CN113161262A - Heating device in semiconductor processing equipment and semiconductor processing equipment - Google Patents
Heating device in semiconductor processing equipment and semiconductor processing equipment Download PDFInfo
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- CN113161262A CN113161262A CN202110235086.6A CN202110235086A CN113161262A CN 113161262 A CN113161262 A CN 113161262A CN 202110235086 A CN202110235086 A CN 202110235086A CN 113161262 A CN113161262 A CN 113161262A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Abstract
The embodiment of the invention provides a heating device in semiconductor processing equipment and the semiconductor processing equipment, wherein the heating device is arranged in a transmission cavity of the semiconductor processing equipment and comprises a power mechanism, an actuating mechanism and a heating mechanism, wherein the actuating mechanism is respectively connected with the power mechanism and the heating mechanism, and the power mechanism is used for driving the actuating mechanism to drive the heating mechanism to swing; the heat generating mechanism is directed towards different positions of the transfer member in the transfer chamber during the oscillation for transferring heat to the different positions of the transfer member. The heating device provided by the embodiment of the invention can be used for heating the transmission part in the transmission chamber, and particularly can be used for preheating the fingers of the manipulator in the transmission chamber, so that the electronic components in the manipulator can be prevented from being damaged due to high-temperature baking.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a heating device in semiconductor processing equipment and the semiconductor processing equipment.
Background
A Chemical Vapor Deposition (CVD) process is often accompanied by a high temperature condition, and when the process is finished, a heating function of a process chamber is stopped, and after the temperature of the process chamber is reduced to a set temperature, a vacuum robot in a transfer chamber performs a wafer picking operation to transfer a wafer back to a Front Opening Unified Pod (FOUP).
In the wafer taking process of the mechanical arm, the temperature difference between the fingers (such as quartz fingers) of the mechanical arm and the wafer may cause the wafer to be broken or warped during the contact process, thereby causing unnecessary loss. Therefore, a common method is to perform a delay processing on the flow before the robot performs the film taking action, and the fingers of the robot are not taken immediately after extending into the process chamber, but are baked for several seconds before performing the film taking action. However, this method causes the following problems in practical use:
because the process chamber is in a high-temperature environment, and the gate valve of the process chamber is opened in the process of baking the fingers of the manipulator, heat in the process chamber is transferred to the manipulator arm and even the transmission chamber, so that the electronic components in the manipulator are in an abnormal working environment, the service life of the electronic components is shortened, and the use cost is increased.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a heating device in semiconductor processing equipment and the semiconductor processing equipment, which can heat a transmission part in a transmission chamber, and can be particularly applied to preheating a manipulator finger in the transmission chamber, so that electronic components in the manipulator can be prevented from being damaged due to high-temperature baking.
In order to achieve the above object, an embodiment of the present invention provides a heating device in a semiconductor processing apparatus, the heating device being disposed in a transfer chamber of the semiconductor processing apparatus and including a power mechanism, an actuator mechanism and a heat generating mechanism, wherein,
the actuating mechanism is respectively connected with the actuating mechanism and the heating mechanism, and the actuating mechanism is used for driving the actuating mechanism to drive the heating mechanism to swing; the heat generating mechanism faces different positions of the transfer member in the transfer chamber during the oscillation for transferring heat to the different positions of the transfer member.
Optionally, the heat generating mechanism comprises a housing, and a heating element and an air supply assembly arranged in the housing, wherein,
the shell is relatively provided with an air inlet and an air outlet, and the heating element is positioned at the air outlet;
the air supply assembly is arranged on one side, close to the air inlet, of the heating element and used for blowing air to the air outlet.
Optionally, the actuator includes a first fixed bracket and a swing assembly, wherein the first fixed bracket is fixedly connected to a chamber wall of the transfer chamber; the swing assembly is connected with the first fixed support in a swinging mode; the heating mechanism is fixedly connected with the swinging assembly;
the power mechanism is connected with the swinging assembly and used for driving the swinging assembly to swing.
