KR20160133171A - An Equipment Front End Module having low dew point and low temperature - Google Patents

An Equipment Front End Module having low dew point and low temperature Download PDF

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Publication number
KR20160133171A
KR20160133171A KR1020150065868A KR20150065868A KR20160133171A KR 20160133171 A KR20160133171 A KR 20160133171A KR 1020150065868 A KR1020150065868 A KR 1020150065868A KR 20150065868 A KR20150065868 A KR 20150065868A KR 20160133171 A KR20160133171 A KR 20160133171A
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South Korea
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air
case
substrate transfer
transfer chamber
moisture
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KR1020150065868A
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Korean (ko)
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KR101744953B1 (en
Inventor
이찬우
김도형
김병채
이재봉
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주식회사 스피드터치
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

The EFEM having the low dew point low temperature dehumidifying function according to the present invention includes a substrate transfer chamber inside and a fan filter unit above the substrate transfer chamber, And an air circulation passage which is arranged to be spaced apart from the first case by a predetermined distance so as to surround the first case and in which air discharged from the substrate transfer chamber through the discharge port moves and circulates, A condenser for condensing the compressed refrigerant and a condenser for condensing the condensed refrigerant to absorb the heat of the ambient air and to remove the contaminant containing moisture in the air, A dehumidifier for dehumidifying low-temperature dehumidifying air, and a vaporizer for collecting and removing the air, And a heating source for heating the air. The vaporizer is disposed at a corresponding position above the air circulation passage on the movement path of the air so as to collect and remove the moisture in the air passing through the circulation passage and remove the moisture while passing through the vaporizer, And then flows back into the chamber and circulates.

Description

(EFEM) having a low-temperature low-temperature dehumidifying function (an equipment front end module having low dew point and low temperature)

The present invention relates to an EFEM (Equipment Front End Muffler) used in a semiconductor facility, and more particularly, to an EFEM (equipment front end muffler) used in a semiconductor facility. More specifically, EFEM < / RTI >

The EFEM (Equipment Front End Module) is a module that allows the wafer to be handled in a clean state by bonding it to the equipment for the semiconductor front-end (FAB process) or the measuring equipment. Specifically, To the interface module.

1, EFEM 10 serves as an interface module for supplying wafers to process modules 20 and 30, and is used as a front end of process chamber 30 And is connected to the load lock chamber 20 located at the bottom of the load lock chamber.

A run cassette 50 on which a plurality of wafers 60 are mounted is placed on a load station 40 and a door 51 is provided between the run cassette 50 and the EFEM 10. [

The wafer 60 mounted on the run cassette 50 is transferred to the load lock chamber 20 by the transfer robot 70 in the substrate transfer chamber 15 after the door 51 is opened and then transferred to the process chamber 30 ). ≪ / RTI > The wafer 60 that has undergone the manufacturing process in the process chamber 30 is mounted on the separate run cassette 50 through the transfer robot 70 inside the substrate transfer chamber 15 via the load lock chamber 20. When all of the processed wafers have entered the run cassette 50 through these steps, the door 51 of the run cassette 50 is closed and the run cassette 50 is removed from the EFEM 10.

The fan filter unit 12 is formed by integrating a fan and a filter so that the air introduced from an external clean room is filtered again through the filter and transferred to the substrate transfer chamber 15 down flow. And an exhaust port for discharging the inflow air is provided on the bottom surface. The air of the external clean room is sucked into the substrate transfer chamber 15 of the EFEM by the fan filter unit 12 and the flow rate of the air is controlled through the damper (not shown) In order to maintain the internal cleanliness, the pressure should be maintained at atmospheric pressure slightly higher than atmospheric pressure so that no outside air is introduced. Since the run cassette 50 is connected to the substrate transfer chamber 15 through the door 51, the inside of the run cassette 50 is also maintained at the same atmospheric pressure.

Therefore, the substrate transfer chamber 15 of the external clean room and the EFEM has the same temperature (room temperature, about 23 ° C) and humidity (about 45%), and the air introduced from the clean room passes through the fan filter unit 12 Only the particles are removed.

During the process of the wafer, the wafers 60 loaded in the run cassette 50 are lengthened in stagnation time and exposed to the same atmosphere as the EFEF internal air temperature (room temperature) and humidity (about 45%). The wafers in the run cassette 50 are exposed to airborne molecular contaminants (AMC) in various air such as moisture and ozone in the air.

