JP2015037193A - Multilayer ceramic capacitor and mounting substrate thereof - Google Patents

Multilayer ceramic capacitor and mounting substrate thereof Download PDF

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JP2015037193A
JP2015037193A JP2014164134A JP2014164134A JP2015037193A JP 2015037193 A JP2015037193 A JP 2015037193A JP 2014164134 A JP2014164134 A JP 2014164134A JP 2014164134 A JP2014164134 A JP 2014164134A JP 2015037193 A JP2015037193 A JP 2015037193A
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ceramic
external electrode
lead
mounting
electrode
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JP2015037193A5 (en
Inventor
クァン リー、キョ
Kyo Kwang Lee
クァン リー、キョ
キム、ジン
Jin Kim
ギュ アーン、ヨン
Young Ghyu Ahn
ギュ アーン、ヨン
ファ リー、ビョン
Byoung Hwa Lee
ファ リー、ビョン
Original Assignee
サムソン エレクトロ−メカニックス カンパニーリミテッド.
Samsung Electro-Mechanics Co Ltd
サムソン エレクトロ−メカニックス カンパニーリミテッド.
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Priority to KR1020130095952A priority Critical patent/KR20140038876A/en
Priority to KR10-2013-0095952 priority
Priority to KR1020140087022A priority patent/KR101659155B1/en
Priority to KR10-2014-0087022 priority
Application filed by サムソン エレクトロ−メカニックス カンパニーリミテッド., Samsung Electro-Mechanics Co Ltd, サムソン エレクトロ−メカニックス カンパニーリミテッド. filed Critical サムソン エレクトロ−メカニックス カンパニーリミテッド.
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Abstract

Provided are a multilayer ceramic capacitor in which the ESL of a multilayer ceramic capacitor is reduced, the adhesion strength of external electrodes is improved, and acoustic noise is reduced when mounted on a substrate, and a mounting substrate thereof.
Three external electrodes (131, 132, 133) are spaced apart from each other on a mounting surface of a ceramic body (110), and the height of a portion formed on one side surface of the ceramic body in the width direction of the external electrode is increased. When the thickness is defined as d and the thickness of the ceramic body is defined as T, the ratio d / T is 0.10 ≦ d / T ≦ 0.50.
[Selection] Figure 1

Description

  The present invention relates to a multilayer ceramic capacitor and a mounting substrate thereof.

  Electronic parts that use ceramic materials include capacitors, inductors, piezoelectric elements, varistors, and thermistors.

  Among the ceramic electronic components, a multilayer ceramic capacitor (MLCC) is advantageous in that it is small in size, has a large capacity and is easy to mount, and is a power source for an LSI (large scale integration circuit). It is usefully used as a decoupling capacitor disposed in a high-frequency circuit such as a circuit.

  Here, the stability of the power supply circuit depends on the ESL (Equivalent Serial Inductance) of the multilayer ceramic capacitor, and is particularly stable at a low ESL.

  Therefore, in order to stabilize the power supply circuit, the multilayer ceramic capacitor must have a lower ESL value, and such a requirement is further increased due to the trend of high frequency and high current of electronic devices.

  The multilayer ceramic capacitor is used as an EMI filter (electromagnetic interference filter) in addition to the decoupling capacitor. In this case, it is preferable that the ESL is low in order to improve high frequency noise removal and attenuation characteristics.

  In order to reduce such ESL, internal electrodes are mounted perpendicular to the substrate surface, and dielectric layers of ceramic material and metal internal electrodes are alternately stacked at the corners and both end surfaces of the ceramic body. A three-terminal capacitor having the above structure is disclosed.

  However, the three-terminal monolithic ceramic capacitor has a problem in that the ground terminal formed in the central portion of the ceramic body and the ceramic body have a low bonding strength, and the reliability of the product is lowered.

  On the other hand, since the dielectric layer of the multilayer ceramic capacitor has piezoelectricity and electrostrictive properties, when a DC or AC voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon occurs between the internal electrodes, causing vibration. May occur.

  The vibration is transmitted to the substrate on which the multilayer ceramic capacitor is mounted via the external electrode of the multilayer ceramic capacitor, and the entire substrate becomes an acoustic reflection surface to generate a vibration sound that becomes noise.

  The vibration sound may correspond to an audible frequency in the range of 20 to 20,000 Hz that gives an unpleasant feeling to the person, and the vibrating sound giving the person an unpleasant feeling is called acoustic noise.

Korean Patent Publication No. 10-2008-0073193 US Patent 6,950,300

  SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer ceramic capacitor and its mounting substrate that can lower the ESL of the multilayer ceramic capacitor, improve the adhesion strength of external electrodes, and reduce acoustic noise when mounted on the substrate.

