KR102018306B1 - Multi-layered ceramic capacitor and board for mounting the same - Google Patents

Multi-layered ceramic capacitor and board for mounting the same Download PDF

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Publication number
KR102018306B1
KR102018306B1 KR1020140160582A KR20140160582A KR102018306B1 KR 102018306 B1 KR102018306 B1 KR 102018306B1 KR 1020140160582 A KR1020140160582 A KR 1020140160582A KR 20140160582 A KR20140160582 A KR 20140160582A KR 102018306 B1 KR102018306 B1 KR 102018306B1
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South Korea
Prior art keywords
ceramic body
lead
mounting surface
disposed
part
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KR1020140160582A
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Korean (ko)
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KR20150050519A (en
Inventor
이교광
이병화
안영규
김진
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삼성전기주식회사
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components

Abstract

According to the present invention, three external electrodes are disposed on the mounting surface of the ceramic body to be spaced apart from each other, and the first to third lead parts are formed to extend from the first and second internal electrodes to be exposed through the mounting surface of the ceramic body. At least a part of the sides is formed of an inclined extension portion, and the first to third external electrodes provide a multilayer ceramic capacitor and a mounting substrate, each of which has a width greater than the length of the first to third lead portions.

Description

Multi-layered ceramic capacitor and board for mounting the same

The present invention relates to a multilayer ceramic capacitor and a mounting substrate thereof.

With the recent miniaturization and high capacity of electronic products, miniaturization and high capacity of electronic components used in electronic products are also required.

In the case of multilayer ceramic capacitors, the equivalent series inductance (“ESL”) increases, which may degrade the performance of electronic products.Increasing the ESL of multilayer ceramic capacitors increases with the miniaturization and high capacity of the applied electronic components. The impact on the performance degradation of the system becomes relatively large.

In particular, as the performance of ICs increases, the use of decoupling capacitors increases, reducing the distance between external terminals, thereby reducing the current flow path, thereby reducing the inductance of capacitors. Demand for low inductance chip capacitors (LICC) is increasing.

Korean Patent Publication No. 2009-0117686 Korean Registered Patent No. 0920614

SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer ceramic capacitor and its mounting substrate which can improve low ESL characteristics in a vertically stacked three-terminal capacitor.

According to an aspect of the present invention, three external electrodes are disposed on the mounting surface of the ceramic body so as to be spaced apart from each other, and are formed to extend from the first and second internal electrodes to be exposed through the mounting surface of the ceramic body. The lead portion provides a multilayer ceramic capacitor in which at least part of one side is an inclined extension portion.

According to one embodiment of the present invention, by forming at least a portion of one side of the lead portion as the inclined extension portion, there is an effect that can reduce the current path to reduce the ESL and improve the ESL distribution.

1 is a perspective view schematically showing an inverted multilayer ceramic capacitor according to an embodiment of the present invention.
FIG. 2 is a perspective view illustrating the ceramic body of the multilayer ceramic capacitor of FIG. 1 upside down. FIG.
FIG. 3 is an exploded perspective view of the multilayer ceramic capacitor of FIG. 1, with the external electrode omitted. FIG.
4 is a cross-sectional view illustrating the multilayer ceramic capacitor of FIG. 1.
5 is a perspective view schematically showing a multilayer ceramic capacitor according to another embodiment of the present invention.
FIG. 6 is an exploded perspective view illustrating the multilayer ceramic capacitor of FIG. 5 with the external electrode omitted. FIG.
7 is a cross-sectional view illustrating the multilayer ceramic capacitor of FIG. 5.
8 is a perspective view schematically illustrating a multilayer ceramic capacitor according to still another embodiment of the present invention.
9 is a perspective view illustrating a ceramic body of the multilayer ceramic capacitor of FIG. 8.
FIG. 10 is an exploded perspective view of the multilayer ceramic capacitor of FIG. 8, with the external electrode omitted. FIG.
FIG. 11 is a cross-sectional view illustrating the multilayer ceramic capacitor of FIG. 8.
12 is a plan view illustrating an embodiment of a lead unit in the multilayer ceramic capacitor of the present invention.
FIG. 13 is a plan view illustrating another embodiment of a lead unit in the multilayer ceramic capacitor of the present invention. FIG.
14 is a perspective view illustrating a board in which the multilayer ceramic capacitor of FIG. 8 is mounted on a substrate.
FIG. 15 is a cross-sectional view illustrating a board in which the multilayer ceramic capacitor of FIG. 8 is mounted on a substrate.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

However, embodiments of the present invention may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below.

Moreover, embodiment of this invention is provided in order to demonstrate this invention more completely to the person with average knowledge in the technical field.

