KR20150139090A - Improved Heat Treatment Chamber of Substrates and Heat Treatment Apparatus Having the Same - Google Patents

Abstract

The present invention discloses a heat treatment chamber for a substrate and a substrate heat treatment apparatus having the same. According to the present invention, the heat treatment chamber for a substrate includes: a chamber body providing a heat treatment space for a plurality of substrates inside; a boat which is provided in the heat treatment space, and which the substrates are loaded onto and supported from; an upper heater housing integrally provided in an upper part of the chamber body and having a plurality of lamp heaters therein; and a lower heater housing integrally provided in a lower part of the chamber body and having a plurality of lower lamp heaters therein.

Description

TECHNICAL FIELD [0001] The present invention relates to an improved substrate heat treatment chamber and a substrate heat treatment apparatus having the same,

The present invention relates to an improved substrate heat treatment chamber and a substrate heat treatment apparatus having the same.

More specifically, the present invention relates to a method of manufacturing a heat treatment chamber, which includes a lower heater housing having an upper heater housing and a plurality of lower lamp heaters mounted integrally on upper and lower portions of a substrate heat treatment chamber body having a plurality of upper lamp heaters, The heat treatment efficiency of the substrate is increased more than two times by providing two or more substrates in the heat treatment space of the heater housing, and in particular, when a failure occurs in a part of a plurality of lamp heaters in a plurality of heater housings, To a substrate heat treatment chamber in which the installation and maintenance time and cost of the entire equipment are greatly reduced, and a substrate heat treatment apparatus having the same.

Further, the present invention provides, in addition to the above-mentioned features, at least one crossbar constituting a frame of a boat on which a substrate is supported to form a gas-feeding tube, and a separate upper gas-supplying tube is provided on the uppermost substrate, In particular, the gas flow length on the substrate is reduced to less than 1/2 and thus the uniform gas flow and pressure distribution can be formed on the entire surface of the substrate, which ultimately leads to the production of large area substrates To a substrate heat treatment chamber capable of mass production of a substrate and a substrate heat treatment apparatus having the same.

An annealing apparatus used for manufacturing semiconductors, flat panel displays and solar cells can be applied to a predetermined film (organic material and / or organic material) deposited on a flexible substrate (hereinafter collectively referred to as "substrate") such as a silicon wafer, Inorganic substance), which is necessary for a process such as crystallization and phase change.

A typical annealing apparatus is a silicon crystallization apparatus for crystallizing amorphous silicon deposited on a glass substrate into polysilicon when a liquid crystal display or a thin film crystalline silicon solar cell is manufactured.

In order to perform such a crystallization process (heat treatment process), a heat treatment apparatus capable of heating a substrate on which a predetermined thin film (hereinafter referred to as "film") is formed must be provided. For example, for crystallization of amorphous silicon, a temperature of at least 550 to 600 DEG C is required.

Generally, a heat treatment apparatus includes a single-wafer type in which heat treatment can be performed on one substrate, and a batch type in which heat treatment can be performed on a plurality of substrates. There is a merit of simple configuration of the apparatus, but there is a disadvantage that the productivity is low, and the batch formula is getting popular for the mass production in recent years.

FIG. 1 is a perspective view showing a configuration of a batch type heat treatment apparatus according to the prior art, FIG. 2 (a) is a perspective view showing a configuration of a chamber of a batch type heat treatment apparatus according to the prior art shown in FIG. 1, Fig. 5 is a perspective view showing the arrangement of the substrate, the main heater unit, and the auxiliary heater unit of the batch type heat treatment apparatus according to the first embodiment. Such a batch heat treatment apparatus according to the prior art is applied, for example, by Korean Patent Application No. 10-2008-0069329, entitled " Batch Heat Treatment Apparatus "filed on July 16, 2008, Are described in detail in Korean Patent No. 10-1016048, filed on February 11,

1 to 2B, a batch type thermal processing apparatus 1 according to the related art includes a chamber 100 having a rectangular parallelepiped shape for providing a heat treatment space and a frame 110 for supporting the chamber 100, do.

A door 140 is installed at one side of the chamber 100 to open and close the chamber 100 in order to load the substrate 10 into the chamber 100. The substrate 10 can be loaded into the chamber 100 by using a substrate loading device (not shown) such as a transfer arm in a state where the door 140 is opened. On the other hand, after the heat treatment is completed, the substrate 10 may be unloaded from the chamber 100 through the door 140.

A cover 160 is provided on the upper side of the chamber 100 for repairing and replacing the boats 120, the gas supply pipes 300 and the gas discharge pipes 320 installed in the chamber 100 .

A main heater unit 200 for directly heating the substrate 10 in the chamber 100, an auxiliary heater unit 220 for preventing heat loss in the chamber 100, A cooling pipe 250 for rapidly cooling the inside of the cooling pipe 100 is installed.

