KR20160085457A - Double plungers interconnected pogo pin and manufacturing method of it - Google Patents

Abstract

The present invention relates to a pogo pin composed of a probing unit and an elastic unit. More specifically, the present invention relates to the pogo pin having interconnected upper/lower probing units, which may minimize a manufacturing process and production costs, as the cylinder-shaped upper/lower probing units and the elastic unit are integrated with one another, wherein the upper/lower probing units and the elastic unit constitute the pogo pin, which is configured to transmit an electric signal between electronic components including a semiconductor wafer, a LCD module, a semiconductor package, various types of sockets, and so forth. In addition, an external diameter of the pogo pin may be minimized, as the elastic unit surrounds the cylinder-shaped lower probing unit. Also, loss and a distortion of the electric signal may be minimized by allowing the lower probing unit to come into contact with the upper probing unit through surfaces thereof, and moving distances of the upper/lower probing units may be separately selected depending on user′s necessity.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a pogo pin,

The present invention relates to a pogo pin comprising a probe portion and an elastic portion. More specifically, the present invention relates to a pogo pin comprising a probe portion and an elastic portion,

A probe for connecting upper and lower probes, and a pogo pin for connecting upper and lower probes, which are formed as a cylindrical upper and lower probe portions, upper and lower inserting portions, and elastic portions constituting a pogo pin for transmitting an electric signal.

Spring probe pins, also known as Pogo pins, are semiconductor wafers, LCD modules,

La module, image sensor and semiconductor package, as well as various sockets,

It is a widely used part for battery connection of the device.

Conventional pogo pins generally include a top probe 12,

A spring 14 for applying an elastic force to the probe 13, the upper probe 12 and the lower probe 13,

A cylindrical body for receiving the lower end of the probe 12 and the upper end of the lower probe 13 and the spring 14

(11).

One end of the upper probe 12 and the lower probe 13 are hooked on the cylindrical body 11,

The separation from the body 11 to the outside is prevented, and between the upper probe 12 and the lower probe 13

And the elastic force is received by the spring 14 provided on the outer circumferential surface.

2 is a cross-sectional view showing a plurality of pogo pins housed in one insulative body, illustrating a socket for inspecting a semiconductor package. Socket for inspection of semiconductor packages (20)

A plurality of pogo pins 6, an insulating main body 1 for housing a plurality of pogo pins at predetermined intervals,

. The plurality of pogo pins 6 are arranged such that the upper probe 12 protrudes from the upper surface of the insulating main body 1

And the lower probe (13) protrudes from the bottom surface of the insulating main body (1), and between the pogo pin

The interval between the external terminals 3a of the semiconductor package 3 contacting the upper probe 12

The same as the contact pad 5a of the test board 5 contacting the lower probe 13

And is accommodated in the insulating main body 1 at an interval.

When the semiconductor package (3) is pressed to inspect the semiconductor package,

The external terminals 3a of the comb are brought into contact with the upper probe 12 of the pogo pin 6,

Is contacted with the contact pad 5a of the test board 5,

The upper probe 12 and the lower probe 13 are elastically supported by the ring 14,

The semiconductor package can be accurately inspected by electrically connecting the body package 3 and the test board 5.

However, as shown in FIGS. 1 and 2, pogo pins must be provided for each terminal interval of the semiconductor package, and miniaturization, integration, and high performance of the semiconductor package

The size of the pogo pin for inspection of the semiconductor package, that is, the outer diameter of the pogo pin must be reduced. In order to transmit the high frequency electrical signal without distortion, the transmission path must be stable and the impedance on the transmission path must be minimized. However, since the conventional pogo pin has to satisfy the outer diameter of the cylindrical body which accommodates the spring and the spring as the cylindrical body is provided outside the spring, there is a problem that the outer diameter can not be reduced to a certain size or less. Also, the path through the spring 14 is not suitable as an electric path because the path is long by the number of times the spring is wound and is wound like a coil so as to include a resistance component and an inductance component. Therefore, since the conventional pogo pin must use an electrical path through the upper probe 12, the cylindrical body 11 and the lower probe 13, the gap between the upper probe 12 and the cylindrical body 11, the cylindrical body 11, There is a problem that electrical contact between the lower probe 13 and the lower probe 13 must be precisely maintained.

