KR20160087550A - Light emitting device, light emitting device package having the same, and light system having the same - Google Patents

Abstract

A light emitting device according to an embodiment includes a first conductivity type semiconductor layer, a second conductivity type semiconductor layer arranged under the first conductivity type semiconductor layer, an active layer arranged between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, holes which penetrate the second conductivity type semiconductor layer and the active layer from the lower surface of the second conductivity type semiconductor layer and expose part of the first conductivity type semiconductor layer, a first electrode layer which is electrically connected to the first conductivity type semiconductor layer through the holes from the lower surface of the second conductivity type semiconductor layer, and a substrate arranged under the first electrode. The substrate includes a metal-insulator-metal (MIM) type capacitor. So, the light emitting device can have a high-capacity capacitor against electrostatic discharge.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, a light emitting device package including the light emitting device,

Embodiments relate to a light emitting device, a light emitting device package including the same, and an illumination system including the same.

A light emitting diode is a pn junction diode in which electrical energy is converted into light energy. The light emitting diode can be produced as a compound semiconductor such as Group III and Group V on the periodic table. By controlling the composition ratio of the compound semiconductor, This is possible.

When the forward voltage is applied to the light emitting device, the electrons in the n-layer and the holes in the p-layer are coupled to emit energy corresponding to the energy gap between the conduction band and the valance band, Emitting device.

Nitride semiconductors have attracted great interest in the development of optical devices and high output electronic devices due to their high thermal stability and wide band gap energy. Particularly, a blue light emitting element, a green light emitting element, and an ultraviolet (UV) light emitting element using a nitride semiconductor are widely used for commercial use.

In a conventional light emitting device, a zener diode is connected in parallel to a light emitting device to prevent damage of an active layer from an electrostatic discharge (ESD), and the device is mounted in a package. However, light absorption due to zener diode connection degrades package performance and requires additional processing for mounting.

Embodiments provide a light emitting device, a light emitting device package, and an illumination system including a substrate having a large-capacity capacitor built in for protection from ESD.

Also, the embodiment is intended to provide a light emitting device, a light emitting device package, and an illumination system which are excellent in ESD resistance without using a zener diode.

The light emitting device according to the embodiment includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed below the first conductive semiconductor layer, and a second conductive semiconductor layer between the first conductive semiconductor layer and the second conductive semiconductor layer A plurality of holes penetrating the second conductivity type semiconductor layer and the active layer from a bottom surface of the second conductivity type semiconductor layer to expose a part of the first conductivity type semiconductor layer, A first electrode layer electrically connected to the first conductivity type semiconductor layer through the plurality of holes from a bottom surface of the first semiconductor layer, and a substrate disposed below the first electrode layer, the substrate including a metal-insulator- metal-type capacitors.

The light emitting device according to the embodiment includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed below the first conductive semiconductor layer, and a second conductive semiconductor layer between the first conductive semiconductor layer and the second conductive semiconductor layer A first electrode electrically connected to the first conductivity type semiconductor layer, a second electrode disposed below the second conductivity type semiconductor layer, and a substrate disposed below the second electrode, , The substrate may include a metal-insulator-metal (MIM) type capacitor.

The embodiment has the effect of protecting the active layer from ESD shock by providing a capacitor substrate of a large capacity.

In addition, the embodiment has the effect of increasing the light efficiency of the light emitting device package because there is no zener diode.

1 is a cross-sectional view of a light emitting device according to an embodiment.
2 is a conceptual diagram for explaining that the light emitting device shown in FIG. 1 protects the active layer from ESD.
3 is a cross-sectional view of a light emitting device according to another embodiment.
4 is a cross-sectional view of a light emitting device according to another embodiment.
5 to 7 are exploded perspective views showing embodiments of the illumination system including the light emitting device according to the embodiment.

In the description of the embodiments, each layer (film), region, pattern or structure is referred to as being "on" or "under" the substrate, each layer (film) Quot; on "and" under "are intended to include both" directly "or" indirectly " do. Also, the criteria for top, bottom, or bottom of each layer will be described with reference to the drawings.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

1 is a cross-sectional view of a light emitting device according to an embodiment.