Shape and size of the elements in the drawings may be exaggerated for more clear description.

In addition, the components with the same functions within the scope of the same idea shown in the drawings of each embodiment will be described using the same reference numerals.

In order to clarify the embodiments of the present invention, the direction of the cube is defined, and L, W, and T indicated on the drawings indicate a length direction, a width direction, and a thickness direction, respectively. Here, the width direction may be used in the same concept as the stacking direction in which the dielectric layers are stacked.

Multilayer Ceramic Capacitors

1 is a perspective view schematically showing a multilayer ceramic capacitor inverted according to an embodiment of the present invention, FIG. 2 is a perspective view of a ceramic body inverted among the multilayer ceramic capacitors of FIG. 1, and FIG. 3 is a perspective view of the multilayer ceramic capacitor of FIG. 1. 4 is an exploded perspective view of an external electrode, and FIG. 4 is a cross-sectional view of the multilayer ceramic capacitor of FIG. 1.

1 to 4, the multilayer ceramic capacitor 100 according to the present embodiment includes a ceramic body 110 in which a plurality of dielectric layers 111 are stacked, and a plurality of first and second internal electrodes 120 and 130. ) And an first to third external electrodes 141 to 143.

The multilayer ceramic capacitor 100 of the present embodiment can be viewed as a so-called three-terminal capacitor having a total of three external terminals.

The ceramic body 110 connects the first surface S1 and the second surface S2 and the first surface S1 and the second surface S2 in the thickness direction T facing each other and face each other. It may have a fifth surface S5 and a sixth surface S6 in the direction W, and a third surface S3 and a fourth surface S4 in the longitudinal direction L facing each other.

Hereinafter, in the present embodiment, the mounting surface of the multilayer ceramic capacitor 100 is defined and described as the first surface S1 of the ceramic body 110.

The ceramic body 110 is formed by laminating a plurality of dielectric layers 111 in the width direction and then firing, and the ceramic body 110 may have a hexahedron shape as shown in the figure.

However, the shape, the dimensions, and the number of stacked layers of the dielectric layer 111 of the ceramic body 110 are not limited to those shown in the present embodiment.

In addition, the plurality of dielectric layers 111 forming the ceramic body 110 are in a sintered state, and the boundary between adjacent dielectric layers 111 is difficult to confirm without using a scanning electron microscope (SEM). Can be integrated.

The ceramic body 110 is composed of an active layer having a plurality of internal electrodes as a part contributing to the capacitance formation of the capacitor, and cover layers 112 and 113 disposed on both sides of the active layer in the width direction as a margin part. Can be.

The active layer may be formed by alternately stacking a plurality of first and second internal electrodes 120 and 130 with a dielectric layer 111 interposed therebetween in the width direction.

At this time, the thickness of the dielectric layer 111 can be arbitrarily changed according to the capacity design of the multilayer ceramic capacitor 100, preferably the thickness of one layer can be configured to be 0.01 to 1.00 ㎛ after firing, the present invention is limited thereto. It doesn't happen.

In addition, the dielectric layer 111 may include a ceramic powder having a high dielectric constant, for example, barium titanate (BaTiO 3 ) -based or strontium titanate (SrTiO 3 ) -based powder, and the present invention may be obtained as long as sufficient capacitance can be obtained. It is not limited to this.

In addition, a ceramic additive, an organic solvent, a plasticizer, a binder, a dispersant, and the like may be further added to the dielectric layer 111 when necessary.

In this case, the average particle diameter of the ceramic powder used to form the dielectric layer 111 is not particularly limited, and may be adjusted to achieve the object of the present invention, for example, may be adjusted to 400 nm or less, the present invention is It is not limited.

The cover layers 112 and 113 may have the same material and construction as the dielectric layer 111 except that the cover layers 112 and 113 do not include internal electrodes.

In addition, the cover layers 112 and 113 may be formed by further stacking a single dielectric layer or two or more dielectric layers on both surfaces of the active layer in the width direction, respectively. The first and second layers may be formed by physical or chemical stress. It may serve to prevent damage to the internal electrodes 120 and 130.

The first and second internal electrodes 120 and 130 are electrodes having different polarities and are formed inside the ceramic body 110 and are disposed to face each other with the dielectric layer 111 interposed therebetween.

In this case, the first and second internal electrodes 120 and 130 may be electrically insulated from each other by the dielectric layer 111 disposed therebetween.

The first and second internal electrodes 120 and 130 include a capacitor part overlapping with the neighboring internal electrode and contributing to the formation of a capacitor, and a lead part of which the capacitor part extends to be exposed to the outside of the ceramic body 110. .

