050 A JP 2016569050A JP 2017524542 A JP2017524542 A JP 2017524542A
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Japan
Prior art keywords
metal layer
major surface
layer
metal
flexible film
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JP2016569050A
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Japanese (ja)
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JP2017524542A5 (OSRAM
Inventor
フィリップ ジェイ． ベルジュロン，
フィリップ ジェイ． ベルジュロン，
ブレント ディー． ランスフォード，
ブレント ディー． ランスフォード，
ジョン ディー． ガイシンガー，
ジョン ディー． ガイシンガー，
ダグラス ビー． グンデル，
ダグラス ビー． グンデル，
ジャスティン エー． ムーニー，
ジャスティン エー． ムーニー，
ラヴィ パラニスワミー，
ラヴィ パラニスワミー，
シャン シン フー，
シャン シン フー，
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2017524542A publication Critical patent/JP2017524542A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/05—Arrays
    • B81B2207/053—Arrays of movable structures

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
JP2016569050A 2014-05-28 2015-05-11 可撓性基板上のｍｅｍｓデバイス Withdrawn JP2017524542A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462004016P 2014-05-28 2014-05-28
US62/004,016 2014-05-28
PCT/US2015/030158 WO2015183534A1 (en) 2014-05-28 2015-05-11 Mems devices on flexible substrate

Publications (2)

Publication Number Publication Date
JP2017524542A true JP2017524542A (ja) 2017-08-31
JP2017524542A5 JP2017524542A5 (OSRAM) 2018-06-21

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JP2016569050A Withdrawn JP2017524542A (ja) 2014-05-28 2015-05-11 可撓性基板上のｍｅｍｓデバイス

Country Status (7)

Country Link
US (2) US10207916B2 (OSRAM)
EP (1) EP3148924A1 (OSRAM)
JP (1) JP2017524542A (OSRAM)
KR (1) KR20170042513A (OSRAM)
CN (1) CN106536403B8 (OSRAM)
TW (1) TW201607880A (OSRAM)
WO (1) WO2015183534A1 (OSRAM)

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US10611628B2 (en) * 2016-12-29 2020-04-07 Epack, Inc. MEMS isolation platform with three-dimensional vibration and stress isolation
IT201700091226A1 (it) * 2017-08-07 2019-02-07 St Microelectronics Srl Dispositivo mems comprendente una membrana ed un attuatore per controllare la curvatura della membrana e compensare deformazioni indesiderate della membrana
JP7195082B2 (ja) * 2017-08-22 2022-12-23 株式会社 大昌電子 静電駆動アクチュエータ組み込みプリント配線板装置およびその製造方法
FR3072445B1 (fr) * 2017-10-16 2020-11-13 Valeo Vision Module lumineux pour vehicule automobile
CN108996465A (zh) * 2018-08-14 2018-12-14 苏州纽劢特新材料科技有限公司 一种量子传输型高性能薄膜感知材料及其制备方法
KR102831948B1 (ko) * 2019-04-12 2025-07-09 주식회사 기가레인 수직구간 및 수평구간이 형성된 연성회로기판
WO2020209538A1 (ko) * 2019-04-12 2020-10-15 주식회사 기가레인 수직구간 및 수평구간이 형성된 연성회로기판
US11757378B1 (en) * 2022-06-06 2023-09-12 Taiwan Semiconductor Manufacturing Company, Ltd. Micromechanical arm array in micro-electromechanical system (MEMS) actuators

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KR100512988B1 (ko) 2002-09-26 2005-09-07 삼성전자주식회사 플렉서블 ｍｅｍｓ 트랜스듀서 제조방법
KR100512960B1 (ko) 2002-09-26 2005-09-07 삼성전자주식회사 플렉서블 ｍｅｍｓ 트랜스듀서와 그 제조방법 및 이를채용한 플렉서블 ｍｅｍｓ 무선 마이크로폰
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Also Published As

Publication number Publication date
US10207916B2 (en) 2019-02-19
US20190135611A1 (en) 2019-05-09
CN106536403A (zh) 2017-03-22
CN106536403B8 (zh) 2019-08-20
US20170073215A1 (en) 2017-03-16
TW201607880A (zh) 2016-03-01
EP3148924A1 (en) 2017-04-05
KR20170042513A (ko) 2017-04-19
WO2015183534A1 (en) 2015-12-03
CN106536403B (zh) 2019-07-02

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