  According to one aspect of the present invention, the three external electrodes are spaced apart from each other on the mounting surface of the ceramic body, and the external electrode has a height of a portion formed on one side surface of the ceramic body in the width direction. When the thickness is defined as d and the thickness of the ceramic body is defined as T, a multilayer ceramic capacitor in which the ratio of d / T is 0.10 ≦ d / T ≦ 0.50 is provided.

  According to another aspect of the present invention, a ceramic body having a plurality of dielectric layers stacked in the width direction and a plurality of first and second internal electrodes, and a length of the ceramic body on a mounting surface of the ceramic body. The first and second external electrodes, which are spaced apart from each other along the direction and connected to the plurality of first internal electrodes, are disposed between the first external electrode and the second external electrode, A third external electrode formed extending from a mounting surface of the ceramic body to a part of both side surfaces in the width direction of the ceramic body, and connected to the plurality of second internal electrodes. Where the height of the portion formed on one side surface of the ceramic body in the width direction is defined as d and the thickness of the ceramic body is defined as T, the ratio of d / T is 0.10 ≦ d / T ≦ 0. .50 multilayer ceramic capacity Over it is provided.

  According to an embodiment of the present invention, since the ESL of the multilayer ceramic capacitor can be reduced, when applied to a decoupling capacitor and an EMI filter, the voltage fluctuation of the power supply circuit can be more effectively suppressed, High frequency attenuation characteristics and high frequency noise removal effects can be improved.

  Further, the adhesion strength of the external electrode can be improved, the reliability of the product can be improved, and the acoustic noise can be reduced when mounted on the substrate.

1 is a perspective view schematically showing a multilayer ceramic capacitor according to an embodiment of the present invention. It is a side view of FIG. FIG. 2 is an exploded perspective view showing a structure of internal electrodes of the multilayer ceramic capacitor of FIG. 1. FIG. 5 is a perspective view schematically illustrating a multilayer ceramic capacitor according to another embodiment of the present invention. FIG. 5 is a plan view showing a structure of internal electrodes of the multilayer ceramic capacitor of FIG. 4. 6 is a perspective view schematically illustrating a multilayer ceramic capacitor according to still another embodiment of the present invention. FIG. FIG. 7 is a plan view showing a structure of internal electrodes of the multilayer ceramic capacitor of FIG. 6. 6 is a perspective view schematically illustrating a multilayer ceramic capacitor according to still another embodiment of the present invention. FIG. It is a side view of FIG. FIG. 9 is an exploded perspective view illustrating a structure of an internal electrode of the multilayer ceramic capacitor of FIG. 8. FIG. 2 is a perspective view schematically showing a state in which the multilayer ceramic capacitor of FIG. 1 is mounted on a substrate. FIG. 5 is a perspective view schematically showing a state in which the multilayer ceramic capacitor of FIG. 4 is mounted on a substrate. FIG. 7 is a perspective view schematically illustrating a state in which the multilayer ceramic capacitor of FIG. 6 is mounted on a substrate. FIG. 9 is a perspective view schematically showing a state in which the multilayer ceramic capacitor of FIG. 8 is mounted on a substrate.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for a clearer description.

[Multilayer ceramic capacitor]
FIG. 1 is a perspective view schematically showing a multilayer ceramic capacitor according to an embodiment of the present invention, FIG. 2 is a side view of FIG. 1, and FIG. 3 shows a structure of internal electrodes of the multilayer ceramic capacitor of FIG. It is the disassembled perspective view shown.

  1 to 3, a multilayer ceramic capacitor 100 according to an embodiment of the present invention includes a ceramic body 110, a plurality of first and second internal electrodes 121 and 122, first to third lead parts 123, 124, 125, and first to third external electrodes 131, 132, 133.

  The ceramic body 110 is formed by laminating a plurality of dielectric layers 111 in the width direction and then firing, and the boundary between adjacent dielectric layers 111 is not used by using a scanning electron microscope (SEM; Scanning Electron Microscope). Can be integrated so as not to be confirmed.

  The shape of the ceramic body 110 is not particularly limited, but may be a hexahedral shape, for example.

  In order to clearly describe the embodiment of the present invention, when the hexahedral direction of the ceramic body 110 is defined, L, W, and T displayed in FIG. 1 are the length direction, the width direction, and the thickness direction, respectively. Indicates.

  In the present embodiment, for convenience of explanation, the upper and lower surfaces S2 and S1 and the upper and lower surfaces S2 and S1 are connected to each other in the thickness direction facing each other of the ceramic body 110, and the longitudinal surfaces facing each other are connected. Both side surfaces are defined as first and second side surfaces S3 and S4, and opposite side surfaces in the width direction are defined as third and fourth side surfaces S5 and S6.