The lead portion is not particularly limited, but may have, for example, a shorter length than the length of the internal electrode constituting the capacitor portion.

In addition, the thicknesses of the first and second internal electrodes 120 and 130 may be determined according to a use. For example, the thicknesses of the first and second internal electrodes 120 and 130 may be determined to be within a range of 0.2 to 1.0 μm in consideration of the size of the ceramic body 110. The invention is not limited thereto.

In addition, the material for forming the first and second internal electrodes 120 and 130 is not particularly limited. For example, precious metal materials such as palladium (Pd) and palladium-silver (Pd-Ag) alloys, and nickel (Ni) And a conductive paste made of one or more materials of copper (Cu).

In addition, a screen printing method or a gravure printing method may be used as the printing method of the conductive paste, but the present invention is not limited thereto.

In the present embodiment, the first internal electrodes 120 have first and second leads 121 and 122 spaced apart from each other in the longitudinal direction and exposed to the first surface S1 of the ceramic body 110. The third and fourth surfaces S3 and S4 may be disposed to be spaced apart from each other by a predetermined distance.

The second internal electrode 130 may be exposed to the first surface S1 of the ceramic body 110, but may be formed to be spaced apart by a predetermined distance between the first and second lead parts 121 and 122, respectively. 131 and may be spaced apart from the third and fourth surfaces S3 and S4 by a predetermined distance.

In this case, at least one of the first to third lead parts 121, 122, and 131 may be formed as an inclined extension part of at least one side connected to the first surface S1 of the ceramic body 110.

In addition, the inclined extension may be made of a curve rather than a straight line if necessary.

In the present embodiment, the first and second lead parts 121 and 122 may have an inner side edge extending from the capacitive part of the first internal electrode 120 and the first surface S1 of the ceramic body 110. It may include an inclined extension extending obliquely from the electrode 120 and a vertical extension formed to extend vertically from the inclined extension toward the first surface S1 of the ceramic body 110.

In this case, the first and second lead parts 121 and 122 are the same as the outer side surfaces of the capacitor part of the first internal electrode 120 and the first surface S1 of the ceramic body 110 when necessary. It may be configured to include an inclined extension extending obliquely from the first internal electrode 120 and a vertical extension formed to extend vertically from the inclined extension toward the first surface S1 of the ceramic body 110.

In addition, one side of the third lead part 131 extending from the capacitive part of the second internal electrode 130 and the first surface S1 of the ceramic body 110 may be inclined from the second internal electrode 130. It may include an inclined extension portion and an inclined extension portion formed to extend vertically from the inclined extension portion toward the first surface S1 of the ceramic body 110.

In this case, the third lead part 131 may include the capacitive part of the second internal electrode 130 and the sides of the first surface S1 of the ceramic body 110 extending from the second internal electrode 130 if necessary. It may be configured to include an inclined extension extending obliquely from) and a vertical extension formed to extend vertically from the inclined extension toward the first surface (S1) of the ceramic body (110).

In this case, the area of the first space part provided between the first or second lead parts 121 and 122 and the vertical extension part of the third lead part 131 is Sa, and the first or second lead parts 121 and 122 are Sa. ) And when the area of the second space provided between the slanted extension of the third lead part 131 is Sb and Sa + Sb is St, 0.383 ≦ Sa / Sb ≦ 12, and 0.277 ≦ Sa / St ≦ 0.923.

In general multilayer ceramic electronic components, external electrodes may be disposed on both surfaces of the ceramic body facing each other in the length direction of the ceramic body.

However, in this case, since the current path is long when an alternating voltage is applied to the external electrode, the current loop may be formed larger, and the inductance may increase due to the size of the induced magnetic field.

In order to solve the above problem, according to an embodiment of the present invention, the first to third external electrodes 141 to 143 are disposed on the first surface S1, which is the mounting surface of the ceramic body 110, in order to reduce the current path. This can be arranged.

In this case, since the distance between the first and second external electrodes 141 and 142 and the third external electrode 143 is small, the current loop can be reduced, thereby reducing the inductance.

The first and second external electrodes 141 and 142 are formed to be spaced apart from each other in the longitudinal direction on the first surface S1 of the ceramic body 110 and are connected to the first and second lead parts 121 and 122, respectively. The third external electrode 143 is connected to the first and second external electrodes 141 and 142 on the first surface S1 of the ceramic body 110 between the first and second external electrodes 141 and 142. And are formed spaced apart from each other by a predetermined distance and are connected to and connected to the third lead part 131.

