KR20160044804A - Heating jacket with electromagnetic wave shielding function - Google Patents

Heating jacket with electromagnetic wave shielding function Download PDF

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Publication number
KR20160044804A
KR20160044804A KR1020140139729A KR20140139729A KR20160044804A KR 20160044804 A KR20160044804 A KR 20160044804A KR 1020140139729 A KR1020140139729 A KR 1020140139729A KR 20140139729 A KR20140139729 A KR 20140139729A KR 20160044804 A KR20160044804 A KR 20160044804A
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KR
South Korea
Prior art keywords
heating jacket
copper sheet
hot wire
electromagnetic wave
present
Prior art date
Application number
KR1020140139729A
Other languages
Korean (ko)
Inventor
이승룡
Original Assignee
(주)제이솔루션
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Filing date
Publication date
Application filed by (주)제이솔루션 filed Critical (주)제이솔루션
Priority to KR1020140139729A priority Critical patent/KR20160044804A/en
Publication of KR20160044804A publication Critical patent/KR20160044804A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The present invention relates to a heating jacket having an electromagnetic shielding function, and more particularly, to a heating jacket having an electromagnetic wave shielding function, which functions as a base for maintaining and heating a temperature of a discharge pipe, Thereby preventing an error caused by the error.
The present invention relates to an endoscope comprising: an endothelium having an insulating function while being in contact with an outer circumferential surface of a discharge tube; A heat line arranged outside the inner skin; A heat insulating material surrounding the outside of the hot wire; And a copper sheet enclosing the outer surface of the heat insulating material and having an insulating function and enclosing the inside of the hot wire and blocking the electromagnetic wave generated from the hot wire from reaching the discharge tube, .

Description

[0001] HEATING JACKET WITH ELECTROMAGNETIC WAVE SHIELDING FUNCTION WITH ELECTROMAGNETIC WAVE PROTECTION [

The present invention relates to a heating jacket used in semiconductors and LCD lines, and more particularly to a heating jacket which functions to maintain and heat the temperature of a discharge pipe, while preventing electromagnetic waves generated from a built- in hot wire from leaking to the discharge pipe, To a heating jacket having an electromagnetic wave shielding function.

Generally, the process chambers used in the semiconductor or LCD manufacturing process are operated in a vacuum atmosphere, and the residual gas and the by-product gas among the gases supplied to the process chamber for performing the process are discharged through a discharge line which is a vacuum line have.

In this process, the residual gas and the by-product gas in the high-temperature process chamber are lowered in temperature through the discharge pipe, so that a part of the residual gas and the by-product gas are adhered to the inner wall surface of the gas discharge pipe. That is, since the inside of the process chamber in which the process is performed is a high-temperature state, the gas can be maintained in a gaseous state. However, since the temperature of the gas moves through the discharge pipe, a part of the gas adheres to the inner wall of the discharge pipe, The pressure is increased and the exhaust power is lowered.

In order to solve such a problem, a heating jacket disclosed in Korean Patent Publication No. 0990157 is attached to the outside of the discharge pipe and heated to maintain the temperature inside the discharge pipe at a predetermined temperature.

Such a heating jacket is not complicated in configuration, but is relatively easy to use and widely used. However, it has been urgent to take measures to eliminate the cause of unknown errors in equipment connected to a discharge pipe equipped with a heating jacket.

Korean Patent Registration No. 0990157 (Oct. 20, 201)

It is therefore an object of the present invention to provide an apparatus and a method for controlling the temperature of a discharge pipe while maintaining the temperature of the discharge pipe and for preventing the electromagnetic waves generated from the built- Thereby preventing an error caused by electromagnetic waves from being generated in equipment connected to the discharge pipe by blocking the electromagnetic wave shielding function.

In order to achieve the above object, a heating jacket according to the technical idea of the present invention is a heating jacket provided outside a discharge pipe for transferring reaction by-product gas from a process chamber of a semiconductor or LCD manufacturing process, An endothelium having an insulating function; A heat line arranged outside the inner skin; A heat insulating material surrounding the outside of the hot wire; And a copper sheet enclosing the outer surface of the heat insulating material and having an insulating function and enclosing the inside of the hot wire and blocking the electromagnetic wave generated from the hot wire from reaching the discharge tube, And is characterized by its technical structure.

