JP5155571B2 - Plasma processing equipment - Google Patents

Description

  The present invention relates to a plasma processing apparatus, and is suitable, for example, for a plasma processing apparatus having a window for entering an electromagnetic wave in a container.

  In an inductively coupled plasma processing apparatus, in order to turn the gas supplied into the container of the apparatus into plasma, electromagnetic waves are transmitted from an antenna outside the container to the inside of the container through an RF (Radio Frequency) incident window. Incident. In the plasma processing apparatus having such an RF incident window, a ceramic material is used for the RF incident window in consideration of heat resistance and plasma resistance.

JP 2002-237462 A

  In the plasma processing apparatus, the ceramic RF entrance window has a heat input distribution due to electromagnetic wave absorption or generated plasma and a cooling distribution by a cooling device such as a cooling fan, and when a large temperature difference occurs in the RF entrance window, There is a risk of cracking due to thermal stress. In particular, as the diameter of the substrate has increased in recent years, the RF incident window has also become larger. Therefore, the risk of cracks in the RF incident window due to thermal stress is increasing. In the worst case, the RF incident window is increased. It can lead to window breakage.

  If the RF incident window is broken, the broken RF incident window may fall into the container, damaging and contaminating the container. In this case, the broken RF incident window is recovered from the container. If the inside of the container is not cleaned, the apparatus cannot be returned to the normal state, and it can be easily expected that the post-processing return operation will be a heavy burden. Therefore, in consideration of the case where the RF incident window is broken, it is desired to minimize the damage caused by the breakage.

  The present invention has been made in view of the above problems, and it is an object of the present invention to provide a plasma processing apparatus that reduces damage caused by breakage when an RF incident window is broken.

A plasma processing apparatus according to a first invention for solving the above-mentioned problems is
In the plasma processing apparatus for injecting electromagnetic waves from an antenna disposed above the window through the insulating window that closes the upper opening of the container into the container to convert the gas in the container into plasma,
A holding member that supports a lower surface of the peripheral edge of the window and seals between the upper end surface of the container and a lower surface of the peripheral edge of the window via an O-ring ; Attach to the top surface
A ring member having an inner circumference smaller than the outer circumference of the window is attached to the holding member in the vicinity of the upper surface of the peripheral edge of the window,
A peripheral portion of the window is disposed between the support portion and the ring member ;
A protective ring for protecting the support portion from plasma in the container is provided on the inner peripheral side of the support portion of the holding member .

A plasma processing apparatus according to a second invention for solving the above-mentioned problems is as follows.
In the plasma processing apparatus for injecting electromagnetic waves from an antenna disposed above the window through the insulating window that closes the upper opening of the container into the container to convert the gas in the container into plasma,
An O-ring having a support portion for supporting the lower surface of the peripheral edge portion of the window and a proximity surface portion close to the outer peripheral surface of the window, and between the upper end surface of the container and the lower surface of the peripheral edge portion of the window A holding member for sealing via is attached to the upper end surface of the container,
Inserting an insertion member made of a material having elasticity and high heat insulation into the gap between the outer peripheral surface of the window and the proximity surface portion,
A ring member having an inner circumference smaller than the outer circumference of the window is attached to the holding member in the vicinity of the upper surface of the peripheral edge of the window,
A peripheral portion of the window is disposed between the support portion and the ring member ;
A protective ring for protecting the support portion from plasma in the container is provided on the inner peripheral side of the support portion of the holding member .

A plasma processing apparatus according to a third invention for solving the above-described problem is
In the first or the plasma processing apparatus according to the second invention,
The size of the inner periphery of the ring member is equal to or greater than the size of the inner periphery of the container.

A plasma processing apparatus according to a fourth invention for solving the above-mentioned problems is as follows.
In the plasma processing apparatus according to any one of the first to third inventions,
A sheet member made of a material having elasticity and high heat insulating property is inserted into a portion where the lower surface of the peripheral edge of the window can directly contact the upper end surface of the container.