In addition, the first to third external electrodes 141 to 143 are electrically connected to corresponding leads of the first and second internal electrodes 120 and 130, respectively, to form a capacitance, and, if necessary, the ceramic body 110. A band may be formed by extending to a part of the fifth and sixth surfaces S5 and S6 of FIG.

In this case, the first to third lead parts 121, 122, and 131 may be positioned inside the first to third external electrodes 141 to 143, respectively. To this end, the widths of the first to third external electrodes 141 to 143 may be larger than the lengths of the first to third lead parts 121, 122, and 123, respectively. According to the above structure, since the first to third lead parts 121, 122, and 131 are not exposed through the first surface S1 of the ceramic body 110, the first to third leads 121, 122, and 131 may not be exposed to the first surface S1 of the ceramic body 110. It is not necessary to form a separate insulating layer.

Meanwhile, the first to third external electrodes 141 to 143 may be formed in a triple layer structure, and the first to third conductive layers 141a-to be in contact with the lead portions of the corresponding internal electrodes. 143a, first to third nickel (Ni) plating layers 141b to 143b formed to cover the first to third conductive layers 141a to 143a, and first to third nickel plating layers 141b to 143b, respectively. The first to third tin (Sn) plating layers 141c to 143c formed to cover the respective layers.

The first to third conductive layers 141a to 143a may be formed of a conductive material having the same material as the first and second internal electrodes 120 and 130, but are not limited thereto. For example, copper (Cu), It may be formed of a metal powder such as silver (Ag) and nickel (Ni), and may be formed by applying a conductive paste prepared by adding a glass frit to the metal powder and then baking the same.

Experiment example

The multilayer ceramic capacitor according to the embodiment and the comparative example of the present invention was manufactured as follows.

A slurry formed of powder such as barium titanate (BaTiO 3 ) is applied and dried on a carrier film to prepare a plurality of ceramic green sheets manufactured to a thickness of 1.8 μm.

Next, a first internal electrode and a first internal electrode having first and second lead portions exposed to the first surface of the ceramic green sheet by applying a conductive paste for nickel internal electrodes on the ceramic green sheet using a screen. A second internal electrode having a third lead portion spaced apart from the second lead portion and exposed to the first surface of the ceramic green sheet is formed.

In this case, the first and second internal electrodes may have the inclined extension part which is inclinedly extended from the first and second internal electrode and the inclined extension part which extends vertically from the inclined extension part toward the mounting surface of the ceramic body. It is formed to include a vertical extension.

Next, the ceramic green sheet is laminated in about 200 layers, and the ceramic green sheet, in which the first and second internal electrodes are not formed, is further laminated on both sides of the width direction to prepare a laminate, and the laminate is formed. Isostatic pressing was carried out at 1000 ° C. under 1000 kgf / cm 2 pressure.

Next, the pressed ceramic laminate was cut in the form of individual chips, and the cut chips were kept at about 230 ° C. for 60 hours in an air atmosphere to carry out binder removal.

Next, the ceramic body was prepared by firing in a reducing atmosphere at an oxygen partial pressure of 10 −11 to 10 −10 atm lower than the Ni / NiO equilibrium oxygen partial pressure so that the internal electrode was not oxidized at about 1,200 ° C.

The chip size of the laminated chip capacitor after firing was about 1.0 mm × 0.5 mm (L × W, 1005 size) in length × width (L × W). Here, the production tolerance was set within the range of ± 0.1 mm in length × width (L × W).

Next, the multilayer ceramic capacitor is completed by forming the first to third external electrodes on the first surface of the ceramic body so as to correspond to the lead portions of the first and second internal electrodes, respectively, and have a poor delamination. Table 1 shows the occurrence and equivalent series inductance (ESL) measurement test. Each test was performed on 200 sample samples.

No So Sa Sb St Sa / St St / so Sa / Sb ratio Delamination ESL [pH] One 15120 0 7560 7560 0 0.5 0 50/200 37.8 2 15120 810 7155 7965 0.102 0.527 0.113 12/200 38.2 3 15120 1620 6750 8370 0.194 0.554 0.240 5/200 38.7 4 15120 2430 6345 8775 0.277 0.580 0.383 0/200 39.2 5 15120 3240 5940 9180 0.353 0.607 0.545 0/200 39.9 6 15120 4050 5535 9585 0.423 0.634 0.732 0/200 40.2 7 15120 4860 5130 9990 0.486 0.661 0.947 0/200 40.6 8 15120 5670 4725 10395 0.545 0.688 1.200 0/200 41.3 9 15120 6480 4320 10800 0.600 0.714 1.500 0/200 41.9 10 15120 7290 3915 11205 0.651 0.741 1.862 0/200 42.2 11 15120 8100 3510 11610 0.698 0.768 2.308 0/200 42.5 12 15120 8910 3105 12015 0.742 0.795 2.870 0/200 42.9 13 15120 9720 2700 12420 0.783 0.821 3.600 0/200 43.1 14 15120 10530 2295 12825 0.821 0.848 4.588 0/200 43.5 15 15120 11340 1890 13230 0.857 0.875 6.000 0/200 44.1 16 15120 12150 1485 13635 0.891 0.902 8.182 0/200 44.5 17 15120 12960 1080 14040 0.923 0.929 12.000 0/200 44.9 18 15120 13770 675 14445 0.953 0.955 20.400 0/200 46 19 15120 14580 270 14850 0.982 0.982 54.000 0/200 47.5

