KR20150105691A - Chip type coil component and board for mounting the same - Google Patents

Abstract

The present invention relates to a chip type coil component and a board for mounting the same. The chip type coil component according to the present invention includes: a main body which is formed by stacking magnetic layers, and satisfies T/W > 1.0, when referring that the length is L, the width is W, and the thickness is T; an internal coil part which is electrically connected to an internal coil pattern formed on the magnetic layers, and is formed in the main body; and an external electrode which is formed on a cross section of the main body and is connected to the internal coil part. The main body has at least one rounded edge in the length, width, and thickness directions of the main body. If the rounded length from the cross section of the main body to the length direction is d, d/w <= 0.03 can be satisfied.

Description

CHIP TYPE COIL COMPONENT AND BOARD FOR MOUNTING THE SAME

The present invention relates to a chip-type coil component and a mounting substrate thereof.

As miniaturization, slimming, and multifunctionalization of electronic products are required, miniaturization of chip components is required, and mounting of electronic components is also highly integrated. The space between the mounted electronic parts is minimized in response to such tendency.

An inductor, which is one of the electronic components, is a typical passive element that removes noise by forming an electronic circuit together with a resistor and a capacitor. The inductor amplifies a signal of a specific frequency band in combination with a capacitor using electromagnetic characteristics A resonance circuit, a filter circuit, and the like.

At this time, the mounted parts can be mounted with a small area, and it is necessary to realize electric characteristics equivalent to those of a large size electronic part. To this end, chip type coil parts with increasing number of layers have been manufactured with thinner magnetic layer thickness.

However, such a chip-type coil component can be manufactured in a form that its thickness is further increased compared to its width, so that a high capacitance can be realized. However, when the chip component is mounted on a substrate, the chip is often defective.

On the other hand, in the manufacturing process of the chip type coil part, chipping failure may occur due to collision of the ceramic body with each other. To prevent this, there has been used a method of polishing the corners and vertices of the main body.

However, when polishing the corners and vertices of the main body, if the polishing becomes excessive or insufficient, the reliability of the chip-type coil component is affected. Therefore, it is necessary to improve the reliability of the chip-type coil part while realizing a high capacity, preventing the defective falling-off and chipping failure on the substrate.

Korean Patent Publication No. 10-2012-0089199

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems in the prior art, and it is an object of the present invention to provide a chip-type coil component in which the height of the main body is larger than the width, A chip type coil part and a mounting substrate thereof.

According to a first technical aspect of the present invention, there is provided a chip-type coil component comprising a plurality of magnetic body layers laminated, wherein when a length of the body is L, a width is W, and a thickness is T, T / ; An inner coil part electrically connected to an inner coil pattern formed on the magnetic body layer and formed inside the main body; And an external electrode formed on one end face of the main body and connected to the internal coil part; Wherein at least one of the corners has a round shape in the length, width and thickness direction of the body, and the length of the round in the longitudinal direction of the body is d, d / w &lt; = 0.03.

Alternatively, the main body may be in the form of a hexahedron.

Alternatively, the external electrode may include at least one selected from the group consisting of silver (Ag), platinum (Pt), copper (Cu), silver (Ag), and palladium (Pd).

Or an insulating layer formed on a surface of the main body in a region where the external electrode is not formed; As shown in FIG.

In addition, the inner coil portion may be laminated in the thickness direction of the main body.

Further, the inner coil portion may be stacked in the width direction of the main body.

According to a second technical aspect of the present invention, a mounting substrate for a chip-type coil component includes: a printed circuit board having first and second electrode pads on the top; And a chip-type coil component mounted on the printed circuit board; Wherein the chip-type coil component comprises: a main body in which a plurality of magnetic body layers are laminated and at least one corner has a round shape in the length, width, and thickness direction; An inner coil part electrically connected to an inner coil pattern formed on the magnetic body layer and formed inside the main body; And an external electrode formed on one end face of the main body and connected to the internal coil part; And d / w < = 0.03, where d is the length of the round in the longitudinal direction in the cross section of the main body.

Further, the main body satisfies T / W > 1.0 when the length of the main body is L, the width is W, and the thickness is T, and may be in the form of a hexahedron.

The external electrode may include at least one selected from the group consisting of silver (Ag), platinum (Pt), copper (Cu), silver (Ag), and palladium (Pd).

The inner coil portion may be laminated in the thickness direction of the main body.

In addition, the inner coil portion may be stacked in the width direction of the main body.

