KR20150032771A

KR20150032771A - Cutting device and cutting method

Info

Publication number: KR20150032771A
Application number: KR20140108225A
Authority: KR
Inventors: 쇼이치 가타오카; 마사유키 야마모토
Original assignee: 토와 가부시기가이샤
Priority date: 2013-09-20
Filing date: 2014-08-20
Publication date: 2015-03-30
Also published as: JP6218526B2; JP2015061016A; CN104465358A; TW201526189A; TWI541967B; KR101651002B1; CN104465358B

Abstract

The object of the present invention is to suppress the thermal deformation during the period from the time of alignment to the time of cutting by cooling the material to be cut at a set temperature that is the same as the number of cuts in advance.
In a twin-cut table type cutting apparatus, cool air is supplied to the loader from a cool air generating mechanism. Cooling air flows in the cooling passage formed in the cooling section of the loader to cool the sealed substrate adhered to the fixed section. The sealed substrate is cooled in advance so as to be equal to the set temperature of the cutting water so that the sealed substrate is shrunk so as to be in a state of being cut. Since alignment is performed in the contracted state, it is possible to accurately cut along the cut line so that the position of the cut line does not deviate from the alignment time to the cut time.

Description

CUTTING DEVICE AND CUTTING METHOD [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting apparatus and a cutting method for producing a plurality of pieces of electronic parts that are cut into pieces to be cut.

A substrate made of a printed board or a lead frame or the like is virtually divided into a plurality of regions in a lattice shape, and chip-like elements are mounted on the divided regions, and the entire substrate is resin-sealed. This sealed substrate, which is the object to be cut, is cut by a cutting apparatus using a rotary blade or the like, and is divided into individual regions by cutting to be electronic parts.

Conventionally, a predetermined region of the sealed substrate is cut by a cutting apparatus having a cutting mechanism such as a rotary blade. For example, a BGA (Ball Grid Array Package) product is cut in the following manner. First, at the substrate arrangement position, the sealed substrate is placed and adsorbed on the cutting table with the surface (ball surface) on which the connecting balls are present as the opposite surface of the resin sealed surface of the sealed substrate. Next, alignment (alignment) is performed with respect to the ball surface of the sealed substrate. At this time, an alignment mark formed on the ball surface is detected using an image pickup mechanism. The positional relationship between the alignment mark and a virtual cut line (boundary line) for dividing a plurality of regions is determined in advance as a design value. Therefore, the position of the virtual cutting line is set based on the positional relationship between them. Next, the cutting table for sucking the sealed substrate is moved to the substrate cutting position. At the substrate cutting position, the cutting water is injected at the cutting point of the sealed substrate. In this state, using the cutting mechanism, the sealed substrate is cut along the cutting line. And the sealed electronic component is cut by cutting the finished electronic component.

When the cutting of one sheet of the sealed substrate is repeated by using the cutting device, the frictional heat generated by the rotary blade mounted on the cutting mechanism, the thermal gradient caused by the temperature difference between the sealed substrate and the cutting water, Due to various factors such as heat conduction, the sealed substrate may undergo thermal deformation due to temperature changes after alignment. Therefore, the position of the cutting line set on the sealed substrate may deviate from the alignment point and immediately before cutting. If the cutting is performed while the position of the cutting line is shifted, there is a possibility that the electronic component is damaged or deteriorated.

A cutting method for measuring a positional deviation of a cutting line and correcting the position of the cutting line by using a cutting device, wherein a distance between the reference line and the blade detecting means is set to D, And the distance d from the blade detection means to the cutting blade is set to be (1) in a state in which the predetermined position is aligned with the reference line, And cutting out the plate-like material by correcting the position of the cutting blade to (dD) with respect to the interval (D) between the reference line and the blade detecting means (see, for example, Patent Document 1 Paragraph [0011]).

[Patent Document 1] Japanese Unexamined Patent Application Publication No. 2009-206362

However, in the above cutting method, the following problems arise. According to the method described above, the positional deviation of the cutting blade in the cutting apparatus is corrected, but the thermal deformation in accordance with the temperature change of the plate-like object to be cut is not considered in the correction. When the temperature of the cutting water is intentionally lowered at room temperature (atmospheric temperature), or when the temperature of the cutting water is lowered at room temperature, the object to be cut or the cutting table is cooled by the cutting water at the time of cutting , The material to be cut is also thermally deformed (heat shrinkable). Further, during the alignment and during the movement, the object to be cut is thermally deformed (heat shrunk) by conducting heat to the cooled cutting table. In the above-described method, after the planned cutting position is set by alignment, the amount of deviation of the planned cutting position due to thermal deformation of the cut material is not detected. Therefore, if the displacement amount due to thermal deformation of the workpiece to be cut is large, there is a possibility that the workpiece is cut in a state in which the positional deviation of the cutting planned position occurs.