Here, a ground wire may be connected to the copper sheet.

In addition, the copper sheet may be characterized in that a plurality of holes are perforated.

Further, the material of the inner skin and the outer skin may be silicon rubber.

Further, the material of the heat insulating material is silicon rubber, and is thicker than the inner skin or the sheath.

The heating jacket according to the present invention can be almost completely cut off so that the electromagnetic wave generated from the hot wire is not leaked to the discharge pipe due to the simple structure built in the copper sheet. Can be provided.

Further, the present invention can safely discharge the electromagnetic wave cut off by the constitution of connecting the ground wire to the copper sheet.

In addition, the present invention can solve the problem that the heat transferred from the hot wire to the inner skin is concentrated in one place, despite the installation of the copper sheet, by providing a plurality of holes formed in the copper sheet, The workability is improved.

FIG. 1 is a view showing a usage state of a heating jacket according to an embodiment of the present invention.
2 is a side view of a heating jacket according to an embodiment of the present invention.
FIG. 3 is a cross-sectional view taken along the line II of FIG. 2 for explaining the structure of the heating jacket according to the embodiment of the present invention
4 is a cross-sectional view taken along the line II-II in Fig. 2 for explaining the configuration of the heating jacket according to the embodiment of the present invention
FIG. 5 is a developed view for explaining the configuration of a copper sheet in a heating jacket according to an embodiment of the present invention. FIG.

A heating jacket having an electromagnetic wave shielding function according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention, and are actually shown in a smaller scale than the actual dimensions in order to understand the schematic structure.

Also, the terms first and second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

1 is a use state diagram of a heating jacket according to an embodiment of the present invention.

As shown in the figure, the heating jacket 100 according to the embodiment of the present invention is installed outside the discharge pipe P for transferring reaction by-product gas from the process chamber of the semiconductor or LCD manufacturing process to maintain and heat the temperature of the discharge pipe The electromagnetic waves generated from the built-in heat line 113 are prevented from leaking to the discharge pipe, thereby preventing errors caused by electromagnetic waves in the equipment connected to the discharge pipe (P).

Hereinafter, the construction of the heating jacket according to the embodiment of the present invention will be described in detail.

FIG. 2 is a side view of a heating jacket according to an embodiment of the present invention. FIG. 3 is a cross-sectional view of the heating jacket according to an embodiment of the present invention, 2 is a cross-sectional view taken along the line II-II in Fig. 2 for explaining the construction of the heating jacket according to the example. 5 is a developed view for explaining the configuration of the copper sheet in the heating jacket according to the embodiment of the present invention.

As shown in the figure, the heating jacket according to an embodiment of the present invention includes a body 110 having a circular tubular shape that closely surrounds an outer side of a discharge pipe through which reaction by-product gas is delivered, and a pair of A flange 120 and a grounding wire 130 connected to a copper sheet 114 built in the main body 110. The main body 110 has an outer shell 111a and an inner shell 111b, A heat insulating material 112, a heat ray 113, and a copper sheet 114.

As described above, according to the present invention, the electromagnetic waves generated from the heat ray 113 can be prevented from leaking to the discharge pipe due to the simple structure in which the copper sheet 114 is installed on the circular tubular body 110. The electromagnetic waves thus cut off are safely discharged to the outside by the ground wire 130 connected to the copper sheet 114. Thus, it is possible to completely eliminate the cause of the error caused by the electromagnetic waves in the equipment connected to the discharge pipe due to the electromagnetic wave emitted from the heat ray 113.

Hereinafter, each component constituting the main body 110 will be mainly described.

The inner skin 111b of the main body 110 is in contact with the outer circumferential surface of the discharge tube and has an insulating function. For this insulation function, it is preferable that the material of the inner film 111b is made of silicon rubber.