Optionally, the swing assembly includes a connecting member and a swing member, wherein the connecting member is rotatably connected to the first fixing bracket; the swinging piece is fixedly connected with the connecting piece; the heating mechanism is fixedly connected with the swinging piece; the power mechanism is connected with the swinging piece and used for driving the swinging piece to swing around the axis of the connecting piece; or
The swing assembly comprises a connecting piece and a swing piece, wherein the connecting piece is fixedly connected with the first fixed support; the swinging piece is rotatably connected with the connecting piece; the heating mechanism is fixedly connected with the swinging piece; the power mechanism is connected with the swinging piece and used for driving the swinging piece to swing around the axis of the connecting piece.
Optionally, the connecting member includes two first connecting pins disposed at two sides of the swinging member, and two ends of the first connecting pin are connected to the first fixing bracket and the swinging member, respectively.
Optionally, the swing assembly further includes a second connecting pin, the second connecting pin is disposed on the swing member and connected to the power mechanism, and an axis of the second connecting pin is perpendicular to an axis of the connecting member.
Optionally, the power mechanism includes a second fixing support, a driving motor, a first swing arm and a second swing arm, wherein the second fixing support is used for being fixedly connected with a chamber wall of the transfer chamber; the driving motor with second fixed bolster fixed connection, just driving motor's drive shaft with the one end fixed connection of first swing arm, the other end of first swing arm extends to one side of actuating mechanism, with the one end fixed connection of second swing arm, the other end of second swing arm extends to actuating mechanism's opposite side, with actuating mechanism fixed connection.
As another technical solution, an embodiment of the present invention further provides a semiconductor processing apparatus, including a transfer chamber, a transfer member is disposed in the transfer chamber, and the heating device provided in the embodiment of the present invention is further disposed in the transfer chamber, and is configured to heat at least a part of the transfer member.
Optionally, the system further comprises a temperature detection device and a control device, wherein the temperature detection device is used for detecting an actual temperature value of a preset position on the transmission component in real time and sending the actual temperature value to the control device; the control device is used for comparing the actual temperature value with a target temperature value and controlling the power mechanism and the heating mechanism to be started when the actual temperature value is lower than the target temperature value; and controlling the power mechanism and the heating mechanism to be closed when the actual temperature value is equal to or higher than the target temperature value.
Optionally, the power mechanism and the actuating mechanism are both arranged on the top wall of the transmission chamber; and/or
The temperature detection device is arranged on the top wall of the transmission chamber and is positioned above the preset position.
The invention has the beneficial effects that:
according to the heating device in the semiconductor processing equipment, the actuating mechanism is driven by the power mechanism to drive the heating mechanism to swing, heat is transferred to different positions of the transmission component (such as a manipulator finger) in the transmission chamber by enabling the heating mechanism to face different positions of the transmission component in the swinging process, the transmission component can be remotely and uniformly heated, and the heat transfer mode can reduce the risk of damage of electronic elements in the transmission component, so that the service life of the transmission component can be prolonged, and the use cost can be reduced. The heating device provided by the embodiment of the invention can be particularly applied to preheating the manipulator finger in the transmission chamber, compared with the prior art that the manipulator finger is baked in the process chamber, the heating device not only can enable the manipulator finger to take the wafer immediately after the process in the process chamber is finished, but also does not need time delay, thereby improving the productivity; meanwhile, the fingers are heated in the transmission chamber, so that the damage of electronic components in the manipulator due to high-temperature baking can be avoided, the service life of the manipulator can be prolonged, and the use cost is reduced.
According to the semiconductor processing equipment provided by the embodiment of the invention, the risk of damage of electronic elements in the transmission component can be reduced by adopting the heating device provided by the embodiment of the invention, so that the service life of the transmission component can be prolonged, and the use cost can be reduced. The method can be particularly applied to preheating the manipulator finger before the manipulator finger enters the process chamber to carry out the wafer taking operation, compared with the method of baking the manipulator finger in the process chamber in the prior art, the method can ensure that the manipulator finger can take the wafer immediately after the process in the process chamber is finished without time delay, thereby improving the productivity; meanwhile, the fingers are heated in the transmission chamber, so that the damage of electronic components in the manipulator due to high-temperature baking can be avoided, the service life of the manipulator can be prolonged, and the use cost is reduced.