The dielectric layer 111 can contain a ceramic material having a high dielectric constant. For example, the dielectric layer 111 can contain a barium titanate (BaTiO 3 ) -based ceramic powder, but a sufficient capacitance can be obtained. If it exists, this invention is not limited to this.

  In addition to the ceramic powder, a ceramic additive, an organic solvent, a plasticizer, a binder, a dispersant, and the like can be further added to the dielectric layer 111 as necessary.

  The ceramic additive may be a transition metal oxide or carbide, a rare earth element, magnesium (Mg), aluminum (Al), or the like, but the present invention is not limited thereto.

  The first and second internal electrodes 121 and 122 are electrodes having mutually different polarities, and are alternately arranged so as to face each other with the ceramic sheet forming the dielectric layer 111 interposed therebetween. It is a portion that is superimposed and contributes to the capacitance of the capacitor.

  The first and second internal electrodes 121 and 122 can be electrically insulated from each other by a dielectric layer 111 disposed between them.

  At this time, the second internal electrode 122 may be spaced apart from both side surfaces S3 and S4 in the length direction of the ceramic body 110.

  The first and second internal electrodes 121 and 122 are made of a conductive metal.

  As the conductive metal, for example, one made of silver (Ag), palladium (Pd), platinum (Pt), nickel (Ni), copper (Cu) or an alloy thereof can be used. However, the present invention is not limited to this.

  The first and second lead parts 123 and 124 are spaced apart from each other along the length direction of the ceramic body 110, and are exposed through the lower surface S1 that is the mounting surface of the ceramic body 110. It is formed extending from the electrode 121.

  The third lead part 125 is disposed between the first lead part 123 and the second lead part 124 and extends from the second internal electrode 122 so as to be exposed through the lower surface S1 of the ceramic body 110. .

  The first and second external electrodes 131 and 132 are electrodes having the same polarity. The first and second external electrodes 131 and 132 are spaced apart from each other along the length of the ceramic body 110 on the lower surface S1 of the ceramic body 110. The first and second lead portions 123 and 124 exposed through the lower surface S1 are in contact with each other and are electrically connected.

  The third external electrode 133 is an electrode having a different polarity from the first and second external electrodes 131 and 132, and can be used as a ground terminal in the present embodiment.

  The third external electrode 133 is disposed between the first external electrode 131 and the second external electrode 132, and extends from the lower surface S1 of the ceramic body 110 to the third and fourth side surfaces S5 and S6 in the width direction of the ceramic body 110. The third lead part 125 is formed extending to a part and exposed through the lower surface S1 of the ceramic body 110 to be electrically connected.

  At this time, if the height of the portion formed on the third or fourth side surface S5, S6 of the ceramic body 110 in the third external electrode 133 is defined as d and the thickness of the ceramic body 110 is defined as T, the above d / T The ratio satisfies the range of 0.10 ≦ d / T.

  In addition, when the length of the portion formed on the third or fourth side surface S5, S6 of the ceramic body 110 in the third external electrode 133 is defined as G, the ratio of d / G is 0.143 ≦ d / G The range of ≦ 0.536 can be satisfied.

  The first to third external electrodes 131, 132, 133 can be formed of a conductive metal.

  Examples of the conductive metal include silver (Ag), nickel (Ni), and copper (Cu), but the present invention is not limited thereto.

  The first to third external electrodes 131, 132, and 133 can be formed by applying a conductive paste prepared by adding glass frit to the conductive metal powder and then baking the conductive paste. However, the present invention is not limited to this.

  In addition, a plating layer (not shown) may be formed on the first to third external electrodes 131, 132, 133 as necessary. The plating layer is for increasing the adhesive strength between the multilayer ceramic capacitors 100 when they are mounted on a substrate using solder.

  The plating layer includes, for example, a nickel (Ni) plating layer formed on the first to third external electrodes 131, 132, and 133, and a tin (Sn) plating layer formed on the nickel plating layer. Can be included.

  Meanwhile, the first and second lead parts 123 and 124 may be formed to extend from the first internal electrode 121 so as to be exposed through the upper surface S2 that is a surface facing the mounting surface of the ceramic body 110. .

  At this time, the first and second external electrodes 131 and 132 are formed on the upper surface S <b> 2 of the ceramic body 110.

  The first and second lead parts 123 and 124 are formed to extend from the first internal electrode 121 so as to be exposed through the first and second side surfaces S3 and S4 in the length direction of the ceramic body 110. be able to.

  At this time, the first and second external electrodes 131 and 132 may be formed to extend from the lower surface S1 of the ceramic body 110 to the first and second side surfaces S3 and S4 in the length direction of the ceramic body 110.