1, a light emitting device 100 according to an embodiment includes a first conductive semiconductor layer 160, a second conductive semiconductor layer 140 disposed under the first conductive semiconductor layer 160, A light emitting structure 130 including a first conductive semiconductor layer 160 and an active layer 150 disposed between the first conductive semiconductor layer 160 and the second conductive semiconductor layer 140; A plurality of holes that penetrate the second conductivity type semiconductor layer 140 and the active layer 150 to expose a portion of the first conductivity type semiconductor layer 160 and a plurality of holes A first electrode layer 175 and a first electrode layer 170 electrically connected to the first conductivity type semiconductor layer 160 through holes of the first conductivity type semiconductor layer 140 and a second electrode layer 185 electrically connected to the second conductivity type semiconductor layer 140 A second electrode 180, and a substrate 110 disposed below the first electrode layer 175. The first electrode layer 175 may include a first electrode layer 175, a second electrode layer 180,

The substrate 110 includes a first conductive line 113 connected to the first electrode layer 175, a second conductive line 115 connected to the second electrode, a first conductive line 113, And an insulating layer 111 may be interposed between the insulating layer 111 and the insulating layer 115.

The first conductive line 113 and the second conductive line 115 may be alternately formed and the linewidths of the first conductive line 113 and the second conductive line 115 may be the same , The distance between the first conductive line 113 and the second conductive line 115 may be constant but is not limited thereto.

The insulating layer 111 may be disposed between the first conductive line 113 and the second conductive line 115 to separate the first conductive line 113 and the second conductive line 115 from each other. The first conductive line 113 and the second conductive line 115 may have the shape of a fork and the width of the first conductive line 113 and the distance between the first conductive line 113 and the second conductive line 115, To adjust the capacitance.

That is, the light emitting device according to the embodiment can arrange a metal-insulator-metal (MIM) type capacitor substrate under the light emitting structure 130 to protect the light emitting device from ESD. Further, by embodying the substrate 110 with a capacitor, it is possible to have a large capacitance and to protect the light emitting element from ESD.

The first conductivity type semiconductor layer 160 is formed of a Group III-V compound semiconductor doped with the first conductivity type dopant, and the first conductivity type semiconductor layer 160 is formed of In _x Al _y Ga _1-xy N (0 1, 0? Y? 1, 0? X + y? 1). The first conductive semiconductor layer 160 may have a stacked structure of layers including at least one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. . The first conductivity type semiconductor layer 160 is an n-type semiconductor layer, and the first conductivity type dopant is an n-type dopant including Si, Ge, Sn, Se, and Te. An electrode may be further disposed on the first conductivity type semiconductor layer.

The active layer 150 is formed by the electron (or hole) injected through the first conductivity type semiconductor layer 160 and the holes (or electrons) injected through the second conductivity type semiconductor layer 140, The light emitting layer is a layer that emits light due to a band gap difference of an energy band according to a forming material of the light emitting layer. The active layer 130 may be formed of any one of a single well structure, a multi-well structure, a quantum dot structure, and a quantum wire structure, but is not limited thereto.

The second conductive semiconductor layer 140 may include a semiconductor doped with a second conductive dopant such as In _x Al _y Ga _1-xy N (0? X? 1, 0? _Y? 1, 0? _X + ). The second conductive semiconductor layer 140 may be formed of any one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP and AlGaInP. The second conductivity type semiconductor layer 140 may be a p-type semiconductor layer, and the second conductivity type dopant may include Mg, Zn, Ca, Sr, and Ba as p-type dopants.

The second conductive semiconductor layer 140 may include a superlattice structure, and the superlattice structure may include an InGaN / GaN superlattice structure or an AlGaN / GaN superlattice structure. The superlattice structure of the second conductivity type semiconductor layer 140 may protect the active layer by diffusing a current contained in the voltage abnormally.

For example, the first conductive semiconductor layer 160 may be a p-type semiconductor layer, the second conductive semiconductor layer 140 may be an n-type semiconductor layer, As shown in FIG. A first conductive semiconductor layer having a polarity opposite to that of the second conductive semiconductor layer may be further disposed on the second conductive semiconductor layer 140.

