KR101952860B1 - Multi-layered ceramic capacitor and board for mounting the same - Google Patents

Abstract

The present invention is characterized in that three external electrodes are arranged on a mounting surface of a ceramic body so as to be spaced apart from each other and a height of a portion formed on one surface in a width direction of the ceramic body and a thickness of the ceramic body, A laminated ceramic capacitor whose numerical value is adjusted so as to improve the bonding strength of the intermediate external electrode and its mounting substrate are provided.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a multilayer ceramic capacitor,

The present invention relates to a multilayer ceramic capacitor and a mounting substrate thereof.

Electronic components using ceramic materials include capacitors, inductors, piezoelectric elements, varistors and thermistors.

A multilayer ceramic capacitor (MLCC) among these ceramic electronic parts is advantageous in that it is compact, has a high capacity and is easy to be mounted, and is provided with a decoupling capacitor (not shown) disposed in a high frequency circuit such as a power circuit of a large scale integration circuit .

In this case, the stability of the power supply circuit depends on the ESL (Equivalent Serial Inductance) of the multilayer ceramic capacitor, and particularly the stability is low at a low ESL.

Therefore, in order to stabilize the power supply circuit, the multilayer ceramic capacitor must have a lower ESL value, and this demand is further increased in accordance with the tendency of the electronic devices to have high frequency and high current.

In addition, the multilayer ceramic capacitor is used as an electromagnetic interference filter in addition to the decoupling capacitor. In this case, it is desirable that the ESL is low even in order to improve the high frequency noise elimination and attenuation characteristics.

In order to lower the ESL, a three-terminal type capacitor having a structure in which internal electrodes are arranged vertically with respect to a substrate mounting surface and dielectric layers of a ceramic material and internal electrodes made of metal are alternately laminated is disclosed.

However, the 3-terminal type multilayer ceramic capacitor has a problem that the reliability of the product is deteriorated because the bonding strength between the ground terminal and the ceramic body formed in the middle portion of the ceramic body is low.

On the other hand, since the dielectric layer of the multilayer ceramic capacitor has piezoelectricity and electrostrictive properties, when a direct current or an alternating voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon occurs between the internal electrodes and vibration may occur.

Such vibration is transmitted to the substrate on which the multilayer ceramic capacitor is mounted through the external electrode of the multilayer ceramic capacitor, and the entire substrate becomes an acoustic reflective surface, thereby generating a noisy vibration noise.

The vibration sound may correspond to an audible frequency in a range of 20 to 20,000 Hz which may cause an uncomfortable feeling to a person. An unpleasant vibration sound is called an acoustic noise.

Korean Patent Laid-Open Publication No. 10-2008-0073193 US registered patent 6,950,300

It is an object of the present invention to provide a multilayer ceramic capacitor capable of lowering the ESL of the multilayer ceramic capacitor, improving the bonding strength of the external electrode, and reducing the acoustic noise when the multilayer ceramic capacitor is mounted on the substrate, and a mounting substrate for the multilayer ceramic capacitor.

In one aspect of the present invention, three external electrodes are arranged on a mounting surface of a ceramic body so as to be spaced apart from each other, and a height of a portion formed on one side of the ceramic body in the width direction and a thickness of the ceramic body The present invention provides a multilayer ceramic capacitor which is numerically controlled so as to improve the bonding strength of the intermediate external electrode.

In one embodiment of the present invention, when the height of a part of the external electrode located at the middle in the width direction of the ceramic body is defined as d and the thickness of the ceramic body is defined as T, , And 0.10? D / T.

In another embodiment of the present invention, when the height of a part of the external electrode located at the middle in the width direction of the ceramic body is defined as d and the thickness of the ceramic body is defined as T, , And 0.1? D / T? 0.5.

In another embodiment of the present invention, when the height of a part of the external electrode located on the one side in the width direction of the ceramic body is d and the length of the part formed on one side in the width direction of the ceramic body is G , The ratio of d / G can satisfy the range of 0.143? D / G? 0.536.