Drawings
FIG. 1 is a process diagram of a robot entering a process chamber for taking a wafer;
fig. 2 is a structural view of a heating apparatus in a semiconductor processing apparatus according to a first embodiment of the present invention;
FIG. 3 is a structural view of a heat generating mechanism employed in the first embodiment of the present invention;
FIG. 4A is a left side view of a swing assembly used in the first embodiment of the present invention;
FIG. 4B is a left side view of a first stationary bracket used in the first embodiment of the present invention;
FIG. 4C is a top view of a swing assembly used in the first embodiment of the present invention;
FIG. 5 is a cross-sectional view of a transfer chamber provided in accordance with a second embodiment of the present invention;
FIG. 6 is a diagram illustrating an operation of a temperature detecting device according to a second embodiment of the present invention;
fig. 7 is a top view of a transfer chamber in a semiconductor processing apparatus according to a second embodiment of the present invention;
fig. 8 is a flowchart of a method for picking up a film by a manipulator according to a second embodiment of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the heating device in the semiconductor processing equipment and the semiconductor processing equipment provided in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 1, a semiconductor process such as Chemical Vapor Deposition (CVD) is often accompanied by high temperature conditions, when the process in the process chamber 101 is completed, a finger 102 of a vacuum robot in a transfer chamber (not shown) enters the process chamber 101 to perform a pick-up operation to transfer a wafer 103 back to a FOUP (Front Opening Unified Pod). In the wafer taking process of the mechanical arm, the temperature difference between the fingers (such as quartz fingers) of the mechanical arm and the wafer may cause the wafer to be broken or warped during the contact process, thereby causing unnecessary loss. For this reason, it is common practice that the fingers 102 of the robot are not used for taking the wafer immediately after being inserted into the process chamber 101, but are baked for several seconds before taking the wafer. However, since the process chamber 101 is in a high temperature environment, and the gate valve of the process chamber 101 is opened during the process of baking the finger 102 of the robot, heat in the process chamber is transferred to the arm of the robot or even the transfer chamber, so that the electronic components in the robot are in an abnormal working environment, the service life of the electronic components is shortened, and the use cost is increased.
In order to solve the above technical problems, a first embodiment of the present invention provides a heating device in a semiconductor processing apparatus, the heating device being disposed in a transfer chamber of the semiconductor processing apparatus. Referring to fig. 2, the heating device includes a power mechanism 1, an actuator 2 and a heating mechanism 3, wherein the actuator 2 is respectively connected to the power mechanism 1 and the heating mechanism 3, and the power mechanism 1 is configured to drive the actuator 2 to drive the heating mechanism 3 to swing in a vertical plane, such as a vertical plane, where a Y axis-Z axis in fig. 2 is located; the heat generating means 3 are directed towards different positions of the transfer member 4 in the transfer chamber during the oscillation for transferring heat to different positions of the transfer member 4. The transfer member 4 is, for example, a robot or other transfer member that requires heating.
According to the heating device provided by the embodiment of the invention, the actuating mechanism 2 is driven by the power mechanism 1 to drive the heating mechanism 3 to swing, and the heating mechanism 3 is enabled to face different positions of the transmission part 4 in the transmission chamber in the swinging process and transfer heat to different positions of the transmission part 4, so that the transmission part 4 can be remotely and uniformly heated, that is, at least part of the transmission part 4 can be ensured to reach the required temperature without being close to the transmission part 4. The mode of transferring heat can reduce the risk of damaging electronic components in the manipulator, thereby prolonging the service life of the manipulator and reducing the use cost.
The heating device provided by the embodiment of the invention can be particularly applied to preheating the manipulator finger in the transmission chamber, under the condition, the heating device can be used for preheating the manipulator finger before the manipulator finger enters the process chamber to perform the wafer taking operation, so that after the process in the process chamber is finished, the manipulator finger can enter the process chamber and immediately take the wafer without time delay, the productivity can be improved, meanwhile, compared with the process of baking the manipulator finger in the process chamber, the heating device can prevent the electronic components in the manipulator from being damaged due to high-temperature baking, the service life of the manipulator can be prolonged, and the use cost is reduced.