The light emitting structure 130 may be formed of any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure. Here, p is a p-type semiconductor layer, and n is an n-type semiconductor layer, and the - includes a structure in which the p-type semiconductor layer and the n-type semiconductor layer are in direct contact or indirect contact.

In the embodiment, the light emitting structure 130 is a via hole type vertical type, but it is not limited thereto.

The first electrode layer 175 may electrically connect the first conductive semiconductor layer 160 and the first electrode 170 through the plurality of holes and the second electrode layer 185 may connect the second electrode 180 The second conductive semiconductor layer 140 may be electrically connected.

2 is a conceptual diagram for explaining that the light emitting device shown in FIG. 1 protects the active layer from ESD.

Referring to FIGS. 1 and 2, an equivalent circuit diagram of a light emitting structure 130 and a substrate 110 is shown. The light emitting structure 130 may be connected in parallel with the substrate 110. When the transient overvoltage is applied to the light emitting structure 130, the light emitting structure 130 can be protected. Thus, the reliability for ESD can be improved through the capacitor substrate 110 without using a zener diode.

3 is a cross-sectional view of a light emitting device according to another embodiment.

1 to 3, a light emitting device 100 according to an embodiment may be connected to a first lead frame 213 and a second lead frame 214 disposed on a package body. When the first lead frame 213 and the second lead frame 214 are electrically separated from each other, power can be supplied to the light emitting device 100.

The light emitting device 100 may be electrically connected to the first lead frame 213 and / or the second lead frame 214 by any one of wire type, flip chip type and die bonding methods. Although the light emitting device 100 is electrically connected to the first lead frame 213 and the second lead frame 214 through wires, the present invention is not limited thereto.

The first electrode 170 may be connected to the first lead frame 213 and the second electrode 180 may be connected to the second lead frame 214 and the light emitting structure 130 and the substrate 110 May be connected in parallel to protect the light emitting structure 130 from the ESD.

4 is a cross-sectional view of a light emitting device according to another embodiment.

Referring to FIG. 4, the light emitting device 100 includes a first conductive semiconductor layer 160, a second conductive semiconductor layer 140 disposed under the first conductive semiconductor layer 160, An active layer 150 disposed between the first conductivity type semiconductor layer 160 and the second conductivity type semiconductor layer 140 and a first electrode 170 electrically connected to the first conductivity type semiconductor layer 160, And a second electrode 180 disposed below the second conductive semiconductor layer 140 and includes a substrate 110 disposed below the second electrode 180. The substrate 110 may include a metal- insulator-metal-type capacitors.

The substrate 110 includes a second conductive line 115 connected to the first electrode 170, a first conductive line 113 connected to the second electrode 180, a first conductive line 115 connected to the first electrode 170, An insulating layer may be interposed between the first and second electrodes. The first conductive line and the second conductive line may be alternately formed.

The line widths of the first conductive line 113 and the second conductive line 115 may be the same and the interval between the first conductive line 113 and the second conductive line 115 may be constant, It is not.

The insulating layer 111 may be disposed between the first conductive line 113 and the second conductive line 115 to separate the first conductive line 113 and the second conductive line 115 from each other. The first conductive line 113 and the second conductive line 115 may be formed in a plurality of layers and the width and the separation distance of the first conductive line 113 and the second conductive line 115 may be adjusted So that the capacitance can be adjusted.

The first electrode 170 may be connected to the first lead frame 213 and the second electrode 180 may be connected to the second lead frame 214 and the light emitting structure 130 and the substrate 110 May be connected in parallel to protect the light emitting structure 130 from the ESD.

5 to 7 are exploded perspective views showing embodiments of the illumination system including the light emitting device according to the embodiment.

5 is a cross-sectional view of a light emitting device package according to an embodiment.

The light emitting device package according to the present invention may be mounted with the light emitting device having the structure as described above.

The light emitting device package 200 includes a package body 205, a first lead frame 213 and a second lead frame 214 disposed on the package body 205, A light emitting device 100 disposed on the first lead frame 213 and electrically connected to the first lead frame 213 and the second lead frame 214 and a molding member 230 surrounding the light emitting device 100.