The copper sheet 114 is installed between the inner skin 111b and the heat ray 113 while enclosing the inner skin 111b. When the copper sheet 114 is installed between the inner skin 111b and the heat ray 113, the electromagnetic radiation generated from the heat ray 113 can be almost completely blocked from reaching the discharge tube. The copper sheet 114 is connected to the ground line 130 and can safely discharge the electromagnetic waves to the outside. Such a configuration in which a heating jacket is provided with a copper plate is very simple, but it can be an effective way to fundamentally solve the problem caused by electromagnetic waves.

Meanwhile, the copper sheet 114 has a plurality of holes 114a as shown in FIG. The plurality of punched holes 114a help the heat generated from the heat ray 113 to be uniformly dispersed without being partially concentrated in the process of being transferred to the inner skin 111b. Further, when the copper sheet 114 is bent in the form of a circular tube, work is easily performed.

As a suitable material for shielding electromagnetic waves in place of the copper sheet 114, aluminum may be mentioned. However, in spite of the price advantage compared to copper in case of aluminum, copper is preferable to aluminum as a material for cutting off the electronic plate in consideration of requirements such as heat conduction.

The heat ray 113 is disposed on the outer side of the copper sheet 114 and fixed by the copper sheet 114 and the heat insulating material 112 installed inside. However, in the case of an accessory configuration for controlling and applying power to the heat ray 113, it is a well-known technology, and thus a detailed description thereof will be omitted.

The heat insulating material 112 is made of a material such as silicone rubber, like the outer skin 111a and the inner skin 111b. However, the heat insulating material 112 is formed to have a much thicker thickness than the outer skin 111a or the inner skin 111b in order to prevent the heat to be directed to the pipe from being diverted to the outside.

The outer skin 111a covers and protects the outer surface of the heat insulating material 112. The material of the outer skin 111a is preferably made of silicone rubber as in the case of the inner skin 111b.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It is clear that the present invention can be suitably modified and applied in the same manner. Therefore, the above description does not limit the scope of the present invention, which is defined by the limitations of the following claims.

110: main body 111a: sheath
111b: inner skin 112: insulation
113: hot wire 114: copper sheet

Claims (5)

A heating jacket provided outside a discharge pipe for transferring reaction by-product gas from a process chamber of a semiconductor or LCD manufacturing process,
An inner skin having an insulating function while being in contact with the outer peripheral surface of the discharge tube;
A heat line arranged outside the inner skin;
A heat insulating material surrounding the outside of the hot wire;
And an outer shell having an insulating function while covering the outer surface of the heat insulating material,
And a copper sheet enclosing the inside of the hot wire and blocking the electromagnetic wave generated from the hot wire from reaching the outlet tube is interposed between the inner skin and the hot wire. The method according to claim 1,
And a ground wire is connected to the copper sheet. 3. The method of claim 2,
Wherein a plurality of holes are formed in the copper sheet. 3. The method of claim 2,
Wherein the material of the inner skin and the outer skin is silicone rubber. 5. The method of claim 4,
Wherein the material of the heat insulating material is silicone rubber and is thicker than the thickness of the inner panel or the sheath.
KR1020140139729A 2014-10-16 2014-10-16 Heating jacket with electromagnetic wave shielding function KR20160044804A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020140139729A KR20160044804A (en) 2014-10-16 2014-10-16 Heating jacket with electromagnetic wave shielding function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140139729A KR20160044804A (en) 2014-10-16 2014-10-16 Heating jacket with electromagnetic wave shielding function

Publications (1)

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KR20160044804A true KR20160044804A (en) 2016-04-26

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180080570A (en) * 2017-01-04 2018-07-12 한국수력원자력 주식회사 Electric furnace for nozzle
KR20190111667A (en) 2018-03-23 2019-10-02 김상현 The electrical heater jacket with a layer of the thermally conductive non metallic pad to improve temperature homogeneity

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180080570A (en) * 2017-01-04 2018-07-12 한국수력원자력 주식회사 Electric furnace for nozzle
KR20190111667A (en) 2018-03-23 2019-10-02 김상현 The electrical heater jacket with a layer of the thermally conductive non metallic pad to improve temperature homogeneity

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