  In the present embodiment, the first and second lead portions 123 and 124 are exposed through all of the upper and lower surfaces S2 and S1 of the ceramic body 110 and the first and second side surfaces S3 and S4 in the length direction of the ceramic body 110. However, the present invention is not limited to this.

  Further, as in the present embodiment, the first and second lead portions 123 and 124 are exposed through the upper and lower surfaces S2 and S1 of the ceramic body 110 and the first and second side surfaces S3 and S4. When formed, the first and second external electrodes 131 and 132 corresponding to the first and second lead parts 123 and 124, respectively, are also formed on the first and second side surfaces S3 and S4 in the length direction of the ceramic body 110. In addition, the first and second side surfaces S3 and S4 in the length direction of the ceramic body 110 to a part of the third and fourth side surfaces S5 and S6 in the width direction of the ceramic body 110 and the upper surface S2 of the ceramic body 110. It extends to a part.

  As a result, the contact area between the first and second external electrodes 131 and 132 and the first and second lead parts 123 and 124 is widened, so that ESL is reduced.

  In addition, a fourth lead part 126 extending from the second internal electrode 122 so as to be exposed through the upper surface S2 of the ceramic body 110 may be further formed.

  The fourth lead portion 126 is disposed between the first lead portion 123 and the second lead portion 124 so as to be separated from the first and second lead portions 123 and 124.

  At this time, the fourth external electrode 134 is formed between the first external electrode 131 and the second external electrode 132 on the upper surface S <b> 2 of the ceramic body 110.

  The fourth external electrode 134 is in contact with and electrically connected to the portion of the fourth lead portion 126 exposed on the upper surface S2 of the ceramic body 110.

  At this time, the fourth external electrode 134 may be formed to extend from the upper surface S2 of the ceramic body 110 to part of the third and fourth side surfaces S5 and S6 in the width direction of the ceramic body 110.

  Here, in the fourth external electrode 134, if the height of the portion formed on the third or fourth side surface S5, S6 of the ceramic body 110 is defined as d and the thickness of the ceramic body 110 is defined as T, the above d / T The ratio of can satisfy the range of 0.10 ≦ d / T.

  Further, when the length of the portion formed on the third or fourth side surface S5, S6 of the ceramic body 110 in the fourth external electrode 134 is defined as G, the ratio of d / G is 0.143 ≦ d / G The range of ≦ 0.536 can be satisfied.

  As described above, the first and second lead parts 123 and 124 and the fourth lead part 126 are also exposed on the upper surface S2 of the ceramic body 110, and the inner and outer structures of the multilayer ceramic capacitor 100 are formed to be vertically symmetrical. In this case, the directionality of the multilayer ceramic capacitor 100 can be removed.

  Accordingly, when the multilayer ceramic capacitor 100 is mounted on the substrate, any one of the upper and lower surfaces S2 and S1 can be provided as a mounting surface. Therefore, when the multilayer ceramic capacitor 100 is mounted on the substrate, the direction of the mounting surface is changed. There is an advantage that it is not necessary to consider.

[Experimental example]
Table 1 below shows the presence / absence of adhesion strength and acoustic noise value depending on the d / T and d / G values of the multilayer ceramic capacitor. At this time, the fourth external electrode 134 arranged so as to face the third external electrode 133 in the thickness direction can have the same defect strength and acoustic noise value as those shown in Table 1 below.

  Here, whether or not the bonding strength is defective is determined by applying a force to the third external electrode 133 of the completed multilayer ceramic capacitor 100 of FIG. 1 for 10 ± 1 seconds, and then separating the third external electrode 133 from the ceramic body 110. Judgment by whether or not.

  In addition, 100 pieces were tested per sample in the case of fixing strength, and 10 pieces were tested per sample in the case of acoustic noise measurement.

  The d / T is the ratio of the height d of the portion formed on the third or fourth side surface S5, S6 of the ceramic body 110 in the third external electrode 133 to the thickness T of the ceramic body 110. At this time, the d / T affects the fixing strength of the third external electrode 133.

  In the present experimental example, the third external electrode 133 has a band portion only on a part of both side surfaces of the ceramic body 110 in the width direction. Therefore, if the height is too small compared to the thickness of the ceramic body 110, the third external electrode 133 may be separated from the ceramic body 110 when a predetermined force is applied to the third external electrode 133. .

  Referring to Table 1 above, in the case of Sample 1 to Sample 4 having a d / T value of less than 0.10, a minimum of 8% and a maximum of 80% of the third external electrodes 133 were observed from the ceramic body 110 in the adhesion strength test. A defect to be separated occurred. Therefore, it can be seen from this experimental example that the d / T value at which no poor fixing strength occurs is at least 0.1 or more as in Samples 5 to 21.

  The d / G is a ratio of the height d to the length G of the portion formed on the third or fourth side surface S5, S6 of the ceramic body 110 in the third external electrode 133.