According to the first to fourth inventions, the window (RF incident window) is held so as to be sandwiched between the container upper end portion and the ring member or between the holding member and the ring member, or the window is held from the side. Therefore, it is not necessary to process the window itself, and even if the window is broken, it can be prevented from dropping as much as possible, and damage caused by the broken window can be minimized.

According to the first and second inventions, since the window is disposed between the holding member and the ring member, the damaged window is removed from the container together with the holding member and the ring member by removing the holding member from the container. It can be removed, making it easy to return when the window breaks.

  Since the RF incident window in the plasma processing apparatus tends to have a higher temperature at the center than at the end, thermal stress is applied in the circumferential direction at the end, and compressive stress is applied at the center. And since the RF entrance window is subject to tensile stress in the circumferential direction at the end, and when breakage occurs, a crack runs from the end to the center and tends to wrap around in the circumferential direction when reaching the center. In the case of breakage, the present inventors always have cracks at the end portions, then cracks grow from the end portions to the center portion, leading to breakage, and the broken RF incident window includes large fragments including the end region. I found out that

  Therefore, in order to reduce the damage caused by the breakage of the RF incident window, even if a crack occurs in the RF incident window and the breakage occurs, at least a large piece of the broken RF incident window should not be dropped. For that purpose, if a structure capable of holding the end of the RF incident window is provided, it is possible to prevent a large piece of the RF incident window that has been damaged from falling. Some of the embodiments of the plasma processing apparatus according to the present invention having such a structure will be described below and will be described in detail.

Reference example 1

FIG. 1 is a schematic configuration diagram showing an example of an embodiment of a plasma processing apparatus according to the present invention.
As shown in FIG. 1, the plasma processing apparatus according to the present invention is configured such that the inside of a metal cylindrical vacuum chamber 1 (container) is configured as a processing chamber 2, and is formed in an upper opening of the vacuum chamber 1. The insulating disk-shaped RF incident window 3 (window) is disposed so as to close the upper opening. A support table 4 is provided at the lower part of the vacuum chamber 1, and a substrate 5 such as a semiconductor is placed on the upper surface of the support table 4. The inner wall of the vacuum chamber 1 is anodized, and the RF incident window 3 is made of ceramics such as alumina.

  A high-frequency antenna 7 (antenna) made up of, for example, a plurality of circular rings is disposed above the RF incident window 3. The high-frequency antenna 7 has a frequency of several hundred kHz to several hundred MHz via a matching unit 8. A high frequency (RF) power source 9 is connected. The vacuum chamber 1 is provided with gas nozzles 10 a and 10 b for introducing a desired gas into the processing chamber 2.

  In addition, an electrode portion 12 is provided on the support base 4 that supports the substrate 5, and a low frequency (LF) power source 14 is connected to the electrode portion 12 via a matching unit 13. The low-frequency power source 14 can apply a lower frequency than the high-frequency power source 9 to the electrode unit 12 to apply bias power to the substrate 5.

  In the plasma processing apparatus having the above configuration, by supplying power to the high-frequency antenna 7, electromagnetic waves are incident on the vacuum chamber 1 via the RF incident window 3, and the incident electromagnetic waves are transmitted to the vacuum chamber via the gas nozzles 10a and 10b. The gas introduced into 1 is ionized to generate plasma. Then, a desired plasma process such as etching or CVD (Chemical Vapor Deposition) is performed on the substrate 5 by using the generated plasma.

  In the plasma processing apparatus having the above configuration, as described above, the electromagnetic wave from the high frequency antenna 7 is incident on the vacuum chamber 1 through the RF incident window 3, and the plasma of the gas in the vacuum chamber 1 is caused by the incident electromagnetic wave. Has been generated. Therefore, the RF incident window 3 is heated by the collision of particles in plasma generated by electromagnetic waves. At this time, the RF incident window 3 has a high temperature at the center of the RF incident window 3 and a low temperature at the periphery so as to correlate with the intensity distribution of the electromagnetic wave from the high frequency antenna 7 and the generated plasma density distribution. As a result, a temperature difference is generated in the RF incident window 3. Normally, a large temperature difference is not generated by a cooling fan or the like (not shown), and the RF incident window 3 is prevented from being damaged by thermal stress due to the temperature difference. However, there is still a high possibility that the RF incident window 3 will be damaged when a process with a heavy load is accidentally or intentionally performed or when there is an operation error.