The package body 205 may be formed of a silicon material, a synthetic resin material, or a metal material, and the inclined surface may be formed around the light emitting device 100.

The first lead frame 213 and the second lead frame 214 are electrically isolated from each other and provide power to the light emitting device 100. The first lead frame 213 and the second lead frame 214 may reflect the light generated from the light emitting device 100 to increase the light efficiency. And may also serve to discharge generated heat to the outside.

The light emitting device 100 may be disposed on the package body 205 or may be disposed on the first lead frame 213 or the second lead frame 214.

The light emitting device 100 may be electrically connected to the first lead frame 213 and / or the second lead frame 214 by any one of wire, flip chip, and die bonding methods. The light emitting device 100 is electrically connected to the first lead frame 213 and the second lead frame 214 through wires, but the present invention is not limited thereto.

The molding member 230 surrounds the light emitting device 100 to protect the light emitting device 100. In addition, the molding member 230 may include a phosphor 232 to change the wavelength of light emitted from the light emitting device 100.

6 and 7 are views showing a lighting apparatus according to an embodiment.

6, the illumination device according to the embodiment includes a cover 2100, a light source module 2200, a heat discharger 2400, a power supply unit 2600, an inner case 2700, a socket 2800, . Further, the illumination device according to the embodiment may further include at least one of the member 2300 and the holder 2500. The light source module 2200 may include the light emitting device 100 or the light emitting device package 200 according to the present invention.

For example, the cover 2100 may have a shape of a bulb or a hemisphere, and may be provided in a shape in which the hollow is hollow and a part is opened. The cover 2100 may be optically coupled to the light source module 2200. For example, the cover 2100 may diffuse, scatter, or excite light provided from the light source module 2200. The cover 2100 may be a kind of optical member. The cover 2100 may be coupled to the heat discharging body 2400. The cover 2100 may have an engaging portion that engages with the heat discharging body 2400.

The inner surface of the cover 2100 may be coated with a milky white paint. Milky white paints may contain a diffusing agent to diffuse light. The surface roughness of the inner surface of the cover 2100 may be larger than the surface roughness of the outer surface of the cover 2100. This is for sufficiently diffusing and diffusing the light from the light source module 2200 and emitting it to the outside.

The cover 2100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance and strength. The cover 2100 may be transparent so that the light source module 2200 is visible from the outside, and may be opaque. The cover 2100 may be formed by blow molding.

The light source module 2200 may be disposed on one side of the heat discharging body 2400. Accordingly, heat from the light source module 2200 is conducted to the heat discharger 2400. The light source module 2200 may include a light source unit 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on the upper surface of the heat discharging body 2400 and has guide grooves 2310 through which the plurality of light source portions 2210 and the connector 2250 are inserted. The guide groove 2310 corresponds to the substrate of the light source unit 2210 and the connector 2250.

The surface of the member 2300 may be coated or coated with a light reflecting material. For example, the surface of the member 2300 may be coated or coated with a white paint. The member 2300 reflects the light reflected by the inner surface of the cover 2100 toward the cover 2100 in the direction toward the light source module 2200. Therefore, the light efficiency of the illumination device according to the embodiment can be improved.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Therefore, electrical contact can be made between the heat discharging body 2400 and the connecting plate 2230. The member 2300 may be formed of an insulating material to prevent an electrical short circuit between the connection plate 2230 and the heat discharging body 2400. The heat discharger 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to dissipate heat.

The holder 2500 blocks the receiving groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 housed in the insulating portion 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 has a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside and provides the electrical signal to the light source module 2200. The power supply unit 2600 is housed in the receiving groove 2719 of the inner case 2700 and is sealed inside the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide 2630, a base 2650, and an extension 2670.

The guide portion 2630 has a shape protruding outward from one side of the base 2650. The guide portion 2630 may be inserted into the holder 2500. A plurality of components may be disposed on one side of the base 2650. The plurality of components include, for example, a DC converter for converting AC power supplied from an external power source into DC power, a driving chip for controlling driving of the light source module 2200, an ESD (ElectroStatic discharge) protective device, and the like, but the present invention is not limited thereto.