  In the present experimental example, when the d value of the third external electrode 133 is decreased, a phenomenon occurs in which the property of fixing strength, which is mechanical strength, decreases. Further, when the G value of the third external electrode 133 is increased, the fixing strength characteristic is improved. However, a short circuit may occur due to interference between terminals after mounting, which may increase the acoustic noise of the multilayer ceramic capacitor. is there. Further, when the G value is decreased, the ESL of the capacitor may be increased.

  Therefore, the value of d / G is proportional to the amount of vibration transmitted from the multilayer ceramic capacitor 100 to the outside through the third external electrode 133. As a result, when the value of d / G increases, The acoustic noise of the ceramic capacitor 100 is increased.

  At this time, if the standard for determining whether or not acoustic noise is defective is set to 30 dB, it is confirmed that the acoustic noise exceeds the reference value of 30 dB in the samples 17 to 21 when the d / G exceeds 0.536. can do.

  On the other hand, when the d / G is less than 0.143, it can also be confirmed that a defect in fixing strength occurs.

  Therefore, the third or fourth side surface S5 in the width direction of the ceramic body 110 in the third external electrode 133 is used in order to prevent the external electrode fixing strength from being defective and to have acoustic noise below a predetermined reference value. The ratio d / G between the height d and the length G of the portion formed in S6 satisfies the range of 0.143 ≦ d / G ≦ 0.536.

[Modification]
FIG. 4 is a perspective view schematically showing a multilayer ceramic capacitor according to another embodiment of the present invention, and FIG. 5 is a plan view showing a structure of internal electrodes of the multilayer ceramic capacitor of FIG.

  Here, a specific description of the same part as that of the above-described embodiment will be omitted to avoid duplication, and only a part having a structure different from that of the above-described embodiment will be specifically described.

  Referring to FIGS. 4 and 5, in a multilayer ceramic capacitor 1 according to another embodiment of the present invention, a plurality of first and second internal electrodes 20 and 30 are alternately arranged with a dielectric layer 11 interposed therebetween.

  The first internal electrode 20 has first and second lead portions 22 and 23 formed extending from the first main body 21, and the first internal electrode 20 and the first and second side surfaces S 3 and S 4 of the ceramic main body 10. The space portions 11a and 11b may be provided between the two.

  Further, a space portion 11 c may be provided between the first main body portion 21 and the upper surface S <b> 2 of the ceramic main body 10.

  The second internal electrode 30 has a third lead portion 32 formed extending from the second main body portion 31, and a space is provided between the second internal electrode 30 and the first and second side surfaces S3 and S4 of the ceramic main body 10. Portions 11a and 11b may be provided.

  Further, a space portion 11 c may be provided between the second main body portion 31 and the upper surface S <b> 2 of the ceramic main body 10.

  Here, the space portions 11a, 11b, and 11c are the corner portions of the ceramic main body 10 and the first and second side surfaces S3 and S4 of the ceramic main body 10, and secure portions where the ceramic materials having high bonding strength contact each other. Thus, a phenomenon in which delamination occurs in the corner portion of the ceramic body 10 and the first and second side surfaces S3 and S4 of the ceramic body 10 can be minimized.

  The first and second external electrodes 41 and 42 are formed on the lower surface S1 of the ceramic body 10 so as to be separated from the first and second side surfaces S3 and S4 of the ceramic body 10, and the lower surface S1 of the ceramic body 10 as necessary. To a part of the third and fourth side surfaces S5 and S6 in the width direction of the ceramic body 10 can be formed.

  The third external electrode 43 is disposed between the first external electrode 41 and the second external electrode 42, and is one of the third and fourth side surfaces S 5 and S 6 in the width direction of the ceramic body 10 from the lower surface S 1 of the ceramic body 10. It extends to the part.

  FIG. 6 is a perspective view schematically showing a multilayer ceramic capacitor 1 ′ according to still another embodiment of the present invention, and FIG. 7 is a plan view showing the structure of internal electrodes of the multilayer ceramic capacitor of FIG.

  Here, a specific description of the same part as that of the above-described embodiment will be omitted to avoid duplication, and only a part having a structure different from that of the above-described embodiment will be specifically described.

  Referring to FIGS. 6 and 7, in a multilayer ceramic capacitor 1 ′ according to still another embodiment of the present invention, a plurality of first and second internal electrodes 20 and 30 are alternately arranged with a dielectric layer 11 in between. .

  The first internal electrodes 20 are formed to extend from the first main body portion 21 so as to be exposed through the upper surface S2 of the ceramic main body 10, and are arranged apart from each other along the length direction of the ceramic main body 10. The fourth and fifth lead portions 24 and 25 may be further included.