The structure of the heat generating mechanism 3 may be various, for example, in the present embodiment, as shown in fig. 3, the heat generating mechanism 3 includes a housing 31, and a heating element 32 and an air supply assembly 33 which are arranged in the housing 31, wherein an air inlet 311 and an air outlet 312 which communicate the inside of the housing 31 with the outside are oppositely arranged on the housing 31; a heating element 32 is located at the air outlet 312, and the heating element 32 is used for generating heat, such as a heating wire, which generates heat when energized. The air supply assembly 33 is disposed on a side of the heating element 32 close to the air inlet 311, and is used for supplying air to the air outlet 312, so that heat generated by the heating element 32 can be output through the air outlet 312. During the oscillation of the casing 31, the outlet port 312 faces different positions of the transfer member 4 to be able to transfer heat to the different positions of the transfer member 4.
The structure of the air supply assembly 33 can be various, for example, in the present embodiment, as shown in fig. 3, the air supply assembly 33 includes a fan 331 and an air supply motor 332 for driving the fan 331 to rotate. When the blower motor 332 drives the fan 331 to rotate, the air outside the housing 31 flows into the housing 31 through the air inlet 311 and then flows out through the air outlet 312, the air flows in the direction shown by the arrow in fig. 3, and when the air flows through the heating element 32, the air carries away the heat generated by the air, so that the heat is transferred. In practical applications, the fan 331 may be disposed inside the air inlet 311, or may be disposed in the air inlet 311, as long as the function of air supply is achieved, and the embodiment of the present invention is not particularly limited thereto.
It should be noted that the heating mechanism 3 swings in a vertical plane where the Y axis-Z axis in fig. 2 is located, for example, the heating mechanism may swing back and forth on both sides of the Y axis in fig. 2 as a symmetry line, and the swing angle range may be set according to the size of the transmission member 4 on the Z axis.
In some embodiments, the heat generating mechanism 3 further includes an insulating fixing member 34, and the insulating fixing member 34 is disposed in the housing 31 and is used for fixing the heating element 32 in the housing 31, so that the heating element 32 is prevented from being moved by the air flow, and the structural stability is improved. The heating element 32 may be, for example, wound around the insulating fixture 34, or may be fixedly attached to the insulating fixture 34 in any other manner. In addition, the insulating fixing member 34 is preferably made of a high temperature resistant insulating material, such as mica.
In some embodiments, optionally, in order to converge the airflow to increase the airflow speed and thus the heating efficiency, the housing 31 has a conical cylinder shape, and the diameter of the air outlet 312 is smaller than that of the air inlet 311.
The structure of the actuator 2 may be various, for example, in the present embodiment, as shown in fig. 2, the actuator 2 includes a first fixed bracket 21 and a swing assembly 22, wherein the first fixed bracket 21 is fixedly connected with the chamber wall of the transfer chamber, for example, fixedly connected with the upper cover 201 of the transfer chamber, so as to be able to suspend the swing assembly 22 in the transfer chamber. The swing member 22 is swingably connected to the first fixing bracket 21; the heating mechanism 3 is fixedly connected with the swing component 22, for example, by using a connecting column 23, and the connecting manner is, for example, welding. The power mechanism 1 is connected with the swinging component 22 and is used for driving the swinging component 22 to swing. By means of the first fixed bracket 21 described above, it is possible to realize that the swing assembly 22 is swingably provided in the transfer chamber.
The structure of the first fixing bracket 21 can be various, for example, in the present embodiment, as shown in fig. 4B, the first fixing bracket 21 includes two parallel suspension arms, an orthographic projection of each suspension arm of the first fixing bracket 21 on a vertical plane (i.e., a plane of the Y-Z axis) is similar to an "L" shape, upper ends of the two suspension arms are connected integrally and fixedly connected with a chamber wall of the transfer chamber, and free ends of the two suspension arms are respectively connected with the swing assembly 22 in a swinging manner from two sides thereof. The structure of the first fixing bracket 21 is beneficial to leave enough space for the connection between the power mechanism 1 and the swinging component 22, and meanwhile, the structure does not interfere with the swinging of the swinging component 22.
In this embodiment, the swing assembly 22 includes a connecting member and a swing member 222, wherein the connecting member is rotatably connected to the first fixing bracket 21, and the swing member 222 is fixedly connected to the connecting member; the heating mechanism 3 is fixedly connected with the swinging piece 222; the power mechanism 1 is connected with the swinging member 222 and is used for driving the swinging member 222 to swing around the axis of the connecting member.