Here, the area of the first space portion provided between the first or second lead portion and the vertical extension portion of the third lead portion is Sa, and between the inclined extension portion of the first or second lead portion and the third lead portion. The area of the second space portion provided in Sb is defined as Sb, and Sa + Sb is defined as St. In addition, So represents each area provided when the 1st or 2nd lead part and a 3rd lead part have a square shape which does not have a diagonal extension part.

Referring to Table 1, in the case of Samples 1 to 17 where the area Sa ratio of the first space portion Sa / St provided between the vertical extension portions of the lead portion to the area St of the entire space portion is 0.923 or less, the ESL is 45 pH. It was found to be lower than, it can be seen that the ESL is greater than 45 for the samples 18 and 19 Sa / St is greater than 0.923.

Therefore, it is preferable that Sa / St is 0.923 or less.

Further, in the samples 1 to 3 in which the area ratio Sa / Sb of the first space part provided between the vertical extension parts to the area Sb of the second space formed between the inclined extension parts of the lead part is less than 0.383, Lamination failure occurred.

Therefore, it is preferable that Sa / Sbt is 0.383 or more.

Variant

5 is a perspective view schematically illustrating a multilayer ceramic capacitor according to another exemplary embodiment of the present invention, FIG. 6 is an exploded perspective view of the multilayer ceramic capacitor of FIG. 5 without an external electrode, and FIG. 7 is a multilayer ceramic capacitor of FIG. 5. It is sectional drawing which shows.

Here, since the structure of the ceramic body 110 is the same as the above-described embodiment, a detailed description thereof will be omitted in order to avoid duplication, and the first and second internal electrodes 120 and 130 having a different structure from the above-described embodiment will be omitted. ) And the insulating layer 150 will be described in detail.

5 to 7, in the multilayer ceramic capacitor 100 ′ of the present embodiment, the insulating layer 150 may be disposed on a second surface S2 opposite to the mounting surface of the ceramic body 110.

The first and second internal electrodes 120 are exposed through the second surface S2 of the ceramic body 110 to contact the insulating layer 150 formed on the second surface S2 of the ceramic body 110. 5 may have lead portions 123 and 124.

The second internal electrode 130 is disposed between the third and fourth lead parts 123 and 124 and is exposed through the second surface S2 of the ceramic body 110 to contact the insulating layer 150. It may have a lead portion 132.

FIG. 8 is a perspective view schematically illustrating a multilayer ceramic capacitor according to still another embodiment of the present disclosure, FIG. 9 is a perspective view illustrating a ceramic body among the multilayer ceramic capacitors of FIG. 8, and FIG. 10 is an external view of the multilayer ceramic capacitor of FIG. 8. FIG. 11 is an exploded perspective view showing the electrode omitted, and FIG. 11 is a cross-sectional view illustrating the multilayer ceramic capacitor of FIG. 8.

Here, since the structure of the ceramic body 110 is the same as the above-described embodiment, a detailed description thereof is omitted in order to avoid duplication, and the fourth to sixth external electrodes 144-146 having a different structure from the above-described embodiment. ) And the first and second internal electrodes 120 and 130 will be described in detail.

8 to 11, in the multilayer ceramic capacitor 100 ″ of the present embodiment, the fourth to sixth external electrodes 144-146 may have a first surface on the second surface S2 of the ceramic body 110. To the third external electrodes 141 to 143.

In this case, the fourth to sixth external electrodes 141 to 146 may be formed to extend to portions of the fifth and sixth surfaces S5 and S6 of the ceramic body 110 as necessary.

The fourth to sixth external electrodes 144 to 146 have a triple layer structure, and include the fourth to sixth conductive layers 144a to 146a connected to and in contact with the lead portions of the respective internal electrodes. The fourth to sixth nickel (Ni) plating layers 144b to 146b and the fourth to sixth nickel plating layers 144b to 146b formed to cover the sixth to sixth conductive layers 144a to 146a, respectively. Fourth to sixth tin (Sn) plating layers 144c to 146c are included.

