GB2488936B - Uniform film-layered structure that converts the wavelengh of emitted light and method for forming the same - Google Patents

Uniform film-layered structure that converts the wavelengh of emitted light and method for forming the same

Info

Publication number
GB2488936B
GB2488936B GB1210550.8A GB201210550A GB2488936B GB 2488936 B GB2488936 B GB 2488936B GB 201210550 A GB201210550 A GB 201210550A GB 2488936 B GB2488936 B GB 2488936B
Authority
GB
United Kingdom
Prior art keywords
wavelengh
converts
forming
same
emitted light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB1210550.8A
Other languages
English (en)
Other versions
GB201210550D0 (en
GB2488936A (en
Inventor
Peiching Ling
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Achrolux Inc
Original Assignee
Achrolux Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Achrolux Inc filed Critical Achrolux Inc
Publication of GB201210550D0 publication Critical patent/GB201210550D0/en
Publication of GB2488936A publication Critical patent/GB2488936A/en
Application granted granted Critical
Publication of GB2488936B publication Critical patent/GB2488936B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Laminated Bodies (AREA)
  • Luminescent Compositions (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
GB1210550.8A 2009-12-26 2010-12-27 Uniform film-layered structure that converts the wavelengh of emitted light and method for forming the same Expired - Fee Related GB2488936B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28479209P 2009-12-26 2009-12-26
PCT/US2010/062129 WO2011079325A1 (en) 2009-12-26 2010-12-27 Uniform film-layered structure that converts the wavelength of emitted light and method for forming the same

Publications (3)

Publication Number Publication Date
GB201210550D0 GB201210550D0 (en) 2012-07-25
GB2488936A GB2488936A (en) 2012-09-12
GB2488936B true GB2488936B (en) 2015-03-25

Family

ID=44196166

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1210550.8A Expired - Fee Related GB2488936B (en) 2009-12-26 2010-12-27 Uniform film-layered structure that converts the wavelengh of emitted light and method for forming the same

Country Status (8)