According to one embodiment of the present invention, ESL of a multilayer ceramic capacitor can be reduced. When applied to a decoupling capacitor, an EMI filter, or the like, voltage fluctuations in a power supply circuit can be suppressed more effectively and a high frequency attenuation characteristic and a high frequency noise removing effect There is an effect that can be improved.

Further, it is possible to improve the reliability of the product by improving the bonding strength of the external electrode, and it is possible to reduce the acoustic noise when mounting the substrate.

1 is a perspective view schematically showing a multilayer ceramic capacitor according to an embodiment of the present invention.
2 is a side view of Fig.
3 is an exploded perspective view showing an internal electrode structure of the multilayer ceramic capacitor of FIG.
4 is a perspective view schematically showing a multilayer ceramic capacitor according to another embodiment of the present invention.
5 is a plan view showing the internal electrode structure of the multilayer ceramic capacitor of FIG.
6 is a perspective view schematically showing a multilayer ceramic capacitor according to still another embodiment of the present invention.
7 is a plan view showing an internal electrode structure of the multilayer ceramic capacitor of FIG.
8 is a perspective view schematically showing a multilayer ceramic capacitor according to still another embodiment of the present invention.
Fig. 9 is a side view of Fig. 8. Fig.
10 is an exploded perspective view showing the internal electrode structure of the multilayer ceramic capacitor of FIG.
11 is a perspective view schematically showing a state in which the multilayer ceramic capacitor of FIG. 1 is mounted on a substrate.
12 is a perspective view schematically showing a state in which the multilayer ceramic capacitor of FIG. 4 is mounted on a substrate.
FIG. 13 is a perspective view schematically showing a state in which the multilayer ceramic capacitor of FIG. 6 is mounted on a substrate.
14 is a perspective view schematically showing a state in which the multilayer ceramic capacitor of FIG. 8 is mounted on a substrate.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below.

Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art.

The shape and size of elements in the drawings may be exaggerated for clarity.

In the drawings, like reference numerals are used to designate like elements that are functionally equivalent to the same reference numerals in the drawings.

Multilayer Ceramic Capacitors

FIG. 1 is a perspective view schematically showing a multilayer ceramic capacitor according to an embodiment of the present invention, FIG. 2 is a side view of FIG. 1, and FIG. 3 is an exploded perspective view showing an internal electrode structure of the multilayer ceramic capacitor of FIG.

1 to 3, a multilayer ceramic capacitor 100 according to an embodiment of the present invention includes a ceramic body 110, a plurality of first and second inner electrodes 121 and 122, Lead portions 123, 124 and 125 and first to third external electrodes 131, 132 and 133, respectively.

The ceramic body 110 is formed by laminating a plurality of dielectric layers 111 and then firing. The boundary between the adjacent dielectric layers 111 is unified so as to be difficult to confirm without using a scanning electron microscope (SEM) .

The shape of the ceramic body 110 is not particularly limited and may have a hexahedral shape, for example.

In order to clearly explain the embodiment of the present invention, when the hexahedral direction of the ceramic body 110 is defined, L, W and T shown in Fig. 1 indicate the longitudinal direction, the width direction and the thickness direction, respectively.

In the present embodiment, for convenience of explanation, the surfaces of the ceramic body 110 facing each other in the thickness direction T are referred to as first and second surfaces S1 and S2, and the first and second surfaces S1, S2 on both sides in the longitudinal direction L opposite to each other to the third and fourth surfaces S3 and S4 and both surfaces in the width direction W opposite to each other on the fifth and sixth surfaces S5 , S6).

The dielectric layer 111 may include a ceramic material having a high dielectric constant, for example, a ceramic powder such as barium titanate (BaTiO ₃ ). However, the present invention is not limited thereto as long as a sufficient capacitance can be obtained no.

If necessary, a ceramic additive, an organic solvent, a plasticizer, a binder, a dispersant, and the like may be further added to the dielectric layer 111 together with the ceramic powder.

The ceramic additive may be a transition metal oxide or a carbide, a rare earth element, magnesium (Mg), aluminum (Al) or the like, but the present invention is not limited thereto.

