KR20160061695A - Led package and making method for using the same - Google Patents

Led package and making method for using the same Download PDF

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Publication number
KR20160061695A
KR20160061695A KR1020140164392A KR20140164392A KR20160061695A KR 20160061695 A KR20160061695 A KR 20160061695A KR 1020140164392 A KR1020140164392 A KR 1020140164392A KR 20140164392 A KR20140164392 A KR 20140164392A KR 20160061695 A KR20160061695 A KR 20160061695A
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KR
South Korea
Prior art keywords
reflective sheet
light source
sheet
sheets
led package
Prior art date
Application number
KR1020140164392A
Other languages
Korean (ko)
Inventor
김완호
김재필
윤창훈
전시욱
김기현
송상빈
Original Assignee
한국광기술원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국광기술원 filed Critical 한국광기술원
Priority to KR1020140164392A priority Critical patent/KR20160061695A/en
Publication of KR20160061695A publication Critical patent/KR20160061695A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

The present invention relates to an LED package capable of realizing various light-directing angles through the inner surface of the reflective sheet portion having an arbitrary curvature, by laminating respective sheets made to have arbitrary diameters by individual punching to form a reflective sheet portion and And a method for producing the same. To this end, the present invention provides a light source device comprising: a light source unit for outputting light having a certain wavelength; And a reflective sheet portion formed by laminating a plurality of sheets having an arbitrary diameter through individual punching so that an inner surface having an arbitrary curvature is formed on the light source portion. Therefore, the LED package and the method of manufacturing the same according to the present invention are characterized in that each of the sheets manufactured to have an arbitrary diameter by individual punching is laminated to form a reflective sheet portion, and various light It is advantageous to implement the orientation angle. Further, the light directing angle can be controlled without a separate lens through the structure of the laminated reflection sheet portion, thereby simplifying the production process, reducing the volume of the structure, and providing an inexpensive production cost.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an LED package,

The present invention relates to an LED package and a method of manufacturing the same. More specifically, the present invention relates to an LED package and a method of manufacturing the LED package. More particularly, the present invention relates to an LED package and a method of manufacturing the same, To an LED package capable of implementing various light directing angles through an inner surface and a manufacturing method thereof.

In general, a light emitting diode (LED) emits light using the characteristics of a PN junction diode, and can obtain a relatively high light quantity with a low power consumption, and is applied to various fields such as a backlight unit of an illumination lamp or an LCD.

Such an LED device is referred to as an LED package.

1, a method of manufacturing a conventional LED package 1 includes placing a reflector 20 having a hollow on a ceramic substrate 10 and placing the reflector 20 on a hollow portion of the reflector 20, The LED element 15 is seated on the ceramic substrate 10.

In order to protect the LED element 15 from the outside after the LED element 15 is seated, a resin 16 such as a silicone liquid is filled in the hollow of the reflector 20, The LED package 1 was manufactured by placing a lens 30 for forming an optical image.

However, in the conventional LED package 1, the reflector 20 is fabricated by using a mold or a mold. In this case, the reflector 20 is changed every time the manufacturing specification is changed, There is a need to re-manufacture a new mold or a mold for manufacturing the mold.

Further, the angle and depth of the reflector 20 are adjusted to control the directional angle of the light emitted from the LED device 15, or the light directing angle is controlled using a separate lens 30.

However, the LED package 1 using the ceramic substrate 10 has a limited range of controlling the light directing angle by the reflector 20 in the vertical or diagonal structure. Particularly, in the case of realizing a narrow light directing angle The thickness of the reflector 20 is increased.

Further, when the separate lens 30 is applied to adjust the light directing angle, the thickness of the LED package 1 is increased, and the process of molding the lens 30 is added to increase the price .

Korean Registered Patent No. 10-0805822 (Feb. 14, 2008)

In order to solve the above problems, the present invention provides an optical sheet having a plurality of sheets, each sheet having an arbitrary diameter formed by individual punching, to form a reflective sheet portion, And an object of the present invention is to provide a method of manufacturing the LED package.