  The second internal electrode 30 is formed to extend from the second main body 31 so as to be exposed through the upper surface S <b> 2 of the ceramic main body 10, and is disposed between the fourth lead portion 24 and the fifth lead portion 25. The sixth lead part 33 may be further included.

  At this time, the insulating layer 50 may be disposed on the upper surface S2 facing the mounting surface of the ceramic body 10.

  8 is a perspective view schematically illustrating a multilayer ceramic capacitor 1000 according to still another embodiment of the present invention, FIG. 9 is a side view of FIG. 8, and FIG. 10 is an internal electrode of the multilayer ceramic capacitor of FIG. It is the disassembled perspective view which showed the structure.

  Here, a specific description of the same part as that of the above-described embodiment will be omitted to avoid duplication, and only a part having a structure different from that of the above-described embodiment will be specifically described.

  Referring to FIGS. 8 to 10, in a multilayer ceramic capacitor 1000 according to another embodiment of the present invention, a plurality of first and second internal electrodes 1200 and 1300 are alternately disposed with a dielectric layer 1110 interposed therebetween.

  The first internal electrodes 1200 are formed to extend from the first main body portion 1210 so as to be exposed through the lower surface S1 which is a mounting surface of the ceramic main body 1100, and are separated from each other along the length direction of the ceramic main body 1100. The first and second lead portions 1220 and 1230 to be disposed and the first main body portion 1210 are formed so as to be exposed through the upper surface S2 of the ceramic main body 1100, and extend along the length direction of the ceramic main body 1100. The fourth and fifth lead portions 1240 and 1250 may be further disposed apart from each other.

  At this time, space portions 1110a may be provided between the first internal electrode 1200 and the first and second side surfaces S3 and S4 of the ceramic body 1100, respectively.

  The second internal electrode 1300 is formed to extend from the second main body portion 1310 so as to be exposed through the lower surface S1 of the ceramic main body 1100, and is disposed between the first lead portion 1220 and the second lead portion 1230. The third lead portion 1320 is formed to extend from the second main body portion 1310 so as to be exposed through the upper surface S2 of the ceramic main body 1100, and is disposed between the fourth lead portion 1240 and the fifth lead portion 1250. And a sixth lead part 1330.

  At this time, space portions 1110a may be provided between the second internal electrode 1300 and the first and second side surfaces S3 and S4 of the ceramic body 1100, respectively.

  The first and second external electrodes 1410 and 1420 are formed on the lower surface S1 of the ceramic body 1100 so as to be spaced apart from the first and second side surfaces S3 and S4 of the ceramic body 1100, and the lower surface S1 of the ceramic body 1100 as necessary. To a part of the third and fourth side surfaces S5 and S6 in the width direction of the ceramic body 1100.

  The third external electrode 1430 is disposed between the first external electrode 1410 and the second external electrode 1420, and is one of the third and fourth side surfaces S5 and S6 in the width direction of the ceramic body 1100 from the lower surface S1 of the ceramic body 1100. It extends to the part.

  The fourth and fifth external electrodes 1510 and 1520 may be spaced apart from each other along the length direction of the ceramic body 1100 on the upper surface S <b> 2 of the ceramic body 1100.

  The fourth and fifth external electrodes 1510 and 1520 are connected to the fourth and fifth lead portions 1240 and 1250, respectively.

  In addition, a sixth external electrode 1530 may be disposed between the fourth external electrode 1510 and the fifth external electrode 1520 on the top surface S2 of the ceramic body 1100.

  The sixth external electrode 1530 is connected to the sixth lead portion 1330.

[Mounted substrate of multilayer ceramic capacitor]
11 is a perspective view schematically showing a state in which the multilayer ceramic capacitor of FIG. 1 is mounted on a substrate, and FIG. 12 is a perspective view schematically showing a state in which the multilayer ceramic capacitor of FIG. 4 is mounted on a substrate. 13 is a perspective view schematically illustrating a state in which the multilayer ceramic capacitor of FIG. 6 is mounted on a substrate, and FIG. 14 is a schematic view of the state in which the multilayer ceramic capacitor of FIG. 8 is mounted on a substrate. It is the perspective view shown in.

  11 to 14, the mounting substrate 200 of the multilayer ceramic capacitors 100, 1, 1 ′, 1000 according to the embodiment of the present invention includes a substrate 210 on which the multilayer ceramic capacitors 100, 1, 1 ′, 1000 are mounted. , First to third electrode pads 211, 212, and 213 formed on the upper surface of the substrate 210 to be spaced apart from each other.

  At this time, the multilayer ceramic capacitors 100, 1, 1 ′, and 1000 are arranged with the lower surface S1 in the thickness direction of the ceramic main bodies 110, 10, and 1100 as a mounting surface, and the first to third external electrodes are the first. The first and third electrode pads 211, 212, and 213 are arranged so as to be in contact with each other, and can be electrically connected to and coupled to the substrate 210 by the solder 220.