Referring to FIGS. 2A and 2B, the main heater unit 200 includes a unit main heater 210 having a predetermined interval in parallel with the short side direction of the substrate 10. The unit main heater 210 is a conventional cylindrical heater having a long length and constitutes a main heater unit 200 in which a heating element is inserted into a quartz tube and external power is applied through terminals provided at both ends to generate heat Lt; / RTI >

A plurality of main heater units 200 are arranged at regular intervals along the stacking direction of the substrates 10. The substrate 10 is disposed between a plurality of main heater units 200. It is preferable that the substrate 10 is disposed at the center between the main heater units 200.

As described above, in the batch type thermal processing apparatus 1 according to the related art, the main heater unit 200 composed of the unit main heaters 210 capable of covering the entire surface of the substrate 10 on the plurality of substrates 10, The substrate 10 can receive heat from the unit main heater 210 over the entire surface thereof, and can be heat-treated.

2A and 2B, the auxiliary heater unit 220 includes a first auxiliary heater unit 220a disposed parallel to the short side direction of the substrate 10 and a second auxiliary heater unit 220b disposed along the long side direction of the substrate 10 And a second auxiliary heater unit 220b. The first auxiliary heater unit 220a includes a plurality of first unit auxiliary heaters 230a disposed on both sides of the main heater unit 200 in parallel with the unit main heaters 210. [

In the batch type heat treatment apparatus 1 according to the related art described above, since only one substrate 10 is stacked between the main heater units 200, the heat treatment efficiency of the substrate 10 is lowered.

In the batch type thermal processing apparatus 1 according to the related art, since the chamber 100 is formed in a rectangular parallelepiped shape, the chambers 100 are individually manufactured according to the height of the installation space and the required substrate production amount The manufacturing cost and the manufacturing time are increased. That is, the chamber 100 used in the batch heat treatment apparatus 1 according to the prior art has a problem that it can not be manufactured in a rapid response to a change in the height of the installation space and the required amount of the substrate production.

Since the main heater unit 200 and the auxiliary heater unit 220 are provided through the body of the chamber 100 having a rectangular parallelepiped shape in the batch type thermal processing apparatus 1 according to the related art, The heat treatment operation of the batch type heat treatment apparatus 1 itself for repairing or replacing the failed main heater unit 200 and auxiliary heater unit 220 when a failure occurs in some of the auxiliary heater unit 200 and the auxiliary heater unit 220, There is a problem that the worker must go into the chamber 100 and repair or replace the main heater unit 200 and the auxiliary heater unit 220 that have failed.

Therefore, due to the above-mentioned problems, the total heat treatment process time and cost are greatly increased.

FIG. 3A is a perspective view illustrating a configuration of a gas supply pipe and a gas discharge pipe used in the batch type heat treatment apparatus according to the related art, and FIG. 3B is a view illustrating an operation state of the gas supply pipe shown in FIG.

Referring to FIGS. 3A and 3B, the substrate 10 is loaded on the boat 120 while being mounted on the holder 12.

The chamber 100 is provided with a gas supply pipe 300 in the form of a rod having a plurality of first gas holes 310 for discharging a process gas for supplying a process gas for forming a heat treatment atmosphere into the chamber 100, And a plurality of rod-shaped gas discharge pipes 320 each having a plurality of second gas holes (not shown) through which waste gas used for the composition of the heat treatment atmosphere flows.

The position of the plurality of first gas holes 310 formed in the gas supply pipe 300 is positioned as close to the substrate 10 as possible so that the process gas to be injected is in direct contact with the substrate 10. [

However, in the structures of the gas supply pipe 300 and the gas discharge pipe 320 of the related art, the gas supply / discharge pipe 320 and the gas supply / discharge pipe 320 are formed in the shape of a nozzle like the plurality of first gas holes 310 and the plurality of second gas holes 320, . Therefore, since a linear gas flow is formed only in front of the plurality of first gas holes 310 and is difficult to uniformly diffuse over the entire surface of the substrate 10, a uniform gas flow And it is difficult to form a pressure distribution.

In addition, since a uniform gas flow and pressure distribution are not formed on the entire surface of the substrate 10, contaminants such as fumes generated in the film formed on the substrate 10 are discharged through the gas discharge pipe 320, (100).

In addition, contaminants such as fumes that have not been discharged from the chamber 100 may be reattached to the substrate 10 to cause defects in the substrate 10. The possibility of contamination and defects of the substrate 10 due to such contaminants increases with the increase of the number of the substrates 10 and the case of the large area substrates, which has been a great obstacle to the manufacture of large area substrates and mass production of substrates.

In addition, in particular, as the substrate becomes larger, the gas flow length of the substrate necessarily increases, and the above-mentioned problems are further exacerbated.

As a solution to the above-described problems of the prior art, a method of providing gas at the upper part of the chamber has been proposed and used. Such another conventional substrate heat treatment apparatus has been filed as a Korean Patent Application No. 10-2010-0067187, entitled " Substrate Heat Treatment Apparatus ", filed on July 12, 2010, Korean Patent No. 10-1104201, filed on January 3.

FIG. 3C is a view for explaining a problem with gas supply in a heat treatment apparatus according to another prior art. FIG.

3C, in the above-described conventional substrate heating apparatus, four static pressure units 360 are provided adjacent to the outside of each corner of the chamber 9100 in which the air supply line 340 is supplied from the center of the substrate 10, The shortest purging distance L of the airflow has a value at least 1.4 times longer than half of the width of the substrate 10, not half.