According to an aspect of the present invention, there is provided a light source comprising: a light source for outputting light having a predetermined wavelength; And a reflective sheet portion formed by laminating a plurality of sheets having arbitrary diameters formed by individual punching so that an inner surface having an arbitrary curvature is formed on the light source portion.

Further, the inner surface of the reflection sheet portion according to the present invention is characterized in that the cross-sectional shape is any one of a parabolic shape, a conical shape, a trumpet shape, an elliptical shape, and an inverted elliptic shape.

In addition, the LED package according to the present invention may further include a reflective layer formed on an inner surface of the reflective sheet portion so as to increase reflectance of the reflective sheet portion.

In addition, the LED package according to the present invention may further include an insulating sheet portion for electrically insulating the light source portion and the reflective sheet portion.

The present invention also provides a method of manufacturing an LED package, comprising the steps of: a) preparing a plurality of sheets; b) punching the plurality of sheets prepared in step a) so as to form an arbitrary diameter using a punching tool; c) laminating the plurality of sheets punched through the step b) in a predetermined order and firing a reflection sheet portion having an inner surface with an arbitrary curvature; And d) combining the reflective sheet portion with the light source portion.

The step d) may further include forming a reflective layer on the inner surface of the reflective sheet.

In addition, the step d) according to the present invention may further comprise the step of providing an insulating sheet part between the light source part and the reflection sheet part.

In addition, the step (d) according to the present invention may further comprise the step of filling the hollow formed in the reflective sheet part with an encapsulating material.

The LED package and the method of manufacturing the same according to the present invention are characterized in that each sheet produced to have an arbitrary diameter by individual punching is laminated to form a reflective sheet portion, There is an advantage that each angle can be implemented.

Further, according to the present invention, the light directing angle can be controlled without a separate lens through the structure of the laminated reflection sheet portion, thereby simplifying the production process, reducing the volume of the structure, and providing an inexpensive production cost .

1 is a cross-sectional view of an LED package according to the prior art;
2 is an exploded view showing a configuration of an LED package according to the present invention;
3 is a sectional view showing a configuration of an LED package according to the present invention;
4 is a sectional view showing a second embodiment of a reflection sheet portion according to the present invention.
5 is a cross-sectional view showing a third embodiment of the reflection sheet portion according to the present invention.
6 is a sectional view showing a fourth embodiment of the reflection sheet portion according to the present invention.
7 is a sectional view showing a fifth embodiment of the reflection sheet portion according to the present invention.
8 is a flowchart illustrating a method of manufacturing an LED package according to the present invention.

Hereinafter, preferred embodiments of the LED package according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is an exploded view showing a configuration of an LED package according to the present invention, FIG. 3 is a cross-sectional view showing a configuration of an LED package according to the present invention, FIG. 4 is a sectional view showing a reflection sheet according to a second embodiment of the present invention 5 is a cross-sectional view showing a third embodiment of the reflection sheet according to the present invention, FIG. 6 is a sectional view showing a fourth embodiment of the reflection sheet according to the present invention, FIG. 7 is a cross- 5 is a cross-sectional view showing an embodiment.

2 to 3, the LED package 100 according to the present invention includes a light source 110, an insulating sheet 120, a reflective sheet 130, a reflective layer 140, 150).

The light source unit 110 is configured to output light having a certain wavelength and includes a base sheet 111, an electrode frame 112, a wire 113, and an LED chip 114.

The base sheet 111 serves as a lower body of the LED package 100 and is formed so that an electrode frame 112 described later is fastened.

The electrode frame 112 supplies power to the LED chip 114 through the wire 113. The electrode frame 112 is a substrate having an electrode configured to supply power to the LED chip 114.

This is a technique obvious to those skilled in the art, so a more detailed description is omitted.

The wire 113 electrically connects the connection terminal of the electrode frame 112 and the connection terminal of the LED chip 114, and serves as a path through which the power source can be moved.

The LED chip 114 is a light source that emits light and is electrically connected to the electrode frame 112 to emit a specific wavelength.

The LED chip 114 may be configured to output one of blue light and ultraviolet ray. However, the present invention is not limited to this, The LED chip 114 that emits light can be applied.