  Further, as described above, the upper opening of the vacuum chamber 1 is closed by the RF incident window 3, but an O-ring is arranged between the upper end surface of the vacuum chamber 1 and the RF incident window 3, thereby While maintaining the degree of vacuum inside the chamber 1, the RF incident window 3 was placed on the upper end surface of the chamber 1 to support the RF incident window 3. In such a structure, only the upper end surface of the vacuum chamber 1 supports the RF incident window 3. When the RF incident window 3 is cracked, the weight of the RF incident window 3 and the vacuum inside the vacuum chamber 1 are reduced. Due to this force, a force is exerted in the inner direction of the vacuum chamber 1 to spread the crack, and when the crack spreads and breaks, the broken piece falls into the vacuum chamber 1 as it is.

Therefore, in this reference example, in the plasma processing apparatus shown in FIG. 1, when the RF incident window 3 is damaged by using the structure shown in FIG. 2, the fall is prevented and the damage is minimized. I try to keep it down. FIG. 2 is an example of a structure used in the plasma processing apparatus according to the present invention, and a part thereof is shown in a sectional view.

Specifically, in this reference example, as shown in FIGS. 2A and 2B, the upper surface is RF incident on the outer peripheral edge side of the upper end surface of the vacuum chamber 1, that is, on the outer peripheral side of the RF incident window 3. A structure in which a ring-shaped holding member 21 higher than the upper surface of the window 3 is attached, and a ring-shaped ring member 22 having an inner diameter (or inner periphery) smaller than the outer diameter (or outer periphery) of the RF incident window 3 is attached to the upper surface. It is. In addition, the cover 24 in the figure covers the high frequency antenna 7 and the like constituting the plasma source for ensuring safety.

  That is, by supporting the ring member 22 on the vacuum chamber 1 side (holding member 21 side), as viewed from the side (see FIG. 2A), the ring member 22 is placed on the upper surface of the peripheral portion of the RF incident window 3. The ring members 22 are arranged so as to be close to each other and viewed from above (see FIG. 2B) so that the inner diameter side of the ring member 22 overlaps with the peripheral edge of the RF incident window 3. The holding member 21 and the ring member 22 are made of a metal such as aluminum, and the surface thereof is subjected to, for example, chromium oxidation treatment in order to maintain corrosion resistance and conductivity.

  A ring-shaped protrusion 1a is provided on the inner peripheral side of the upper end surface of the vacuum chamber 1 along the inner periphery, and RF is incident on the space between the protrusion 1a and the holding member 21. An O-ring 26 that seals between the window 3 and the vacuum chamber 1 is arranged. Therefore, the space between the vacuum chamber 1 and the RF incident window 3 is sealed by the O-ring 26 disposed in this space, and the vacuum in the processing chamber 2 is maintained.

  In addition, a sheet member 25 having heat insulation, plasma resistance, and elasticity is disposed on the upper surface of the protruding portion 1a, which is a portion with which the lower surface of the peripheral edge of the RF incident window 3 can directly contact. This is because the vacuum chamber 1 is normally heated to about 70 ° C. to 100 ° C. to prevent heat conduction between the RF incident window 3 and the vacuum chamber 1. This is to withstand the generated plasma and to prevent contamination by particles and metal generated by rubbing by preventing rubbing between members. For these reasons, the sheet member 25 is preferably a fluororesin such as Teflon (trademark).