Also, in the manufacturing process of the conventional pogo pin, the cylindrical body, the upper probe,

The probe and the spring are separately manufactured, and the upper probe and the lower probe are connected to the cylindrical body

There is a disadvantage that the manufacturing process is complicated, the time is long, and the manufacturing cost is increased.

SUMMARY OF THE INVENTION The present invention has been made to solve the problems of the prior art, and it is an object of the present invention to provide a pogo pin and its manufacturing method capable of minimizing its outer diameter so as to be suitable for application to a high degree of integration.

Also, it is intended to provide a pogo pin which can simplify the manufacturing process to facilitate mass production of pogo pin, and to minimize manufacturing cost, and a method of manufacturing the same.

Also, it is intended to provide a method for manufacturing a pogo pin which can prevent waste of materials and prevent defective products from occurring in an order of efficient manufacturing process.

A pogo pin for minimizing and simplifying a path of a signal detected by the upper probe portion or the lower probe portion to the lower probe portion or the upper probe portion to minimize the loss and distortion of the electric signal and improve the signal quality; .

The present invention provides a pogo pin and a method of manufacturing the same that can select the moving distance of the upper probe and the moving distance of the lower probe from one pogo pin separately or determine the elastic force of the upper probe and the elastic force of the lower probe differently.

According to an aspect of the present invention, there is provided a pogo pin comprising an upper probe, a lower probe, a connection part, and an elastic part located between the upper probe and the lower probe and surrounding the connection,

a) the upper probe includes a first body and an attachment provided at an upper end of the first body, the first body including a cylindrical opening which is hollow at the lower end,

b) the lower probe includes a second body and an attachment provided at a lower end of the second body, the second body includes a cylindrical opening that is hollowed at the upper end,

c) said connecting portion includes an upper insertion portion and a lower insertion portion which can be inserted into said opening (s)

d) The resilient portion is divided into two branches in a state where one end of the resilient portion is fixed to one side of the connecting portion, one end of the resilient portion surrounds the outer surface of the upper insertion portion and the other end of the resilient portion is fixed to the lower end of the upper probe, And a spring fixed to the upper end of the lower probe portion at the other end,

Probe-connected pogo pin is provided.

According to another preferred embodiment of the present invention, there is provided a probe-connected pogo pin comprising a single member which is integrally formed with the upper probe, the lower probe and the elastic portion.

According to still another preferred embodiment of the present invention, the upper and lower probe-connected pogo pin is spaced apart from the opening (s) and the insertion portion (s) when no external force is applied to the elastic portion.

According to another preferred embodiment of the present invention, the upper insertion portion is inserted into the upper opening portion and the lower insertion portion is inserted into the lower opening portion, respectively, so that, in a state where no external force is applied to the elastic portion, Since the opening portion (s) and the insertion portion (s) are independently inserted and moved when an external force is applied to the elastic portion, the moving distance of the upper probe portion and the moving distance of the lower probe portion Upper and lower probe connection pogo pins are available to select separately.

According to another preferred embodiment of the present invention, a pogo pin comprising an upper probe, a lower probe, and an elastic part positioned between the upper probe and the lower probe,

A) an upper probe portion deployment portion formed with an attached deployment portion at an upper end;

A lower probe part developing part formed at a lower end of the lower probe part, and a strip-shaped elastic deformation part connecting the upper probe part developing part and the lower probe part developing part to each other, The plate portion of the sub-expanding portion is formed by a rolling means to form a lower or upper part of the lower probe portion and a portion of the upper or lower portion of the probe portion is wrapped around the outer surface of the lower portion of the insertion portion Forming a circular prototype pin integrally formed with the upper probe portion, the lower probe portion and the elastic portion so as to be formed into a cylindrical shape; c) curing the circular prototype pin by heat treatment, A method of manufacturing a probe-connected pogo pin, comprising the steps of:

According to still another preferred embodiment of the present invention, the circular pogo pin

There is provided a method of manufacturing an upper and lower probe-connected pogo pin in which the insertion portion (s) is not inserted into the probe portion (s) while the force is not applied.