In addition, in recent years, miniaturization of electronic parts is progressing more and more, and in order to increase the production efficiency of electronic parts, there is a strong demand for increasing the number of electronic parts that are made into a single board by enlarging the size of the board. Thus, the time required for cutting one substrate is also increased. In order to solve this problem, it is required to improve the productivity in the cutting apparatus. As one countermeasure thereto, a so-called twin cut table type cutting apparatus in which two cutting tables are provided has been widely used.

In the twin cut table type cutting apparatus, a waiting time may occur in the other cutting table until the cutting of the piece to be cut is completed in one cutting table. When the length of time required for cutting one workpiece in one cutting table is increased, the waiting time becomes longer in the other cutting table. During this waiting time, the object to be cut may be subjected to thermal deformation (heat shrinkage) under the influence of cutting water or the like. Therefore, there is a fear that the positional deviation of the cutting line set at the time of alignment may occur at the cutting line just before cutting. If cutting is performed in a state where the positional deviation occurs, there is a fear that breakage or deterioration of the electronic component may occur.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a cutting apparatus capable of cutting a workpiece before alignment, And a cutting method and a cutting method which are capable of suppressing thermal deformation during the period from the cutting to the cutting.

In order to solve the above-described problems,

A transport mechanism for transporting the material to be cut,

A stage on which the workpiece is placed,

An aligning mechanism for aligning and setting a position of a cutting line of the object to be cut disposed on the stage,

A cutting mechanism for cutting the workpiece along the cutting line using a rotary blade,

And a jetting mechanism for jetting a cutting water at a predetermined temperature to a working point at which the rotary blade and the workpiece are in contact with each other,

And a first cooling mechanism provided in at least one of the transport mechanism and the stage to cool the object to be cut,

The object to be cut is cooled to the predetermined temperature by the first cooling mechanism,

And the position of the cutting line in the workpiece cooled to the predetermined temperature is set by the alignment mechanism.

Further, the cutting apparatus according to the present invention is the above-described cutting apparatus,

A plurality of stages are provided,

Wherein the to-be-cut object conveyed by the conveying mechanism is cooled while the to-be-cut object disposed on one stage of the plurality of stages is being cut, or the to-be- And is cooled.

The object to be cut is cooled by a cooling medium flowing in a passage formed in at least one of the transport mechanism and the stage.

The object to be cut is cooled by ejecting the cooling medium to the material to be cut arranged on at least one of the conveying mechanism and the stage.

And the first cooling mechanism has a Peltier element.

And a second cooling mechanism for cooling the workpiece before it is delivered to the transport mechanism.

The object to be cut is characterized in that the chip of the electronic component mounted on the circuit board is a sealed substrate which is resin-sealed with a cured resin.

The object to be cut is a semiconductor wafer on which an electronic circuit is assembled.

In order to solve the above-mentioned problems, the cutting method according to the present invention is characterized in that,

A step of delivering the material to be cut to a transporting mechanism,

A step of transporting the object to be cut to the stage using the above transport mechanism,

Disposing the object to be cut on the stage;

A step of positioning and setting a position of a cutting line of the object to be cut arranged on the stage,

Cutting the object to be cut disposed on the stage along a cutting line using a rotary blade;

And a step of spraying a cutting water having a predetermined temperature at a work point at which the workpiece and the rotary blade are in contact with each other,

And cooling the material to be cut up to the predetermined temperature for at least a part of the period up to the setting step,

Wherein the setting step sets the position of the cut line with respect to the object to be cut cooled to the predetermined temperature.

The cutting method according to the present invention is characterized in that, in the above cutting method,

A plurality of stages are provided,

Wherein in the cutting step, the to-be-cut material disposed on one of the plurality of stages is cut,

In the cooling step, the object to be cut, which is different from the object to be cut, is cooled while the object to be cut arranged on one of the stages is being cut.

And in the cooling step, the object to be cut is cooled by causing a cooling medium to flow in a path formed in at least one of the transport mechanism and the stage.

In the cooling step, the object to be cut is cooled by jetting a cooling medium onto the object to be cut disposed on at least one of the transport mechanism and the stage.