The insulating sheet part 120 is formed to electrically isolate the light source part 110 from a reflective sheet part 130 to be described later and is preferably installed between the light source part 110 and the reflective sheet part 130 Do.

The insulating sheet portion 120 is preferably made of rubber or resin so as not to transmit electricity or heat. However, the insulating sheet portion 120 is not limited to the inorganic sheet, the inorganic sheet, the glass sheet, Various insulating materials such as varnish may be applied.

As shown in the drawing, the insulation sheet 120 may be formed with a hollow 120R through which the LED chip 114 of the light source unit 110 is exposed.

The reflection sheet unit 130 is configured to receive the LED chip 114 of the light source unit 110 and reflect light emitted from the LED chip 114. The reflection sheet unit 130 forms an inner surface having an arbitrary curvature, So that light is reflected through the inner surface thereof.

According to the present invention, the first sheet 131, the second sheet 132, the third sheet 133, and the third sheet 133 may be formed of a material that reflects light. .

The first sheet 131, the second sheet 132 and the third sheet 133 are laminated to form the reflective sheet part 130 as the respective ceramic sheets constituting the reflective sheet part 130, .

Also, the first sheet 131, the second sheet 132, and the third sheet 133 are individually punched using a punching tool (not shown).

The punching tool is a tool for forming holes in the first, second, and third sheets 131, 132, and 133, and is a typical apparatus used in the related art, and a detailed description thereof will be omitted.

However, it is preferable that the punching tool is capable of forming holes having various diameters in the first, second and third sheets 131, 132 and 133 for the preferred embodiment of the present invention. It will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the present invention.

That is, the hollow of the reflection sheet portion 130 is generated while the holes formed by the individual punching of the first, second, and third sheets 131, 132, and 133 are laminated.

Therefore, the hollow shape of the reflection sheet portion 130 is determined according to the diameter of the holes of the first, second, and third sheets 131, 132, and 133, and the inner surface thereof has an arbitrary curvature.

The curvatures of various hollow shapes and inner surfaces of the reflection sheet portions 130, 130a, 130b, 130c, and 130d according to the embodiment of the present invention will be described with reference to FIGS.

However, the same components as those of the LED package shown in Figs. 2 to 3 are denoted by the same reference numerals, and a detailed description thereof will be omitted.

3 is a parabolic structure in which the inner surface of the reflective sheet portion 130 is curved outward as the inner surface of the reflective sheet portion 130 is curved downward.

Here, the diameter R1 of the first sheet 131 may be the smallest, and the diameter R3 of the third sheet 133 may be the largest.

That is, a hole is formed with a diameter size of R1 <R2 <R3.

4 is a conical structure in which the inner surface of the reflective sheet portion 130a is curved inward as it goes downward.

4, the diameter of the holes formed in the first, second, and third sheets 131a, 132a, and 133a is R1 <R2 <R3, which is the same as the parabolic structure of FIG. 3 , The difference between R2 and R3 is large so that the curvature of the inner surface curves inward.

5 is a trumpet structure in which the inside surface of the reflection sheet portion 130b is curved inward as it goes downward, which is similar to the conical structure of FIG. 4, The diameters of the holes formed in the sheets 131b, 132b, and 133b are smaller than those of the first, second, and third sheets 131a, 132a, and 133a in FIG.

Also, since the difference between R2 and R3 is larger than that of the conical structure of FIG. 4, there is a difference in that the overall inner surface shape of the reflection sheet portion 130b has a more abrupt curvature.

6 is an elliptical structure in which the inner surface of the reflective sheet portion 130c curves outward as it goes downward, and the upper and lower portions are equally balanced.

The diameters of the holes formed in the first sheet 131c and the third sheet 133c have the same size and curvature and the diameters of the holes formed in the second sheet 132c stacked at the center are smaller than the diameters of the holes formed in the first and third sheets 131c, Is relatively larger than the diameter of the hole formed in the holes 131c and 133c.

That is, a hole is formed with a diameter size of R1 = R3 <R2.