The first internal electrode 120 is exposed through the second surface S2 of the ceramic body 110 to form the fourth and fifth external electrodes 144 and 145 formed on the second surface S2 of the ceramic body 110. And fourth and fifth lead portions 123 and 124 respectively connected to each other.

The second internal electrode 130 is disposed between the third and fourth lead portions 123 and 124 and exposed through the second surface S2 of the ceramic body 110 to connect with the sixth external electrode 146. It may have a sixth lead portion 132.

As described above, when the internal and external structures of the multilayer ceramic capacitor 100 ″ are formed in a vertically symmetrical structure, the direction of the capacitor may be removed.

That is, the multilayer ceramic capacitor 100 ″ has a vertically symmetric structure to prevent defects caused by reversing the mounting surface when mounting on the substrate.

Therefore, since any one of the first and second main surfaces S1 and S2 of the multilayer ceramic capacitor 100 ″ may be provided as a mounting surface, the direction of the mounting surface is taken into consideration when the multilayer ceramic capacitor 100 ″ is mounted on a substrate. There is an advantage that you do not have to.

In this case, at least one of the fourth to sixth lead parts 123, 124, and 132 may be an inclined extension part of at least one side connected to the second surface S2 of the ceramic body 110.

In addition, the inclined extension may be made of a curve rather than a straight line if necessary.

In the present embodiment, the fourth and fifth lead parts 123 and 124 may have an inner side edge extending from the capacitive part of the first internal electrode 120 and the second surface S2 of the ceramic body 110. It may include an inclined extension extending obliquely from the electrode 120 and a vertical extension formed to extend vertically from the inclined extension toward the second surface S2 of the ceramic body 110.

In this case, the fourth and fifth lead parts 123 and 124 may be the same as the outer side surface extending from the capacitive part of the first internal electrode 120 and the second surface S2 of the ceramic body 110 when necessary. It may be configured to include an inclined extension extending obliquely from the first internal electrode 120 and a vertical extension formed to extend vertically from the inclined extension toward the second surface S2 of the ceramic body 110.

In addition, the sixth lead part 132 may have one side that extends the capacitive part of the second internal electrode 130 and the second surface S2 of the ceramic body 110, and is inclinedly extended from the second internal electrode 130. It may include an inclined extension portion and an inclined extension portion formed to extend vertically from the inclined extension portion toward the second surface S2 of the ceramic body 110.

In this case, the sixth lead part 132 may have both the capacitor part of the second internal electrode 130 and the sides of the second surface S2 extending the second surface S2 of the ceramic body 110 as necessary, as described above. It may be configured to include an inclined extension extending obliquely from) and a vertical extension formed to extend vertically from the inclined extension toward the second surface (S2) of the ceramic body (110).

At this time, the area of the first space part provided between the fourth or fifth lead parts 123 and 124 and the vertical extension part of the sixth lead part 132 is Sa, and the fourth or fifth lead parts 123 and 124 is used. When the area of the second space part provided between S and the inclined extension part of the sixth lead part 132 is Sb and Sa + Sb is defined as St, 0.383 ≦ Sa / Sb ≦ 12, and 0.277 ≦ Sa / St ≦ 0.923.

On the other hand, whether or not the occurrence of defects and the ESL value according to the value of the first and second spaced portion provided between the first to the third lead portion shown in Table 1 is the value of the space portion provided between the fourth to sixth lead portion The same can be applied to.

12 is a plan view illustrating an embodiment of a lead unit in the multilayer ceramic capacitor of the present invention.

Referring to FIG. 12, at least one side of a portion where the first to sixth lead parts 1210-1240, 1310 and 1320 and the ceramic body 110 are connected to the first and second internal electrodes 1200 and 1300 may be formed. It may consist only of an inclined extension consisting of straight lines.

Here, since the other forming structures of the first and second internal electrodes 1200 and 1300 and the first to sixth external electrodes 141 to 146 are similar to those of the above-described embodiment, detailed description thereof will be provided to avoid overlapping. Omit.

FIG. 13 is a plan view illustrating another embodiment of a lead unit in the multilayer ceramic capacitor of the present invention. FIG.

Referring to FIG. 13, the first and second lead portions 1210 ′ and 1220 ′ and the fourth and fifth lead portions 1230 ′ and 1240 ′ are connected to each other in the first internal electrode 1200 ′. The sides connected to the first and second surfaces S1 and S2 of the body 110 may be formed in one curve.