In the cooling step, the object to be cut is cooled using a Peltier element provided on at least one of the transport mechanism and the stage.

And in the cooling step, the workpiece is cooled in a step before the workpiece is delivered to the transporting mechanism.

According to the present invention, the object to be cut is cooled in advance at the same set temperature as the number of cuts until the time of alignment. Thus, it is possible to suppress the thermal deformation of the material to be cut from the position of alignment to the time of cutting. Therefore, since the position of the cut line of the object to be cut is prevented from being displaced from the position of alignment to the time of cutting, the cut can be accurately cut along the cut line.

1 is a schematic plan view showing a twin cut table type cutting apparatus according to the present embodiment.
Fig. 2 is an outline view showing the outline of the sealed substrate. Fig. 2 (a) is a plan view seen from a ball side, Fig. 2 (b) is a front view, and Fig. 2 (c) is a side view.
3 is an outline time table showing the operation of each cutting table according to the present embodiment in a twin cut table type cutting apparatus.
4 is a schematic configuration diagram showing the configurations of the transport mechanism and the cool air generation mechanism according to the embodiment.

In the present invention, in the twin cut table type cutting apparatus, cool air is supplied to the loader from the cool air generating mechanism. Cooling air flows in the cooling passage formed in the cooling section of the loader to cool the sealed substrate adhered to the fixed section. The sealed substrate is cooled in advance so as to be equal to the set temperature of the cutting water so that the sealed substrate is shrunk so as to be in a state of being cut. Since alignment is performed in a contracted state, it is possible to accurately cut along the cut line so that the position of the cut line does not deviate.

Referring to Figs. 1 to 4, a cutting apparatus, which is an embodiment of the present invention, will be described. Is drawn schematically by omitting or exaggerating appropriately in order to facilitate understanding of the drawings in the present application document. The same components are denoted by the same reference numerals, and the description thereof will be appropriately omitted. In this embodiment, a case where the temperature of the cutting water is intentionally lowered (cooled) with respect to the room temperature (atmosphere temperature) will be described.

1 is a schematic plan view showing a cutting apparatus 1 of the twin cut table type according to the present embodiment. The cutting apparatus (1) separates the sealed substrate (3) corresponding to the object to be cut into a plurality of electronic parts. The cutting apparatus 1 includes a receiving unit A, a feeding unit B, a cutting unit C, a cleaning unit D, an inspection unit E, and a receiving unit F, As a component (module), respectively.

Each of the units A to F as components is detachable and exchangeable with respect to each of the other components, and is prepared in advance so as to have a plurality of different specifications according to the anticipated requirement specifications. The cutting apparatus 1 including the units A to F is constituted.

The substrate loading unit (2) is provided in the receiving unit (A). In the substrate loading part 2, the sealed substrate 3 is received from the resin sealing device which is a device of the previous step. The sealed substrate 3 (e.g., a BGA-type sealed substrate) is disposed on the substrate holder 2 with the ball surface 3a facing upward.

The sealed substrate 3 includes a circuit board such as a lead frame or a printed circuit board, a chip mounted on a plurality of lattice-shaped areas on the circuit board and including a passive element or an active element, And a sealing resin.

The feed unit B is provided with a pre-stage 4 and a loader 5. The loader 5 is movable in the X direction and the Z direction. Further, the loader 5 may be configured to be rotatable in the &thetas; direction. After the sealing substrate 3 is positioned in the pre-stage 4, it is sucked by the loader 5 and transported to the cutting unit C.

In the present embodiment, the supply unit B is provided with a compressed air supply mechanism 6 and a cool air generating mechanism 7 for converting compressed air into cool air as a cooling medium. Compressed air is supplied from the compressed air supply mechanism 6 to the cold air generating mechanism 7. [ In the cold air generating mechanism 7, the supplied compressed air is converted into a cold air and an air warmer. The loader 5 is constituted by a fixing unit for fixing the sealed substrate 3 by suction and a cooling unit for cooling the sealed substrate 3. Cool air is supplied from the cool air generating mechanism 7 to the cooling section of the loader 5, and the sealed substrate 3 sucked by the fixed section is cooled by the cool air. The sealed substrate 3 may be fixed by a method such as a clamp in the loader 5. [ Furthermore, a cooling bath BT may be provided as another cooling mechanism (second cooling mechanism) for cooling the sealed substrate 3. Details will be described later.