7 is an inverted elliptical structure in which the inner surface of the reflective sheet portion 130d is curved inward as the inner surface is downward, and the upper and lower portions are equally balanced.

That is, similar to the elliptical structure of Fig. 6 in that the holes formed in the first sheet 131d and the third sheet 133d have the same size and curvature as each other, but the second sheet 132d, The diameters of the holes formed in the first and third sheets 131d and 133d are smaller than the diameters of the holes formed in the first and third sheets 131d and 133d.

That is, holes are formed in the diameter of R1 = R3 > R2 so that the overall inner surface of the reflective sheet portion 130d, which is laminated and bonded, is different from the overall inner surface of the reflective sheet portion 130c of FIG. .

As described above, the LED package 100 according to the present invention can control the light directing angle variously through various inner surface shapes of the reflection sheet portions 130, 130a, 130b, 130c and 130d.

In the present invention, the inner surface shapes of the reflective sheet portions 130, 130a, 130b, 130c, and 130d according to the five embodiments are described. However, the present invention is not limited thereto, It goes without saying that other inner surface shapes can be implemented through various modification designs within the technical scope of the invention.

Further, although the ceramic sheet is illustrated as three sheets 131, 132, and 133 in the present invention, the number of the sheets is not limited to three and can be variously applied. As the number of sheets increases, It is obvious that it can be implemented.

Meanwhile, the LED package 100 according to the present invention may further include a reflective layer 140 formed by plating the inner surface of the reflective sheet part 130 having an arbitrary curvature.

The reflective layer 140 may be plated with silver, aluminum, rhodium, palladium, or the like to further increase the reflectance of light emitted from the light source 110.

The reflective layer 140 may be formed by laminating the first, second, and third sheets 131, 132, and 133, and then firing the reflective sheet portion 130. However, The first, second and third sheets 131, 132 and 133 may be individually plated.

The sealing material 150 is filled in any hollow formed in the reflective sheet part 130 so that the wire 113 of the light source part 110 and the LED chip 114 are protected. Is injected into the hollow of the reflective sheet part 130 to mold the overall structure of the light source part 110.

The encapsulant 150 may be easily processed and is preferably transparent quartz. However, the encapsulant 150 may be mixed with a nonconductive fluorescent material to enhance the luminescent effect or to produce a specific wavelength.

(Manufacturing Method of LED Package)

Hereinafter, the structure of the LED package and the method of manufacturing the LED package according to the present invention will be described in detail with reference to FIG.

8, a method of manufacturing an LED package according to the present invention includes the steps of preparing a ceramic sheet (S100), punching a ceramic sheet (S200), firing a reflective sheet (S300), and combining a light source (S400) .

First, in step S100, a plurality of sheets made of ceramics are prepared.

In the embodiment of the present invention, three ceramic sheets are prepared from the first sheet 131, the second sheet 132 and the third sheet 133. [

In step S200, the first sheet 131, the second sheet 132, and the third sheet 133 prepared in step S100 are individually punched using a punching tool.

Here, it is preferable to punch a hole having a diameter suitable for the user's intention, so that each of the first, second, and third sheets 131, 132, 133 is formed with a hole having an arbitrary diameter size.

In step S300, the first, second and third sheets 131, 132 and 133 punched individually are stacked in a predetermined order through the step S200, and the reflective sheet part 130 is sintered do.

At this time, the first, second, and third sheets 131, 132, and 133 may be joined through heat, adhesive, or the like, and various processes may be applied by experts in the related field Of course.

In the reflection sheet part 130 fired through step S300, any hollow is formed as the holes having diameters of the first, second, and third sheets 131, 132, and 133 are laminated, Lt; / RTI &gt; has an arbitrary curvature.

In step S400, the reflective sheet part 130 fired through step S300 is coupled to the upper part of the light source part 110.

The LED chip 114 of the light source unit 110 may be disposed in the hollow formed in the reflective sheet unit 130 so that the light emitted from the light source unit 110 is reflected by the reflective sheet unit 130 And is reflected.