  Also, in consideration of preventing heat conduction between the RF incident window 3 and the ring member 22 between the RF incident window 3 and the ring member 22, the RF incident window 3 and the ring member 22 are in direct contact with each other. Instead, the upper surface of the holding member 21 is slightly higher than the upper surface of the RF incident window 3 so that a gap is provided between the RF incident window 3 and the ring member 22 so as to be close to each other. Since the O-ring 26 is disposed below the RF incident window 3, even if the RF incident window 3 and the ring member 22 are in contact with each other in the atmospheric state, the RF incident window 3 is in a vacuum chamber in a vacuum state. Since the O-ring 26 is retracted by being pulled to the 1 side, a gap is naturally generated between the RF incident window 3 and the ring member 22.

  The holding member 21 does not necessarily have a ring shape as long as it can support the ring member 22 at a position slightly higher than the upper surface of the RF incident window 3. For example, a plurality of holding members 21 are attached in the circumferential direction of the upper end surface of the vacuum chamber 1. These blocks may be configured, or may not necessarily be a member independent of the vacuum chamber 1, and may be formed integrally with the vacuum chamber 1.

  Further, the inner diameter of the ring member 22 only needs to be smaller than the outer diameter of the RF incident window 3, but considering the electromagnetic waves incident from the high frequency antenna 7 disposed above the RF incident window 3, the inner diameter of the vacuum chamber 1. It is desirable to be equal to or higher than. Further, when the vacuum chamber 1 is not cylindrical (for example, a rectangular tube) and the RF incident window 3 is not a disk (for example, rectangular), the inner periphery of the ring member 22 is similar to the RF incident window 3. The inner periphery of the ring member 22 may be made smaller than the outer periphery of the RF incident window 3 so that the inner peripheral side of the ring member 22 overlaps with the peripheral edge of the RF incident window 3 when viewed from above the apparatus. Desirably, it may be equal to or more than the inner circumference of the vacuum chamber 1.

Thus, in this reference example, since the RF incident window 3 is disposed between the protrusion 1a of the vacuum chamber 1 and the ring member 22 supported on the vacuum chamber 1, the RF incident window 3 is damaged. Even when it reaches, a large debris having a large destructive force can be held between the protrusion 1a of the vacuum chamber 1 and the ring member 22, and can be prevented from falling to minimize damage. .

Note that this reference example requires only one O-ring for the seal portion of the RF incident window 3 and has a relatively simple structure, and therefore can be configured at low cost.

FIG. 3 is another example of the structure in the vicinity of the RF incident window in the plasma processing apparatus according to the present invention, and shows a partial cross-sectional view thereof.
The present embodiment also, in the same manner as in Reference Example 1, which used in the plasma processing apparatus shown in FIG. 1, the configuration that overlaps with Example 1 are denoted by the same reference numerals, and detailed description thereof is omitted .

  In this embodiment, as shown in FIG. 3, a ring-shaped holding member 27 whose uppermost surface is higher than the upper surface of the RF incident window 3 is attached to the upper end surface of the vacuum chamber 1, and the RF incident window 3 is disposed on the uppermost surface. This is a structure for holding a ring-shaped ring member 22 having an inner diameter (or inner circumference) smaller than the outer diameter (or outer circumference).

  That is, by supporting the ring member 22 on the vacuum chamber 1 side (holding member 27 side), the ring member 22 is brought close to the upper surface of the peripheral edge of the RF incident window 3 when viewed from the side (see FIG. 3). As shown in FIG. 2B, the inner diameter side of the ring member 22 is arranged so as to overlap the peripheral edge portion of the RF incident window 3 as viewed from above.

  Further, a support portion 27a that supports the lower surface of the peripheral edge portion of the RF incident window 3 is extended on the inner peripheral side of the holding member 27, and a groove in which the O-ring 26 is disposed on the upper surface of the support portion 27a. Is provided, and the gap between the RF incident window 3 and the holding member 27 is sealed by the O-ring 26.

  Further, on the inner peripheral side of the upper end surface of the vacuum chamber 1, a ring-shaped protrusion 1 a is provided along the inner periphery, and a space formed by the protrusion 1 a and the support part 27 a of the holding member 27. Further, an O-ring 26 that seals between the holding member 27 and the vacuum chamber 1 is arranged. Therefore, the space between the vacuum chamber 1 and the RF incident window 3 is sealed by the two O-rings 26 disposed on the upper and lower surfaces of the support portion 27a of the holding member 27, and the vacuum in the processing chamber 2 is maintained. Will be.