The above-described link may have various configurations, for example, as shown in fig. 4C, the link includes two first link pins (221a, 221b) oppositely disposed on both sides (both sides in a direction parallel to the X axis) of the swinging member 222, both ends of each first link pin are respectively connected to the first fixed bracket 21 and the swinging member 222, and the first link pin is capable of rotating with respect to the first fixed bracket 21, and the swinging member 222 is fixedly connected to the first link pin. Specifically, the axes of the two first connecting pins (221a, 221b) are arranged coaxially with the rotation axis a (perpendicular to the vertical plane) shown in fig. 2, so that the two first connecting pins (221a, 221b) can rotate about the rotation axis a, thereby causing the swinging member 222 to swing about the rotation axis a. For example, two first connecting pins (221a, 221b) may be rotatably connected with the first fixing bracket 21 through bearings.
Alternatively, the connecting member may be fixedly connected to the first fixing bracket 21; the swing member 222 is rotatably connected to the link member; the heating mechanism 3 is fixedly connected with the swinging piece 222; the power mechanism 1 is connected with the swinging member 222 and is used for driving the swinging member 222 to swing around the axis of the connecting member. In this case, the connecting member may also include the two first connecting pins (221a, 221b), and the two first connecting pins (221a, 221b) are fixedly connected to the first fixing bracket 21 and rotatably connected to the swinging member 222. For example, two first connecting pins (221a, 221b) may be rotatably connected to the swinging member 222 through two bearings, respectively.
In the present embodiment, as shown in fig. 2 and 4A, the swing assembly 22 further includes a second connecting pin 223, the second connecting pin 223 is disposed on the swing member 222 and connected with the power mechanism 1, and an axis of the second connecting pin 223 and an axis of the connecting member (i.e., the rotation axis a) are perpendicular to each other. In this case, the power mechanism 1 can drive the swinging member 222 to swing by driving the second connecting pin 223 to rotate around the rotation axis a.
The structure of the swing member 222 may be various, for example, the swing member 222 includes a sphere, and since the size of the sphere in any direction in the three-dimensional space is the same, it is easier to connect the swing member 222 and the two first connecting pins (221a, 221b) and the second connecting pin 223 in the directions of the X axis and the Z axis, respectively, and it is more advantageous to swing in the vertical plane without interference from the surrounding components. However, the embodiment of the present invention is not limited to this, and in practical applications, the oscillating member 222 may also adopt any other structure, for example, a cylinder, and the axis of the cylinder is coaxial with the rotation axis a. Or may be ellipsoidal or of any other shape.
The structure of the power mechanism 1 may be various, for example, in the present embodiment, as shown in fig. 2, the power mechanism 1 includes a second fixed bracket 11, a driving motor 12, a first swing arm 13 and a second swing arm 14, wherein the second fixed bracket 11 is used for being fixedly connected with a chamber wall of the transfer chamber; the driving motor 12 is fixedly connected to the second fixing bracket 11, and the second fixing bracket 11 is fixedly connected to, for example, the upper cover 201 of the transfer chamber, so that the driving motor 12 can be suspended in the transfer chamber and located at one side of the swing assembly 22.
As shown in fig. 2 and 4A, the driving shaft 121 of the driving motor 12 is fixedly connected to one end of the first swing arm 13, the other end of the first swing arm 13 extends to one side of the actuator 2 and is fixedly connected to one end of the second swing arm 14, and the other end of the second swing arm 14 extends to the other side of the actuator 2 and is fixedly connected to the actuator 2. Specifically, the drive shaft 121 is disposed coaxially with the above-described rotation axis a, for example. And, as shown in fig. 2, the other end of the first swing arm 13 extends obliquely upward to the upper side of the swinging piece 222; as shown in fig. 4A, the other end of the first swing arm 13 is fixedly connected to one end of the second swing arm 14; the other end of the second swing arm 14 is fixedly connected to the swing mechanism 2 (i.e., the second connecting pin 223).
The driving motor 12 is used to provide a rotating power, and the switching of the swing direction is realized by switching the forward rotation and the reverse rotation. Optionally, the driving motor 12 is a servo motor, and the switching between the forward rotation and the reverse rotation of the servo motor can be controlled by the forward pulse signal and the reverse pulse signal. Under the driving of the driving motor 12, the first swing arm 13 swings around the rotation axis a, and the second swing arm 14 drives the swinging member 222 to swing synchronously.