The chip-type coil component and its mounting board according to the present invention can enhance the mounting capability through the correlation between the polishing round and the width. In addition, it is possible to prevent chipping defects that may damage the main body due to collision with other parts, and to prevent a defective fall-off when mounting a chip-type coil component having a large capacity realized on a substrate. As a result, a high-capacity, high-reliability chip-type coil component can be realized.

1 is a perspective view showing a chip-type coil component according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view of the chip-type coil component shown in Fig. 1 cut in the AA 'direction.
Fig. 3 is an exploded perspective view of the configuration of the chip-type coil component shown in Fig. 1 in which the magnetic substance layers are laminated in the thickness direction of the main body.
Fig. 4 is an exploded perspective view of a configuration in which the magnetic substance layers in the configuration of the chip-type coil component shown in Fig. 1 are stacked in the longitudinal direction of the body.
5 is a perspective view showing the inner coil portion in the chip-type coil component shown in Fig.
Fig. 6 is a perspective view showing the moisturization in which the chip-type coil component shown in Fig. 1 is mounted on a printed circuit board.

Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements.

It is to be understood that, although the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Will be described using the symbols.

Throughout the specification, when an element is referred to as "comprising &quot;, it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

Chip type  Coil parts

Hereinafter, a chip-type coil component according to an embodiment of the present invention will be described, but a laminate type inductor will be described, but the present invention is not limited thereto.

1 is a perspective view showing a chip-type coil component according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view of the chip-type coil component shown in Fig. 1 cut along the A-A 'direction.

Fig. 3 is an exploded perspective view of the configuration of the chip-type coil component shown in Fig. 1 in which the magnetic substance layers are laminated in the thickness direction of the main body.

1 to 3, the chip-type coil component according to the present invention may include a main body 110, an inner coil part 120, and an external electrode 130.

Referring to FIGS. 1 and 3, the main body 110 may have a plurality of magnetic layer layers 112 stacked thereon, and may have a bottom surface and a top surface opposite to the bottom surface.

The plurality of magnetic substance layers 112 are sintered, and the boundaries between adjacent magnetic substance layers 112 can be integrated so that it is difficult to confirm without using a scanning electron microscope (SEM).

Each of the plurality of magnetic layers 112 includes a known ferrite such as Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Ba ferrite, Li ferrite, can do.

The shape of the main body 110 is not particularly limited, and may have a hexahedral shape, for example. On the other hand, in the chip-type coil component according to the present embodiment, the 'longitudinal direction' is defined as the 'L' direction in FIG. 1, the 'W' direction in the 'width direction', and the 'T' direction in the 'thickness direction'. Here, the 'thickness direction' can be used in the same concept as the stacking direction of the magnetic material layers 112, that is, the 'lamination direction'.

Particularly, the main body 110 can satisfy T / W > 1.0. It is characterized in that the thickness T is larger than the width W of the main body 110, in which the number of stacked layers is increased to realize a high capacity.

In the case of a general chip type coil component, the width and the thickness of the main body 110 have been made to have substantially the same size.

However, since the chip-type coil component according to an embodiment of the present invention can be miniaturized, it is possible to secure a sufficient space when mounted on a substrate, so that the number of layers can be increased to realize a high-capacity chip-type coil component.

The relationship between the thickness T and the width W of the ceramic body can satisfy T / W &gt; 1.0 because the stacking direction in the main body 110 is the thickness direction as the number of layers increases as described above. Accordingly, the chip-type coil component according to the present invention can realize a large capacity of capacitance.

The inner coil part 120 is formed inside the main body 110 by electrically connecting the inner coil patterns 125 formed on the plurality of magnetic layer layers 112.

At this time, the inner coil patterns 125 formed on the plurality of magnetic substance layers 112 are electrically connected by via-electrodes (not shown) to form the inner coil part 120. The via electrodes may be formed by punching to connect the upper and lower magnetic layers 112.

The inner coil pattern 125 may be formed by printing a conductive paste containing a conductive metal. The conductive metal is not particularly limited as long as it is a metal having an excellent electrical conductivity. Examples of the conductive metal include silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti) Cu) or platinum (Pt), or the like.

Referring to FIG. 3, a plurality of magnetic substance sheets 112 may be further laminated on the upper and lower portions of the inner coil section 120 to form upper and lower cover layers.

The external electrode 130 may be formed on one end surface of the main body 110, and more specifically, may be connected to the internal coil part 120. 3, the inner coil pattern 125 may have lead portions 123 and 124 that are exposed to the outside of the magnetic layer 112. The lead portions 123 and 124 may extend through the lead portions 123 and 124, (Not shown).

The external electrode 130 may be formed of a conductive material having the same material as that of the internal coil 120. The external electrode 130 may be formed of copper, .