  Further, the support portion 27 a of the holding member 27 extends to the front of the inner wall surface of the vacuum chamber 1, and the front end portion of the support portion 27 a is placed on the upper surface of the protrusion portion 1 a of the vacuum chamber 1. is there. In the structure as it is, the support portion 27 a is exposed to the plasma generated in the vacuum chamber 1, so that the inner peripheral surface is the same as the inner wall surface of the vacuum chamber 1 on the inner peripheral side of the support portion 27 a of the holding member 27. A protective ring 28 having a diameter is arranged to protect the support portion 27 a of the holding member 27 made of metal from plasma generated in the vacuum chamber 1. The protective ring 28 is made of alumina or aluminum whose surface is anodized for plasma resistance.

  Further, the upper surface of the protective ring 28 is formed at the same height as the upper surface of the support portion 27 a of the holding member 27. Since these upper surfaces are portions that can directly contact the lower surface of the peripheral edge portion of the RF incident window 3, the sheet member 25 having heat insulation, plasma resistance, and elasticity is disposed thereon.

Also in this embodiment, considering the prevention of heat conduction between the RF incident window 3 and the ring member 22, the holding member 27 is not directly contacted between the RF incident window 3 and the ring member 22. It is preferable that the upper surface of each of these is slightly higher than the upper surface of the RF incident window 3 so that a gap is provided between the RF incident window 3 and the ring member 22 so as to be close to each other. Further, since the holding member 27 may be in direct or indirect contact with the RF incident window 3 as compared with the holding member 21 of Reference Example 1, it may be made of stainless steel or the like having poor thermal conductivity. Good.

  In this embodiment, the O-ring 26 is disposed below the support portion 27a. However, if the space between the vacuum chamber 1 and the holding member 27 can be sealed, the arrangement position of the O-ring 26 is below the support portion 27a. There is no need to limit it to the side.

  As described above, in this embodiment, the RF incident window 3 is disposed between the support portion 27a of the holding member 27 and the ring member 22 supported by the holding member 27, so that the RF incident window 3 is damaged. Even in this case, a large piece having a large breaking force can be held between the support portion 27a of the holding member 27 and the ring member 22, and can be prevented from falling to minimize damage. In this embodiment, it is necessary to use two O-rings for the seal portion of the RF incident window 3. When the RF incident window 3 is broken, the holding member 27 is removed from the vacuum chamber 1 together with the ring member 22. Thus, the damaged RF incident window 3 can be removed together from the vacuum chamber 1 side, and the removal operation of the damaged RF incident window 3 becomes extremely easy.

Reference example 2

FIG. 4 is another example of the structure near the RF incident window in the plasma processing apparatus according to the present invention, and shows a partial cross-sectional view thereof.
The present reference example also, Example 1, in the same manner as in Example 1, which used in the plasma processing apparatus shown in FIG. 1, Example 1, the same reference numerals are given to the configuration that overlaps with Example 1 Detailed description thereof will be omitted.

In this reference example, as shown in FIG. 4A, a ring-shaped holding member 29 is attached to the outer peripheral side of the upper end surface of the vacuum chamber 1, that is, the outer peripheral side of the RF incident window 3. A proximity surface portion 29a that is close to the outer peripheral surface of the RF incident window 3 is provided, and an insertion member 30 that fills this clearance is inserted into the clearance between the outer peripheral surface of the RF incident window 3 and the adjacent surface portion 29a of the holding member 29. Structure.

  The insertion member 30 prevents the RF incident window 3 and a part of the holding member 29 from coming into contact with each other to generate a significant temperature gradient, and the RF incident window 3 and the holding member 29 (on the vacuum chamber 1 side). In order to further prevent heat conduction between the two, it is made of a heat insulating material. Further, the insertion member 30 is made of an elastic material, and when the RF incident window 3 is cracked or cracked, the outer peripheral surface of the RF incident window 3 and the adjacent surface portion of the holding member 29 are formed. It is comprised so that the elastic force by the insertion member 30 may work between 29a.