In addition, in another conventional substrate heat treatment apparatus, the air flow of nitrogen spreads from the center of the substrate 10 in all directions, so that the purge distance of the airflow injected into the regions A, B, C, and D shown in FIG. (Indicated by the dotted arrows only for the A and C regions for the convenience of explanation) is not only longer than the half distance of the width of the substrate 10, but also makes it possible to move the airflow moving L1 along the shortest purging distance L, There arises a problem that a vortex is generated and ultimately it is difficult to achieve a uniform purge effect of contaminants on the substrate 10. [

Further, in another conventional substrate heat treatment apparatus, the supply line 340 is extended to the upper portion of each substrate 10 of the chamber 100 because the supply is performed at the center of the substrate 10. To this end, the structure of the supply device (not shown) including the supply line 340 is very complicated, and in particular, the supply line 340 must be provided in the inner space of the chamber 100 in which the substrate 10 is provided There is a problem that the supply line 340 is very difficult or substantially impossible to install.

Therefore, there is a need for a new method for solving the problems of the chamber and the batch type heat treatment apparatus used in the batch type heat treatment apparatus of the prior art described above.

Korean Patent No. 10-1016048 Korean Patent No. 10-1104201

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems of the prior art, and it is an object of the present invention to provide a lower heater housing, And the heat treatment is performed by providing two or more substrates in the heat treatment space inside the heat treatment chamber body to increase the heat treatment efficiency of the substrate by more than two times and particularly to improve the heat treatment efficiency of the heat of the plurality of lamp heaters And more particularly, to a substrate heat treatment chamber in which the replacement of a broken lamp heater is very easy, and the installation and maintenance time and cost of the entire equipment are greatly reduced, and a substrate heat treatment apparatus having the same.

Further, the present invention provides, in addition to the above-mentioned features, at least one crossbar constituting a frame of a boat on which a substrate is supported to form a gas-feeding tube, and a separate upper gas-supplying tube is provided on the uppermost substrate, In particular, the gas flow length on the substrate is reduced to less than 1/2 and thus the uniform gas flow and pressure distribution can be formed on the entire surface of the substrate, which ultimately leads to the production of large area substrates A substrate heat treatment chamber capable of mass production of a substrate and a substrate heat treatment apparatus having the same.

A substrate heat treatment chamber according to a first aspect of the present invention includes: a chamber body for providing a heat treatment space for a plurality of substrates therein; A boat provided in the heat treatment space and loaded and supported by the plurality of substrates; An upper heater housing integrally provided on an upper portion of the chamber body, the upper heater housing having a plurality of upper lamp heaters therein; And a lower heater housing integrally provided at a lower portion of the chamber body, the lower heater housing having a plurality of lower lamp heaters therein.

A substrate heat treatment chamber according to a second aspect of the present invention includes: a chamber body for providing a plurality of first to n-th substrate heat treatment spaces; A boat provided in the heat treatment space and loaded and supported by the plurality of first through n-th substrates; An upper heater housing integrally provided on the upper portion of the chamber body, the upper heater housing having a plurality of upper lamp heaters therein; A lower heater housing integrally provided at a lower portion of the chamber body, the lower heater housing having a plurality of lower lamp heaters therein; And a plurality of first through n-1 internal lamp heaters provided in the chamber body and provided between the plurality of first through n-th substrates, respectively.

According to a third aspect of the present invention, there is provided a substrate heating apparatus comprising: a chamber body for providing a plurality of substrates with a heat treatment space; A boat provided in the heat treatment space and having a plurality of supporting crossbars constituting a frame in which the plurality of substrates are loaded and supported; An upper crossbar provided in a direction parallel to the plurality of support cross bars at an upper portion of the uppermost one of the plurality of substrates; An upper heater housing integrally provided on the upper portion of the chamber body, the upper heater housing having a plurality of upper lamp heaters therein; A lower heater housing integrally provided at a lower portion of the chamber body and including a plurality of lower lamp heaters therein; A gas supply device connected to one side end of the upper cross bar and the plurality of support cross bars at an outer side surface of the chamber body through an air supply line; And a gas exhausting device provided on both side surfaces of the chamber body along a direction parallel to the longitudinal direction of the plurality of support crossbars, wherein one end of the lowermost support crossbars among the plurality of support crossbars extend through the supply line And is selectively connected to the gas supply device.