Such molecular contaminants, in particular moisture, may cause oxidization on the surface of the wafer, resulting in a problem that the process yield is lowered. When the degree of integration is 40 to 50 μm, there is no particular abnormality. However, when the degree of integration is 20 μm or less, there is an influence, and the yield is affected at the portion where oxidation occurs. In addition, if the degree of integration is less than 10 탆, the exposure process is currently under development, and in this case, the yield problem is expected to be more influential. On the other hand, it is necessary to prevent oxidation in metal (especially copper process), oxide and sputtering processes, and it is necessary to suppress humidity in order to improve the yield. However, as described above, the air that flows into the EFEM from the outside of the clean room at present is clean, and only the particles are managed through the paint, but the temperature and humidity can not be separately managed.

In order to lower the humidity of the external clean room, it is practically impossible to make a huge facility investment and affect other process equipments. In other words, a separate dehumidifying device may be installed in the external clean room to remove moisture from the air of the external clean room and supply the moisture-depleted air to the inside of the EFEM. In this case, a compressor of approximately 10 HP is required The size of other equipment, such as a blower, a heater, etc., is increased in proportion to the increase in power consumption.

Therefore, a method of lowering the humidity inside the EFEM is being studied. For example, Korean Patent Laid-Open Publication No. 10-2003-0001542 discloses a method of supplying nitrogen gas (N2), which is a purge gas, into a substrate transfer chamber of an EFEM to lower the relative humidity. However, since the nitrogen gas supply lowers the relative humidity but not the absolute humidity, the moisture inside the substrate transfer chamber of the EFEM still exists, thereby failing to solve the problems affecting the process yield of the wafer described above. In addition, the nitrogen gas supply is consumed in a large amount due to a large internal area of the substrate transfer chamber of the EFEM, which is practically difficult in terms of manufacturing cost. Also, since EFEM is used in most semiconductor processing facilities, there is a risk of suffocating the environment due to the lack of oxygen, for example, when the nitrogen gas is used in a very large number of situations.

Korean Patent Publication No. 10-2004-0064326 (published on July 19, 2004) Korean Patent Registration No. 10-1215962 (Dec. 27, 2012)

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and it is an object of the present invention to provide a simple equipment for low-temperature low temperature dehumidification in EFEM and circulate air to collect molecular air pollutants in the air inside the substrate transfer chamber of EFEM, Temperature dehumidifying function for reducing environmental pollution while lowering the cost of the EFEM.

In order to achieve the above object, the EFEM having a low dew point low temperature dehumidifying function according to the present invention is for collecting and removing moisture inside the substrate transfer chamber of the EFEM by low temperature and low temperature dehumidification, A first case having a fan filter unit on top of the substrate transfer chamber, and a discharge port through which air in the substrate transfer chamber is discharged at a side lower portion; A second case disposed to be spaced apart from the first case by a predetermined distance so as to surround the first case and having an air circulation passage through which air discharged from the substrate transfer chamber moves and circulates through the discharge port; A condenser for condensing the compressed refrigerant and a vaporizer for vaporizing the condensed refrigerant to absorb the heat of the ambient air and to collect and remove moisture in the air, Dew point dehumidifier; And a heating source installed on the fan filter unit for heating the air flowing into the fan filter unit. The vaporizer is disposed at a corresponding position above the air circulation passage on the movement path of the air so as to collect contaminants including moisture in the air passing through the circulation passage, And then flows back into the substrate transfer chamber.

Meanwhile, an outer air inlet for introducing the air of the external clean room is formed on the upper end of the second case, and a part of the vaporizer is disposed at a position corresponding to the external air inlet, The moisture is collected and removed.

According to a preferred embodiment of the present invention, the discharge port of the first case is formed on both side surfaces of the first case, and the air circulation path is also formed on both sides of both sides of the first case, Two at the corresponding positions above the air circulation passage.

According to the present invention, the EFEM is provided with a low dew point low temperature dehumidifying function and circulates air to collect the moisture in the air circulating inside the EFEM by the low dew point low temperature dehumidification to remove moisture gradually, It is possible to reach the state where the moisture is almost removed, so that it is possible to remove the moisture of the inside air of the EFEM while solving the low cost and environmental problems.

1 is a view for explaining a general EFEM,
2 is a schematic front sectional view of an EFEM having a low dew point low temperature dehumidifying function according to an embodiment of the present invention,
FIGS. 3A to 3C are graphs showing the humidity charts for the relative humidity at room temperature.

These and other objects, features and other advantages of the present invention will become more apparent by describing in detail preferred embodiments of the present invention with reference to the accompanying drawings. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an EFEM having a low-temperature low-temperature dehumidifying function according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2, an EFEM 100 having a low dew point low temperature dehumidifying function according to an embodiment of the present invention includes a first case 110 having a substrate transfer chamber 112 therein, a first case 110 A second case 130 disposed to be spaced apart from the first case 110 by a predetermined distance to surround the first case 110, a low dew point dehumidifying device 150 disposed above the first case 110, and a heating source 170.

A substrate transfer chamber 112 is formed in the first case 110 and a substrate transfer unit (not shown), that is, a substrate transfer robot, is disposed in the substrate transfer chamber 112. For convenience of explanation, the substrate transfer robot 112 of FIG. 2 omits the substrate transfer robot and omits a run cassette, a load lock chamber, and the like containing wafers connected to the substrate transfer chamber 112.

A fan filter unit (FFU) 115 is installed in the upper portion of the substrate transfer chamber 112 to introduce air circulating outside air or EFEM into the substrate transfer chamber 112. The fan filter unit 115 is a unit in which a fan and a filter are integrated so that air introduced from an external clean room or air circulating through the EFEF is filtered again through the filter to be transferred to the substrate transfer chamber 112 to down flow.

On the other hand, a discharge port 117 through which air is discharged is formed on the lower side of both sides of the first case 110.

The second case 130 is spaced apart from the first case 110 by a predetermined distance so that a space is formed between the second case 130 and the substrate transfer chamber 112 through the discharge port 117 of the first case 110, An air circulation path 132 is formed in which air discharged from the air circulation path is circulated. The air passing through the air circulation passage 132 is moved to the upper space of the first case 110.

An external air inlet 134 for introducing air from an external clean room into the EMEM 100 is formed at both upper ends of the second case 130. The external air inlet 134 is separated from the air circulation passage 132 by the diaphragm 134. Meanwhile, the external air inlet 134 may be provided with a damper or an adjustable bed for controlling the inflow of air.

The low dew point dehumidifying device 150 is disposed on the upper portion of the first case 110 and collects and removes moisture from air passing through the air circulation passage 132. Specifically, the low dew point dehumidifier 150 includes a compressor 152 for compressing a refrigerant, a condenser 154 for condensing the compressed refrigerant, and a condenser 154 for condensing the condensed refrigerant to absorb the heat of ambient air, And a vaporizer 156 for collecting the vaporized gas. The PCW circulates in the condenser 154 to condense the refrigerant. Although not shown, an expansion valve is provided at the front end of the vaporizer 156, and the refrigerant passing through the vaporizer 156 flows into the compressor 152 again.

The low dew point dehumidifier 150 is a type of refrigeration cycle in which a non-furnace mixed refrigerant is used to realize ultra-low temperature and a single-stage compression refrigeration cycle using a general single refrigerant, an azeotropic refrigerant, A cryogenic temperature of about 100 ° C can be realized.

The vaporizer 156 is disposed at a corresponding position above the air circulation passage 132 on the movement path of the air. Accordingly, the pollutant containing the moisture of the air passing through the air circulation passage 132 is trapped and eventually the moisture in the air is removed. Although not shown in the drawings, a water receptacle for collecting moisture collected in the lower part of the vaporizer may be provided or a drain pipe may be installed. Various types of cooling coil structures known in the art such as a fin tube coil and a tube coil can be applied to the vaporizer 156 to collect contaminants including moisture. According to a preferred embodiment, the vaporizer is maintained at a cryogenic temperature of -100 ° C for dehumidification of the low dew point, so that the temperature of the air passing through the vaporizer is cooled from -60 ° C to -80 ° C to remove moisture from the air .

FIGS. 3A to 3C are graphs showing the relative humidity for each relative humidity (RH: 45%, 10%, 5%) at room temperature (23 ° C.).

As shown in FIG. 3A, at a room temperature and relative humidity (RH) of 45%, the dew point temperature is 10.44 ° C and the absolute humidity is 0.007861 kg / kg. As shown in FIG. 3B, the dew point is -9.11 ° C and the absolute humidity is 0.001730 kg / kg under the condition of room temperature and RH 10%. In the condition of room temperature and RH 5% as shown in FIG. 3c The dew point is -16.74 占 폚, and the absolute humidity is 0.000864 kg / kg.

Therefore, according to the present invention, the low-temperature dehumidifying device 150 is cooled to a temperature of -60 ° C. to -80 ° C. by implementing a cryogenic temperature using a non-azeotropic mixed refrigerant, so that the relative humidity is reduced to 5 to 10% So that moisture in the air can be almost removed.