The extension portion 2670 has a shape protruding outward from the other side of the base 2650. The extension portion 2670 is inserted into the connection portion 2750 of the inner case 2700 and receives an external electrical signal. For example, the extension portion 2670 may be provided to be equal to or smaller than the width of the connection portion 2750 of the inner case 2700. One end of each of the positive wire and the negative wire is electrically connected to the extension portion 2670 and the other end of the positive wire and the negative wire are electrically connected to the socket 2800 .

The inner case 2700 may include a molding part together with the power supply part 2600. The molding part is a hardened portion of the molding liquid so that the power supply unit 2600 can be fixed inside the inner case 2700.

7, the lighting apparatus according to the present invention includes a cover 3100, a light source unit 3200, a heat sink 3300, a circuit unit 3400, an inner case 3500, and a socket 3600. As shown in FIG. can do. The light source unit 3200 may include a light emitting device or a light emitting device package according to the embodiment.

The cover 3100 has a bulb shape and is hollow. The cover 3100 has an opening 3110. The light source unit 3200 and the member 3350 can be inserted through the opening 3110. [

The cover 3100 may be coupled to the heat discharging body 3300 and surround the light source unit 3200 and the member 3350. The light source part 3200 and the member 3350 may be shielded from the outside by the combination of the cover 3100 and the heat discharging body 3300. The coupling between the cover 3100 and the heat discharging body 3300 may be combined through an adhesive, or may be combined by various methods such as a rotational coupling method and a hook coupling method. The rotation coupling method is a method in which a screw thread of the cover 3100 is engaged with a thread groove of the heat dissipating body 3300 so that the cover 3100 is coupled to the heat dissipating body 3300 by rotation of the cover 3100 In the hook coupling method, the protrusion of the cover 3100 is inserted into the groove of the heat discharging body 3300, and the cover 3100 and the heat discharging body 3300 are coupled.

The cover 3100 is optically coupled to the light source unit 3200. Specifically, the cover 3100 may diffuse, scatter, or excite light from the light emitting device 3230 of the light source unit 3200. The cover 3100 may be a kind of optical member. Here, the cover 3100 may have a phosphor inside / outside or in the inside thereof to excite light from the light source part 3200.

The inner surface of the cover 3100 may be coated with a milky white paint. Here, the milky white paint may include a diffusing agent for diffusing light. The surface roughness of the inner surface of the cover 3100 may be larger than the surface roughness of the outer surface of the cover 3100. This is for sufficiently scattering and diffusing light from the light source part 3200.

The cover 3100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance and strength. The cover 3100 may be a transparent material that can be seen from the outside of the light source unit 3200 and the member 3350, and may be an invisible and opaque material. The cover 3100 may be formed, for example, by blow molding.

The light source unit 3200 is disposed on the member 3350 of the heat sink 3300 and may be disposed in a plurality of units. Specifically, the light source portion 3200 may be disposed on at least one of the plurality of side surfaces of the member 3350. The light source unit 3200 may be disposed at the upper end of the member 3350.

The light source portion 3200 may be disposed on three of the six sides of the member 3350. However, the present invention is not limited thereto, and the light source portion 3200 may be disposed on all the sides of the member 3350. The light source unit 3200 may include a substrate 3210 and a light emitting device 3230. The light emitting device 3230 may be disposed on one side of the substrate 3210.

The substrate 3210 has a rectangular plate shape, but is not limited thereto and may have various shapes. For example, the substrate 3210 may have a circular or polygonal plate shape. The substrate 3210 may be a printed circuit pattern on an insulator. For example, the substrate 3210 may be a printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB . ≪ / RTI > In addition, a COB (Chips On Board) type that can directly bond an unpackaged LED chip on a printed circuit board can be used. In addition, the substrate 3210 may be formed of a material that efficiently reflects light, or may be formed of a color whose surface efficiently reflects light, for example, white, silver, or the like. The substrate 3210 may be electrically connected to the circuit unit 3400 housed in the heat discharging body 3300. The substrate 3210 and the circuit portion 3400 may be connected, for example, via a wire. The wire may pass through the heat discharging body 3300 to connect the substrate 3210 and the circuit unit 3400.