The first and second internal electrodes 121 and 122 are alternately arranged so as to face each other with a ceramic sheet forming the dielectric layer 111 therebetween and are overlapped with each other when viewed in the stacking direction, Which is a portion contributing to the capacitance of the capacitor.

The first and second internal electrodes 121 and 122 may be electrically insulated from each other by a dielectric layer 111 disposed in the middle.

At this time, the first or second internal electrodes 121 and 122 may be spaced apart from the third and fourth surfaces S3 and S4 of the ceramic body 110.

Also, the first and second internal electrodes 121 and 122 are formed of a conductive metal.

The conductive metal may be one made of, for example, silver (Ag), palladium (Pd), platinum (Pt), nickel (Ni) and copper (Cu) or an alloy thereof. But is not limited thereto.

The first and second lead portions 123 and 124 are spaced apart from each other along the longitudinal direction of the ceramic body 110 and electrically connect the first surface S1 of the ceramic body 110 to the first internal electrode 121 As shown in FIG.

The third lead portion 125 is disposed between the first and second lead portions 123 and 124 and is extended from the second internal electrode 122 to be exposed through the first surface S1 of the ceramic body 110 .

The first and second external electrodes 131 and 132 are electrodes having the same polarity and are spaced from each other along the longitudinal direction of the ceramic body 110 on the first surface S1 of the ceramic body 110, And are electrically connected to the first and second lead portions 123 and 124 exposed through the first surface S1 of the ceramic body 110, respectively.

The third external electrode 133 is an electrode having a polarity different from that of the first and second external electrodes 131 and 132 and can be utilized as a ground terminal in the present embodiment.

The third external electrode 133 is disposed between the first and second external electrodes 131 and 132 on the first surface S1 of the ceramic body 110 and electrically connected to the first surface S1 of the ceramic body 110 And is electrically connected to the third lead portion 125 exposed through the second lead portion 125. [

At this time, at least one of the first to third external electrodes 131, 132, and 133 may extend to a portion of the fifth and sixth surfaces S5 and S6 of the ceramic body 110. [ Although the first to third external electrodes 131, 132 and 133 all have bands in the present embodiment, the present invention is not limited thereto, and if necessary, the first to third external electrodes 131 , 132, and 133 may have a band.

The height of the portion of the first to third external electrodes 131, 132 and 133 formed on the fifth or sixth surfaces S5 and S6 of the ceramic body 110 is d, When the thickness is defined as T, the ratio of d / T satisfies a range of 0.10? D / T.

When the length of the portion of the first to third external electrodes 131, 132 and 133 formed on the fifth or sixth surface S5 or S6 of the ceramic body 110 is defined as G, Can satisfy the range of 0.143? D / G? 0.536.

The first to third external electrodes 131, 132, and 133 may be formed of a conductive metal.

The conductive metal may be, for example, silver (Ag), nickel (Ni), copper (Cu) or the like, but the present invention is not limited thereto.

The first to third external electrodes 131, 132, and 133 may be formed by applying a conductive paste prepared by adding glass frit to the conductive metal powder, and then firing the conductive paste. However, the present invention is not limited thereto.

In addition, a plating layer (not shown) may be formed on the first to third external electrodes 131, 132 and 133 if necessary. The plating layer is intended to increase the mutual bonding strength when the multilayer ceramic capacitor 100 is mounted on the substrate by solder.

The plating layer may include, for example, a nickel (Ni) plating layer formed on the first to third external electrodes 131, 132, and 133 and a tin (Sn) plating layer formed on the nickel plating layer.

The first and second lead portions 123 and 124 may be extended from the first internal electrode 121 to be exposed through a second surface S2 that is a surface facing the mounting surface of the ceramic body 110 have.

At this time, the first and second external electrodes 131 and 132 are formed on the second surface S2 of the ceramic body 110.

The first and second lead portions 123 and 124 may extend from the first internal electrode 121 to be exposed through the third and fourth surfaces S3 and S4 of the ceramic body 110 .