  In the multilayer ceramic capacitor 100, 1, 1 ′, 1000 of the present embodiment, the first and second internal electrodes are disposed perpendicular to the substrate 210, and the first to first of the substrate 210 disposed adjacent to each other. A current flows from the three electrode pads 211, 212, and 213 to the first and second internal electrodes through the first to third external electrodes, so that a current path can be shortened.

  Therefore, the ESL value can be lowered as compared with the multilayer ceramic capacitor having the internal electrode arranged horizontally on the substrate and the external electrode structure corresponding to the internal electrode. Such an ESL value is further lowered as the number of laminated internal electrodes is increased.

  As an example, when the multilayer ceramic capacitor is used as a 3-terminal EMI filter, the first and second external electrodes are connected to the input end and the output end of the signal line, respectively, and the third external electrode is connected to the ground end. The high frequency noise of the signal line can be removed.

  In this case, the first and second electrode pads 211 and 212 which are (+) poles correspond to input / output terminals, respectively, and the third electrode pad 105 which is a (−) pole corresponds to a ground terminal.

  As another application example, when the multilayer ceramic capacitor is used as a decoupling capacitor, the first and second external electrodes are connected to the power supply line, and the third external electrode is connected to the ground line to stabilize the power supply circuit. be able to.

  In this case, the first and second electrode pads 211 and 212 correspond to the power supply line, and the third electrode pad 213 corresponds to the ground terminal.

  Although the embodiment of the present invention has been described in detail above, the scope of the right of the present invention is not limited to this, and various modifications and modifications can be made without departing from the technical idea of the present invention described in the claims. It will be apparent to those skilled in the art that variations are possible.

100, 1, 1 ', 1000 Multilayer ceramic capacitor 110, 10, 1100 Ceramic body 111, 11, 1110 Dielectric layer 121, 20, 1200 First internal electrode 122, 30, 1300 Second internal electrode 123, 22, 1220 First 1st lead part 124, 23, 1230 2nd lead part 125, 32, 1320 3rd lead part 131, 41, 1410 1st external electrode 132, 42, 1420 2nd external electrode 133, 43, 1430 3rd external electrode 210 Substrate 211, 212, 213 First to third electrode pads 220 Solder

Claims (16)