In addition, the third and sixth leads 1310 ′ and 1320 ′ of the second internal electrode 1300 ′ may be formed to have both side curves connected to the mounting surface of the ceramic body 110.

Here, since the basic structures of the first and second internal electrodes 1200 'and 1300' and the first to sixth external electrodes 141 to 146 are similar to those of the above-described embodiment, a detailed description thereof will be provided to avoid duplication. Omit.

Mounting Boards for Multilayer Ceramic Capacitors

14 is a perspective view illustrating a board in which the multilayer ceramic capacitor of FIG. 8 is mounted on a substrate, and FIG. 15 is a cross-sectional view of FIG. 14.

Referring to FIGS. 14 and 15, the substrate 200 of the multilayer ceramic capacitor according to the present embodiment may include a substrate 210 on which the multilayer ceramic capacitor is mounted, and first through second substrates spaced apart from each other on the upper surface of the substrate 210. Third electrode pads 221, 222, and 223 are included.

In this case, the multilayer ceramic capacitor may include the substrate 210 by the solder 230 while the first to third external electrodes 141 to 143 are positioned to contact the first to third electrode pads 221, 222, and 223, respectively. And can be electrically connected.

In FIG. 15, reference numeral 224 denotes a ground terminal, and reference numeral 225 denotes a power supply terminal.

Meanwhile, the present embodiment is illustrated and described in the form of mounting the multilayer ceramic capacitor of FIG. 8, but the present invention is not limited thereto. For example, the multilayer ceramic capacitor illustrated in FIGS. 1 and 5 may have a similar structure. The mounting substrate can be configured by mounting on a furnace substrate.

The present invention is not limited by the above-described embodiment and the accompanying drawings, but is intended to be limited by the appended claims.

Accordingly, various forms of substitution, modification, and alteration may be made by those skilled in the art without departing from the technical spirit of the present invention described in the claims, which are also within the scope of the present invention. something to do.

100, 100 ', 100 "; Multilayer Ceramic Capacitors
110; Ceramic body
111; Dielectric layer
112, 113; Cover layer
120, 1200, 1200 '; First and internal electrodes
121-124; 1-2-2 and 4-5 lead parts
130, 1300. 1300 '; Second internal electrode
131, 132; Third and sixth lead portions
141-146; First to sixth external electrodes
200; Mounting Board
210; Board
221, 222, 223; First to third electrode pads
230; Solder

Claims (10)