The cutting unit C is provided with two cutting tables 8A and 8B. The sealing substrate 3 is fixed to the cutting tables 8A and 8B by using an adsorption, a clamp, an adhesive tape or the like. The two cutting tables 8A and 8B are movable in the Y direction in the drawings by a moving mechanism (not shown), and are rotatable in the? Direction. Cutting stages 9A and 9B are attached on the cutting tables 8A and 8B. The cutting unit C is constituted by a substrate arranging portion 10, a substrate cutting portion 11, and a substrate cleaning portion 12.

An alignment camera (13) is provided on the substrate arrangement part (10). The camera 13 is movable in the X direction independently of the substrate placement section 10. [ In the sealed substrate 3, an alignment mark formed on the ball surface 3a is detected by the camera 13 in the substrate arrangement section 10, and the position of the virtual cut line is set by the control section CTL (described later) .

The substrate cutting section 11 is provided with two spindle units 14A and 14B as a cutting mechanism. The two spindle units 14A and 14B are independently movable in the X and Z directions. Rotary blades 15A and 15B are provided on the two spindle units 14A and 14B, respectively. These rotary blades 15A and 15B rotate in the plane along the Y direction to cut the sealed substrate 3, respectively. Therefore, in the present embodiment, two cutting mechanisms (spindle units 14A and 14B) are provided on the substrate cutting portion 11. [

The spindle units 14A and 14B are provided with cutting and receiving nozzles 16A and 16B for spraying cutting water to suppress frictional heat generated by rotating blades 15A and 15B rotating at high speed. The cutting water is sprayed toward the working point at which the rotary blades 15A and 15B cut the finished substrate 3. On the spindle unit 14B side is further provided a cuff check camera 17 for checking the position, width, and the presence or absence of chipping of the cut groove (cuff) cut by the rotary blade 15B . The camera 17 picks up a cutting line cut by the rotary blade 15B. The camera 17 is installed on one of the two spindle units 14A and 14B. Alternatively, the camera 17 may be provided on both of the two spindle units 14A and 14B.

The substrate cleaning section 12 is provided with a cleaning mechanism (not shown) that cleans the sealed surface of the aggregate 18 composed of a plurality of individual electronic components P cut from the sealed substrate 3.

An unloader 19 for transporting the aggregate 18 of the electronic parts P with the ball surface cleaned to the cleaning unit D is provided in the substrate placement unit 10. [ The unloader 19 is movable in the X and Z directions. Further, the unloader 19 may be configured to be rotatable in the &thetas; direction.

The cleaning unit D is provided with a cleaning mechanism 20 for cleaning the surface (mold surface 3b) on the sealing resin side of the individualized electronic parts P. The cleaning mechanism 20 is provided with a cleaning roller 21 which is rotatable about the Y direction. Above the cleaning mechanism 20 for cleaning the mold surface 3b is disposed an aggregate 18 composed of a plurality of individual electronic components P cut from the encapsulated substrate 3. In the aggregate 18, the ball surface is attracted and fixed by the unloader 19. That is, the aggregate 18 is fixed to the unloader 19 with the mold surface facing downward. The mold surface of the aggregate 18 is cleaned by the cleaning roller 21 by reciprocating the unloader 19 in the X direction.

An inspection stage (22) is provided in the inspection unit (E). The aggregate 18 composed of a plurality of individual electronic components P cut from the sealed substrate 3 is collectively transported to the inspection stage 22 by the unloader 19. [ The inspection stage 22 is movable in the X direction and is configured to be able to rotate about the Y direction as an axis. The mold 18 and the ball face are inspected by the camera 23 for inspection, and a good product and a defective product are selected by the assembly 18 composed of a plurality of individualized electronic components P (for example, a BGA product). The assembled body 18 of the inspected electronic component P is delivered to the index table 24 in the form of a checker flag pattern or a lattice pattern. The inspection unit E is provided with a plurality of conveyance mechanisms 25 for conveying the electronic parts P arranged on the index table 24 to the tray.

The receiving unit F is provided with a good tray 26 for accommodating good articles and a tray for rejecting bad articles (not shown) for receiving defective articles. The electronic component P selected by the conveying mechanism 25 as a good product and a defective product is accommodated in each tray. In the figure, two good-quality trays 26 are provided, but three or more good-quality trays 26 may be provided.