According to a fourth aspect of the present invention, there is provided a substrate heating apparatus comprising: a chamber body for providing a plurality of first through n-th substrates with a heat treatment space; A boat provided in the heat treatment space and having a plurality of supporting crossbars constituting a frame in which the plurality of first to nth substrates are loaded and supported; An upper crossbar provided in a direction parallel to the plurality of support cross bars at an upper portion of the uppermost one of the plurality of first to nth substrates; An upper heater housing integrally provided on the upper portion of the chamber body, the upper heater housing having a plurality of upper lamp heaters therein; A lower heater housing integrally provided at a lower portion of the chamber body, the lower heater housing having a plurality of lower lamp heaters therein; A plurality of first through n-1 internal lamp heaters provided in the chamber body, the first through n-1 internal lamp heaters being provided between the first through n-th substrates, respectively; A gas supply device connected to one side end of the upper cross bar and the plurality of support cross bars at an outer side surface of the chamber body through an air supply line; And one or more gas exhausting devices provided on both side surfaces of the chamber body along a direction parallel to the longitudinal direction of the plurality of support crossbars, wherein one end of the lowermost support crossbar of the plurality of support crossbars is connected to the air supply line And the gas supply unit is selectively connected to the gas supply unit.

The following effects can be achieved by using the improved substrate heat treatment chamber and the substrate heat treatment apparatus having the same according to the present invention.

1. The heat treatment efficiency of the substrate increases more than 2 times.

2. In particular, when a failure occurs in a plurality of upper and lower lamp heaters in the upper and lower heater housings, it is very easy to replace the failed lamp heater, so that installation and maintenance time and cost of the entire equipment are greatly reduced.

3. The gas flow length on the substrate is reduced to less than 1/2.

4. It is possible to form a uniform gas flow and pressure distribution on the entire surface of the substrate.

5. It is possible to manufacture a large area substrate and mass production of a substrate.

Further advantages of the present invention can be clearly understood from the following description with reference to the accompanying drawings, in which like or similar reference numerals denote like elements.

1 is a perspective view showing a configuration of a batch type heat treatment apparatus according to the prior art.
FIG. 2A is a perspective view showing a configuration of a chamber of the batch type heat treatment apparatus according to the prior art shown in FIG. 1. FIG.
FIG. 2B is a perspective view showing the arrangement of the substrate, the main heater unit, and the auxiliary heater unit of the batch type heat treatment apparatus according to the related art.
3A is a perspective view showing a configuration of a gas supply pipe and a gas discharge pipe used in a batch type heat treatment apparatus according to the prior art.
FIG. 3B is a view for explaining the operation state of the gas supply pipe of FIG. 3A.
FIG. 3C is a view for explaining a problem with gas supply in a heat treatment apparatus according to another prior art. FIG.
4A is an exploded perspective view of the substrate heat treatment chamber according to the first embodiment of the present invention.
4B is a schematic side cross-sectional view of a substrate thermal processing chamber according to a first embodiment of the present invention.
4C is a schematic view of a substrate heat treatment chamber according to a second embodiment of the present invention.
4D is a side view of the substrate heat treatment chamber and the substrate heat treatment apparatus having the gas supply and exhaust device for substrate heat treatment according to the first embodiment of the present invention.
FIG. 4E is a schematic plan view of the substrate heat treatment chamber and the substrate heat treatment apparatus having the gas supply and exhaust device for substrate heat treatment according to the first embodiment of the present invention shown in FIG. 4D.
FIG. 4F is an enlarged view of a part of the gas supply apparatus for substrate heat treatment according to the second embodiment of the present invention shown in FIGS. 4D and 4E.
FIG. 4G is a cross-sectional view of the gas supply and supply holes of the gas supply apparatus for substrate heat treatment according to the first embodiment of the present invention shown in FIG. 4F.
4H is a schematic view showing a side view of a substrate heat treatment chamber and a substrate heat treatment apparatus having a gas supply and exhaust device for substrate heat treatment according to a second embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described with reference to embodiments and drawings of the present invention.

FIG. 4A is an exploded perspective view of the substrate heat treatment chamber according to the first embodiment of the present invention, and FIG. 4B is a schematic cross-sectional side view of the substrate heat treatment chamber according to the first embodiment of the present invention.

Referring to FIGS. 4A and 4B, a substrate thermal processing chamber 400 according to a first embodiment of the present invention includes a chamber body 402 for providing a thermal processing space 401 of a plurality of substrates 10u and 10d therein; A boat 420 provided in the heat treatment space 401 and loaded and supported by the plurality of substrates 10u and 10d; An upper heater housing 404a integrally provided on the upper portion of the chamber body 402 and having a plurality of upper lamp heaters 410a therein; And a lower heater housing 404b integrally provided at a lower portion of the chamber body 402 and having a plurality of lower lamp heaters 410b therein.

In the substrate heating chamber 400 according to the first embodiment of the present invention shown in FIG. 4A, an upper heater housing 404a is integrally provided on the upper portion of the chamber body 402, and a lower heater housing 404b And is integrally provided at a lower portion of the chamber body 402.

In addition, in the substrate heat treatment chamber 400 according to an embodiment of the present invention, the space enclosed by the upper heater housing 404a, the chamber body 402, and the lower heater housing 404b forms the heat treatment space 401 .

4C is a schematic view of a substrate heat treatment chamber according to a second embodiment of the present invention.