The first and second external electrodes 131 and 132 are formed to extend from the first surface S1 of the ceramic body 110 to the third and fourth surfaces S3 and S4 of the ceramic body 110 .

The first and second lead portions 123 and 124 are formed on the first and second surfaces S1 and S2 of the first internal electrode 121 and the third and fourth surfaces S1 and S2 of the ceramic body 110, (S3, S4). However, the present invention is not limited to this, as described above.

The first and second lead portions 123 and 124 are formed on the first and second surfaces S1 and S2 and the third and fourth surfaces S3 and S4 of the first inner electrode 121, The first and second external electrodes 131 and 132 corresponding to the first and second lead portions 123 and 124 are also electrically connected to the third and fourth external electrodes 131 and 132 of the ceramic body 110, A fourth portion of the ceramic body 110 on the third and fourth surfaces S3 and S4 and a portion of the fifth and sixth sides S5 and S6 of the ceramic body 110, And may extend to a portion of the second surface S2 of the second substrate 110. [

Therefore, the contact area between the first and second external electrodes 131 and 132 and the first and second lead portions 123 and 124 is increased, thereby reducing the ESL.

The fourth lead portion 126 may be further extended to expose the second internal electrode 122 through the second surface S2 of the ceramic body 110. [

The fourth lead portion 126 is disposed between the first and second lead portions 123 and 124 so as to be spaced apart from the first and second lead portions 123 and 124.

At this time, a fourth external electrode 134 may be formed on the second surface S2 of the ceramic body 110. [

The fourth outer electrode 134 is electrically connected to the exposed portion of the second surface S2 of the ceramic body 110 of the fourth lead portion 126. [

The fourth external electrode 134 may extend from the second surface S2 of the ceramic body 110 to a portion of the fifth and sixth surfaces S5 and S6 of the ceramic body 110. [

When the height of the portion of the fourth external electrode 134 formed on the fifth or sixth surface S5 or S6 of the ceramic body 110 is defined as d and the thickness of the ceramic body 110 is defined as T, , And the ratio of d / T can satisfy the range of 0.10? D / T.

When the length of the portion of the fourth external electrode 134 formed on the fifth or sixth surface S5 or S6 of the ceramic body 110 is defined as G, the ratio of d / G is 0.143? D / G? 0.536 can be satisfied.

The first and second lead portions 123 and 124 and the fourth lead portion 126 are also exposed to the second surface S2 of the ceramic body 110 so that the inside and the outside of the multilayer ceramic capacitor 100 When the structure is formed in a vertically symmetrical structure, the directionality of the multilayer ceramic capacitor 100 can be eliminated.

Therefore, when the multilayer ceramic capacitor 100 is mounted on the substrate, any one of the first and second surfaces S1 and S2 can be provided as a mounting surface. Therefore, when the multilayer ceramic capacitor 100 is mounted on the substrate, There is an advantage in that it is not necessary to consider.

Experimental Example

Table 1 below shows whether or not the adhesion strength is poor depending on the d / T and d / G values of the multilayer ceramic capacitor, and the acoustic noise value. In this embodiment, the third external electrode 133 is used as the value of d and G. On the other hand, the fourth external electrode 134 disposed to face the third external electrode 133 in the thickness direction may have the same adhesion strength defect and acoustic noise value as those in Table 1 below.

Here, the test for the poor adhesion strength is performed by applying a force to the third external electrode 133 of the multilayer ceramic capacitor 100 shown in FIG. 1 for 10 ± 1 second, and then the third external electrode 133 is pressed against the ceramic body 110, As shown in FIG.

In addition, the number of samples was tested 100 for each sample in the case of the sticking strength test and 10 samples in the case of the acoustic noise measurement.