The external electrode 130 may be formed by applying a conductive paste prepared by adding a glass frit to a metal powder and then firing it. The main body 110 is formed by laminating a plurality of magnetic material layers 112 and then firing. The shape and dimensions of the main body 110 and the number of stacked layers of the magnetic material layers 112 are limited to those shown in the present embodiment It is not. That is, by increasing the number of layers of the magnetic layer 112, it is possible to realize a high-capacity chip-type coil component in which the thickness T of the main body 110 is larger than the width W.

However, according to one embodiment of the present invention, at least one edge of the body 110 is rounded in the length, width, and thickness direction of the main body 110, ) Shape. At this time, if the length of the round in the longitudinal direction in the cross section of the main body 110 is d, the edges and the corners of the main body 110 can be polished so that d / w < = 0.03.

The polishing may be performed using a polishing apparatus, and the polishing apparatus is not particularly limited, and an apparatus used for polishing a general body 110 may be used.

Thus, the chipping failure can be prevented, and even when mounted on a substrate, the chip-type coil component according to the present invention can be prevented from falling over and thus the reliability can be excellent.

In addition, by polishing the main body 110 before firing as described above, it is possible to prevent chipping defects that may occur during the firing of the body 110 having brittleness after firing, which may occur during transportation of the body 110 for manufacturing a chip-type coil component.

Since the corners of the main body 110, particularly the longitudinal edges of the ceramic body, are round when the chip-type coil component is mounted on the substrate after the firing by polishing the main body 110 before firing as described above, Can be prevented.

Next, the mounting defect rate of the chip-type coil component according to the present invention will be described.

Tables 1 and 2 below are a table comparing the occurrence frequency of chipping defects according to the ratio of the length (d) of the round of the main body 110 to the width W of the main body 110 and the degree of product conduction during mounting on the substrate .

The width W of the main body 110 is set to 0.30 mm and the length L of the main body 110 is set to 0.6 mm in the case of Table 1 below. And the length of the main body 110 is d, the mounting defect ratio is shown when d / W is fixed at 0.10 and the thickness T of the main body 110 is increased.

d / w = 0.1 Thickness [mm] 0.30 0.35 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 Defect ratio of mounting
(%) 0.0 0.0 0.0 0.0 0.0 0.0 0.0 0.0 0.0 0.0 0.0 0.0 0.1 0.3

Referring to Table 1, it can be seen that the mounting failure does not occur until the thickness T of the main body 110 becomes three times the width W, but increases when the thickness T becomes greater than the width W .

The width W of the main body 110 is set to 0.30 mm and the length L of the main body 110 is set to 0.6 mm in the case of Table 2 below. The thickness T of the main body 110 is fixed to 0.75 mm and the d / W is changed to check the mounting defect ratio.

T =
0.75mm d / w (ratio of polishing rounds) 0.000 0.033 0.067 0.100 0.133 0.167 0.200 0.233 0.267 0.300 0.333 0.367 0.400 0.433 0.467 Mounting
Defect rate
(%) 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.01 0.23 1.30 5.00 15.00 35.00 edge
Defect rate
(%) 15.00 0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00

Referring to Table 2, it can be seen that the mounting defect rate, which is transmitted as the length of the round of the main body 110 increases, increases while d / W exceeds 0.30. On the other hand, when the length of the round of the main body 110 is small, it can be confirmed that the peeling of the electrode at the corners of the main body 110 occurs.

That is, in the case of the chip-type coil component according to the present invention, when the length of the round in the longitudinal direction in the cross section of the main body 110 is d and d / w <0.03 is satisfied, It is possible to eliminate defective elements and improve the mounting force.

Fig. 4 is an exploded perspective view of a configuration in which the magnetic substance layers in the configuration of the chip-type coil component shown in Fig. 1 are stacked in the longitudinal direction of the body.

5 is a perspective view showing the inner coil portion in the chip-type coil component shown in Fig.

Referring to FIGS. 4 and 5, in the chip-type coil component according to another embodiment of the present invention, the 'longitudinal direction' is the 'L' direction in FIG. 3, the 'W''T' direction can be defined. Here, the 'width direction' can be used in the same sense as the direction in which the magnetic material layers are piled up, that is, the 'lamination direction'.

3 and 4, the chip-type coil component according to another embodiment of the present invention is different from the chip-type coil component according to the embodiment of the present invention described above, .

Accordingly, the chip-type coil component according to another embodiment of the present invention may have a vertical mounting form in which the inner coil part 120 is arranged perpendicular to the substrate when mounted on a substrate, as described later.