Referring to FIG. 4C, the substrate thermal processing chamber 400 according to the second embodiment of the present invention includes a plurality of first to n-th substrates 10u1, 10d1, ..., 10un, 10dn, A chamber body (402) for providing a chamber (402); A boat 420 provided in the heat treatment space 401 and loaded and supported by the first through n-th substrates 10u1, 10d1, ..., 10un, 10dn; An upper heater housing 404a integrally provided on the upper portion of the chamber body 402 and having a plurality of upper lamp heaters 410a therein; A lower heater housing 404b integrally provided at a lower portion of the chamber body 402 and having a plurality of lower lamp heaters 410b therein; And a plurality of first to n-1th internal lamps provided in the chamber body (402) and provided between the plurality of first to nth substrates (10u1, 10d1; ... 10un, 10dn) And includes heaters 410c1, ..., 410cn-1.

A plurality of first to n-th substrates 10u1, 10d1, ..., 10un, 10dn are arranged in the heat treatment space 401 in the substrate heat treatment chamber 400 according to the second embodiment of the present invention, Lt; / RTI >

In addition, a plurality of first lamp heaters 410a, a plurality of first to nth substrates 10u1, 10d1, ..., 10un, 10dn, a plurality of lower lamp heaters 410b, The arrangement relationship between the inner lamp heaters 410c1 to 410cn-1 is such that the plurality of first substrates 10u1 and 10d1 are connected to the plurality of the lower lamp heaters 410b and the plurality of the first inner lamp heaters 410c1, A plurality of second substrates 10u2 and 10d2 are provided between a plurality of first inner lamp heaters 410c1 and a plurality of second inner lamp heaters 410c2 and a plurality of nth substrates 10un, 10dn are arranged in such a manner that they are provided between the plurality of n-1th inner lamp heaters 410cn-1 and the plurality of upper lamp heaters 410a. That is, the plurality of first substrates 10u1 and 10d1 to the plurality of nth substrates 10un and 10dn are respectively connected to a plurality of lower lamp heaters 410b, a plurality of first to n-1th inner lamp heaters 410c1,. ..., 410cn-1, and a plurality of upper lamp heaters 410a.

In the first and second embodiments of the present invention described above, two substrates 10u and 10d and a plurality of first to nth substrates 10u1, 10d1, ..., 10un and 10dn are two, It should be noted that each of the plurality of substrates 10u and 10d and the plurality of first to n-th substrates 10u1, 10d1, ..., 10un and 10dn may be three or more.

Accordingly, in the substrate thermal processing chamber 400 according to the first and second embodiments of the present invention, a plurality of upper lamp heaters 410a, a plurality of first to nth substrates 10u1, 10d1, ..., 10dn) and the plurality of lower lamp heaters 410b, at least two or more substrates are provided in the space between each of the plurality of lower lamp heaters 410b and 410dn and the plurality of lower lamp heaters 410b, so that the heat treatment efficiency of the substrate is increased by at least two times .

In the substrate heat treatment chamber 400 according to the first and second embodiments of the present invention, the upper and lower heater housings 404a and 404b are separately provided from the chamber body 402 so that the plurality of heater housings 404a and 404b If a failure occurs in a part of the plurality of upper and lower lamp heaters 410a and 410b in the chamber 400, unlike the related art, a worker enters the inside of the chamber 400 to replace the broken lamp heater only do. Therefore, the replacement of the broken lamp heater is very easy, and the installation and maintenance time and cost of the entire equipment are greatly reduced.

The substrate heat treatment apparatus 1 according to an embodiment of the present invention includes a plurality of support cross bars constituting a frame of a boat 420 of the substrate heat treatment chamber 400 according to the first and second embodiments of the present invention, By providing a separate upper crossbar as the upper gas feed tube on the uppermost substrate to reduce the gas flow length on the substrate to less than one half and thus to provide a uniform gas on the entire surface of the substrate Flow and pressure distributions are possible, which can ultimately provide additional features that enable the fabrication of large area substrates and the mass production of substrates.

4D is a side view of the substrate heat treatment chamber and the substrate heat treatment apparatus having the gas supply and exhaust device for substrate heat treatment according to the first embodiment of the present invention. FIG. 4E is a cross- FIG. 4F is a schematic plan view of a substrate heat treatment chamber and a substrate heat treatment apparatus having the gas supply and exhaust apparatus for substrate heat treatment according to the first embodiment of the present invention. FIG. 4F is a cross- FIG. 4G is a cross-sectional view of the gas supply and supply holes of the gas supply apparatus for substrate heat treatment according to the first embodiment of the present invention shown in FIG. 4F; FIG. to be.

Referring to FIGS. 4D to 4G with reference to FIGS. 4A to 4A and 4B, a substrate thermal processing apparatus 1 according to a first embodiment of the present invention includes a plurality of substrates 10u and 10d, A chamber body (402) for providing a chamber (402); A boat 420 provided in the heat treatment space 401 and having a plurality of support cross bars 422c constituting a frame in which the plurality of substrates 10u and 10d are loaded and supported; An upper crossbar 422u provided on the upper portion of the uppermost substrate 10u among the plurality of substrates 10u and 10d in a direction parallel to the plurality of supporting crossbars 422c; An upper heater housing 404a integrally provided on the upper portion of the chamber body 402 and having a plurality of upper lamp heaters 410a therein; A lower heater housing 404b integrally provided at a lower portion of the chamber body 402 and having a plurality of lower lamp heaters 410b therein; A gas supply device 432 connected to one side end of the upper crossbar 422u and the plurality of support crossbars 422c at an outer side of the chamber body 402 through an air supply line 440; And a gas exhausting device (470) provided on both side surfaces of the chamber body (402) along a direction parallel to the longitudinal direction of the plurality of supporting crossbars (422c), wherein a lowermost part One end of the support crossbar 422c1 is selectively connected to the gas supply device 432 through the supply line 440. [

In the substrate heating apparatus 1 according to the first embodiment of the present invention described above, the upper heater housing 404a, the chamber body 402, and the lower heater housing 404b are formed by the present invention Thereby forming a substrate thermal processing chamber 400 according to the first embodiment of FIG.