# d / G d / T Bad adhesion strength
(%) Acoustic Noise
(dB) One 0.000 0 80 20.2 2 0.036 0.025 65 20.8 3 0.071 0.05 34 21.3 4 0.107 0.075 8 22.1 5 0.143 0.1 0 22.5 6 0.179 0.125 0 23.7 7 0.214 0.15 0 23.9 8 0.250 0.175 0 24.2 9 0.286 0.2 0 24.5 10 0.321 0.225 0 24.9 11 0.357 0.25 0 25.4 12 0.393 0.275 0 25.9 13 0.429 0.3 0 26.3 14 0.464 0.325 0 27.2 15 0.500 0.35 0 28.9 16 0.536 0.375 0 29.1 17 0.571 0.4 0 30.5 18 0.607 0.425 0 32.5 19 0.643 0.45 0 35.8 20 0.679 0.475 0 36.7 21 0.714 0.5 0 36.9

The d / T is the height (d (t)) of the portion formed on the fifth or sixth side S5 or S6 of the ceramic body 110 in the third external electrode 133 with respect to the thickness T of the ceramic body 110 ), Where d / T affects the bonding strength of the third external electrode 133.

The third external electrode 133 is disposed on only a part of both surfaces of the ceramic body 110 in the width direction. Therefore, if the height of the third external electrode 133 is too small as compared with the thickness of the ceramic body 110, The third external electrode 133 can be separated from the ceramic body 110 when a certain level of force is applied to the electrode 133. [

Referring to Table 1, in the case of Sample 1 to Sample 4 having a value of d / T of less than 0.10, the third outer electrode 133 of less than 8% and as much as 80% of the outer diameter of the ceramic body 110 was detached from the ceramic body 110 A failure occurred. Therefore, in the present experimental example, it can be seen that the numerical value at which the d / T adhesion failure strength does not occur is at least 0.1 or more as in the samples 5 to 21.

The d / G represents the ratio of the height d to the length G of the portion formed on the fifth or sixth surface S5 or S6 of the ceramic body 110 at the third external electrode 133.

In this experiment, if the d value of the third external electrode 133 is reduced, the mechanical strength of the adhesive strength characteristic is deteriorated. Also, if the G value of the third external electrode 133 is increased, the fixing strength characteristics are improved. However, after mounting, a short occurs due to inter-terminal interference, and the acoustic noise of the multilayer ceramic capacitor can be increased. When the G value becomes smaller, the ESL value of the capacitor can be increased.

Therefore, the d / G ratio is proportional to the amount of vibration transmitted to the outside through the third external electrode 133 in the multilayer ceramic capacitor 100. As a result, when the value of d / G becomes larger, the multilayer ceramic capacitor 100 ) Becomes larger.

At this time, if the criterion for determining whether or not the acoustic noise is bad is set to 30 dB, it can be confirmed that the acoustic noise exceeds the reference value of 30 dB in the case where the d / G exceeds 0.536, that is, in the samples 17 to 21.

On the other hand, it is also confirmed that the d / G ratio is less than 0.143, and the poor adhesion strength occurs.

Therefore, in order to have an acoustic noise below a predetermined reference value without causing a defect in the bonding strength of the external electrode, it is preferable to form the third external electrode 133 on the fifth or sixth surface S5 or S6 of the ceramic body 110 The ratio d / G of the height (d) to the length (G) of the portion to be dipped satisfies the range of 0.143? D / G? 0.536.

Variation example

FIG. 4 is a perspective view schematically showing a multilayer ceramic capacitor according to another embodiment of the present invention, and FIG. 5 is a plan view showing an internal electrode structure of the multilayer ceramic capacitor of FIG.

Here, in order to avoid redundancy, a detailed description thereof will be omitted, and a portion having a structure different from that of the above-described embodiment will be described in detail.

4 and 5, a multilayer ceramic capacitor 1 according to another embodiment of the present invention includes a plurality of first and second inner electrodes 20 and 30 alternately arranged with a dielectric layer 11 therebetween .

The first internal electrode 20 is disposed between the first and second lead portions 22 and 23 extending from the first body portion 21 and between the third and fourth surfaces S3 and S4 of the ceramic body 10, And may have space portions 11a and 11b.

A space portion 11c may be provided between the first body portion 21 and the second surface S2 of the ceramic body 10.