The light emitting device 3230 may be a light emitting diode chip that emits red, green, or blue light, or a light emitting diode chip that emits UV light. Here, the light emitting diode chip may be a lateral type or a vertical type, and the light emitting diode chip may emit blue, red, yellow, or green light. .

The light emitting device 3230 may have a phosphor. The phosphor may be at least one of a garnet system (YAG, TAG), a silicate system, a nitride system, and an oxynitride system. Alternatively, the fluorescent material may be at least one of a yellow fluorescent material, a green fluorescent material, and a red fluorescent material.

The heat discharging body 3300 may be coupled to the cover 3100 to dissipate heat from the light source unit 3200. The heat discharging body 3300 has a predetermined volume and includes an upper surface 3310 and a side surface 3330. A member 3350 may be disposed on the upper surface 3310 of the heat discharging body 3300. An upper surface 3310 of the heat discharging body 3300 can be engaged with the cover 3100. The upper surface 3310 of the heat discharging body 3300 may have a shape corresponding to the opening 3110 of the cover 3100.

A plurality of radiating fins 3370 may be disposed on the side surface 3330 of the heat discharging body 3300. The radiating fin 3370 may extend outward from the side surface 3330 of the heat discharging body 3300 or may be connected to the side surface 3330. The heat dissipation fin 3370 may increase the heat dissipation area of the heat dissipator 3300 to improve heat dissipation efficiency. Here, the side surface 3330 may not include the radiating fin 3370.

The member 3350 may be disposed on the upper surface 3310 of the heat discharging body 3300. The member 3350 may be integral with the top surface 3310 or may be coupled to the top surface 3310. The member 3350 may be a polygonal column. Specifically, the member 3350 may be a hexagonal column. The hexagonal column member 3350 has an upper surface, a lower surface, and six sides. Here, the member 3350 may be a circular column or an elliptic column as well as a polygonal column. When the member 3350 is a circular column or an elliptic column, the substrate 3210 of the light source portion 3200 may be a flexible substrate.

The light source unit 3200 may be disposed on six sides of the member 3350. The light source unit 3200 may be disposed on all six sides and the light source unit 3200 may be disposed on some of the six sides. In Fig. 11, the light source unit 3200 is disposed on three sides of six sides.

The substrate 3210 is disposed on a side surface of the member 3350. The side surface of the member 3350 may be substantially perpendicular to the upper surface 3310 of the heat discharging body 3300. Accordingly, the upper surface 3310 of the substrate 3210 and the heat discharging body 3300 may be substantially perpendicular to each other.

The material of the member 3350 may be a material having thermal conductivity. This is to receive the heat generated from the light source 3200 quickly. The material of the member 3350 may be, for example, aluminum (Al), nickel (Ni), copper (Cu), magnesium (Mg), silver (Ag), tin (Sn) Or the member 3350 may be formed of a thermally conductive plastic having thermal conductivity. Thermally conductive plastics are advantageous in that they are lighter in weight than metals and have unidirectional thermal conductivity.

The circuit unit 3400 receives power from the outside and converts the supplied power to the light source unit 3200. The circuit unit 3400 supplies the converted power to the light source unit 3200. The circuit unit 3400 may be disposed on the heat discharging body 3300. Specifically, the circuit unit 3400 may be housed in the inner case 3500 and stored in the heat discharging body 3300 together with the inner case 3500. The circuit portion 3400 may include a circuit board 3410 and a plurality of components 3430 mounted on the circuit board 3410.

The circuit board 3410 has a circular plate shape, but is not limited thereto and may have various shapes. For example, the circuit board 3410 may be in the shape of an oval or polygonal plate. Such a circuit board 3410 may be one in which a circuit pattern is printed on an insulator.

The circuit board 3410 is electrically connected to the substrate 3210 of the light source unit 3200. The electrical connection between the circuit board 3410 and the substrate 3210 may be connected by wire, for example. The wires may be disposed inside the heat discharging body 3300 to connect the circuit board 3410 and the substrate 3210.

The plurality of components 3430 include, for example, a DC converter for converting AC power supplied from an external power source to DC power, a driving chip for controlling the driving of the light source 3200, An electrostatic discharge (ESD) protection device, and the like.