According to still another preferred embodiment of the present invention,

There is provided a method for producing a pogo pin connected to a vertical probe, wherein the pogo pin is plated with gold after nickel plating.

The present invention eliminates the outer body used to wrap the springs in conventional pogo pins

To minimize the outer diameter of the pogo pin, thereby reducing the minimum spacing between the pogo pins arranged

And can be used in highly integrated electronic components and test equipment.

In addition, the upper probe portion and the upper insertion portion, and the lower probe portion and the lower insertion portion are in direct surface contact with each other to transmit a signal, thereby minimizing the loss and distortion of the electrical signal. In addition, through the simplification and unification of the manufacturing process, high-speed and mass production can be achieved, and the effect of manufacturing cost reduction can be expected.

Another object of the present invention is to provide a pogo pin and a method of manufacturing the same that can select the moving distance of the upper probe part and the moving distance of the lower probe part separately or as different from the elastic force of the upper probe part and the elastic force of the lower probe part

1 is a cross-sectional view of a conventional pogo pin.
2 is a sectional view of a socket for inspection of a semiconductor package using a conventional pogo pin.
3 is a perspective view of one embodiment of the pogo pin of the present invention.
4 is an exploded view of one embodiment of the pogo pin of the present invention.
FIG. 5 is a cross-sectional view of the pogo pin of the present invention before compression (left) and after compression (right)
to be.
Fig. 6 illustrates the separation of the cross section of the insertion portion of the pogo pin of the present invention during bending.

The present invention comprises an upper probe portion, a lower probe portion, and an elastic portion forming a spring

The pogo pin is formed such that a part or the whole of the upper probe and the lower probe forms a cylindrical body and the pogo pin is formed without a separate body surrounding the elastic part so that the outer diameter can be minimized.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In the following description of the present invention, however, it is to be understood that the present invention is not limited to the disclosed embodiments.

3, the pogo pin of the present invention comprises an upper probe 100, a lower probe 101, and elastic portions 300 and 301 located between the upper probe and the lower probe . The upper probe unit 100, the lower probe unit 101, and the elastic units 300 and 301 constituting the pogo pin may be independently formed and then coupled to each other to form a pogo pin. However, And a single member integrally formed to facilitate mass production is preferably used as follows to form the pogo pin.

FIG. 4 is an exploded view of an embodiment of a pogo pin of the present invention, in which a single member in a thin plate shape is cut through a process of punching, and the plate is folded, rolled, rolled, , Or rolled to form the pogo pin of the present invention. The plate-like single member of the present invention is an electrically conductive metal plate material having a predetermined elongation property and capable of increasing elasticity and strength through heat treatment and having a small electrical resistance. Accordingly, beryllium copper alloy is preferred, and beryllium copper 25 alloy ASTM C17200 is preferred, but other materials satisfying mechanical and electrical properties can be used.

The upper probe unit 100 includes an attachment 120 provided at an upper end portion and a cylindrical upper opening portion 130 hollowed at a lower end portion of the upper probe portion,

And a cylindrical lower opening portion (131) hollowed in an upper end portion of the lower probe portion,

The upper insertion portion 200 is provided at the upper end of the insertion portion 1000 and has a diameter that can be inserted into the upper opening portion 130. The lower insertion portion 200 is provided at the lower end portion of the insertion portion 1000, And has a diameter that can be inserted into the opening 131. The attachments 120 and 220 are located at both ends of the pogo pin of the present invention and are in direct contact with the test terminals and the contact pads and may be formed in various shapes. However, in order to make accurate contact with the test terminals, .