The second internal electrode 30 is electrically connected to the third lead portion 32 formed on the second body portion 31 and the third and fourth surfaces S3 and S4 of the ceramic body 10, , 11b.

A space portion 11c may be provided between the second body portion 31 and the second surface S2 of the ceramic body 10.

Here, the space portions 11a, 11b, and 11c are formed so that ceramic materials having high bonding strength at the corner portions of the ceramic body 10 and the third and fourth surfaces S3 and S4 of the ceramic body 10 It is possible to minimize the occurrence of delamination at the corner portions of the ceramic body 10 and the third and fourth surfaces S3 and S4 of the ceramic body 10. [

The first and second external electrodes 41 and 42 are formed on the first surface S1 of the ceramic body 10 away from the third and fourth surfaces S3 and S4 of the ceramic body 10, And may extend from the first surface S1 of the ceramic body 10 to a portion of the fifth and sixth surfaces S5 and S6 of the ceramic body 10. [

The third external electrode 43 is disposed between the first and second external electrodes 41 and 42 and is electrically connected to the fifth and sixth surfaces of the ceramic body 10 on the first surface S1 of the ceramic body 10. [ (S5, S6).

FIG. 6 is a perspective view schematically showing a multilayer ceramic capacitor 1 'according to still another embodiment of the present invention, and FIG. 7 is a plan view showing an internal electrode structure of the multilayer ceramic capacitor of FIG.

Here, in order to avoid redundancy, a detailed description thereof will be omitted, and a portion having a structure different from that of the above-described embodiment will be described in detail.

6 and 7, a multilayer ceramic capacitor 1 'according to still another embodiment of the present invention includes a plurality of first and second inner electrodes 20 and 30 sandwiching a dielectric layer 11 therebetween, Respectively.

The first internal electrode 20 is extended to be exposed through the second surface S2 of the ceramic body 10 in the first body portion 21 and is spaced apart from the first internal electrode 20 along the longitudinal direction of the ceramic body 10. [ And may further include fifth and sixth lead portions 24 and 25 arranged.

The second internal electrode 30 extends from the second body portion 31 to be exposed through the second surface S2 of the ceramic body 10 and extends between the fifth and sixth lead portions 24 and 25 And a fourth lead portion 33 disposed on the second lead portion 33. [

At this time, the insulating layer 50 may be disposed on the second surface S2 facing the mounting surface of the ceramic body 10.

FIG. 8 is a perspective view schematically showing a multilayer ceramic capacitor 1000 according to still another embodiment of the present invention, FIG. 9 is a side view of FIG. 8, and FIG. 10 is an exploded perspective view showing the internal electrode structure of the multilayer ceramic capacitor of FIG. It is a perspective view.

Here, in order to avoid redundancy, a detailed description thereof will be omitted, and a portion having a structure different from that of the above-described embodiment will be described in detail.

8 to 10, a multilayer ceramic capacitor 1000 according to another embodiment of the present invention includes a plurality of first and second internal electrodes 1200 and 1300 alternately sandwiching a dielectric layer 1110 therebetween .

The first internal electrode 1200 is formed to extend through the first surface S1 of the ceramic body 1100 in the first body portion 1210 and is spaced apart from the first internal electrode 1200 in the longitudinal direction of the ceramic body 1100 The first and second lead portions 1220 and 1230 and the ceramic body 1100 are formed to extend through the first and second lead portions 1220 and 1230 and the second surface S2 of the ceramic body 1100 in the first body portion 1210, And fifth and sixth lead portions 1240 and 1250 spaced apart from each other along the longitudinal direction of the first and second lead portions 1240 and 1250.

At this time, a space portion 1110a may be provided between the first internal electrode 1200 and the third and fourth sides S3 and S4 of the ceramic body 1100, respectively.

The second internal electrode 1300 is extended from the second body portion 1310 to be exposed through the first surface S1 of the ceramic body 1100 and extends between the first and second lead portions 1220 and 1230 A third lead portion 1320 disposed on the second body portion 1310 and a second surface S2 of the ceramic body 1100 on the second body portion 1310. The fifth and sixth lead portions 1240 And a fourth lead portion 1330 disposed between the first and second lead portions 1230 and 1250.