That is, the directing angle of the light emitted from the light source unit 110 can be determined according to the shape of the hollow inner surface of the reflection sheet unit 130.

In addition, the step S400 may further include a step (not shown) of forming a reflective layer 140 on the inner surface of the reflective sheet part 130 on which an arbitrary curvature is formed.

The step of forming the reflective layer 140 may be performed after punching the first, second, and third sheets 131, 132, and 133 in step S200. Alternatively, After the first, second, and third sheets 131, 132, and 133 of the reflective sheet unit 130 are laminated and the reflective sheet unit 130 is baked.

The step S400 further includes a step (not shown) for electrically insulating the light source unit 110 and the reflection sheet unit 130 when the reflection sheet unit 130 is coupled to the light source unit 110 .

In the insulation step, an insulation sheet part 120 is provided between the light source part 110 and the reflection sheet part 130 so that a gap between the electrode frame 112 of the light source part 110 and the reflection sheet part 130 Thereby preventing the power AC from being generated.

The step S400 may further include the step of coupling the reflective sheet part 130 to the light source part 110 and filling the hollow space formed in the reflective sheet part 130 with an encapsulating material 150. [

Accordingly, it is an object of the present invention to provide an optical sheet having a plurality of sheets each having an arbitrary diameter formed by individual punching to form a reflective sheet portion and to realize various light-directing angles through the inner surface of the reflective sheet portion having an arbitrary curvature .

Further, the light directing angle can be controlled without a separate lens through the structure of the laminated reflection sheet portion, so that the production process can be simplified, the volume of the structure can be reduced, and an inexpensive production cost can be provided.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims. It can be understood that

In the course of the description of the embodiments of the present invention, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation, , Which may vary depending on the intention or custom of the user, the operator, and the definitions of these terms should be based on the contents throughout this specification.

100: LED package 110: light source part
111: base sheet 112: electrode frame
113: wire 114: LED chip
120: insulating sheet portion 130: reflective sheet portion
131: first sheet 132: second sheet
133: third sheet 140: reflective layer
150: Encapsulant

Claims (8)

A light source 110 for outputting light having an arbitrary wavelength; And
A plurality of sheets 131, 132 and 133 having arbitrary diameters R 1, R 2 and R 3 formed by individual punching are formed so as to form an inner surface having an arbitrary curvature on the light source unit 110 And a reflective sheet portion (130).
The method according to claim 1,
Wherein an inner surface of the reflective sheet part (130) is one of a parabolic shape, a conical shape, a trumpet shape, an elliptical shape, and an inverted elliptical shape in section.
The method according to claim 1,
Wherein a reflective layer (140) is further formed on an inner surface of the reflective sheet part (130) so that a reflectance of the reflective sheet part (130) is increased.
The method according to claim 1,
Wherein the LED package further comprises an insulating sheet part (120) for electrically insulating between the light source part (110) and the reflective sheet part (130).
A method of manufacturing an LED package,
a) preparing a plurality of sheets (131, 132, 133);
b) punching the plurality of sheets (131, 132, 133) prepared in step a) so as to form an arbitrary diameter using a punching tool;
c) laminating the plurality of sheets (131, 132, 133) punched through the step b) in a predetermined order and firing the reflection sheet part (130) having an inner surface with an arbitrary curvature; And
d) combining the reflective sheet part (130) with the light source part (110).
6. The method of claim 5,
Wherein the step d) further includes the step of forming a reflective layer 140 on the inner surface of the reflective sheet part 130.
6. The method of claim 5,
Wherein the step d) further includes the step of providing an insulating sheet part 120 between the light source part 110 and the reflection sheet part 130.
6. The method of claim 5,
Wherein the step d) further comprises the step of filling an encapsulant (150) in the hollow formed in the reflective sheet part (130).
KR1020140164392A 2014-11-24 2014-11-24 Led package and making method for using the same KR20160061695A (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100805822B1 (en) 2006-08-10 2008-02-21 주식회사 티투엘 Light emitting diode package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100805822B1 (en) 2006-08-10 2008-02-21 주식회사 티투엘 Light emitting diode package

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