KR20160141913A - Water jet type mask cleaning apparatus capable of recovering cleaning solution - Google Patents
Water jet type mask cleaning apparatus capable of recovering cleaning solution Download PDFInfo
- Publication number
- KR20160141913A KR20160141913A KR1020150077324A KR20150077324A KR20160141913A KR 20160141913 A KR20160141913 A KR 20160141913A KR 1020150077324 A KR1020150077324 A KR 1020150077324A KR 20150077324 A KR20150077324 A KR 20150077324A KR 20160141913 A KR20160141913 A KR 20160141913A
- Authority
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- South Korea
- Prior art keywords
- cleaning liquid
- cleaning
- mask
- recovering
- water jet
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 248
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 163
- 239000012535 impurity Substances 0.000 claims abstract description 19
- 230000000694 effects Effects 0.000 claims abstract description 11
- 238000005507 spraying Methods 0.000 claims description 30
- 238000005406 washing Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 16
- 238000011084 recovery Methods 0.000 claims description 12
- 238000010992 reflux Methods 0.000 claims description 6
- 239000007921 spray Substances 0.000 description 15
- 239000000126 substance Substances 0.000 description 15
- 239000000356 contaminant Substances 0.000 description 13
- 230000008021 deposition Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 10
- 238000000926 separation method Methods 0.000 description 5
- 238000005187 foaming Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 238000012993 chemical processing Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000005108 dry cleaning Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- H01L51/56—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02079—Cleaning for reclaiming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/463—Mechanical treatment, e.g. grinding, ultrasonic treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The present invention relates to a water jet type mask cleaning apparatus which is provided with an ultrasonic vibrator together with a high pressure jetting means of a cleaning liquid to maximize the cleaning effect of a mask to be cleaned and to remove impurities contained in the cleaning liquid after mask cleaning, .
Description
The present invention relates to a water jet type mask cleaning apparatus which is provided with an ultrasonic vibrator together with a high pressure jetting means of a cleaning liquid to maximize the cleaning effect of a mask to be cleaned and to remove impurities contained in the cleaning liquid after mask cleaning, .
BACKGROUND ART An organic light emitting display (OLED) uses an organic light emitting layer, which is a self-luminous element that emits a phosphor by recombination of electrons and holes, and has a contrast ratio and a response time And it has been attracting attention as a next-generation display which is ideal as being easy to implement a flexible display.
In the OLED, a plurality of pixel regions are arranged in a matrix, and a micropattern, such as a driving element for driving each pixel, is formed in each pixel region.
In this case, since the organic light emitting layer that emits light is made of an organic material having weak chemical resistance, the organic material is vaporized rather than the photolithography method using the conventional exposure and etching, and then the organic light emitting layer is selectively On the substrate.
However, the deposition material may be deposited not only on the substrate attached to the mask but also on the surface of the mask during the deposition process, which increases as the number of deposition processes increases.
Therefore, when the mask used for the deposition is not cleaned, the mask must be used in a state in which various deposition materials such as organic and inorganic substances are deposited on the surface, which causes not only failure of the mask but also contamination of the deposition line This is directly related to the reliability of the final product.
Conventionally, in order to solve such a problem, a method of cleaning the mask every predetermined number of times of deposition is used. At this time, as shown in FIG. 1, the front surface of the substrate P or the mask P supplied by the
As a result, the mask has to be discarded every predetermined number of times of deposition in order to prevent defective problems due to incomplete cleaning.
In addition, when the cleaning liquid is sprayed to clean the deposition material on the mask, the deposition material may not be sufficiently removed merely by contacting with the cleaning liquid. In addition, simply spraying the cleaning liquid may cause contact between the deposition material and the cleaning liquid Is not sufficient, it is common to use an excess amount of the cleaning liquid.
In this case, since the cleaning liquid generally used must be used only once, unless it is refined separately, there is an increasing need to solve the problem of waste of the cleaning liquid.
An object of the present invention is to provide a mask cleaning apparatus in which contaminants on a mask are primarily cleaned through a jetting means of a cleaning liquid, and a cleaning liquid acts as a medium to perform secondary cleaning by an ultrasonic vibrator.