In the present embodiment, the driving motor 12 transmits the rotational power to the swinging member 222 through the first swing arm 13 and the second swing arm 14, but the present invention is not limited to this embodiment, and any other transmission structure may be adopted in practical application as long as the transmission of the rotational power to the swinging member 222 is realized.
In summary, in the heating device in the semiconductor processing apparatus provided in the embodiment of the invention, the actuating mechanism is driven by the power mechanism to drive the heating mechanism to swing, and the heating mechanism transfers heat to different positions of the transmission component (for example, a robot finger) in the transmission chamber in a swinging process, so that the transmission component can be remotely and uniformly heated, and the heat transfer mode can reduce the risk of damage to the electronic component in the transmission component, thereby improving the service life of the transmission component and reducing the use cost. The heating device provided by the embodiment of the invention can be particularly applied to preheating the manipulator finger in the transmission chamber, compared with the prior art that the manipulator finger is baked in the process chamber, the heating device not only can enable the manipulator finger to take the wafer immediately after the process in the process chamber is finished, but also does not need time delay, thereby improving the productivity; meanwhile, the fingers are heated in the transmission chamber, so that the damage of electronic components in the manipulator due to high-temperature baking can be avoided, the service life of the manipulator can be prolonged, and the use cost is reduced.
As another technical solution, referring to fig. 5, a second embodiment of the present invention provides a semiconductor processing apparatus, which includes a transfer chamber 200, wherein the transfer chamber 200 includes a cavity, for example, the cavity includes a sidewall 202 and an upper cover 201 disposed on the top of the sidewall 202, and a heating device 100 is further disposed in the cavity, and the heating device 100 employs the heating device provided in the first embodiment of the present invention, so as to heat at least a portion of the transfer member 203.
The transfer member 203 is, for example, a robot arm that is movable between the transfer chamber 200 and a process chamber connected thereto through a gate valve to enable a wafer pick-and-place operation on a wafer in the process chamber.
In this embodiment, optionally, the actuating mechanism (i.e. via the second fixing bracket 11) and the actuating mechanism (i.e. via the first fixing bracket 21) of the heating device 100 are both disposed on the top wall of the transfer chamber, i.e. on the upper cover 201, so as to heat the transfer part 203 from above.
In some embodiments, in order to realize automatic control of heating, optionally, as shown in fig. 6, the above-mentioned transfer chamber 200 further includes a temperature detection device 300 and a control device (not shown in the figure), wherein the temperature detection device 300 is configured to detect an actual temperature value of a preset position on the transfer component 203 in real time and send the actual temperature value to the control device. Taking the transfer unit 203 as an example of a robot, the predetermined position is, for example, the position of the finger of the robot in the transfer chamber.
The temperature detection device 300 may be installed in various ways, for example, in some embodiments, optionally, as shown in fig. 7, the temperature detection device 300 is disposed on the top wall (i.e., the upper cover 201) of the transfer chamber and above the preset position of the transfer member 203. Alternatively, the temperature detection device 300 is, for example, a temperature detection device capable of detecting a high temperature, such as a pyrometer.
The control device is configured to compare the actual temperature value with the target temperature value, and when the actual temperature value is lower than the target temperature value, control the power mechanism (i.e., the driving motor) and the heating mechanism (e.g., the heating element is powered on and the air supply motor is turned on) in the heating device 100 to start, so that the heating mechanism can swing and face different positions of the transmission component 203 during the swinging process, and transfer heat; and when the actual temperature value is equal to or higher than the target temperature value, controlling the power mechanism and the heating mechanism to be closed so as to stop the heating mechanism from swinging and stop transferring heat. Thereby, the temperature control of the transfer member 203 can be automatically realized.
In practical application, after the control device controls the power mechanism and the heating mechanism to be closed, the actuating mechanism drives the heating mechanism to be reset to a position in the vertical direction, that is, the heating mechanism is located right below the actuating mechanism.