At this time, a space portion 1110a may be provided between the second internal electrode 1300 and the third and fourth surfaces S3 and S4 of the ceramic body 1100, respectively.

The first and second external electrodes 1410 and 1420 are formed on the first surface S1 of the ceramic body 1100 so as to be separated from the third and fourth surfaces S3 and S4 of the ceramic body 1100, And may extend from the first surface S1 of the ceramic body 1100 to a portion of the fifth and sixth surfaces S5 and S6 of the ceramic body 1100. [

The third external electrode 1430 is disposed between the first and second external electrodes 1410 and 1420 and extends from the first surface S1 of the ceramic body 1100 to the fifth and sixth surfaces (S5, S6).

The fifth and sixth external electrodes 1510 and 1520 may be disposed on the second surface S2 of the ceramic body 1100 so as to be spaced apart from each other along the longitudinal direction of the ceramic body 1100. [

The fifth and sixth external electrodes 1510 and 1520 are electrically connected to the fifth and sixth lead portions 1240 and 1250, respectively.

A fourth external electrode 1530 may be disposed between the fifth and sixth external electrodes 1510 and 1520 on the second surface S2 of the ceramic body 1100. [

The fourth external electrode 1530 is electrically connected to the fourth lead portion 1330.

The mounting substrate of the multilayer ceramic capacitor

FIG. 11 is a perspective view schematically showing a state in which the multilayer ceramic capacitor of FIG. 1 is mounted on a substrate, FIG. 12 is a perspective view schematically showing a multilayer ceramic capacitor of FIG. 4 mounted on a substrate, FIG. 14 is a perspective view schematically showing a state in which the multilayer ceramic capacitor of FIG. 8 is mounted on a substrate. FIG. 14 is a perspective view schematically showing a multilayer ceramic capacitor mounted on a substrate. FIG.

11 to 14, the mounting substrate 200 of the multilayer ceramic capacitor 100, 1, 1 ', 1000 according to the embodiment of the present invention includes the multilayer ceramic capacitor 100, 1, 1' And a first to a third electrode pads 211, 212, and 213 formed on the upper surface of the substrate 210 so as to be spaced apart from each other.

In this case, the multilayer ceramic capacitors 100, 1, 1 ', and 1000 have the first surface S1 of the ceramic bodies 110, 10, and 1100 disposed on the lower side as a mounting surface, And may be electrically connected to and connected to the substrate 210 by the solder 220 in a state of being in contact with the first to third electrode pads 211, 212 and 213.

The first and second internal electrodes of the multilayer ceramic capacitor 100, 1, 1 ', and 1000 according to the present embodiment are arranged such that the first and second internal electrodes of the substrate 210, which are disposed perpendicularly to the substrate 210, A current flows from the three-electrode pads 211, 212, and 213 to the first and second inner electrodes through the first to third outer electrodes, thereby shortening the current path.

Therefore, the ESL value can be lowered as compared with the multilayer ceramic capacitor having the internal electrode horizontally disposed on the substrate and the external electrode structure corresponding thereto, and the ESL value becomes lower as the number of stacked internal electrodes increases.

In one example, when the multilayer ceramic capacitor is used as a three-terminal EMI filter, the first and second external electrodes are respectively connected to the input and output terminals of the signal line, and the third external electrode is connected to the ground terminal, High frequency noise can be removed.

In this case, the first and second electrode pads 211 and 212, which are (+) polarities correspond to input / output terminals, and the third electrode pad 105, which is a (-) pole, correspond to the ground terminal.

In another application, when the multilayer ceramic capacitor is used as a decoupling capacitor, the first and second external electrodes are connected to the power supply line, and the third external electrode is connected to the ground line, so that the power supply circuit can be stabilized.

In this case, the first and second electrode pads 211 and 212 correspond to a power supply line, and the third electrode pad 213 corresponds to a ground terminal.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the scope of the present invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. And will be apparent to those skilled in the art.