Another object of the present invention is to provide a mask cleaning apparatus capable of removing deposition materials with a physical pressing force in addition to a chemical reaction between a cleaning liquid and a deposition material by jetting the cleaning liquid at a high pressure.
It is another object of the present invention to provide a mask cleaning apparatus provided with means for removing contaminants in a cleaning liquid so that the cleaning liquid used for removing contaminants from the mask can be reused.
It is another object of the present invention to provide a mask cleaning apparatus capable of minimizing maintenance and management costs of a mask cleaning process by supplying purified cleaning fluid after removing contaminants to a cleaning device for reuse.
According to an aspect of the present invention, there is provided a cleaning apparatus comprising: a cleaning liquid spraying unit provided at an upper portion and a lower portion of a mask for spraying a cleaning liquid at a high pressure toward the mask; And a cleaning liquid recovery unit for recovering the cleaning liquid to remove impurities in the cleaning liquid, wherein the cleaning liquid recovery unit includes: an ultrasonic vibration unit for applying a cavitation cleaning effect to the cleaning liquid, The ultrasonic vibration unit may be provided with a water jet type cleaning apparatus capable of collecting the cleaning liquid formed integrally with the ultrasonic vibration unit.
Here, the cleaning liquid spraying unit and the ultrasonic vibration unit may be provided in a plurality of cleaning modules arranged along the outer periphery of the mask.
Here, the cleaning module may include a plurality of ultrasonic vibrators, a flow path for injecting the cleaning liquid at a high pressure, and a housing in which the ultrasonic vibrator and the flow path are disposed.
Here, the flow path may be formed to penetrate vertically along the outer periphery of the housing.
Here, the flow path may be formed to penetrate the center of the housing vertically.
Here, the cleaning module and the mask may be spaced within a range of 3 to 5 mm.
Here, the cleaning module may be provided in the housing, and the cleaning liquid recovery unit may be provided at a lower portion of the housing, and the cleaning liquid recovery unit may include a drain for draining the cleaning liquid from the bottom of the housing.
Here, the cleaning liquid recovery unit may include a centrifugal separator for separating impurities in the cleaning liquid by centrifugal force, and a reflux unit for recovering the cleaning liquid from which impurities have been removed in the centrifugal separator and refluxing the cleaning liquid to the cleaning liquid spraying unit.
The apparatus for cleaning a mask according to an embodiment of the present invention can primarily remove contaminants on a mask by spraying a cleaning liquid on top and rear surfaces of the mask, and the cleaning liquid sprayed on the mask acts as a medium of ultrasonic vibration And the secondary cleaning by the ultrasonic vibrator is performed at the same time, whereby the deposition material on the mask can be effectively removed.
In addition, the secondary cleaning by the ultrasonic vibrator can also improve the cleaning effect in invar such as the welding portion or the intersection portion of the stick constituting the mask.
Further, the contaminants on the mask can be more effectively removed by the physical pressing force of the cleaning liquid sprayed at high pressure.
In addition, the mask cleaning apparatus according to an embodiment of the present invention can recover the used cleaning liquid from the bottom portion of the housing where the cleaning of the mask is performed, and then easily remove contaminants from the cleaning liquid through centrifugal separation, It is possible to prevent the waste of the battery.
1 schematically shows a conventional mask cleaning apparatus.
2 is a perspective view of a mask cleaning apparatus according to an embodiment of the present invention.
3 is a perspective view of a mask cleaning apparatus according to an embodiment of the present invention, which is selectively applied with a shower type cleaning liquid jetting unit.
4 is a perspective view of a conveyor belt applied to a mask cleaning apparatus according to an embodiment of the present invention.
5 is a cross-sectional view of a mask cleaning apparatus according to an embodiment of the present invention, which is selectively applied with a shower-type cleaning liquid jetting unit.
6 is a plan view of a mask cleaning apparatus according to an embodiment of the present invention to which a cleaning module is applied.
7 is a perspective view of a cleaning module applied to a cleaning apparatus according to an embodiment of the present invention.