On the other hand, the upper part of the carburetor 156 is disposed at a position corresponding to the external air inlet 134, so that the humidity of the air introduced from the external clean room is also collected.

As shown in the figure, according to the embodiment of the present invention, the discharge ports 117 are formed on both sides of the first case 110, so that the air circulation path 132 is also formed at two positions outside the opposite sides of the first case 110 And two corresponding vaporizers 156 are also installed. This is to distribute the air circulation path so as to reduce the load.

The heating source 170 is installed above the fan filter unit 115 to heat the air sucked by the fan filter unit 115. Since the temperature of the air is lowered through the vaporizer 156, the heating source 170 heats the air introduced into the substrate transfer chamber 112 to the room temperature.

Hereinafter, the operation of the EFEM 100 having the low-dew point low temperature dehumidifying function according to the embodiment of the present invention will be described.

Since the EFEF 100 receives external air of the clean room through the external air inlet 134 and flows into the substrate transfer chamber 112 through the fan filter unit 115, the substrate transfer chamber 112 ) Is maintained under the same conditions as the temperature and humidity of the outside air of the clean room, for example, at a temperature of about 23 캜 and a humidity of 45% (RH). Then, the outside air inlet 134 is closed and the low dew point dehumidifying device 150 is operated. The air in the substrate transfer chamber 112 escapes through the discharge port 117 at the lower end and rises while passing through the air circulation passage 132. The pollutant including moisture is collected and removed through the vaporizer 156. The air having passed through the vaporizer 156 is heated by the heating source 170 and flows into the substrate transfer chamber 112 through the fan filter unit 115 while maintaining the room temperature. And then circulates until the desired humidity reaches 5 to 10% or less.

When the desired humidity condition is met, the EFEM performs the function of substrate transfer, that is, the loading operation for transferring the wafer mounted on the run cassette to the load lock chamber, and the wafer in the load lock chamber is transferred to the run cassette The unloading operation is performed.

Meanwhile, external air may be introduced into the clean room during the process or after the process is completed. In this case, the external air inlet 134 is opened to allow external air to flow into the EFEM 100. At this time, the air in the clean room introduced through the external air inlet 134 passes through the vaporizer 156, so that moisture is collected to some extent and removed.

The prior art does not remove moisture itself by supplying nitrogen gas to the EFEM by lowering the relative humidity. However, according to the present invention, since the moisture itself is collected and removed, the problem of the process yield of the wafer due to moisture can be fundamentally removed There is an advantage. In addition, according to the present invention, the supply of nitrogen gas according to the prior art may cause problems of manufacturing cost and environmental safety. However, according to the present invention, since the air inside the EFEM is circulated and contaminants including moisture in the air are collected and removed, The problem that arises can be solved.

 The vaporizer 156 of the low dew point dehumidifier 150 is disposed at a position corresponding to the upper portion of the air circulation passage 132 in the moving path of the air so as to be exhausted from the substrate transfer chamber 112, The pollutant containing the moisture of the air passing through the circulation passage 132 is collected and removed. The moisture removed air is heated to room temperature through the heating source 170 and then introduced into the substrate transfer chamber 112 through the fan filter unit 115 and then discharged through the discharge port 117. [ So that the above process is repeated while passing through the air circulation passage 132. Therefore, as the air circulates inside the EFEM, the moisture is gradually removed, and after a certain time, the desired humidity (about 5 to 10% (RH)) or less can be reached. Therefore, the air inside the substrate transfer chamber 112 of the EFEM It is possible to remove the moisture of the liquid.

A part of the vaporizer 156 may be disposed at a position corresponding to the external air inlet 134 so as to collect and remove contaminants including moisture in the air introduced from the external clean room to increase the moisture removal efficiency .

As in the present invention, it is also possible to supply dry air dehumidified at 5 to 10% at 23 ° C from the outside without using an internal circulation system. In this case, about 10 horsepower of the compressor is required for the internal dehumidification of the EFEM This is because, as described above, the size of the equipment is increased, and thus the capacity of the blower and the capacity of the heater are increased. As a result, the power consumption increases. Further, there is a problem that heat loss occurs due to the movement of the air due to the remote installation of the dehumidifier.

In the present invention, a non-azeotropic mixed refrigerant, which realizes -100 ° C., is used as an energy saving technology for maximizing the low dew point dehumidification efficiency and minimizing power consumption, 60 to -80 < 0 > C, thereby maximizing the dehumidification efficiency. Also, by using the air circulation system inside the EFEM, the compressor can be used at about 1 horsepower, so that energy saving can be achieved by 1/10.

Although the preferred embodiments of the present invention have been described, the present invention is not limited to the specific embodiments described above. It will be apparent to those skilled in the art that numerous modifications and variations can be made in the present invention without departing from the spirit or scope of the appended claims. And equivalents should also be considered to be within the scope of the present invention.

100. EFEM 110. First case
112. Substrate transfer chamber 115. Fan filter unit
117. Outlet 130. Second case
132. Air circulation passage 134. External air inlet
150. Low dew point dehumidifier 152. Compressor
156. Vaporizer 170. Heating source

Claims (4)

This is for collecting and removing moisture inside the substrate transfer chamber of the EFEM by low temperature and low temperature dehumidification,
A first case having the substrate transfer chamber therein and having a fan filter unit on the substrate transfer chamber, and a discharge port through which the air in the substrate transfer chamber is discharged at a lower side of the first case;
A second case disposed to be spaced apart from the first case by a predetermined distance so as to surround the first case and having an air circulation passage through which air discharged from the substrate transfer chamber moves and circulates through the discharge port;
A condenser for condensing the compressed refrigerant and a condensed refrigerant to vaporize the heat of the ambient air and to collect and remove contaminants including moisture in the air, A dew point dehumidifying device having a vaporizer; And
And a heating source installed on the fan filter unit for heating the air flowing into the fan filter unit,
The vaporizer is disposed at a position corresponding to an upper portion of the air circulation passage on the movement path of the air so as to collect and remove moisture in the air passing through the circulation passage and remove the moisture while passing through the vaporizer, Wherein the EFEM has a low dew point low temperature dehumidifying function.
The method according to claim 1,
An outer air inlet for introducing air from the external clean room is formed in the upper end of the second case,
Wherein a part of the carburetor is disposed at a position corresponding to the external air inlet and collects and removes moisture of the external air introduced through the external air inlet.
The method according to claim 1,
Wherein the outlet of the first case is formed on both sides of the first case and the air circulation passage is formed on both sides of both sides of the first case, Wherein the two low temperature dew point dehumidifiers are disposed in the EFEM.
The method according to claim 1,
Wherein the low dew point dehumidifier uses a non-azeotropic mixed refrigerant to cool the air passing through the vaporizer to a temperature of -60 ° C to -80 ° C to realize a cryogenic temperature. .
KR1020150065868A 2015-05-12 2015-05-12 An Equipment Front End Module having low dew point and low temperature KR101744953B1 (en)

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KR20190049678A (en) * 2019-05-02 2019-05-09 우범제 EFEM SYSTEM, Equipment Front End Module SYSTEM
KR20200063977A (en) * 2018-11-28 2020-06-05 (주) 예스티 EFEM, Equipment Front End Module
KR20200111294A (en) * 2018-02-27 2020-09-28 어플라이드 머티어리얼스, 인코포레이티드 Substrate processing apparatus and methods using factory interface chamber filter purge
KR20210079632A (en) * 2019-12-20 2021-06-30 멜콘 주식회사 Apparatus and method for supplying dry air
CN113161262A (en) * 2021-03-03 2021-07-23 北京北方华创微电子装备有限公司 Heating device in semiconductor processing equipment and semiconductor processing equipment
KR102284342B1 (en) * 2020-07-24 2021-08-03 (주)쿨트론 Air conditioner for outdoor storage

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KR20200111294A (en) * 2018-02-27 2020-09-28 어플라이드 머티어리얼스, 인코포레이티드 Substrate processing apparatus and methods using factory interface chamber filter purge
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KR20200063977A (en) * 2018-11-28 2020-06-05 (주) 예스티 EFEM, Equipment Front End Module
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KR20210079632A (en) * 2019-12-20 2021-06-30 멜콘 주식회사 Apparatus and method for supplying dry air
KR102284342B1 (en) * 2020-07-24 2021-08-03 (주)쿨트론 Air conditioner for outdoor storage
CN113161262A (en) * 2021-03-03 2021-07-23 北京北方华创微电子装备有限公司 Heating device in semiconductor processing equipment and semiconductor processing equipment
WO2022183818A1 (en) * 2021-03-03 2022-09-09 北京北方华创微电子装备有限公司 Heating device in semiconductor processing apparatus, and semiconductor processing apparatus

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