  1. A ceramic body in which a plurality of dielectric layers are stacked;
    An active layer including a plurality of first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween;
    First and second lead parts formed to extend from the first internal electrode to be exposed through the mounting surface of the ceramic body, and spaced apart from each other along a length direction of the ceramic body;
    A third lead part extending from the second internal electrode to be exposed through the mounting surface of the ceramic body and disposed between the first and second lead parts;
    It is disposed on the mounting surface of the ceramic body spaced apart from each other along the longitudinal direction of the ceramic body, connected to the first and second lead portions, respectively, the width is formed larger than the length of the first and second lead portions, respectively First and second external electrodes; And
    A third external electrode disposed between the first and second external electrodes on a mounting surface of the ceramic body, connected to the third lead part, and having a width greater than a length of the third lead part; Including;
    The first and second lead portions may have at least one side connected to the mounting surface of the ceramic body to be inclinedly extending from the first internal electrode to be inclined and to extend vertically from the inclined extension to the mounting surface of the ceramic body. Each includes a vertical extension,
    The third lead portion includes an inclined extension portion at least one side of which is connected to the mounting surface of the ceramic body inclinedly extending from the second internal electrode and a vertical extension portion extending vertically from the inclined extension portion toward the mounting surface of the ceramic body. Including,
    An area of the first space part provided between the vertical extension part of the first or second lead part and the vertical extension part of the third lead part is Sa, and the inclined extension part of the first or second lead part and the third lead part The multilayer ceramic capacitor having 0.383 ≦ Sa / Sb ≦ 12 when defining the area of the second space portion provided between the inclined extension portions as Sb.
  2. A ceramic body in which a plurality of dielectric layers are stacked;
    An active layer including a plurality of first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween;
    First and second lead parts formed to extend from the first internal electrode to be exposed through the mounting surface of the ceramic body, and spaced apart from each other along a length direction of the ceramic body;
    A third lead part extending from the second internal electrode to be exposed through the mounting surface of the ceramic body and disposed between the first and second lead parts;
    Is disposed on the mounting surface of the ceramic body spaced apart from each other along the longitudinal direction of the ceramic body, connected to the first and second lead portions, respectively, the width is greater than the length of the first and second lead portions, respectively First and second external electrodes;
    A third external electrode disposed between the first and second external electrodes on a mounting surface of the ceramic body, connected to the third lead part, and having a width greater than a length of the third lead part;
    Fourth and fifth lead parts formed to extend from the first internal electrode to be exposed through surfaces facing the mounting surface of the ceramic body, and spaced apart from each other along a length direction of the ceramic body;
    A sixth lead portion formed to extend from the second internal electrode to be exposed through a surface opposite to the mounting surface of the ceramic body and disposed between the fourth and fifth lead portions; And
    An insulating layer disposed on a surface of the ceramic body opposite to the mounting surface; Including,
    The side connecting the first and second lead portions to each other and the mounting surface of the ceramic body is made of a single curve,
    At least a portion of one side of the third lead portion is a multilayer ceramic capacitor.
  3. The method according to claim 1 or 2,
    The first and second internal electrodes are spaced apart from both surfaces of the ceramic body in the length direction of the multilayer ceramic capacitor.
  4. The method according to claim 1 or 2,
    The first to third external electrodes are formed to extend on portions of both surfaces of the ceramic body in the width direction, respectively.
  5. A ceramic body in which a plurality of dielectric layers are stacked;
    An active layer including a plurality of first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween;
    First and second lead parts formed to extend from the first internal electrode to be exposed through the mounting surface of the ceramic body, and spaced apart from each other along a length direction of the ceramic body;
    A third lead part extending from the second internal electrode to be exposed through the mounting surface of the ceramic body and disposed between the first and second lead parts;
    It is disposed on the mounting surface of the ceramic body spaced apart from each other along the longitudinal direction of the ceramic body, connected to the first and second lead portions, respectively, the width is formed larger than the length of the first and second lead portions, respectively First and second external electrodes;
    A third external electrode disposed between the first and second external electrodes on a mounting surface of the ceramic body, connected to the third lead part, and having a width greater than a length of the third lead part;
    Fourth and fifth lead parts formed to extend from the first internal electrode to be exposed through surfaces facing the mounting surface of the ceramic body, and spaced apart from each other along a length direction of the ceramic body;
    A sixth lead portion formed to extend from the second internal electrode to be exposed through a surface opposite to the mounting surface of the ceramic body and disposed between the fourth and fifth lead portions; And
    An insulating layer disposed on a surface of the ceramic body opposite to the mounting surface; Including,
    At least a portion of at least one side of the first to third lead portion is a multilayer ceramic capacitor.
  6. delete
  7. delete
  8. A ceramic body in which a plurality of dielectric layers are stacked;
    An active layer including a plurality of first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween;
    First and second lead parts formed to extend from the first internal electrode to be exposed through the mounting surface of the ceramic body, and spaced apart from each other along a length direction of the ceramic body;
    A third lead part extending from the second internal electrode to be exposed through the mounting surface of the ceramic body and disposed between the first and second lead parts;
    It is disposed on the mounting surface of the ceramic body spaced apart from each other along the longitudinal direction of the ceramic body, connected to the first and second lead portions, respectively, the width is formed larger than the length of the first and second lead portions, respectively First and second external electrodes; And
    A third external electrode disposed between the first and second external electrodes on a mounting surface of the ceramic body, connected to the third lead part, and having a width greater than a length of the third lead part; Including;
    The first and second lead portions may have at least one side connected to the mounting surface of the ceramic body to be inclinedly extending from the first internal electrode to be inclined and to extend vertically from the inclined extension to the mounting surface of the ceramic body. Each includes a vertical extension,
    The third lead portion includes an inclined extension portion at least one side of which is connected to the mounting surface of the ceramic body inclinedly extending from the second internal electrode and a vertical extension portion extending vertically from the inclined extension portion toward the mounting surface of the ceramic body. Including,
    An area of the first space part provided between the vertical extension part of the first or second lead part and the vertical extension part of the third lead part is Sa, and the vertical extension part of the first or second lead part and the third lead part The multilayer ceramic capacitor having 0.277 ≦ Sa / St ≦ 0.923 when the area of the second space portion provided between the inclined extensions is Sb and Sa + Sb is St.
  9. The method of claim 1,
    The multilayer ceramic capacitor having the inclined extension portion is curved.
  10. A substrate having first to third electrode pads thereon; And
    The multilayer ceramic capacitor of any one of claims 1, 2, 5, and 8, wherein first to third external electrodes are disposed on the first to third electrode pads, respectively. Mounting substrate of the multilayer ceramic capacitor comprising a.
KR1020140160582A 2013-10-31 2014-11-18 Multi-layered ceramic capacitor and board for mounting the same KR102018306B1 (en)

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CN104599842A (en) 2015-05-06
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