8A and 8B are cross-sectional views of a cleaning module applied to a cleaning apparatus according to an embodiment of the present invention.
9 is a schematic view of a cleaning liquid recovery unit applied to a mask cleaning apparatus according to an embodiment of the present invention.
Certain terms are hereby defined for convenience in order to facilitate a better understanding of the present invention. Unless otherwise defined herein, scientific and technical terms used in the present invention shall have the meanings commonly understood by one of ordinary skill in the art. Also, unless the context clearly indicates otherwise, the singular form of the term also includes plural forms thereof, and plural forms of the term should be understood as including its singular form.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a water jet type cleaning apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.
2 is a schematic perspective view of a mask cleaning apparatus 100 according to an embodiment of the present invention.
A dry cleaning method and / or a wet cleaning method may be selectively applied to the mask cleaning apparatus 100.
The mask cleaning apparatus to which the dry cleaning method is applied may include at least one cleaning means selected from plasma, ultraviolet rays, and ozone.
The mask cleaning apparatus 100 may include a chemical processing unit, a rinsing unit, and a drying unit. In the present embodiment, the mask cleaning apparatus 100 may include a chemical cleaning unit, Particularly with respect to the chemical treatment part.
The chemical treatment unit may be configured to treat a cleaning liquid to remove organic or inorganic substances deposited on a mask or a substrate to be supplied, and the chemical treatment unit may be constituted by one cleaning tank or a plurality of cleaning tanks may be sequentially connected.
Further, when a plurality of cleaning tanks are sequentially connected (in series), each cleaning tank may contain the same or different cleaning liquids. For example, by including a plurality of cleaning tanks including the same cleaning liquid, the cleaning effect can be maximized.
Further, in another example, the chemical processing section may include a first cleaning bath for removing inorganic substances on the mask and a second cleaning bath for removing organic matter on the mask.
The cleaning liquid is contained in the cleaning tank, and the cleaning liquid may be a cleaning liquid which is conventionally used for cleaning inorganic (for example, metal) and / or organic substances deposited (remained) on the mask.
Accordingly, the mask may be immersed more than once in the cleaning bath containing the cleaning liquid, so that the inorganic substances (e.g., metal) and / or organic substances deposited (remained) on the mask may be removed.
However, even if the mask is simply immersed in the cleaning liquid in the cleaning tank, the material deposited on the mask may not be completely removed. Therefore, the present invention employs a configuration in which the cleaning liquid is directly sprayed onto the mask.
In one embodiment, as shown in FIG. 3, a shower type washing liquid spraying unit 110 for spraying a cleaning liquid on the mask may be selectively included.
As described later, in the present invention, a cleaning module integrally formed with an ultrasonic vibration part for applying a cavitation cleaning effect using a cleaning liquid sprayed onto a mask as a cleaning liquid spray part for spraying a cleaning liquid at a high pressure toward a mask is applied.
At this time, in order to complement the cleaning effect by the cleaning module, the shower type washing liquid injecting portion 110 may be selectively applied so as to preliminarily remove contaminants on the mask by a chemical reaction by spraying the washing liquid on the mask by a shower have.
3, the shower type washing liquid injecting unit 110 can inject the washing liquid directly onto the mask supplied to the washing apparatus as shown in FIG. 3, spray the washing liquid to a separate member, So that it flows down onto the mask.
Here, as the cleaning liquid, N-methyl pyrrolidone (NMP), acetone and cyclohexanone, as well as foaming alkaline or non-foaming alkaline, foaming neutral or non-foaming, TFDO 7, TFD 13, TFD W, TFD LC, TFDO 4, TFDO N, TFDO 7, and TFDO W can be used.
It is preferable that the cleaning liquid has solubility and / or peelability to organic and / or inorganic substances, and static electricity is prevented on the surface of the mask after cleaning to prevent foreign matter from adhering to the surface of the mask.
3 to 5, a mask cleaning apparatus 100 in which a chemical treatment for a mask is performed includes a shower type washing liquid injection unit 110, a conveyor belt 120, and a
Referring to FIG. 3, the shower-type washing liquid spraying unit 110 is provided at the upper and lower portions of the mask P, and may be configured to spray the cleaning liquid toward the mask in a shower shape.