  1. A ceramic body having a plurality of dielectric layers stacked in the width direction, a plurality of first internal electrodes and a plurality of second internal electrodes;
    A first external electrode and a second external electrode, which are spaced apart from each other along a length direction of the ceramic body on the mounting surface of the ceramic body, and are connected to the plurality of first internal electrodes;
    The plurality of second internal electrodes are disposed between the first external electrode and the second external electrode and extend from a mounting surface of the ceramic body to part of both side surfaces in the width direction of the ceramic body. A third external electrode connected to the electrode,
    In the third external electrode, when the height of a portion formed on one side surface of the ceramic body in the width direction is defined as d and the thickness of the ceramic body is defined as T, the ratio d / T is 0.10 ≦ d. / T is a multilayer ceramic capacitor.
  2.   In the third external electrode, when the length of the portion formed on one side surface of the ceramic body in the width direction is defined as G, the ratio of d / G is in the range of 0.143 ≦ d / G ≦ 0.536. The multilayer ceramic capacitor according to claim 1, wherein the multilayer ceramic capacitor is filled.
  3.   3. The multilayer ceramic capacitor according to claim 1, wherein the plurality of first internal electrodes and the plurality of second internal electrodes are disposed apart from both side surfaces in the length direction of the ceramic body.
  4.   4. The multilayer ceramic capacitor according to claim 3, wherein the first external electrode and the second external electrode are formed to extend from a mounting surface of the ceramic body to part of both side surfaces in the width direction of the ceramic body.
  5. A ceramic body in which a plurality of dielectric layers are laminated in the width direction;
    A plurality of first internal electrodes and a plurality of second internal electrodes that are alternately arranged across each of the plurality of dielectric layers;
    First and second leads formed extending from the plurality of first internal electrodes so as to be exposed through the mounting surface of the ceramic body, and spaced apart from each other along the length direction of the ceramic body. And a third lead portion formed between the first lead portion and the second lead portion, extending from the plurality of second internal electrodes so as to be exposed through the mounting surface of the ceramic body. When,
    A first external electrode connected to the first lead part and a second lead part connected to the second lead part, which are spaced apart from each other along the length direction of the ceramic body on the mounting surface of the ceramic body. Two external electrodes;
    The third lead portion is disposed between the first external electrode and the second external electrode and extends from a mounting surface of the ceramic body to a part of both side surfaces in the width direction of the ceramic body. A third external electrode connected,
    In the third external electrode, when the height of a portion formed on one side surface of the ceramic body in the width direction is defined as d and the thickness of the ceramic body is defined as T, the ratio d / T is 0.10 ≦ d. / T is a multilayer ceramic capacitor.
  6.   In the third external electrode, when the length of the portion formed on one side surface of the ceramic body in the width direction is defined as G, the ratio of d / G is in the range of 0.143 ≦ d / G ≦ 0.536. The multilayer ceramic capacitor according to claim 5, wherein the multilayer ceramic capacitor is filled.
  7. The first lead portion and the second lead portion extend from the first internal electrode so as to be exposed through a surface facing the mounting surface of the ceramic body and both side surfaces in the length direction of the ceramic body. Formed,
    The first external electrode and the second external electrode are formed on both side surfaces in the length direction of the ceramic body, and from both side surfaces in the length direction of the ceramic body to both side surfaces in the width direction of the ceramic body. Formed to extend partly and part of the surface facing the mounting surface of the ceramic body,
    The multilayer ceramic capacitor according to claim 5, wherein the second internal electrode is disposed apart from both side surfaces in the length direction of the ceramic body.
  8. A fourth lead formed to extend from the second internal electrode so as to be exposed through a surface facing the mounting surface of the ceramic body, and disposed between the first lead portion and the second lead portion. And
    The first external electrode is disposed between the second external electrode and extends from a surface facing the mounting surface of the ceramic body to part of both side surfaces in the width direction of the ceramic body. The multilayer ceramic capacitor according to claim 5, further comprising a fourth external electrode connected to the four lead portions.
  9.   The multilayer ceramic according to any one of claims 5 to 8, wherein the plurality of first internal electrodes and the plurality of second internal electrodes are spaced apart from both side surfaces in the length direction of the ceramic body. Capacitor.
  10.   10. The multilayer ceramic capacitor according to claim 9, wherein the first external electrode and the second external electrode are formed to extend from a mounting surface of the ceramic body to part of both side surfaces in the width direction of the ceramic body.
  11. A fourth lead portion formed extending from the first internal electrode so as to be exposed through a surface facing the mounting surface of the ceramic body and spaced apart from each other along a length direction of the ceramic body; And a fifth lead part,
    A sixth lead extending from the second internal electrode so as to be exposed through a surface facing the mounting surface of the ceramic body, and disposed between the fourth lead portion and the fifth lead portion. And
    The multilayer ceramic capacitor according to claim 9, further comprising an insulating layer disposed on a surface facing the mounting surface of the ceramic body.
  12. A fourth lead portion formed extending from the first internal electrode so as to be exposed through a surface facing the mounting surface of the ceramic body and spaced apart from each other along a length direction of the ceramic body; And a fifth lead part,
    A sixth lead extending from the second internal electrode so as to be exposed through a surface facing the mounting surface of the ceramic body, and disposed between the fourth lead portion and the fifth lead portion. And
    A fourth external electrode and a fourth external electrode, which are spaced apart from each other along a length direction of the ceramic body and are connected to the fourth lead portion and the fifth lead portion, respectively, on a surface facing the mounting surface of the ceramic body; 5 external electrodes;
    The first external electrode is disposed between the fourth external electrode and the fifth external electrode, and extends from a surface facing the mounting surface of the ceramic body to a part of both side surfaces in the width direction of the ceramic body. The multilayer ceramic capacitor according to claim 9, further comprising a sixth external electrode connected to the six lead portions.
  13.   In the sixth external electrode, when the height of a portion formed on one side surface in the width direction of the ceramic body is defined as d and the thickness of the ceramic body is defined as T, the ratio d / T is 0.10 ≦ d. The multilayer ceramic capacitor according to claim 12, which is / T.
  14.   In the sixth external electrode, if the length of the portion formed on one side surface of the ceramic body in the width direction is defined as G, the ratio of d / G is in the range of 0.143 ≦ d / G ≦ 0.536. The multilayer ceramic capacitor according to claim 12, wherein the multilayer ceramic capacitor is filled.
  15.   The said 4th external electrode and the said 5th external electrode are extended and formed from the surface facing the mounting surface of the said ceramic main body to a part of both sides of the width direction of the said ceramic main body. The multilayer ceramic capacitor according to claim 1.
  16. A substrate having first to third electrode pads thereon;
    The multilayer ceramic capacitor mounting substrate according to any one of claims 1 to 15, wherein first to third external electrodes are respectively disposed on the first to third electrode pads.
JP2014164134A 2013-08-13 2014-08-12 Multilayer ceramic capacitor and mounting substrate thereof Pending JP2015037193A (en)

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KR101659155B1 (en) 2016-09-22

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