  A ring-shaped protrusion 1a is provided on the inner peripheral side of the upper end surface of the vacuum chamber 1 along the inner periphery, and RF is incident on the space between the protrusion 1a and the holding member 29. An O-ring 26 that seals between the window 3 and the vacuum chamber 1 is arranged. Therefore, the space between the vacuum chamber 1 and the RF incident window 3 is sealed by the O-ring 26 disposed in this space, and the vacuum in the processing chamber 2 is maintained.

  The holding member 29 does not necessarily have a ring shape as long as the RF incident window 3 and the holding member 29 are not in direct local contact. For example, the holding member 29 is attached in the circumferential direction of the upper end surface of the vacuum chamber 1. You may comprise by several blocks. For example, in the case of a plurality of blocks, it is desirable that the number is as large as possible. However, the holding member 29 may be configured by at least three blocks, and the insertion member 30 may be inserted according to the number of blocks. May be configured to positively press the RF incident window 3 using a block. Further, the holding member 29 is not necessarily a member independent of the vacuum chamber 1, and may be formed integrally with the vacuum chamber 1.

Thus, in this reference example, when the insertion member 30 is inserted between the RF incident window 3 and the holding member 29 and the RF incident window 3 is cracked or cracked, the RF incident window 3 is configured such that an elastic force acts between the outer peripheral surface 3 of the holding member 29 and the adjacent surface portion 29 a of the holding member 29. Even when a large static frictional force acts and the RF incident window 3 is damaged, a large debris with a large destructive force can be held by the static frictional force, preventing its falling and minimizing damage. Can be suppressed.

  In addition, the elastic force acting between the outer peripheral surface of the RF incident window 3 and the adjacent surface portion 29a of the holding member 29 also acts as a force pushing toward the center of the RF incident window 3 as shown in FIG. Even if a crack occurs in the RF incident window 3, the size of the crack can be kept to a minimum. If the size of the crack is kept to a minimum (for example, about several millimeters), it will be difficult to drop due to the friction of the fracture surface, and as a result, the large debris with a large destructive force will be prevented from falling and damaged. Can be minimized.

Note that this reference example has a relatively simple structure and can be configured at low cost.

Reference example 3

FIG. 5 is another example of the structure near the RF incident window in the plasma processing apparatus according to the present invention, and shows a partial cross-sectional view thereof.
Incidentally, this reference example, Reference Example 1 (FIG. 2), since a structure combining Reference Example 2 (FIG. 4), Reference Example 1, the same reference numerals are given to the same structure as Example 2, the Detailed description is omitted.

In this reference example, the configuration of the holding member 31 shown in FIG. 5 is different from the holding member 21 shown in FIG. 2 and the holding member 29 shown in FIG. Specifically, as shown in FIG. 5, a ring-shaped holding member 31 whose upper surface is higher than the upper surface of the RF incident window 3 is provided on the outer peripheral edge side of the upper end surface of the vacuum chamber 1, that is, on the outer peripheral side of the RF incident window 3. In addition to the attachment, the holding member 31 is provided with a proximity surface portion 31 a close to the outer peripheral surface of the RF incident window 3.

The ring member 22 has the same configuration as that of Reference Example 1, and the ring member 22 is brought close to the upper surface of the peripheral edge portion of the RF incident window 3 when viewed from the side by supporting the ring member 22 on the upper surface of the holding member 31. As shown in FIG. 2B, the inner diameter side of the ring member 22 is arranged so as to overlap the peripheral edge of the RF incident window 3 when viewed from above.

The insertion member 30 has the same configuration as that of Reference Example 2, is made of a material having elasticity and heat insulation properties, and is inserted into a gap between the outer peripheral surface of the RF incident window 3 and the adjacent surface portion 31a of the holding member 31. It is a thing.