4 and 5, the openings 130 and 131 and the inserting portions 200 and 201 are formed in a state in which no elastic force is applied to the elastic portions 300 and 301 So that they are spaced apart from each other. Since the upper probe 100 and the lower probe 101 are connected to each other only by the resilient portion of the pogo pin of the present invention, when the openings 130 and 131 and the inserting portions 200 and 201 are separated too widely, It is difficult for the lower probe portion to contact each other and the structural stability of the pogo pin may be problematic. Therefore, the openings 130 and 131 and the inserting portions 200 and 201 are separated from each other at appropriate intervals. The spacing is for accurately plating the entire surfaces of the upper probe unit 100 and the lower probe unit 101 when the pogo pin is plated and the openings 130 and 131 and the insertion unit 200 201 and 201 can cause plating problems such as uneven plating or uneven plating between the openings 130 and 131 and the inserting portions 200 and 201 due to plating . As shown in FIG. 5, when the external pressure is applied to the pogo pin, the insertion portions 200 and 201 are separated from the opening portions 130 and 131 by the spaced openings 130 and 131 and the insertion portions 200 and 201, The upper probe unit 100 and the lower probe unit 101 are connected to each other. When the external force is applied to the upper probe unit 100 or the lower probe unit 101, the external force is transmitted to the upper probe unit 100 or the lower probe unit 101 and the elastic members 300 and 301 The elastic portions 300 and 301 are contracted by the external force and the upper and lower insertion portions 200 and 201 are inserted into the hollow cylindrical openings 130 and 131, The probe unit 100 is connected in a surface contact state through the upper insertion portion and the lower insertion portions 200 and 201. [ The elastic portions 300 and 301 contracted by the external force are restored by the elastic force when the external force is disappeared, so that the gap between the upper probe portion 100 and the lower probe portion 101 is maintained in the original state.

Also, according to the conventional pogo pin, the contact area between the upper probe and the cylindrical body or between the cylindrical body and the lower probe can not be reduced. According to the present invention, it is possible to greatly increase the contact area, thereby minimizing the distortion of the transmitted signal.

The lower probe portion 101 and the upper probe portion 100 of the present invention are inserted into the insertion portions 200 and 201,

The openings 130 and 131 are formed along the cylindrical inner surfaces of the openings 130 and 131 when the upper probe unit 100 and the lower probe unit 101 are contacted by an external force. The insertion portions 200 and 201 are preferably formed in a cylindrical shape.

Since the openings 130 and 131 formed at one end of the upper and lower probes 100 and 101 of the present invention are hollow cylindrical and the spring ends are fixed to the lower ends of the upper and lower probes 100 and 101, A stable structure can be maintained even if a separate structure for controlling the movement of the spring is not located.

When one end of each of the springs 300 and 301 is fixed to one side of the upper and lower probe units 100 and 101

Since the other end of the spring 310 is fixed to one end of the upper and lower probe units 100 and 101 and there is no separate structure for covering the outside of the spring, The outer diameter of the pogo pin 310 of the present invention can be set to be the outer diameter of the pogo pin of the present invention, thereby making it possible to construct a pogo pin having a small outer diameter as compared with the case where the elastic portion is located inside the pogo pin body.

Progressive stamping is a process for forming a mold

Such as punching, coining, roll bending, bening, rolls,

The processes such as rolling and feeding of materials are combined into an automated system.

By implementing the progressive stamping in order to form the pogo pin of the present invention by simplifying the production process, it is possible to reduce manufacturing cost and facilitate mass production.

As shown in FIG. 4, the method for producing the pogo pin of the present invention is as follows.

a) Cutting step (S1)

An upper probe portion developing portion 100 'formed with an attached developing portion 120' at an upper end portion thereof,

A lower probe part deploying part 101 'in which an attached extension part 121' is formed,

Shaped elastic part expanding parts 300 'and 301' connecting the part 100 'and the lower probe part expanding part 101' are cut off in a state of being spread on one metal plate. The above process may be performed by a cutter or the like, preferably by punching during the progressive stamping process.

b) Formation of prototype pogo pin (S2)

The plate material of the lower probe part deploying portion 101 'may be, for example,

The lower probe portion is partially or wholly cylindrical so that the plate portion is wound along the cylindrical curved surface by press-fitting the plate material into the frame having the cylindrical through-hole formed therein, and the elastic portions 300, And the upper and lower probes 100 and 101 are formed in a cylindrical shape so that the upper and lower probes 100 and 101 are formed in a circular shape Original shape) pogo pin. The upper and lower probing parts form upper and lower probe parts 100 and 101, which are partially or wholly cylindrical, using rolling means R of the upper and lower probe part developing parts 100 'and 101'. The step of forming the prototype pogo pin is preferably performed by at least one of rolling, bending, and roll bending during the progressive stamping process.

c) heat treatment, plating step S3,

The circular pogo pin is heat treated and hardened to improve elasticity and strength

Followed by nickel and gold plating to complete the pogo pin of the present invention.

The plating step is performed in order to improve the physical properties of a circular pogo pin, such as lowering the electric resistance, and it is preferable to use a material such as gold having a small electrical resistance

Preferably, rather than performing the gold plating on the surface of the original pogo pin,

It is advisable to carry out gold first, and then to place gold on it. The gold plating layer can be made thinner due to the nickel undercoating, and the pores are reduced on the surface of the copper alloy layer as a base metal to prevent corrosion of the surface and to increase the abrasion resistance of gold.

In addition, the plating step may be performed by forming a circular pogo pin and then curing it by heat treatment

We will do it next. It is also possible to directly coat the metal plate before the cutting step or before the formation of the prototype pogo pin. In this case, in the cutting step or the round pogo pin forming step, the plate is dried by the plunger, There is a possibility that a defective product is generated, and the characteristics of the material are changed by plating, which makes it difficult to form a circular pogo pin by the rolling means. As described above, since the openings and the inserting portions of the present invention are spaced apart from each other at appropriate intervals, there is no possibility that a part which is not plated even if it is directly plated on a circular pogo pin, Plating is preferred.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof,

The embodiments are merely examples for facilitating understanding of the present invention,

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: upper probe portion 101: lower probe portion
120, 121: Attached to the top, attached to the bottom
130, 131: upper opening, lower opening
200, 201: upper insertion portion, lower insertion portion
300, 301: upper elastic portion, lower elastic portion
310: spring
100 ', 101': upper probe section development section, lower probe section development section
120 ', 121': a top attachment attachment,
100 ', 101': upper probe section development section, lower probe section development section
300 ', 301': upper elastic part developing part, lower elastic part developing part
1000; The insertion portion

Claims (5)

The upper probe section 100, the lower probe section 101, and the upper probe section and the lower probe section
And elastic parts 300 and 301 positioned thereon and inserting parts 200 and 201 located inside the elastic part and positioned between the upper probe part and the lower probe part,
The insertion portion may include an upper insertion portion 200 and a lower insertion portion 201. The upper insertion portion may be inserted into the upper probe portion and the lower insertion portion may be inserted into the lower probe portion.

Upper and lower probe connection pogo pin
The method according to claim 1,

a) The upper probe unit 100 includes the attachment 120 provided at the upper end and the cylindrical opening 130 hollowed at the lower end,
b) The lower probe unit 200 includes an attachment 220 provided at the lower end and an opening 131 provided at the upper end,
c) The elastic portions 300 and 301 are fixed at one end to one side of the lower portion of the lower probe portion 101
At least the outer surface of the inserting portion 201 is wrapped and the other end is wrapped around the lower end of the upper probe 100,
And
d) The inserts (200, 201) have a diameter that can be inserted into the openings (130, 301)

The upper and lower probe connection pogo pin

The method according to claim 1,

The upper probe unit 100, the lower probe unit 101, the elastic units 300 and 301, and the insertion units 200 and 201 are formed in one developing unit and are formed as one body.

Upper and lower probe connection pogo pin The method according to claim 2,

a) The upper probe unit 100 includes the attachment 120 provided at the upper end and the cylindrical opening 130 hollowed at the lower end,
b) The lower probe unit 200 includes an attachment 220 provided at the lower end and an opening 131 provided at the upper end,
c) The elastic portions 300 and 301 are fixed at one end to one side of the lower portion of the lower probe portion 101
At least the outer surface of the inserting portion 201 is wrapped and the other end is wrapped around the lower end of the upper probe 100,
And
d) The inserts (200, 201) have a diameter that can be inserted into the openings (130, 301)

The upper and lower probe connection pogo pin
The method of claim 1, wherein

Wherein the cross section of the insertion section is spaced apart from both end portions by a distance of C3 and spaced apart from each other.

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