KR20150138959A - 챔버 내 피처리 대상물 접촉구조, 정전 척 및 그 제조방법 - Google Patents

챔버 내 피처리 대상물 접촉구조, 정전 척 및 그 제조방법 Download PDF

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Publication number
KR20150138959A
KR20150138959A KR1020140066052A KR20140066052A KR20150138959A KR 20150138959 A KR20150138959 A KR 20150138959A KR 1020140066052 A KR1020140066052 A KR 1020140066052A KR 20140066052 A KR20140066052 A KR 20140066052A KR 20150138959 A KR20150138959 A KR 20150138959A
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KR
South Korea
Prior art keywords
contact
layer
protruding structures
processed
protruding
Prior art date
Application number
KR1020140066052A
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English (en)
Korean (ko)
Inventor
이승호
이순재
이명호
서광선
김영호
최영훈
황석재
Original Assignee
(주)아이씨디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)아이씨디 filed Critical (주)아이씨디
Priority to KR1020140066052A priority Critical patent/KR20150138959A/ko
Priority to CN201410754214.8A priority patent/CN105321848A/zh
Priority to TW104102171A priority patent/TW201545267A/zh
Publication of KR20150138959A publication Critical patent/KR20150138959A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020140066052A 2014-05-30 2014-05-30 챔버 내 피처리 대상물 접촉구조, 정전 척 및 그 제조방법 KR20150138959A (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020140066052A KR20150138959A (ko) 2014-05-30 2014-05-30 챔버 내 피처리 대상물 접촉구조, 정전 척 및 그 제조방법
CN201410754214.8A CN105321848A (zh) 2014-05-30 2014-12-10 腔室内被处理对象的接触结构、静电吸盘及其制造方法
TW104102171A TW201545267A (zh) 2014-05-30 2015-01-23 腔內被處理對象的接觸結構、靜電吸盤及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140066052A KR20150138959A (ko) 2014-05-30 2014-05-30 챔버 내 피처리 대상물 접촉구조, 정전 척 및 그 제조방법

Publications (1)

Publication Number Publication Date
KR20150138959A true KR20150138959A (ko) 2015-12-11

Family

ID=55020210

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140066052A KR20150138959A (ko) 2014-05-30 2014-05-30 챔버 내 피처리 대상물 접촉구조, 정전 척 및 그 제조방법

Country Status (3)

Country Link
KR (1) KR20150138959A (zh)
CN (1) CN105321848A (zh)
TW (1) TW201545267A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102171058B1 (ko) * 2019-05-14 2020-10-28 (주)제니스월드 엠보싱 구조 정전척의 제조방법
KR20210111364A (ko) * 2019-02-05 2021-09-10 어플라이드 머티어리얼스, 인코포레이티드 증착 프로세스들을 위한 마스크의 척킹을 위한 기판 지지부

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5548470A (en) * 1994-07-19 1996-08-20 International Business Machines Corporation Characterization, modeling, and design of an electrostatic chuck with improved wafer temperature uniformity
JP4697833B2 (ja) * 2000-06-14 2011-06-08 キヤノンアネルバ株式会社 静電吸着機構及び表面処理装置
US7663860B2 (en) * 2003-12-05 2010-02-16 Tokyo Electron Limited Electrostatic chuck
JP4657824B2 (ja) * 2005-06-17 2011-03-23 東京エレクトロン株式会社 基板載置台、基板処理装置および基板載置台の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210111364A (ko) * 2019-02-05 2021-09-10 어플라이드 머티어리얼스, 인코포레이티드 증착 프로세스들을 위한 마스크의 척킹을 위한 기판 지지부
US11967516B2 (en) 2019-02-05 2024-04-23 Applied Materials, Inc. Substrate support for chucking of mask for deposition processes
KR102171058B1 (ko) * 2019-05-14 2020-10-28 (주)제니스월드 엠보싱 구조 정전척의 제조방법

Also Published As

Publication number Publication date
CN105321848A (zh) 2016-02-10
TW201545267A (zh) 2015-12-01

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