  The holding member 31 supports the ring member 22 at a position slightly higher than the upper surface of the RF incident window 3 and does not necessarily have a ring shape unless the RF incident window 3 and the holding member 31 are in direct local contact. For example, it may be constituted by a plurality of blocks attached in the circumferential direction of the upper end surface of the vacuum chamber 1. Further, the holding member 31 is not necessarily a member independent of the vacuum chamber 1, and may be formed integrally with the vacuum chamber 1.

Thus, in this reference example, by combining the reference examples 1 and 2 , even when the RF incident window 3 is damaged, the size of the crack is kept to a minimum and the fragments are evacuated. It can hold | maintain between the projection part 1a of the chamber 1, and the ring member 22, and can prevent a fall of a fragment, As a result, the damage by breakage can be suppressed to the minimum. In particular, in this reference example, even if the RF incident window 3 is cracked or broken, the movement of the cracked or broken RF incident window 3 is greatly restricted by the ring member 22, the insertion member 30, and the holding member 31, Compared to the case of Reference Example 1, it is possible to prevent the fragments that are separated from the side surfaces from falling near the center of the RF incident window 3.

FIG. 6 is another example of the structure near the RF incident window in the plasma processing apparatus according to the present invention, and shows a partial cross-sectional view thereof.
In addition, since this example has a structure in which Example 1 (FIG. 3) and Reference Example 2 (FIG. 4) are combined, the same components as those in Example 1 and Reference Example 2 are denoted by the same reference numerals. Detailed description is omitted.

  In this embodiment, the configuration of the holding member 32 shown in FIG. 6 is different from the holding member 27 shown in FIG. 3 and the holding member 29 shown in FIG. Specifically, as shown in FIG. 6, a ring-shaped holding member 32 whose uppermost surface is higher than the upper surface of the RF incident window 3 is attached to the upper end surface of the vacuum chamber 1, and the RF incident window 3 is attached to the holding member 32. In this structure, a proximity surface portion 32b close to the outer peripheral surface is provided.

On the inner peripheral side of the holding member 32, like the support portion 27 a in the first embodiment, a support portion 32 a that supports the lower surface of the peripheral edge portion of the RF incident window 3 is extended, and on the upper surface of the support portion 32 a. In this structure, a groove for arranging the O-ring 26 is provided, and the O-ring 26 seals between the RF incident window 3 and the holding member 32. Further, an O-ring 26 is disposed in a space formed by the protrusion 1 a provided on the inner peripheral side of the upper end surface of the vacuum chamber 1 and the support portion 32 a of the holding member 32, and the holding member 32, the vacuum chamber 1, The gap is sealed with an O-ring 26.

  Further, the support portion 32 a of the holding member 32 extends to the front of the inner wall surface of the vacuum chamber 1, and the tip end portion of the support portion 32 a is placed on the upper surface of the protrusion 1 a of the vacuum chamber 1. is there. A protective ring 28 having an inner peripheral surface having the same diameter as the inner wall surface of the vacuum chamber 1 is disposed on the inner peripheral side of the support portion 32a of the holding member 32, and the support portion 32a of the holding member 32 made of metal is vacuum-treated. Protection is made from plasma generated in the chamber 1.

Further, the ring member 22 has the same configuration as that of Reference Example 1 and Example 1 , and the ring member 22 is supported on the uppermost surface of the holding member 32, so that the ring member 22 is seen from the side and the RF incident window 3 is viewed. As shown in FIG. 2B, the inner diameter side of the ring member 22 is arranged so as to overlap with the peripheral edge of the RF incident window 3 when viewed from above.

The insertion member 30 has the same configuration as that of Reference Example 2, is made of a material having elasticity and heat insulation properties, and is inserted into the gap between the outer peripheral surface of the RF incident window 3 and the adjacent surface portion 32b of the holding member 32. It has been done.