Other features of the chip-type coil component according to the other embodiment are the same as those of the chip-type coil component according to the embodiment of the present invention described above, and therefore will not be described here.

An insulating layer (not shown) may be formed on the entire surface of the body 110, and an external electrode 130 may be formed on the insulating layer.

That is, after the insulating layer is formed so as to surround the entire surface of the sintered body 110, the external electrode 130 may be formed to block the foreign substances penetrating through the external electrode 130 So that the main body 110 can be protected more efficiently.

Chip type  Mounting substrate of coil part

Fig. 6 is a perspective view showing the moisturization in which the chip-type coil component shown in Fig. 1 is mounted on a printed circuit board.

3 and 6, a mounting board 200 of a chip-type coil component 100 according to an embodiment of the present invention includes a printed circuit board 210 on which a chip-type coil component 100 is horizontally mounted, And first and second electrode pads 221 and 222 formed on the top surface of the circuit board 210 so as to be spaced apart from each other.

At this time, the external electrodes 130 of the chip-type coil component 100 are electrically connected to the printed circuit board 210 by the soldering 230 in a state where the external electrodes 130 are in contact with the first and second electrode pads 221 and 222, respectively .

4 and 6, the mounting board 200 of the chip-type coil component 100 includes a printed circuit board 210 mounted so that the chip-type coil component 100 is perpendicular to the printed circuit board 210, And first and second electrode pads 221 and 222 spaced apart from each other on the upper surface.

As described above, the mounting substrate of the chip-type coil component according to another embodiment of the present invention includes a plurality of magnetic body layers, and when the length is L, the width is W, and the thickness is T, Shaped chip component including a main body of a shape can be included, and may include a high-capacity chip-type coil component.

In addition, as described above, even if the chip-type coil component 100 is horizontally or vertically mounted on the substrate, the mounting substrate of the multilayer ceramic electronic component according to another embodiment of the present invention can prevent the corners of the main body 110 from being rounded And d / w < = 0.03, when the length of the round in the longitudinal direction in the cross section of the main body 110 is d, the defective fall of the chip-type coil component 100 does not occur have.

As a result, it is possible to realize a mounting substrate of a chip-type coil component including the high-capacity chip-type coil component 100 having excellent reliability.

The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited only by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

100: chip type coil part
110:
120: internal coil part
130: external electrode
200: mounting substrate
210: printed circuit board
221, 222: first and second electrode pads
230: Soldering

Claims (11)

A main body satisfying T / W > 1.0, where L is the length of the main body, W is the width, and T is the thickness of the main body;
An inner coil part electrically connected to an inner coil pattern formed on the magnetic body layer and formed inside the main body; And
An external electrode formed on one end face of the main body and connected to the internal coil part; / RTI &gt;
Wherein the body has at least one corner in a round shape in the length, width and thickness direction of the body,
And d / w &lt; = 0.03, where d is the length of the round in the longitudinal direction in the cross section of the body.
The apparatus of claim 1,
Chip type coil part having a hexahedral shape.
The plasma display panel of claim 1,
Wherein at least one selected from the group consisting of silver (Ag), platinum (Pt), copper (Cu), silver (Ag) and palladium (Pd)
The method according to claim 1,
An insulating layer formed on a surface of the main body in a region where the external electrode is not formed; Further comprising:
The method according to claim 1,
And the inner coil portion is laminated in the thickness direction of the main body.
The method according to claim 1,
And the inner coil portion is laminated in the width direction of the main body.
A printed circuit board having first and second electrode pads on the top; And
A chip-type coil component mounted on the printed circuit board; / RTI &gt;
The chip-type coil component includes: a main body in which a plurality of magnetic material layers are laminated and at least one corner has a round shape in the length, width, and thickness direction; An inner coil part electrically connected to an inner coil pattern formed on the magnetic body layer and formed inside the main body; And an external electrode formed on one end face of the main body and connected to the internal coil part; / RTI &gt;
And d / w &lt; = 0.03, where d is the length of the round in the longitudinal direction in the cross section of the main body.
8. The apparatus according to claim 7,
Wherein the body has a length L, a width W, and a thickness T, wherein T / W > 1.0.
8. The plasma display panel of claim 7,
Wherein at least one selected from the group consisting of silver (Ag), platinum (Pt), copper (Cu), silver (Ag), and palladium (Pd).
8. The apparatus according to claim 7, wherein the inner coil portion
And wherein the chip-type coil component is laminated in the thickness direction of the main body.
8. The apparatus according to claim 7, wherein the inner coil portion
And a plurality of chip-type coil parts laminated in the width direction of the main body.

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