It should also be appreciated that while a plurality of support crossbars 422c are illustratively shown as two, one skilled in the art will appreciate that a plurality of support crossbars 422c may be provided in three or more. Therefore, in the following description, when necessary, reference numeral 422c1 in the plurality of support cross bars 422c is the lowermost support cross bar.

Hereinafter, specific configurations and features of the substrate heat treatment apparatus 1 according to one embodiment of the present invention will be described in detail.

Referring to Figs. 4D to 4G again, with reference to Figs. 4A to 4B, in the substrate heat treatment apparatus 1 according to the first embodiment of the present invention, the upper cross bar 422u, the plurality of support cross bars 422c, The supply line 440, the gas supply device 432, and the gas exhaust device 470 constitute a gas supply device 430 for substrate heat treatment. In this case, the lowermost support crossbar 422c1 can selectively constitute the gas supply device 430 for heat treatment of the substrate.

In the substrate heating apparatus 1 according to the first embodiment of the present invention, the upper crossbar 422u and the plurality of support crossbars 422c are provided with a plurality of lower air supply holes 424d And may further optionally include a plurality of side air supply holes 424s on either side thereof.

In the substrate heating apparatus 1 according to the first embodiment of the present invention, one end of the lowermost support crossbar 422c1 is selectively connected to the gas supply device 432 through the supply line 440 . In this case, the lowermost support crossbar 422c1 has a plurality of lower air supply holes 424d, and may additionally have a plurality of side air supply holes 424s on both sides thereof.

In the substrate heat treatment apparatus 1 according to the first embodiment of the present invention, a plurality of support pins 426 for supporting a plurality of substrates 10u and 10d, respectively, are formed on the support cross bars 422c, Is provided.

The upper crossbar 422u and the plurality of support crossbars 422c are mounted on a plurality of substrates 10u and 10d so as not to be damaged by the high temperature heat used in the heat treatment operation of the plurality of substrates 10u and 10d, It is preferable to embody the same or similar material as the plurality of substrates 10u and 10d so as to have similar heat behavior to the substrates 10u and 10d. More specifically, the upper crossbar 422u and the plurality of support crossbars 422c may each be made of a quartz material.

The upper cross bar 422u and the plurality of supporting cross bars 422c are connected to the gas supply device 432 through the supply line 440 And a plurality of air supply holes 424 for injecting the gas supplied through the plurality of air supply holes (not shown) onto the plurality of substrates 10u and 10d.

The lowermost support cross bar 422c1 also has a plurality of supply holes 424 for selectively supplying gas from the gas supply device 432 through the supply line 440 to the lower portion of the lowermost substrate 10d Contaminants such as fumes remaining in the chamber 400 can be further discharged to the outside of the chamber 400, thereby further enhancing the purge effect of the contaminants in the chamber 400. It should be noted, however, that the use of the lowermost support crossbar 422c1 is not necessarily an option.

On the other hand, the plurality of side air supply holes 424s extend in the vertical direction from the center portion O of the upper cross bar 422u and the plurality of support cross bars 422c in the clockwise direction and the counterclockwise direction, respectively, It is preferable to be provided within an angular range. The gas injected through the plurality of side air supply holes 424s is directly injected onto the plurality of substrates 10u and 10d supplied through the plurality of lower air supply holes 424d and then moved to the gas exhaust unit 470 Gas contributes to form laminar flow. Part of the gas injected through the plurality of side air supply holes 424s may be directly sprayed onto the plurality of substrates 10u and 10d to perform the function of removing contaminants on the plurality of substrates 10u and 10d It is self-evident.

In the substrate heating apparatus 1 according to the first embodiment of the present invention as described above, the upper cross bar 422u and the plurality of support cross bars 422c are arranged at the central portions of the plurality of substrates 10u and 10d The gas flow length is reduced to 1/2 times the entire purge length L (i.e., L / 2).

In the substrate heat treatment apparatus 1 according to the embodiment of the present invention described above, the upper cross bar 422u and the plurality of support cross bars 422c are used one by one along the vertical direction as an example It will be appreciated by those skilled in the art that the upper crossbar 422u and the plurality of support crossbars 422c can be used in two or more different positions, respectively, along the vertical direction. More specifically, the upper crossbar 422u and the plurality of support crossbars 422c are disposed at n positions uniformly dividing the entire purge length L of the plurality of substrates 10u, 10d along the vertical direction, respectively If used, the gas flow length is reduced to 1 / (n + 1) times (i.e., L / (n + 1)) of the total purge distance L.

4H is a schematic view showing a side view of a substrate heat treatment chamber and a substrate heat treatment apparatus having a gas supply and exhaust device for substrate heat treatment according to a second embodiment of the present invention.

Referring to FIG. 4H and FIG. 4C, the substrate thermal processing apparatus 1 according to the second embodiment of the present invention includes a plurality of first to n-th substrates 10u1, 10d1, ..., 10un, 10dn, A chamber body (402) for providing a heat treatment space (401); A plurality of support cross bars 422c provided in the heat treatment space 401 and constituting a frame in which the plurality of first to n th substrates 10u1, 10d1, ..., 10un, 10dn are loaded and supported, A boat 420 provided with the boat; And an upper cross bar provided in a direction parallel to the plurality of support cross bars 422c at an upper portion of the uppermost substrate 10un among the plurality of first to nth substrates 10u1, 10d1, ..., 10un, 422u); An upper heater housing 404a integrally provided on the upper portion of the chamber body 402 and having a plurality of upper lamp heaters 410a therein; A lower heater housing 404b integrally provided at a lower portion of the chamber body 402 and having a plurality of lower lamp heaters 410b therein; N-1 internal lamp heaters provided in the chamber body 402 and provided between the plurality of first to n-th substrates 10u1, 10d1, ..., 10un, 10dn, respectively, (410c1, ..., 410cn-1); A gas supply device 432 connected to one side end of the upper crossbar 422u and the plurality of support crossbars 422c at an outer side of the chamber body 402 through an air supply line 440; And at least one gas exhaust device (470) provided on both sides of the chamber body (402) along a direction parallel to the longitudinal direction of the plurality of support crossbars (422c), wherein the plurality of support crossbars (422c) One end of the lowermost support cross bar 422c1 is selectively connected to the gas supply device 432 through the supply line 440. [

In the substrate heat treatment apparatus 1 according to the second embodiment of the present invention, the upper crossbar 422u and the plurality of support crossbars 422c each have a plurality of lower air supply holes 424d, Optionally, a plurality of side air supply holes 424s may be additionally provided on each of the two side surfaces.

In the substrate heating apparatus 1 according to the second embodiment of the present invention, one end of the lowermost support crossbar 422c1 may be selectively connected to the gas supply device 432 through the supply line 440 have. In this case, the lowermost support crossbar 422c1 has a plurality of lower air supply holes 424d, and may additionally have a plurality of side air supply holes 424s on both sides thereof.

In the substrate heating apparatus 1 according to yet another embodiment of the present invention, a plurality of first through n-1 internal lamp heaters 410c1, ..., A plurality of support pins (not shown) for supporting the plurality of support pins 410cn-1 to 410cn-1 are provided.

As described above, in the substrate heat treatment apparatus 1 according to the first and second embodiments of the present invention, the gas injected from the plurality of lower supply holes 424d and the plurality of side supply holes 424s selectively provided Laminar flow is formed on the plurality of substrates 10u and 10d or the plurality of first to nth substrates 10u1 to 10d1 to 10un to form a substantially laminar flow so that contaminants and the like are purged, It is possible to form a uniform gas flow and pressure distribution on the entire surface of the plurality of substrates 10u and 10d and to greatly improve the purging effect of contaminants do.

Various modifications may be made by those skilled in the art without departing from the spirit and scope of the invention as defined by the following claims. It is not. Accordingly, the scope of the present invention should not be limited by the above-described exemplary embodiments, but should be determined only in accordance with the following claims and their equivalents.

1: Batch type / substrate heat treatment system
10u, 10d, 10u1, 10d1, 10u2, 10d2, 10un, 10dn:
12: holder 100, 400: chamber 120, 420: boat
110: frame 122, 422: support member 140: door
160: Cover 200: Main heater unit 210: Unit main heater
220, 220a, 220b: auxiliary heater unit 230a: first unit auxiliary heater
250: cooling pipe 300: gas supply pipe 310: gas hole
320: gas discharge pipe 340,440: air supply line 360: constant pressure unit
401: heat treatment space 402: chamber body 404a: upper heater housing
404b: Lower heater housing 410a, 410b, 410c1, 410c2, 410cn-1: Lamp heater
422c, 422c1: supporting cross bar 422u: upper cross bar
424: air supply hole 424d: lower air supply hole 424s: side air supply hole
426: Support pin 430: Gas exhaust device
432: gas supply device 470: gas exhaust device

Claims (16)

In the substrate heat treatment chamber,
A chamber body for providing a heat treatment space for a plurality of substrates therein;
A boat provided in the heat treatment space and loaded and supported by the plurality of substrates;
An upper heater housing integrally provided on the upper portion of the chamber body, the upper heater housing having a plurality of upper lamp heaters therein; And
A lower heater housing provided integrally with a lower portion of the chamber body and having a plurality of lower lamp heaters therein,
And a heat treatment chamber. The method according to claim 1,
Wherein a space surrounded by the upper heater housing, the chamber body, and the lower heater housing forms the heat treatment space. In the substrate heat treatment chamber,
A chamber body for providing a plurality of first through n-th substrate heat treatment spaces therein;
A boat provided in the heat treatment space and loaded and supported by the plurality of first through n-th substrates;
An upper heater housing integrally provided on the upper portion of the chamber body, the upper heater housing having a plurality of upper lamp heaters therein;
A lower heater housing integrally provided at a lower portion of the chamber body, the lower heater housing having a plurality of lower lamp heaters therein; And
And a plurality of first to n-l < th > internal lamp heaters provided in the chamber body and provided between the plurality of first to n-
And a substrate heating chamber. The method of claim 3,
Wherein the plurality of first substrates to the plurality of n-th substrates are provided in sequence between the plurality of lower lamp heaters, the plurality of first to n-1-th inner lamp heaters, and the plurality of upper lamp heaters, Heat treatment chamber. In the heat treatment apparatus,
A chamber body for providing a heat treatment space for a plurality of substrates therein;
A boat provided in the heat treatment space and having a plurality of supporting crossbars constituting a frame in which the plurality of substrates are loaded and supported;
An upper crossbar provided in a direction parallel to the plurality of support cross bars at an upper portion of the uppermost one of the plurality of substrates;
An upper heater housing integrally provided on the upper portion of the chamber body, the upper heater housing having a plurality of upper lamp heaters therein;
A lower heater housing integrally provided at a lower portion of the chamber body, the lower heater housing having a plurality of lower lamp heaters therein;
A gas supply device connected to one side end of the upper cross bar and the plurality of support cross bars at an outer side surface of the chamber body through an air supply line; And
A plurality of supporting crossbars provided on both sides of the chamber body along a direction parallel to the longitudinal direction of the plurality of support crossbars,
, ≪ / RTI &
One end of the lowermost support crossbar of the plurality of support crossbars is selectively connected to the gas supply device through the supply line
Substrate heat treatment apparatus. 6. The method of claim 5,
Wherein the upper crossbar and the plurality of support crossbars each have a plurality of lower air supply holes, wherein the lowest support crossbar selectively includes a plurality of lower air supply holes. The method according to claim 6,
Wherein the upper crossbar and the plurality of support crossbars further have a plurality of side air supply holes on both sides thereof. 8. The method of claim 7,
Wherein the plurality of side air supply holes are provided in an angular range of 30 degrees to 90 degrees in a clockwise direction and a counterclockwise direction, respectively, with respect to a vertical direction at a central portion of the upper crossbar and the plurality of support crossbars. The method according to claim 6,
Wherein the lowermost support crossbar further comprises a plurality of side air supply holes on both sides. 10. The method of claim 9,
Wherein the plurality of side air supply holes are provided in an angular range of 30 to 90 degrees in the clockwise and counterclockwise directions with respect to the vertical direction at the center of the lowermost support crossbar. In the heat treatment apparatus,
A chamber body for providing a plurality of first through n-th substrate heat treatment spaces therein;
A boat provided in the heat treatment space and having a plurality of supporting crossbars constituting a frame in which the plurality of first to nth substrates are loaded and supported;
An upper crossbar provided in a direction parallel to the plurality of support cross bars at an upper portion of the uppermost one of the plurality of first to nth substrates;
An upper heater housing integrally provided on the upper portion of the chamber body, the upper heater housing having a plurality of upper lamp heaters therein;
A lower heater housing integrally provided at a lower portion of the chamber body, the lower heater housing having a plurality of lower lamp heaters therein;
A plurality of first through n-1 internal lamp heaters provided in the chamber body, the first through n-1 internal lamp heaters being provided between the first through n-th substrates, respectively;
A gas supply device connected to one side end of the upper cross bar and the plurality of support cross bars at an outer side surface of the chamber body through an air supply line; And
And at least one gas exhausting device provided on both sides of the chamber body along a direction parallel to the longitudinal direction of the plurality of supporting crossbars,
, ≪ / RTI &
One end of the lowermost support crossbar of the plurality of support crossbars is selectively connected to the gas supply device through the supply line
Substrate heat treatment apparatus. 12. The method of claim 11,
Wherein the upper crossbar and the plurality of support crossbars each have a plurality of lower air supply holes, wherein the lowest support crossbar selectively includes a plurality of lower air supply holes. 13. The method of claim 12,
Wherein the upper crossbar and the plurality of support crossbars further have a plurality of side air supply holes on both sides thereof. 14. The method of claim 13,
Wherein the plurality of side air supply holes are provided in an angular range of 30 degrees to 90 degrees in a clockwise direction and a counterclockwise direction, respectively, with respect to a vertical direction at a central portion of the upper crossbar and the plurality of support crossbars. 14. The method of claim 13,
Wherein the lowermost support crossbar further comprises a plurality of side air supply holes on both sides. 16. The method of claim 15,
Wherein the plurality of side air supply holes are provided in an angular range of 30 to 90 degrees in the clockwise and counterclockwise directions with respect to the vertical direction at the center of the lowermost support crossbar.

Images