The shower type washing liquid spraying unit 110 is provided with frames 111 and 112, a plurality of cleaning
At this time, the shower-type washing liquid spraying unit 110 may be provided at the upper and lower portions of the mask P so that the rinsing process on the upper and lower surfaces of the mask P can be performed simultaneously.
The shower type washing liquid spraying unit 110 includes a first shower type washing liquid spraying unit for spraying the cleaning liquid toward the upper surface of the mask P and a second shower for spraying the cleaning liquid toward the lower surface of the mask P. [ And an inclined washing liquid ejecting portion.
Here, the first shower-type cleaning liquid jetting unit includes a first frame 111 disposed on the top of the mask P, a first cleaning
The second shower-type cleaning liquid jetting unit includes a second frame 112 disposed below the mask P, a second cleaning
The angle adjusting portions 117 and 118 adjust the angle at which the cleaning liquid is sprayed on the upper and / or lower surfaces of the mask P. By this adjustment, the cleaning liquid can be uniformly sprayed onto the entire surface of the mask P. The reliability of the cleaning process can be improved.
It is also possible to forcibly form a flow of the cleaning liquid overflowing from the upper surface of the mask P. [
That is, the flow of the cleaning liquid can be formed in the same or opposite direction as the transport direction of the mask P, and the spray angle of the
The injection angle of the
Referring to FIG. 4, the conveyor belt 120 may be configured to seat and transport the mask P in one direction.
As shown in Fig. 4, the mask P may be in the form of a welded stick which transversely crosses the rectangular frame.
The conveyor belt 120 includes a frame 122, a conveying unit 121 for forming a conveying path of the mask P on the frame 122, and a driving unit for supplying power to the mask disposed on the conveying unit to be conveyed in one direction 123).
5, a cleaning liquid injecting unit for injecting a cleaning liquid at a high pressure toward the mask P and a cleaning module for integrally forming an ultrasonic vibration part for imparting a cavitation cleaning effect using the cleaning liquid sprayed on the mask P as a medium, The
Since cavitation is generated in the half period of the decompression side of the ultrasonic wave, a cavity is generated in the liquid (here, three low liquid mediums) due to the generation of negative pressure, and then a large pressure and a high temperature are generated by the half- Which means that shrinkage explosion occurs.
The
At this time, it is preferable that the
5 to 6, a plurality of cleaning
7, the
Here, the output of the ultrasonic vibrator for effectively removing organic or inorganic substances on the mask P may be 1,000 to 1,400 W, and the output frequency may be 30 to 50 kHz.
8A, the
Accordingly, the water jet
Particularly, since the water jet
The apparatus for cleaning a mask according to an embodiment of the present invention may further include a cleaning liquid recovery unit.
The cleaning liquid recovery unit recovers the cleaning liquid, removes impurities such as contaminants contained in the cleaning liquid, and reuses the material.
More specifically, the cleaning liquid recovery portion includes a
The
The
The cleaning liquid drained to the tank of the
The impurities in the cleaning liquid are separated by centrifugal force after being supplied to the
The
The cleaning liquid from which the impurities have been removed from the
The impurities separated by the
For example, the impurities separated by the
At this time, it is also possible to discharge the impurities collected at the lower portion of the
As described above, in the mask cleaning apparatus according to an embodiment of the present invention, the used cleaning liquid is recovered from the bottom of the housing where the cleaning of the mask is performed, the contaminants in the cleaning liquid can be easily removed through centrifugal separation, It is advantageous in that it is possible to use a cleaning liquid of high purity even if the cleaning liquid is repeatedly used.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims. Deletion, addition, or the like of the present invention may be variously modified and changed within the scope of the present invention.