Country Link
EP (1) EP2517272A4 (zh)
JP (1) JP5639662B2 (zh)
KR (2) KR20120083936A (zh)
CN (1) CN102812570A (zh)
DE (1) DE112010004424T5 (zh)
GB (1) GB2488936B (zh)
TW (1) TWI452733B (zh)
WO (1) WO2011079325A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112011101580T5 (de) * 2010-06-17 2013-03-14 Achrolux Inc. Lichtemittierende Struktur und Verfahren zum fertigen derselben
TWI459600B (zh) * 2012-07-06 2014-11-01 Lextar Electronics Corp 發光二極體封裝體及其製造方法
DE102012106949A1 (de) * 2012-07-30 2014-01-30 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauteils
CN103030097B (zh) * 2012-12-12 2015-06-17 中北大学 基于静电场自聚焦的圆片级低维纳米结构的制备方法
TWI499094B (zh) * 2013-01-25 2015-09-01 Achrolux Inc Ｌｅｄ封裝件及其製法
CN106129228A (zh) * 2016-07-06 2016-11-16 苏州星烁纳米科技有限公司 量子点封装体及其制备方法、发光装置和显示装置
JP6923820B2 (ja) * 2018-10-31 2021-08-25 日亜化学工業株式会社 パッケージの製造方法および発光装置の製造方法
CN113024251A (zh) * 2019-12-09 2021-06-25 上海航空电器有限公司 具有平凹形结构薄膜的高显色性激光照明用荧光陶瓷及其制备方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1188657A (en) * 1966-04-22 1970-04-22 Ransburg Electro Coating Corp Improvements in and relating to Methods Of and Apparatus For Electrostatic Coating
US5019748A (en) * 1986-12-12 1991-05-28 E-Lite Technologies, Inc. Method for making an electroluminescent panel lamp as well as panel lamp produced thereby
US20020187571A1 (en) * 2001-06-11 2002-12-12 Collins William David Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor structure
US6635987B1 (en) * 2000-09-26 2003-10-21 General Electric Company High power white LED lamp structure using unique phosphor application for LED lighting products
US20050106329A1 (en) * 2003-07-09 2005-05-19 Fry's Metals, Inc. Deposition and patterning process
WO2007024331A1 (en) * 2005-08-25 2007-03-01 Cree, Inc. Close loop electrophoretic deposition of phosphors on semiconductor substrates
US20080157103A1 (en) * 2005-10-28 2008-07-03 Philips Lumileds Lighting Company, Llc Laminating Encapsulant Film Containing Phosphor Over LEDs
EP2105976A2 (en) * 2008-03-26 2009-09-30 Seoul Semiconductor Co., Ltd. Method and apparatus for coating phosphor, and light emitting diode comprising phosphor coating layer
WO2010057023A2 (en) * 2008-11-13 2010-05-20 Maven Optronics Corp. System and method for forming a thin-film phosphor layer for phosphor-converted light emitting devices
WO2010132160A1 (en) * 2009-05-15 2010-11-18 Peiching Ling Methods and apparatus for forming uniform particle layers of phosphor material on a surface
WO2011159987A1 (en) * 2010-06-17 2011-12-22 Achrolux Inc. Light-emitting structure and a method for fabricating the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1033902A (zh) * 1987-12-30 1989-07-12 依莱特技术公司 电致发光板型灯及其制造方法
JPH11233832A (ja) * 1998-02-17 1999-08-27 Nichia Chem Ind Ltd 発光ダイオードの形成方法
JPH11329235A (ja) * 1998-05-22 1999-11-30 Samsung Display Devices Co Ltd 表示素子用蛍光膜の製造方法
JP2002216622A (ja) * 2001-01-16 2002-08-02 Harison Toshiba Lighting Corp 蛍光ランプの製造方法
JP2003197977A (ja) * 2001-12-27 2003-07-11 Okaya Electric Ind Co Ltd 発光ダイオードの製造方法
US7224000B2 (en) * 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
JP4492378B2 (ja) * 2005-02-03 2010-06-30 豊田合成株式会社 発光装置およびその製造方法
JP2008060542A (ja) * 2006-08-03 2008-03-13 Toyoda Gosei Co Ltd 発光装置、発光装置の製造方法、及びこれを備えた光源装置
JP4835333B2 (ja) * 2006-09-05 2011-12-14 日亜化学工業株式会社 発光装置の形成方法
US9196799B2 (en) * 2007-01-22 2015-11-24 Cree, Inc. LED chips having fluorescent substrates with microholes and methods for fabricating
JP2008187089A (ja) * 2007-01-31 2008-08-14 Yuri Kagi Kofun Yugenkoshi 発光ダイオードのランプフード
US7999283B2 (en) * 2007-06-14 2011-08-16 Cree, Inc. Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1188657A (en) * 1966-04-22 1970-04-22 Ransburg Electro Coating Corp Improvements in and relating to Methods Of and Apparatus For Electrostatic Coating
US5019748A (en) * 1986-12-12 1991-05-28 E-Lite Technologies, Inc. Method for making an electroluminescent panel lamp as well as panel lamp produced thereby
US6635987B1 (en) * 2000-09-26 2003-10-21 General Electric Company High power white LED lamp structure using unique phosphor application for LED lighting products
US20020187571A1 (en) * 2001-06-11 2002-12-12 Collins William David Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor structure
US20050106329A1 (en) * 2003-07-09 2005-05-19 Fry's Metals, Inc. Deposition and patterning process
WO2007024331A1 (en) * 2005-08-25 2007-03-01 Cree, Inc. Close loop electrophoretic deposition of phosphors on semiconductor substrates
US20080157103A1 (en) * 2005-10-28 2008-07-03 Philips Lumileds Lighting Company, Llc Laminating Encapsulant Film Containing Phosphor Over LEDs
EP2105976A2 (en) * 2008-03-26 2009-09-30 Seoul Semiconductor Co., Ltd. Method and apparatus for coating phosphor, and light emitting diode comprising phosphor coating layer
WO2010057023A2 (en) * 2008-11-13 2010-05-20 Maven Optronics Corp. System and method for forming a thin-film phosphor layer for phosphor-converted light emitting devices
WO2010132160A1 (en) * 2009-05-15 2010-11-18 Peiching Ling Methods and apparatus for forming uniform particle layers of phosphor material on a surface
EP2419222A1 (en) * 2009-05-15 2012-02-22 Peiching Ling Methods and apparatus for forming uniform particle layers of phosphor material on a surface
WO2011159987A1 (en) * 2010-06-17 2011-12-22 Achrolux Inc. Light-emitting structure and a method for fabricating the same

Also Published As

Publication number Publication date
JP5639662B2 (ja) 2014-12-10
GB201210550D0 (en) 2012-07-25
EP2517272A1 (en) 2012-10-31
WO2011079325A1 (en) 2011-06-30
KR20150036785A (ko) 2015-04-07
GB2488936A (en) 2012-09-12
KR20120083936A (ko) 2012-07-26
DE112010004424T5 (de) 2012-11-08
CN102812570A (zh) 2012-12-05
JP2013516074A (ja) 2013-05-09
TW201135982A (en) 2011-10-16
EP2517272A4 (en) 2015-04-08
TWI452733B (zh) 2014-09-11

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20161227