KR20150036785A - 발산광의 파장을 변환하는 균일한 필름-층 구조 및 이를 형성하는 방법 - Google Patents

발산광의 파장을 변환하는 균일한 필름-층 구조 및 이를 형성하는 방법 Download PDF

Info

Publication number
KR20150036785A
KR20150036785A KR1020157005281A KR20157005281A KR20150036785A KR 20150036785 A KR20150036785 A KR 20150036785A KR 1020157005281 A KR1020157005281 A KR 1020157005281A KR 20157005281 A KR20157005281 A KR 20157005281A KR 20150036785 A KR20150036785 A KR 20150036785A
Authority
KR
South Korea
Prior art keywords
phosphor
layer
particle layer
way
bonding
Prior art date
Application number
KR1020157005281A
Other languages
English (en)
Korean (ko)
Inventor
페이칭 링
Original Assignee
아크로룩스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아크로룩스 인코포레이티드 filed Critical 아크로룩스 인코포레이티드
Publication of KR20150036785A publication Critical patent/KR20150036785A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Luminescent Compositions (AREA)
KR1020157005281A 2009-12-26 2010-12-27 발산광의 파장을 변환하는 균일한 필름-층 구조 및 이를 형성하는 방법 KR20150036785A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US28479209P 2009-12-26 2009-12-26
US61/284,792 2009-12-26
PCT/US2010/062129 WO2011079325A1 (en) 2009-12-26 2010-12-27 Uniform film-layered structure that converts the wavelength of emitted light and method for forming the same

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020127016526A Division KR20120083936A (ko) 2009-12-26 2010-12-27 발산광의 파장을 변환하는 균일한 필름-층 구조 및 이를 형성하는 방법

Publications (1)

Publication Number Publication Date
KR20150036785A true KR20150036785A (ko) 2015-04-07

Family

ID=44196166

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020157005281A KR20150036785A (ko) 2009-12-26 2010-12-27 발산광의 파장을 변환하는 균일한 필름-층 구조 및 이를 형성하는 방법
KR1020127016526A KR20120083936A (ko) 2009-12-26 2010-12-27 발산광의 파장을 변환하는 균일한 필름-층 구조 및 이를 형성하는 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020127016526A KR20120083936A (ko) 2009-12-26 2010-12-27 발산광의 파장을 변환하는 균일한 필름-층 구조 및 이를 형성하는 방법

Country Status (8)