100: Cleaning device
110:
111, 112: frame
113, 114: cleaning liquid supply pipe
115, 116: Cleaning liquid injection nozzle part
117, 118:
120: Conveyor belt
121:
122: frame
123:
130: Ultrasonic vibration section
130a, 130b, 130c: Ultrasonic module
131a: Ultrasonic vibrator
131b: housing
131c: Euro
141: drain part
142: reserve tank
143: centrifugal separator
Claims (8)
An ultrasonic vibrator for applying a cavitation cleaning effect using a cleaning liquid sprayed on the mask as a medium;
A conveyor belt for receiving the mask and transporting the mask in one direction; And
And a cleaning liquid recovery unit for recovering the cleaning liquid to remove impurities in the cleaning liquid,
Wherein the ultrasonic vibration part is formed integrally with the cleaning liquid spraying part,
A water jet type cleaning apparatus capable of recovering a cleaning liquid.
Wherein the cleaning liquid spraying unit and the ultrasonic vibration unit are provided in a plurality of cleaning modules arranged along an outer periphery of the mask,
A water jet type cleaning apparatus capable of recovering a cleaning liquid.
The cleaning module includes:
A plurality of ultrasonic vibrators;
A flow path for spraying the cleaning liquid at a high pressure; And
And a housing in which the ultrasonic vibrator and the flow path are disposed,
A water jet type cleaning apparatus capable of recovering a cleaning liquid.
Wherein the flow path is vertically penetrated along an outer periphery of the housing,
A water jet type cleaning apparatus capable of recovering a cleaning liquid.
Wherein the flow path is formed to vertically penetrate the center of the housing,
A water jet type cleaning apparatus capable of recovering a cleaning liquid.
Wherein the cleaning module and the mask are spaced within a 3-5 mm range,
A water jet type cleaning apparatus capable of recovering a cleaning liquid.
The cleaning module is provided in the housing,
Wherein the cleaning liquid recovery unit is provided at a lower portion of the housing,
Wherein the cleaning liquid recovery portion includes a drain portion for draining the cleaning liquid from a bottom portion of the housing,
A water jet type cleaning apparatus capable of recovering a cleaning liquid.
The cleaning liquid-
A centrifugal separator for separating impurities in the cleaning liquid by a centrifugal force; And
And a reflux portion for refluxing the washing liquid from which the impurities have been removed in the centrifugal separator to the washing liquid spraying portion.
A water jet type cleaning apparatus capable of recovering a cleaning liquid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020150077324A KR20160141913A (en) | 2015-06-01 | 2015-06-01 | Water jet type mask cleaning apparatus capable of recovering cleaning solution |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020150077324A KR20160141913A (en) | 2015-06-01 | 2015-06-01 | Water jet type mask cleaning apparatus capable of recovering cleaning solution |
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Publication Number | Publication Date |
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KR20160141913A true KR20160141913A (en) | 2016-12-12 |
Family
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KR1020150077324A KR20160141913A (en) | 2015-06-01 | 2015-06-01 | Water jet type mask cleaning apparatus capable of recovering cleaning solution |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113351583A (en) * | 2021-05-31 | 2021-09-07 | 江苏高光半导体材料有限公司 | Mask plate cleaning device and cleaning method thereof |
CN117936433A (en) * | 2024-03-20 | 2024-04-26 | 芯朋半导体科技(如东)有限公司 | Online full-automatic semiconductor cleaning equipment |
CN117936433B (en) * | 2024-03-20 | 2024-05-31 | 芯朋半导体科技(如东)有限公司 | Online full-automatic semiconductor cleaning equipment |
-
2015
- 2015-06-01 KR KR1020150077324A patent/KR20160141913A/en not_active Application Discontinuation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113351583A (en) * | 2021-05-31 | 2021-09-07 | 江苏高光半导体材料有限公司 | Mask plate cleaning device and cleaning method thereof |
CN113351583B (en) * | 2021-05-31 | 2023-03-10 | 江苏高光半导体材料有限公司 | Mask plate cleaning device and cleaning method thereof |
CN117936433A (en) * | 2024-03-20 | 2024-04-26 | 芯朋半导体科技(如东)有限公司 | Online full-automatic semiconductor cleaning equipment |
CN117936433B (en) * | 2024-03-20 | 2024-05-31 | 芯朋半导体科技(如东)有限公司 | Online full-automatic semiconductor cleaning equipment |
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