The inner case 3500 houses the circuit portion 3400 therein. The inner case 3500 may have a receiving portion 3510 for receiving the circuit portion 3400.

The receiving portion 3510 may have a cylindrical shape as an example. The shape of the accommodating portion 3510 may vary depending on the shape of the heat discharging body 3300. The inner case 3500 can be housed in the heat discharging body 3300. The receiving portion 3510 of the inner case 3500 may be received in a receiving portion formed on the lower surface of the heat discharging body 3300.

The inner case 3500 may be coupled to the socket 3600. The inner case 3500 may have a connection portion 3530 that engages with the socket 3600. The connection portion 3530 may have a threaded structure corresponding to the thread groove structure of the socket 3600. The inner case 3500 is nonconductive. Therefore, electrical short circuit between the circuit portion 3400 and the heat discharging body 3300 is prevented. For example, the inner case 3500 may be formed of plastic or resin.

The socket 3600 may be coupled to the inner case 3500. Specifically, the socket 3600 may be engaged with the connection portion 3530 of the inner case 3500. The socket 3600 may have the same structure as a conventional incandescent bulb. The circuit portion 3400 and the socket 3600 are electrically connected. The electrical connection between the circuit part 3400 and the socket 3600 may be connected via a wire. Accordingly, when external power is applied to the socket 3600, the external power may be transmitted to the circuit unit 3400. The socket 3600 may have a screw groove structure corresponding to the threaded structure of the connection portion 3550.

110; Board
120; Protective layer
130; Light emitting structure
140; The second conductive type semiconductor layer
150; Active layer
160; The first conductive semiconductor layer
170; The first electrode
175; The first electrode layer
180; The second electrode
185; The second electrode layer

Claims (15)

A first conductive semiconductor layer;
A second conductive semiconductor layer disposed under the first conductive semiconductor layer;
An active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer;
A plurality of holes passing through the second conductivity type semiconductor layer and the active layer from a bottom surface of the second conductivity type semiconductor layer to expose a part of the first conductivity type semiconductor layer;
A first electrode layer electrically connected to the first conductivity type semiconductor layer from the bottom surface of the second conductivity type semiconductor layer through the plurality of holes; And
And a substrate disposed below the first electrode layer,
Wherein the substrate comprises a metal-insulator-metal (MIM) type capacitor. The method according to claim 1,
Wherein:
A first conductive line connected to the first electrode layer;
A second conductive line connected to the second electrode layer; And
And an insulating layer between the first conductive line and the second conductive line. 3. The method of claim 2,
Wherein the first conductive line and the second conductive line are alternately formed. 3. The method of claim 2,
Wherein the first conductive line and the second conductive line have the same line width. 3. The method of claim 2,
Wherein a distance between the first conductive line and the second conductive line is constant. 3. The method of claim 2,
Wherein the first conductive line and the second conductive line are spaced apart from each other by the insulating layer. 3. The method of claim 2,
Wherein the first conductive line and the second conductive line are in a fork shape. The method according to claim 1,
And a first electrode electrically connected to the first electrode layer. A first conductive semiconductor layer;
A second conductive semiconductor layer disposed under the first conductive semiconductor layer;
An active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer;
A first electrode layer electrically connected to the first conductive semiconductor layer;
A second electrode layer disposed under the second conductive semiconductor layer; And
And a substrate disposed below the second electrode layer,
Wherein the substrate comprises a metal-insulator-metal (MIM) type capacitor. 10. The method of claim 9,
Wherein:
A second conductive line connected to the first electrode;
A first conductive line connected to the second electrode; And
And an insulating layer between the first conductive line and the second conductive line. 11. The method of claim 10,
Wherein the first conductive line and the second conductive line are alternately formed. 11. The method of claim 10,
Wherein the first conductive line and the second conductive line have the same line width. 11. The method of claim 10,
Wherein a distance between the first conductive line and the second conductive line is constant. 11. The method of claim 10,
Wherein the first conductive line and the second conductive line are spaced apart from each other by the insulating layer. An illumination system comprising a light-emitting device according to any one of claims 1 to 14.

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