Country Link
EP (1) EP2517272A4 (zh)
JP (1) JP5639662B2 (zh)
KR (2) KR20150036785A (zh)
CN (1) CN102812570A (zh)
DE (1) DE112010004424T5 (zh)
GB (1) GB2488936B (zh)
TW (1) TWI452733B (zh)
WO (1) WO2011079325A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9480125B2 (en) * 2009-05-15 2016-10-25 Achrolux Inc Light-emitting structure and a method for fabricating the same
TWI459600B (zh) * 2012-07-06 2014-11-01 Lextar Electronics Corp 發光二極體封裝體及其製造方法
DE102012106949A1 (de) * 2012-07-30 2014-01-30 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauteils
CN103030097B (zh) * 2012-12-12 2015-06-17 中北大学 基于静电场自聚焦的圆片级低维纳米结构的制备方法
TWI499094B (zh) * 2013-01-25 2015-09-01 Achrolux Inc Ｌｅｄ封裝件及其製法
CN108417698B (zh) * 2016-07-06 2020-09-11 苏州星烁纳米科技有限公司 量子点封装体及其制备方法、发光装置和显示装置
JP6923820B2 (ja) * 2018-10-31 2021-08-25 日亜化学工業株式会社 パッケージの製造方法および発光装置の製造方法
CN113024251A (zh) * 2019-12-09 2021-06-25 上海航空电器有限公司 具有平凹形结构薄膜的高显色性激光照明用荧光陶瓷及其制备方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL135549C (zh) * 1966-04-22
US5019748A (en) * 1986-12-12 1991-05-28 E-Lite Technologies, Inc. Method for making an electroluminescent panel lamp as well as panel lamp produced thereby
CN1033902A (zh) * 1987-12-30 1989-07-12 依莱特技术公司 电致发光板型灯及其制造方法
JPH11233832A (ja) * 1998-02-17 1999-08-27 Nichia Chem Ind Ltd 発光ダイオードの形成方法
CN1147903C (zh) * 1998-05-22 2004-04-28 三星电管株式会社 用于显示装置的荧光层的制造方法
US6635987B1 (en) * 2000-09-26 2003-10-21 General Electric Company High power white LED lamp structure using unique phosphor application for LED lighting products
JP2002216622A (ja) * 2001-01-16 2002-08-02 Harison Toshiba Lighting Corp 蛍光ランプの製造方法
US6576488B2 (en) * 2001-06-11 2003-06-10 Lumileds Lighting U.S., Llc Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor
JP2003197977A (ja) * 2001-12-27 2003-07-11 Okaya Electric Ind Co Ltd 発光ダイオードの製造方法
US7224000B2 (en) * 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
US7585549B2 (en) * 2003-07-09 2009-09-08 Fry's Metals, Inc. Method of applying a pattern of particles to a substrate
JP4492378B2 (ja) * 2005-02-03 2010-06-30 豊田合成株式会社 発光装置およびその製造方法
US8563339B2 (en) * 2005-08-25 2013-10-22 Cree, Inc. System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices
US7344952B2 (en) * 2005-10-28 2008-03-18 Philips Lumileds Lighting Company, Llc Laminating encapsulant film containing phosphor over LEDs
JP2008060542A (ja) * 2006-08-03 2008-03-13 Toyoda Gosei Co Ltd 発光装置、発光装置の製造方法、及びこれを備えた光源装置
JP4835333B2 (ja) * 2006-09-05 2011-12-14 日亜化学工業株式会社 発光装置の形成方法
US9196799B2 (en) * 2007-01-22 2015-11-24 Cree, Inc. LED chips having fluorescent substrates with microholes and methods for fabricating
JP2008187089A (ja) * 2007-01-31 2008-08-14 Yuri Kagi Kofun Yugenkoshi 発光ダイオードのランプフード
US7999283B2 (en) * 2007-06-14 2011-08-16 Cree, Inc. Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes
KR100973238B1 (ko) * 2008-03-26 2010-07-30 서울반도체 주식회사 형광체 코팅방법 및 장치 그리고 형광체 코팅층을 포함하는ｌｅｄ
TWI508331B (zh) * 2008-11-13 2015-11-11 Maven Optronics Corp 用於形成螢光轉換型發光元件之薄膜螢光層的系統及方法、以及用於螢光轉換型發光元件之薄膜螢光層
US8247248B2 (en) * 2009-05-15 2012-08-21 Achrolux Inc. Methods and apparatus for forming uniform layers of phosphor material on an LED encapsulation structure
US9480125B2 (en) * 2009-05-15 2016-10-25 Achrolux Inc Light-emitting structure and a method for fabricating the same

Also Published As

Publication number Publication date
KR20120083936A (ko) 2012-07-26
TW201135982A (en) 2011-10-16
TWI452733B (zh) 2014-09-11
GB201210550D0 (en) 2012-07-25
WO2011079325A1 (en) 2011-06-30
JP2013516074A (ja) 2013-05-09
GB2488936A (en) 2012-09-12
EP2517272A4 (en) 2015-04-08
EP2517272A1 (en) 2012-10-31
GB2488936B (en) 2015-03-25
DE112010004424T5 (de) 2012-11-08
JP5639662B2 (ja) 2014-12-10
CN102812570A (zh) 2012-12-05

Similar Documents

Publication Publication Date Title
KR20150036785A (ko) 발산광의 파장을 변환하는 균일한 필름-층 구조 및 이를 형성하는 방법
KR101351337B1 (ko) Ｌｅｄ 봉지재 구조체에 균일한 형광 재료층을 형성하는 방법
TWI476959B (zh) 轉移均勻螢光層至一物件上之方法及所製得之發光結構
TWI442604B (zh) 發光結構及其製法
KR101404911B1 (ko) 발광 디바이스의 제조 방법
KR101658446B1 (ko) 형광체 수지 필름 제조방법 및 이에 의해 제조된 형광체 수지 필름

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
AMND Amendment
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment