KR20150036785A - Uniform film-layered structure that converts the wavelength of emitted light and method for forming the same - Google Patents

Abstract

A method for forming a uniform film-layer structure and a uniform film structure that converts the wavelength of divergent light. The method comprising: providing a first surface of the article; Forming at least one phosphor particle layer on the first surface, the phosphor particle layer having a phosphor powder and a bonding material; And forming a first bonding layer on the phosphor particle layer to bond the phosphor particle layer, wherein the phosphor powder occupies at least 75% of the phosphor particle layer volume.

Description

A uniform film-layer structure for converting the wavelength of a divergent light and a method for forming the uniform film-layer structure,

This application claims priority of U.S. Provisional Application No. 61 / 284,792, filed December 26, 2009, by Peiching Ling, the entire contents of which are incorporated herein by reference. This application is also related to U.S. Serial No. 12 / 587,290, filed October 5, 2009 by Peiching Ling, U.S. Application Serial No. 12 / 587,281, filed October 5, 2009 by Peiching Ling, and Peiching No. 12 / 587,291, filed October 5, 2009, by Ling, the entire contents of which are incorporated herein by reference.

The present invention relates to a method of forming a uniform film structure and more particularly to a uniform film-layer structure for converting the wavelength of light emitted by a light emitting diode and a method for forming the uniform film- .

The present invention generally relates to material handling and optical device technology. In particular, an embodiment of the present invention provides a system and method for forming a uniform layer of material that can be used as an optical device, such as a phosphor layer, for a lens in an LED device. As used herein, "phosphor" refers to any luminescent material that absorbs light of a wavelength and emits light of a different wavelength. In such use, the terms "phosphor" and "wavelength conversion material" are used interchangeably.

Phosphor materials have been widely used in LED packages for producing light of various colors (e.g., phosphor-converted green or red) or white light as a blue pump LED. A conventional method of depositing a phosphor material on a package assembly or a blue LED chip includes the following method:

Slurry method: The phosphor particles are dispersed in a silicone, epoxy or solvent-filled material to form a phosphor mixture, which can be applied by spray coating, dipping coating, dispensing, cup- in-cup or over-molding on the support structure.

Electrophoretic deposition (EPD): The phosphor particles are dispersed in an electrochemical solution and deposited on an LED wafer with a bias voltage across the LED wafer.

A problem with the conventional method is that the uniformity of the thickness varies on the LED surface or inside the LED package. Usually, the slurry method forms a layer of different thicknesses, which leads to color discrepancies and poor color uniformity of the LED-converted phosphor LEDs. Moreover, with this conventional method, it is more difficult to form a uniform layer of the phosphor layer on the uneven surface. This makes it very difficult to meet the needs of the lighting industry in a conventional manner.

One of the known problems of applying phosphor silicone to LED non-planar encapsulation surfaces for remote phosphors is the uniformity of the phosphor coating. Generally, the viscosity of the phosphor-silicon mixture is higher than the viscosity of the cured LED sealant, so that the curvature of the phosphor silicon is greater, e.g., the phosphor layer is thicker at the center than the outer edge. There is also the same problem to have a uniform phosphor coating on the LED secondary optical lens for remote phosphor applications.

Thus, how to provide a uniform film-layer structure that converts divergent light to improve the optical quality of LEDs is one of the most important issues in the art.

The present invention provides a method of manufacturing a high yield rate for depositing a uniform phosphor particle layer on an LED chip or a wide variety of LED encapsulation structures. In addition, some embodiments in accordance with the present invention may be applied to coat the phosphors on the LED secondary optics. As used herein, "phosphor" refers to any luminescent material that absorbs light of a wavelength and emits light of a different wavelength.

The present invention provides a method for forming a uniform film structure. The method comprising: providing a first surface of the article; Forming at least one phosphor particle layer on the first surface in such a manner that any phosphor particles are not completely separated from adjacent particles; And forming a first bonding layer on the phosphor particle layer to bind the phosphor particle layer.

In an embodiment of the present invention, the first binding layer is a binding particle layer.

The present invention further provides another method of forming a uniform film structure. Another method includes providing a first surface; Forming at least one phosphor particle layer comprising a phosphor powder and a bonding material on the first surface; And bonding the phosphor particles.

 In embodiments in which the phosphor particles comprise a phosphor powder and a bonding material, the phosphor particles are formed by encapsulating a phosphor powder with a binder material or a mixture of phosphor powder and bonding material, Heating the bonding material to bond the particles, wherein the phosphor powder accounts for at least 75% of the phosphor particle layer volume to which the phosphor particles are bonded. The method may further include forming a first bonding layer on the phosphor particle layer and heating the bonding material and the first bonding layer to bond the phosphor particle layer.

In an embodiment of the invention, the first surface of the article is provided by a second bonding layer that is pointy. In another embodiment of the present invention, the first bonding layer is a moisture-resistant layer such as parylene.

In an embodiment of the present invention, the method includes transferring a bound layer of phosphor particles onto a second surface of the other article, or higher, or a layer of cured phosphor particles on a second surface of the other article, And transferring the image data. The second surface may be the surface of an LED lens, a secondary optics, an LED package, an LED chip or an LED wafer.

In an embodiment of the present invention, the first bonding layer may have a surface that does not contact the phosphor particle layer having a lens profile. Further, in embodiments where the phosphor particles comprise a phosphor powder and a bonding material, if the first bonding layer is formed on the phosphor particle layer, the first bonding layer is not in contact with the phosphor particle layer and may have a surface with a lens profile have.

The present invention further provides a uniform film-layer structure that converts the wavelength of the divergent light. The structure includes a first bonding layer; And a phosphor particle layer formed and bound on the first bonding layer, wherein the phosphor particles comprise a phosphor powder and a bonding material, wherein the phosphor powder accounts for at least 75% of the phosphor particle layer volume.

The first bonding layer is a moisture-resistant layer such as parylene.

In an embodiment of the present invention, the structure further comprises a carrier connected to the phosphor particle layer through the first coupling layer, wherein the coupling layer is located between the carrier and the phosphor particle layer, and the carrier comprises an LED lens, LED package, LED chip or LED wafer.

In an embodiment of the present invention, the first bonding layer does not contact the phosphor particle layer and has a surface with a lens profile.

The phosphors are usually dispersed in a silicone resin or liquid and then deposited on a package or LED surface such that the phosphor particles are not evenly dispersed in the silicone resin or liquid such that the silicone resin or liquid in which the phosphor particles are not uniformly dispersed The phosphor particles can not be controlled to be uniformly dispersed after being coated on the LED or the package, which results in different independence that causes poor color uniformity of the converted-phosphor LED to the LED and inconsistency of the color point of the LED product, Compared to the conventional method of causing the formation of a complex of some phosphor particles in the particle layer, embodiments of the invention form a substantially uniform film structure on the surface of the LED package surface or on the surface of the secondary optics or on the surface of the LED die or LED surface The present invention also provides a system and method for performing the above- You can connect, you have one or many steps less.

(1) forming a uniform phosphor particle layer on the first surface

(2) minimizing particle movement on the first surface during the curing process; And

(3) transferring the phosphor layer to a desired surface such as an LED package surface or an LED surface. The movement may be performed in a molding process that applies an isotropic force to the encapsulating surface to remove a shear force that may cause distortion of the particle distribution formed on the surface of the press, have.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be more fully understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
Figures 1A and 1B are conceptual diagrams of a method for forming a uniform film structure of a first embodiment in accordance with the present invention;
1C is a conceptual view of a first bonding layer which is a bonded particle layer;
2 is a conceptual diagram of a method for forming a uniform film structure of a second embodiment according to the present invention;
Figures 3a and 3b are a conceptual diagram of the structure and a method for forming a uniform film structure of a third embodiment according to the present invention;
Figure 4 illustrates a method of transferring a phosphor particle layer onto or onto a preferred second surface;
5A to 5C are conceptual diagrams showing a phosphor particle layer transferred by a mold;
6A to 6C are conceptual diagrams showing a phosphor particle layer transferred on various surfaces;
7 is a conceptual view of a first surface arrangement for mass production;
8A and 8B are cross-sectional views of an apparatus and method for applying isotropic pressure between two surfaces; And
Figures 9a-9d illustrate a phosphor particle packing structure according to an embodiment of the present invention as compared to the phosphor distribution formed by the slurry method.

The embodiments described below are provided to illustrate the technical content of the present invention, and these and other advantages and effects can be best understood by those skilled in the art after reading the description of the specification. Furthermore, the invention may be practiced or embodied by other different embodiments. The details of the disclosure may be based on different aspects and applications, and various modifications and variations may be devised without departing from the spirit of the invention.

1A and 1B are conceptual diagrams of a method for forming a uniform film structure of the first embodiment according to the present invention. The method comprises: forming at least one phosphor particle layer (10) having phosphor particles constituted by a phosphor powder on a first surface (101) of a mold; And forming a first bonding layer (12) on the phosphor particle layer (10) to bond the phosphor particle layer (10).

Phosphors are used to convert or change the wavelength of light, for example an LED-based light source. Common phosphors for this purpose include YAG (yttrium aluminum garnet) materials, TAG (terbium aluminum garnet) materials, ZnSeS + materials, and silicon aluminum oxynitride (SiAION) materials (e.g., a-SiAION). On the other hand, according to an embodiment of the present invention, any material that converts or changes the wavelength of the incident light can be used as the phosphor material. As used herein, the term "phosphor" refers to any material capable of converting or changing the wavelength of light to other wavelengths and includes combinations or mixtures of different wavelength conversion or wavelength changing materials. In the first embodiment, the phosphor particles represent the powder-type phosphor itself.

The step of forming a substantially uniform phosphor particle layer 10 is important to achieve high quality light conversion. In a first embodiment, the electrostatic process is employed for deposition of a substantially uniform phosphor layer on a first surface 101, such as a mold, as shown in FIG. 1A. Details of the electrostatic process for forming a uniform phosphor particle layer can be found in U.S. Application No. 12 / 587,290, which is incorporated herein by reference. For example, a phosphor particle layer 10 is formed by moving a first surface 101 that is adjacent to and attracted to a phosphor particle to form an electrostatic charge on the first surface 101 and form a phosphor particle layer 10. In one embodiment, the electrostatic process is performed in a non-liquid environment, which is different from the conventional electrochemical charging process of a slurry environment. In some embodiments of the method, the deposition process does not require and maintains uniform distribution of the bonding material in the form of a liquid suspension and the particle powder, and does not suffer from this problem. Instead, in some embodiments, the particle powder and bonding material are separately formed or applied on the first surface of the mold.

Therefore, the electrostatic process applied in the present invention can accurately control the thickness and the packing density of the phosphor particle layer. In one embodiment, the coating process is a hemispherical surface, a different concave or convex surface, or it is repeatable on the same surface to produce a single or multiple uniform particles containing a layer of light-emitting material on a flat surface. As a result, a particle layer of high packing density is formed and uniformly distributed on the surface of the member or the article. The phosphor particles that are attracted in a single layer may comprise different types of phosphor powders, i. E., Phosphor powders of different colors. In addition, different types of phosphor powders can be formed on different layers. The process may be repeatable for a multi-layer of phosphor particles. The phosphor particle layer may comprise phosphor particles and other filled particles.

As shown in Fig. 1B, after the phosphor particle layer 10 is formed, the phosphor particle layer 10 is bound by the first bonding layer 12 to minimize the movement of the phosphor particles.

The first bonding layer 12 may be a curable material such as silicon, epoxy, glass, softener or any suitable material for LED encapsulation. In some implementations, a thin film, such as a dielectric layer, may be deposited over the phosphor particle layer. For example, a dielectric layer, such as a SiO2 layer or parylene, may be deposited using CVD, PVD, electron beam deposition or other deposition methods. In one embodiment, the deposited layer coats the interior region of the phosphor particle layer, such as a cavity between the phosphor particles. In other embodiments, the first bonding layer is formed on the phosphor particle layer to provide sufficient bonding force during subsequent processing.

One of the advantages of using dielectric films to bond particles is that the refractive index of the deposited film can be adjusted to match the refractive index to maximize light extraction. Since dielectric material films are highly porous, they are preferably deposited at low process temperatures. The porous dielectric film is sufficient to secure the particles to eliminate particle movement during the subsequent process and also allows the adhesive material used to adhere the particles to the LED encapsulation to penetrate the cavities in the particle powder.

Also, in other embodiments, the first bonding layer 12 may have a high thermal conductivity that allows heat dissipation efficiency from the phosphor particle layer.

In other embodiments, the first bonding layer 12 may have a strong moisture resistance to prevent degradation of the phosphors or LEDs during humid and / or hot operating conditions.

In another embodiment of the first bonding layer 12, the first bonding layer 12 is a bonding particle layer 12a, as shown in Figure 1C.

Bonding particles such as silicon or epoxy compounds or thermosetting plastics or glass can be attracted onto the upper surface of the layer of phosphor particles 10. The attraction of the bonding particles can be used to form the phosphor particle layer described above for the electrostatic process. The first surface 101 may be selectively heated to a predetermined temperature during the dragging process of the bonding material. This causes the bonding particles 12a to soften as soon as the phosphor particle layer 10 is contacted on the first surface 101. [

After this process, the bonding particles 12a and the phosphor particle layer 10 on the first surface of the mold can be cured at a predetermined temperature to allow the phosphor particles to bond with each other.

2 is a conceptual diagram of a method for forming a uniform film structure of a second embodiment according to the present invention.

The second embodiment differs from the first embodiment only in that the first surface 101 of the mold in the second embodiment is provided by the second bonding layer 14 which is pointed. Particularly, the phosphor particle layer 10 is formed on the surface (i.e., the first surface) of the second bonding layer 14 and positioned between the first bonding layer 12 and the second bonding layer 14. The second bonding layer 14 may have the same material and the same material as the method described above.

Figures 3a and 3b are conceptual diagrams of a method and a structure for forming a uniform film structure of a third embodiment according to the present invention. The method comprises: forming at least one phosphor particle layer comprising a phosphor powder and a bonding material on a first surface (101); And bonding the phosphor particles.

In a third embodiment, pre-coated phosphor particles are prepared. The phosphor particles are a mixture of the phosphor powder 10a and the bonding material 10b or are coated with a polymer bonding material 10b such as silicone, epoxy, thermosetting or thermoplastics. The phosphor particles can be coated with a polymeric binder material in a rolling suspension and the solvent is dried to form a powder. Alternatively, the bonding material coating process may be carried out in a similar manner to forming a polymer molding compound with a combination of additives and polymers obtained by mixing necessary physical and chemical properties. In this embodiment, the phosphor particles can be treated as a filler material. The phosphor-polymer mixture may be prepared in liquid, rubber, sheet, solid or powder form depending on the technique of the selected process. One of the advantages of the pre-coated phosphor particles is the ease of manufacture for the phosphor deposition process either on the LED encapsulation structure or on the LED chip surface, which is also achievable with the techniques of conventional molding processes.

The phosphor particle layer comprises: forming an electrostatic charge on the first surface (101); And moving the first surface 101 so as to be adjacent to and pre-coated with the pre-coated phosphor particles to form the phosphor particle layer. The pre-coated phosphor particles can be charged with an electrostatic or non-charging charge and attracted onto a first surface 101 that can be charged electrostatically. The step of heating to soften the bonding material may bond the phosphor particles. The phosphor powder accounts for 75% or more of the volume of the phosphor particle layer to which the phosphor particles are bonded. After the phosphor particle layer has a predetermined thickness, the first surface 11 is heated to a predetermined temperature to cure the bonding material. The phosphor particles are mutually bonded and can effectively remove particle movement during the subsequent process.

In a third embodiment, the first bonding layer 12 is further formed on the phosphor particle layer as shown in Fig. 3B. In an embodiment of the present invention, the first binding layer is parylene. Next, the bonding material 10b and the first bonding layer 12 are heated to bind the phosphor particle layer 10 '.

Similarly, the coating process can be hemispherical, it can be a concave or convex surface of a different type, or it is repeatable to produce single or multiple uniform particles on the same surface containing a layer of light-emitting material on a flat surface. As a result, a particle layer with a high packing density is formed and evenly distributed on the surface. The phosphor particles that are attracted to a single layer may comprise different kinds of phosphor powders, i. E., Phosphor powders of different colors. In addition, different types of phosphor powders may be formed on different layers of different colors. The process may be repeatable in a multi-layer of phosphor particles. The phosphor particle layer may comprise phosphor particles and other filled particles.

The present invention further provides a uniform film-layer structure that converts the wavelength of the divergent light. A uniform film-layer structure includes a first bonding layer (12) and a phosphor particle layer (10 ') formed and bound on the first bonding layer, wherein the phosphor particles comprise a phosphor powder and a bonding material, The phosphor powder occupies 75% or more of the phosphor particle layer volume.

Referring to Figures 4 and 5, a method of forming a uniform film structure of a fourth embodiment according to the present invention is shown. The method transfers the phosphor particle layer onto or above the preferred second surface of the article or device. In a fourth embodiment, a cured phosphor particle layer of the first or second embodiment, or a phosphor particle layer coupled with the phosphor particles in the third embodiment, is transported on or above the second surface of the article or other device.

As shown in Figure 4, the first surface 101 is disposed on the second surface 102 with an appropriate adhesive layer 5 under a predetermined pressure to form a phosphor layer on the second surface 102 Under pressure, it hardens at a predetermined temperature. As shown in Figure 4, the second surface 102 is the surface of the LED lens, which is a lens that transports the phosphor particle layer onto the second surface 102, which is collectively referred to as the transport lens. Also, the second surface 102 can be the surface of a secondary optics, an LED package, an LED die, or an LED wafer. The second surface 102 and / or the other surface of the LED lens may be coated with a moisture resistant film such as parylene.

When the phosphor particle layer is formed on the basis of the third embodiment, the adhesive layer 5 may be the first bonding layer 12 of FIG. Therefore, the first bonding layer 12 needs to be cured only during the transfer step.

The uniform film-layer structure obtained by the method of converting the wavelength of the divergent light further includes the carrier of the second surface 102. In an embodiment of the invention, the carrier is an LED lens, a secondary optics, an LED package, an LED die or an LED wafer. The carrier is connected to the phosphor particle layer 10 through the first bonding layer 12 (or the bonding layer 5). Thus, the first bonding layer 12 is located between the carrier and the phosphor particle layer 10. In an embodiment of the present invention, the carrier is an LED lens and the LED lens is coated with a moisture resistant film such as parylene.

Referring to FIG. 5, another method of transporting a phosphor particle layer onto a second surface 102 of another device or member is shown. The first surface 101 may be one of the surfaces of the first mold 51 as shown in Figs. 5A to 5C. The molding chamber formed when the first mold 51 is fastened to the second mold 52 is made of a heat-curable material 6 such as silicon, epoxy or thermosetting plastic or glass which can be melted and reformed at an elevated temperature ). ≪ / RTI > The first mold 51 and the second mold 52 may be formed of a metal or a non-conductive material.

The first mold 51 with the phosphor particle layer 10 (or 10 ') is pressed against the second mold 52, so that the phosphor particle layer 10 is inserted into the chamber having the shape of the lens. During the compression process, the phosphor particle layer 10 is still fixed on the surface of the surface of the first mold 51, and thus the distribution of the phosphor particles during the compression process is not disturbed. The mold is heated to harden the heat-curable material 6, and the first mold 51 and the second mold 52 are separated as shown in Fig. 5C. After separation, the phosphor particle layer 10 is formed on an encapsulating surface such as a lens. The lens shown in Fig. 5C is one side of the transfer lens.

If the phosphor particle layer 10 is formed based on the first embodiment, then the steps of Figures 1B and 5A-5C may be integrated to complete the first coupling layer to obtain a first coupling layer having a lens profile. In short, the first bonding layer has a surface which does not contact the phosphor particle layer 10 having a lens profile.

If the phosphor particle layer 10 is formed based on the third embodiment, the heat-curable material 6 can be directly connected on the phosphor particle layer 10 to function as a first bonding layer. Thus, the surface 6a of the first bonding layer, which does not contact the phosphor particle layer 10, can also have a lens profile. In a uniform film-layer structure that converts the wavelength of the divergent light, the surface of the first coupling layer that does not contact the phosphor particle layer 10 has a lens profile.

The description of the above process may be applied to various types of surfaces having suitable counter presses, such as the inner surface of the cover or lens shown in Fig. 6A; A convex surface such as the outer surface of the cover or lens shown in Fig. 6B; And to apply the phosphor particle layer to the flat surface or plate shown in Figure 6C.

As shown in FIG. 7, in the fifth embodiment, the first surface 101 may be configured as an array for mass production. The head portion surface of the first surface 101 may be shaped according to the present invention with a contour corresponding to the phosphor layer on the encapsulation surface.

In a sixth embodiment, a method is provided in which an isotropic pressure is applied between two surfaces. This method can be used to transfer a phosphor layer on a curved surface, such as the bound phosphor particle layer 10, as shown in FIG. 1, onto another curved encapsulation surface, providing a normal force between the two surfaces without shear force.

In the embodiment shown in FIG. 8A, an inflatable material 81 is deposited inside the curved surface layer of the stator 80. The outer surface of the head portion 82 is a flexible material, such as silicon, which is inflatable along the inflatable material 81 inside the stator 80. As the temperature rises, an isotropic force is exerted on the curved surface layer when the volume of the inflatable material 81 is inflated. In some implementations, the phosphor particle layer 10 is formed, for example, on a curved surface layer using one of the methods described above. The curved surface layer is positioned adjacent to a receiving surface such as, for example, a lens or an encapsulating material. The temperature of the inflatable material is raised and causes the phosphor layer to be pressed against the receiving surface. The pressure between the two surfaces causes the phosphor layer to be transported to the receiving surface.

According to an implementation example, the distance between two surfaces is selectable. In one embodiment, the two surfaces can be in contact. In another embodiment, there may be a space between the two surfaces. The space may be 200 microns or larger at a few microns. In either case, the inflatable material 81 is configured to cause a substantially uniform pressure between the two surfaces. Embodiments of the inflatable material 81 include an x-expansel, other suitable materials or combinations of materials that expand at elevated temperatures.

In one embodiment, the phosphor layer 10 is located on a convex surface that can be pushed by the inflatable material 81. In another embodiment, the phosphor particle layer 10 is located in a concave surface as shown in Figure 8B, which can be pushed inward by the layer of inflatable material deposited on the outside of the phosphor particle layer 10. [

Applying a normal force to the surface is important to eliminate the shear force that can cause distortion of the particle distribution formed on the surface of the compactor during attachment of the particles to the encapsulation surface.

In one implementation shown in FIG. 8A, the presser head portion 82 is comprised of an inflatable material such as silicone. The expansion vessel is inserted inside the compression head unit 82. The expansion vessel may be filled with a liquid or a liquid with X-Pansel or X-Pansel together. As described above, the phosphor particles are formed as a uniform layer on the head portion region. In one embodiment, the fiber-induced blue LED may be installed inside the press head to monitor in-situ the amount of phosphor powder attracted onto the press head for the desired color point.

During the transfer of the phosphor particles, the head portion of the device with the phosphor particles undergoes pressure against the encapsulation surface as the device head portion is expanded by heating or by injecting air into the head portion. As the head portion is expanded, the press head portion provides an isotropic force that is perpendicular to the encapsulation surface and removes particle movement during the curing process.

A similar method of providing an isotropic force for transferring the phosphor particle layer to another surface can be applied to various surfaces having the design of a suitable inflation head portion, such as the head portion design of the concave surface, as shown in FIG. 8B.

Referring to Figures 9a-9d, there is shown a phosphor particle packing structure according to an embodiment of the present invention as compared to the phosphor distribution formed by the slurry method. In the packing structure of the phosphor particles deposited according to an embodiment of the present invention as shown in FIG. 9A, the phosphor particles 18 are highly packed on the surface. The phosphor powder accounts for at least 75% of the phosphor particle layer volume. It is difficult to obtain phosphor particles by a slurry method in which the phosphor particles are distributed in the phosphor mixture, the phosphor-silicon mixture, as shown in Fig. 9B. As shown in Fig. 9A, a phosphor packed at a high density can enhance the heat radiation generated from the light conversion in the phosphor particles. The heat generated can be extinguished through interconnected particles, instead of passing silicon between particles in a slurry process requiring a solvent filler material to form a phosphor mixture. In addition, enhanced heat dissipation can increase conversion efficiency and improve optical performance degradation from heat.

For configurations containing multi-phosphor layers of different optical properties according to embodiments of the present invention, different phosphors may be stacked in a layered structure, as shown in Figure 9c, and phosphor particles 19 may be deposited in a layered structure, And is separated from the particles 18. In the slurry method, different phosphor particles are distributed in the silicon-phosphorus-silicon mixture as shown in FIG. 9D.

The layered structure of Figure 9C according to an embodiment of the present invention can improve color quality by optimizing the placement of different characteristics of the phosphor particles by minimizing light re-absorption between different optical properties of the phosphor particles, Efficiency is also enhanced.

The foregoing description of the detailed implementation is provided for the purpose of describing the functions and features of the present invention and not for limiting the technical scope of the present invention. It should be understood by those skilled in the art that all changes and modifications that come within the spirit and principles described herein are intended to be embraced within the scope of the appended claims.

Claims (26)

In the method for forming a uniform film structure,
Providing a first surface of the article;
Forming at least one phosphor particle layer on the first surface in such a way that any phosphor particles are not completely separated from adjacent particles; And
Forming a first bonding layer on the phosphor particle layer to bond the phosphor particle layer
/ RTI >
Way.
The method according to claim 1,
Said first surface being provided by a second bonding layer that is pointy,
Way.
The method according to claim 1,
Wherein the first bonding layer is a bonding particle layer,
Way.
The method of claim 3,
The binding particle layer is attracted by electrostatic charge,
Way.
The method according to claim 1,
Wherein the phosphor particle layer comprises:
Forming an electrostatic charge on the first surface; And
Moving the first surface to attract the phosphor particles adjacent to the phosphor particles to form the phosphor particle layer
Lt; / RTI >
Way.
The method according to claim 1,
Wherein the first bonding layer is a parylene,
Way.
The method according to claim 1,
Wherein the phosphor particles comprise different kinds of phosphor powders.
Way.
The method according to claim 1,
Further comprising transferring a bound layer of the phosphor particles onto a second surface of another article,
Way.
The method according to claim 1,
Wherein the first coupling layer has a surface with a lens profile and is not in contact with the phosphor particle layer,
Way.
In a method for forming a uniform film structure,
Providing a first surface;
Forming at least one phosphor particle layer on the first surface, the phosphor particle layer including a bonding material and a phosphor powder; And
The step of bonding the phosphor particles
/ RTI >
Way.
11. The method of claim 10,
The phosphor particles are formed by encapsulating the phosphor powder with the phosphor powder or the mixture of the phosphor powder and the binding material;
The bonding material being heated to bond with the phosphor particles; And
Wherein the phosphor powder occupies 75% or more of the volume of the phosphor particle layer to which the phosphor particles are bonded,
Way.
11. The method of claim 10,
Said first surface being provided by a second bonding layer that is pointy,
Way.
11. The method of claim 10,
Forming a first bonding layer on the phosphor particle layer; And
Heating the first bonding layer and the bonding material to bond the phosphor particle layer
≪ / RTI >
Way.
14. The method of claim 13,
Wherein the first bonding layer has a surface that does not contact the phosphor particle layer having a lens profile,
Way.
14. The method of claim 13,
Wherein the first bonding layer is a parylene moiety,
Way.
11. The method of claim 10,
Wherein the phosphor particle layer comprises:
Forming an electrostatic charge on the first surface; And
Moving the first surface to attract the phosphor particles adjacent to the phosphor particles to form the phosphor particle layer
Lt; / RTI >
Way.
11. The method of claim 10,
Wherein the phosphor particles comprise different kinds of phosphor powders.
Way.
11. The method of claim 10,
Further comprising transferring the phosphor particle layer wherein the phosphor particles are bonded on a second surface,
Way.
19. The method of claim 18,
The second surface
LED lens, secondary optics, LED package, LED die or LED wafer,
Way.
20. The method of claim 19,
Wherein the second surface of the LED lens is covered by a moisture-
Way.
In a uniform film-layer structure that converts the wavelength of the divergent light,
The uniform film-
A first bonding layer formed on a first surface of the article; And
And a phosphor particle layer formed and bound on the first bonding layer,
Wherein the phosphor particles comprise a phosphor powder and a binder material, wherein the phosphor powder comprises at least 75% of the volume of the phosphor particle layer and wherein the phosphor particles are arranged in such a way that neither phosphor particles are completely separated from adjacent particles ,
A uniform film-layer structure.
22. The method of claim 21,
Wherein the first bonding layer is a parylene moiety,
A uniform film-layer structure.
22. The method of claim 21,
Wherein the phosphor particles comprise different kinds of phosphor powders.
A uniform film-layer structure.
22. The method of claim 21,
The article is used to connect the first bonding layer to the phosphor particle layer,
Wherein the bonding layer is located between the article and the phosphor particle layer and the article is an LED lens, a secondary optics, an LED package, an LED die or an LED wafer,
A uniform film-layer structure.
22. The method of claim 21,
The article is an LED lens,
The LED lens is covered with a moisture-resistant film.
A uniform film-layer structure.
22. The method of claim 21,
Wherein the first bonding layer has a surface with a lens profile, wherein the first bonding layer does not contact the phosphor particle layer,
A uniform film-layer structure.

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