Referring to fig. 8, the present embodiment further provides a robot pick-up method, taking the transfer chamber 200 shown in fig. 5 as an example, the robot pick-up method including:
s1, before the fingers of the manipulator 203 enter the process chamber to perform the wafer taking operation, the heating device 100 is started to preheat the fingers of the manipulator 203;
s2, after the fingers of the robot 203 reach the target temperature value, the fingers of the robot 203 are controlled to enter the process chamber for taking the wafer.
Optionally, in order to automatically achieve that the temperature of the finger of the robot 203 reaches the target temperature value, taking the transfer chamber 200 shown in fig. 6 as an example, the step S1 specifically includes:
receiving an actual temperature value of the finger of the manipulator 203 detected by the temperature detection device 300 in real time;
comparing the actual temperature value with a preset target temperature value, and controlling a power mechanism and a heating mechanism of the heating device 100 to be started if the actual temperature value is lower than the target temperature value; if not, the power mechanism and the heating mechanism are controlled to be closed.
According to the semiconductor processing equipment provided by the embodiment of the invention, by adopting the heating device 100 provided by the embodiment of the invention, the risk of damage of electronic components in the transmission component can be reduced, so that the service life of the transmission component can be prolonged, and the use cost can be reduced. The method can be particularly applied to preheating the manipulator finger before the manipulator finger enters the process chamber to carry out the wafer taking operation, compared with the method of baking the manipulator finger in the process chamber in the prior art, the method can ensure that the manipulator finger can take the wafer immediately after the process in the process chamber is finished without time delay, thereby improving the productivity; meanwhile, the fingers are heated in the transmission chamber, so that the damage of electronic components in the manipulator due to high-temperature baking can be avoided, the service life of the manipulator can be prolonged, and the use cost is reduced.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A heating device in a semiconductor processing device is characterized in that the heating device is arranged in a transmission chamber of the semiconductor processing device and comprises a power mechanism, an actuating mechanism and a heating mechanism, wherein,
the actuating mechanism is respectively connected with the actuating mechanism and the heating mechanism, and the actuating mechanism is used for driving the actuating mechanism to drive the heating mechanism to swing; the heat generating mechanism faces different positions of the transfer member in the transfer chamber during the oscillation for transferring heat to the different positions of the transfer member.
2. The heating device of claim 1, wherein the heat generating mechanism comprises a housing and a heating element and an air supply assembly disposed in the housing, wherein,
the shell is relatively provided with an air inlet and an air outlet, and the heating element is positioned at the air outlet;
the air supply assembly is arranged on one side, close to the air inlet, of the heating element and used for blowing air to the air outlet.
3. The heating device of claim 1, wherein the actuator comprises a first fixed support and a swing assembly, wherein the first fixed support is fixedly connected to a chamber wall of the transfer chamber; the swing assembly is connected with the first fixed support in a swinging mode; the heating mechanism is fixedly connected with the swinging assembly;
the power mechanism is connected with the swinging assembly and used for driving the swinging assembly to swing.
4. The heating device of claim 3, wherein the oscillating assembly comprises a connecting member and an oscillating member, wherein the connecting member is rotatably connected to the first stationary bracket; the swinging piece is fixedly connected with the connecting piece; the heating mechanism is fixedly connected with the swinging piece; the power mechanism is connected with the swinging piece and used for driving the swinging piece to swing around the axis of the connecting piece; or
The swing assembly comprises a connecting piece and a swing piece, wherein the connecting piece is fixedly connected with the first fixed support; the swinging piece is rotatably connected with the connecting piece; the heating mechanism is fixedly connected with the swinging piece; the power mechanism is connected with the swinging piece and used for driving the swinging piece to swing around the axis of the connecting piece.
5. The heating apparatus as claimed in claim 4, wherein the connecting member includes two first connecting pins oppositely disposed at both sides of the oscillating member, and both ends of the first connecting pins are connected to the first fixing bracket and the oscillating member, respectively.
6. The heating device as claimed in claim 4, wherein the swing assembly further comprises a second connecting pin, the second connecting pin is disposed on the swing member and connected to the power mechanism, and an axis of the second connecting pin is perpendicular to an axis of the connecting member.
7. The heating device of claim 1, wherein the power mechanism comprises a second fixing bracket, a driving motor, a first swing arm and a second swing arm, wherein the second fixing bracket is used for fixedly connecting with a chamber wall of the transmission chamber; the driving motor with second fixed bolster fixed connection, just driving motor's drive shaft with the one end fixed connection of first swing arm, the other end of first swing arm extends to one side of actuating mechanism, with the one end fixed connection of second swing arm, the other end of second swing arm extends to actuating mechanism's opposite side, with actuating mechanism fixed connection.
8. A semiconductor processing apparatus comprising a transfer chamber having a transfer member disposed therein, wherein the transfer chamber further has a heating device as claimed in any one of claims 1 to 7 disposed therein for heating at least a portion of the transfer member.
9. The semiconductor processing equipment according to claim 8, further comprising a temperature detection device and a control device, wherein the temperature detection device is configured to detect an actual temperature value of a preset position on the transport component in real time and send the actual temperature value to the control device; the control device is used for comparing the actual temperature value with a target temperature value and controlling the power mechanism and the heating mechanism to be started when the actual temperature value is lower than the target temperature value; and controlling the power mechanism and the heating mechanism to be closed when the actual temperature value is equal to or higher than the target temperature value.
10. The semiconductor processing apparatus of claim 9, wherein the power mechanism and the actuator are both disposed on a top wall of the transfer chamber; and/or
The temperature detection device is arranged on the top wall of the transmission chamber and is positioned above the preset position.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110235086.6A CN113161262B (en) | 2021-03-03 | 2021-03-03 | Heating device in semiconductor processing equipment and semiconductor processing equipment |
| TW110149383A TWI782838B (en) | 2021-03-03 | 2021-12-29 | Heating device in semiconductor processing equipment and semiconductor processing equipment |
| PCT/CN2021/142367 WO2022183818A1 (en) | 2021-03-03 | 2021-12-29 | Heating device in semiconductor processing apparatus, and semiconductor processing apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110235086.6A CN113161262B (en) | 2021-03-03 | 2021-03-03 | Heating device in semiconductor processing equipment and semiconductor processing equipment |
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| CN113161262A true CN113161262A (en) | 2021-07-23 |
| CN113161262B CN113161262B (en) | 2022-06-14 |
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| Country | Link |
|---|---|
| CN (1) | CN113161262B (en) |
| TW (1) | TWI782838B (en) |
| WO (1) | WO2022183818A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022183818A1 (en) * | 2021-03-03 | 2022-09-09 | 北京北方华创微电子装备有限公司 | Heating device in semiconductor processing apparatus, and semiconductor processing apparatus |
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| CN105200387B (en) * | 2014-06-24 | 2018-05-25 | 北京北方华创微电子装备有限公司 | Heating control apparatus and Pvd equipment |
| CN113161262B (en) * | 2021-03-03 | 2022-06-14 | 北京北方华创微电子装备有限公司 | Heating device in semiconductor processing equipment and semiconductor processing equipment |
-
2021
- 2021-03-03 CN CN202110235086.6A patent/CN113161262B/en active Active
- 2021-12-29 WO PCT/CN2021/142367 patent/WO2022183818A1/en unknown
- 2021-12-29 TW TW110149383A patent/TWI782838B/en active
Patent Citations (5)
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| CN201672670U (en) * | 2010-05-17 | 2010-12-15 | 台州市中联电器有限公司 | Heater capable of automatically swinging around transverse shaft |
| CN104716077A (en) * | 2015-03-25 | 2015-06-17 | 上海华力微电子有限公司 | Heating type conveying cavity with controllable temperature and process device and temperature control heating method thereof |
| KR20160133171A (en) * | 2015-05-12 | 2016-11-22 | 주식회사 스피드터치 | An Equipment Front End Module having low dew point and low temperature |
| CN111048444A (en) * | 2018-10-15 | 2020-04-21 | 细美事有限公司 | Heating plate cooling method, substrate processing apparatus and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2022183818A1 (en) * | 2021-03-03 | 2022-09-09 | 北京北方华创微电子装备有限公司 | Heating device in semiconductor processing apparatus, and semiconductor processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI782838B (en) | 2022-11-01 |
| CN113161262B (en) | 2022-06-14 |
| TW202236473A (en) | 2022-09-16 |
| WO2022183818A1 (en) | 2022-09-09 |
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