Thus, in the present embodiment has the structure in which a combination of the Example 1, Reference Example 2, even if the RF entrance window 3 has reached the failure, along with minimizing the size of the crack, debris Can be held between the support portion 32a of the holding member 32 and the ring member 22 to prevent the fragments from falling, and as a result, damage due to breakage can be minimized. In addition, when the RF incident window 3 is broken, the holding member 32 is removed together with the ring member 22 from the vacuum chamber 1 so that the broken RF incident window 3 can be removed together from the vacuum chamber 1 side. The removal operation of the window 3 becomes extremely easy.

  The present invention can be applied to any plasma processing apparatus that has a window on the top of the container that allows electromagnetic waves to enter the container.

It is a block diagram which shows an example of embodiment of the plasma processing apparatus which concerns on this invention. (A) is sectional drawing which shows the reference example of the structure of RF entrance window vicinity in the plasma processing apparatus which concerns on this invention, (b) is a figure which shows the positional relationship of RF entrance window and a ring member from upper direction. . It is sectional drawing which shows an example of the structure of RF entrance window vicinity in the plasma processing apparatus which concerns on this invention. It is sectional drawing which shows the other reference example of the structure of RF incident window vicinity in the plasma processing apparatus which concerns on this invention. It is sectional drawing which shows the other reference example of the structure of RF incident window vicinity in the plasma processing apparatus which concerns on this invention. It is sectional drawing which shows another example of the structure of RF entrance window vicinity in the plasma processing apparatus which concerns on this invention.

DESCRIPTION OF SYMBOLS 1 Vacuum chamber 2 Processing chamber 3 RF incident window 4 Support stand 5 Board | substrate 7 High frequency antenna 8 Matching device 9 High frequency power supply 10a, 10b Gas nozzle 12 Electrode part 13 Matching device 14 Low frequency power supply 21, 27, 29, 31, 32 Holding member 22 Ring member 24 Cover 25 Sheet member 26 O-ring 27a, 32a Support portion 28 Protection ring 30 Insertion member

Claims (4)

In the plasma processing apparatus for injecting electromagnetic waves from an antenna disposed above the window through the insulating window that closes the upper opening of the container into the container to convert the gas in the container into plasma,
A holding member that supports a lower surface of the peripheral edge of the window and seals between the upper end surface of the container and a lower surface of the peripheral edge of the window via an O-ring ; Attach to the top surface
A ring member having an inner circumference smaller than the outer circumference of the window is attached to the holding member in the vicinity of the upper surface of the peripheral edge of the window,
A peripheral portion of the window is disposed between the support portion and the ring member ;
A plasma processing apparatus , wherein a protective ring for protecting the support portion from plasma in the container is provided on an inner peripheral side of the support portion of the holding member . In the plasma processing apparatus for injecting electromagnetic waves from an antenna disposed above the window through the insulating window that closes the upper opening of the container into the container to convert the gas in the container into plasma,
An O-ring having a support portion for supporting the lower surface of the peripheral edge portion of the window and a proximity surface portion close to the outer peripheral surface of the window, and between the upper end surface of the container and the lower surface of the peripheral edge portion of the window A holding member for sealing via is attached to the upper end surface of the container,
Inserting an insertion member made of a material having elasticity and high heat insulation into the gap between the outer peripheral surface of the window and the proximity surface portion,
A ring member having an inner circumference smaller than the outer circumference of the window is attached to the holding member in the vicinity of the upper surface of the peripheral edge of the window,
A peripheral portion of the window is disposed between the support portion and the ring member ;
A plasma processing apparatus , wherein a protective ring for protecting the support portion from plasma in the container is provided on an inner peripheral side of the support portion of the holding member . The claim 1 or the plasma processing apparatus according to claim 2,
The plasma processing apparatus characterized in that the size of the inner periphery of the ring member is equal to or greater than the size of the inner periphery of the container. The plasma processing apparatus according to any one of claims 1 to 3 ,
A plasma processing apparatus, wherein a sheet member made of a material having elasticity and high heat insulating property is inserted into a portion where the lower surface of the peripheral edge of the window can directly contact the upper end surface of the container.

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