100, 1, 1 ', 1000; Multilayer Ceramic Capacitors
110, 10, 1100; Ceramic body
111, 11, 1110; Dielectric layer
121, 20, 1200; The first internal electrode
122, 30, 1300; The second internal electrode
123, 22, 1220; The first lead portion
124, 23, 1230; The second lead portion
125, 32, 1320; The third lead portion
131, 41, 1410; The first outer electrode
132, 42, 1420; The second outer electrode
133, 43, 1430; The third outer electrode
210; Board
211, 212, 213; The first to third electrode pads
220; Solder

Claims (11)

A plurality of dielectric layers and a plurality of first and second internal electrodes, wherein the first and second surfaces in the thickness direction, the third and fourth surfaces in the longitudinal direction connecting the first and second surfaces, A ceramic body having fifth and sixth surfaces;
First and second external electrodes disposed on a first surface of the ceramic body so as to be spaced apart from each other along a longitudinal direction of the ceramic body; And
A third outer electrode disposed between the first and second outer electrodes on a first surface of the ceramic body; / RTI >
Wherein the third external electrode has a numerically controlled portion such that a height of a portion formed on a fifth or sixth surface of the ceramic body and a thickness of the ceramic body may improve a fixing strength of the third external electrode,
Wherein a ratio of d / T is 0.1? D / T when the height of the portion formed on the fifth or sixth surface of the ceramic body at the third external electrode is d and the thickness of the ceramic body is T, Lt; / RTI >
delete delete A plurality of dielectric layers and a plurality of first and second internal electrodes, wherein the first and second surfaces in the thickness direction, the third and fourth surfaces in the longitudinal direction connecting the first and second surfaces, A ceramic body having fifth and sixth surfaces;
First and second external electrodes disposed on a first surface of the ceramic body so as to be spaced apart from each other along a longitudinal direction of the ceramic body; And
A third outer electrode disposed between the first and second outer electrodes on a first surface of the ceramic body; / RTI >
Wherein the third external electrode has a numerically controlled portion such that a height of a portion formed on a fifth or sixth surface of the ceramic body and a thickness of the ceramic body may improve a fixing strength of the third external electrode,
Wherein when a height of a portion formed on the fifth or sixth surface of the ceramic body is d and a length of a portion formed on the fifth or sixth surface of the ceramic body is defined as G in the third external electrode, G ratio satisfies the range of 0.143? D / G? 0.536.
The method according to claim 1 or 4,
And the first and second internal electrodes are disposed apart from the third and fourth surfaces of the ceramic body.
delete The method according to claim 1 or 4,
First and second lead portions extending to be exposed through the first surface of the ceramic body at the first internal electrode and spaced apart from each other along the longitudinal direction of the ceramic body; And
A third lead portion extending from the second internal electrode to be exposed through the first surface of the ceramic body, the third lead portion being disposed between the first and second lead portions; And a capacitor.
8. The method of claim 7,
First and second external electrodes respectively connected to the first and second lead portions; And
A third external electrode connected to the third lead portion; And a capacitor.
8. The method of claim 7,
Further comprising fifth and sixth lead portions extending from the first internal electrode to be exposed through the second surface of the ceramic body,
And the second internal electrode is disposed to be spaced apart from the third and fourth surfaces of the ceramic body along the longitudinal direction of the ceramic body.
10. The method of claim 9,
A fourth lead portion extending from the second internal electrode to be exposed through the second surface of the ceramic body, the fourth lead portion being disposed between the fifth and sixth lead portions;
Fifth and sixth external electrodes disposed on a second surface of the ceramic body and connected to the fifth and sixth lead portions, respectively; And
A fourth external electrode disposed between the fifth and sixth external electrodes and connected to the fourth lead portion; And a capacitor.
A substrate having first to third electrode pads on an upper surface thereof; And
The multilayer ceramic capacitor of any one of claims 1 to 4, wherein first to third external electrodes are disposed on the first to third electrode pads, respectively. And a capacitor connected to the capacitor.

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