In the cutting apparatus 1, the movement of the sealed substrate 3 (movement of the transport mechanism and the like), the positioning of the cut line on the sealed substrate 3 (operation of the alignment mechanism and the like) All processing such as cutting of the sealed substrate 3, cleaning of the ball surface 3a and the mold surface 3b by the cleaning mechanism, inspection and storage of the separated electronic parts P, And is controlled by a control unit (CTL) In this embodiment, the case where all processing is controlled by the control unit CTL provided in the receiving unit A is shown. The present invention is not limited to this, and a control unit CTL may be provided in another unit. It is also possible to control the process from cutting to cleaning, and the process from inspection to acceptance by providing respective control units. In this embodiment, the sealing substrate 3 is an example of a workpiece to be cut, the cutting stages 9A and 9B are examples of a stage, the cooling passage 38 is an example of a passage, The spindle units 14A and 14B are an example of the cutting mechanism and the cutting water receiving nozzles 16A and 16B are used as the cutting mechanism The loader 5, the cutting stages 9A and 9B and the cooling section 36 are examples of the first cooling mechanism and the cooling bath BT is an example of the second cooling mechanism.

Hereinafter, cooling of the cutting water will be described. As shown in Fig. 1, in the substrate arranging portion 10, the sealed substrate 3 is aligned under an ambient temperature (for example, 20 to 25 DEG C) atmosphere. On the other hand, in the substrate cutting portion 11, the cutting water is jetted from the cutting water receiving nozzles 16A and 16B toward the sealed substrate 3 at the processing point to suppress the frictional heat of the rotary blades 15A and 15B. Depending on the cutting conditions, the cutting water may be cooled to a predetermined temperature (set temperature) which is lower than the room temperature (atmosphere temperature), for example, 10 to 15 占 폚. In order to increase the cooling effect, the cutting water may be cooled to a much lower temperature.

A cooling nozzle (not shown) for spraying cooling water from the both sides of the rotary blades 15A and 15B to the working point may be provided separately from the cutting water receiving nozzles 16A and 16B. A plurality of cooling nozzles may be provided on both sides of the rotary blades 15A and 15B to enhance the cooling effect. The cooling water is also cooled to the same set temperature as the cutting water.

The sealed substrate 3, the cutting tables 8A and 8B, and the cutting stages 9A and 9B are cooled by the cutting water and the cooling water, respectively. The sealed substrate 3, the cutting tables 8A and 8B, and the cutting stages 9A and 9B are respectively cooled and contracted at room temperature depending on the materials constituting them.

2 is an outline view showing the outline of the sealed substrate 3. Fig. 2 (a) is a plan view of the sealed substrate 3 seen from the ball surface side, Fig. 2 (b) is a front view, and Fig. 2 (c) is a side view. The sealed substrate 3 is composed of a substrate portion 27 and a sealing resin portion 28 made of a hardened resin. The sealed substrate 3 has a ball surface 3a and a mold surface 3b. On the ball surface 3a of the sealed substrate 3, a plurality of alignment marks 29 (marks shown by + in the figure) are formed along the long side direction and the short side direction. The number of the alignment marks 29 formed along the long side direction and the short side direction is determined corresponding to the size of the sealed substrate 3 and the number of the electronic parts P to be separated.

A plurality of coordinate positions of the alignment marks 29 are detected by the alignment camera 13 (see Fig. 1) provided on the substrate placement section 10, whereby the alignment marks 29, The position of the cutting line 30 is set based on the positional relationship of the cutting line 30 (the boundary line). As the cutting line 30, a cutting line 30S along the short side direction of the sealed substrate 3 and a cutting line 30L along the long side direction are respectively set. The area 31 surrounded by the cutting line 30S and the cutting line 30L corresponds to the electronic part P, respectively. The number of alignment marks 29 detected for setting the cutting lines 30S and 30L can be arbitrarily determined depending on the product.

3 is an outline time table for explaining the operation of the cutting tables 8A and 8B in the cutting unit C in the cutting apparatus 1 of the twin cut table type according to the present embodiment shown in Fig. In FIG. 3, reference numerals LD, PS, and WD denote load, PA, pre-alignment, cut, WD, wash and dry UL, unload WT, (Wait). S 1, S 2, ..., and S 5 are steps from the rod LD to the unloading (UL) with respect to each of the sealed substrates 3 as one target.

A series of steps of cutting the sealed substrate 3 in the respective cutting tables 8A and 8B will be described with reference to Figs. 1 to 3. Fig. The operation up to the dismounting of the sealed substrate 3 from the cutting table 8A to separation into a plurality of electronic parts P will be described.

1, the substrate 3 is placed on the cutting stage 9A attached to the cutting table 8A with the ball surface 3a facing upward 3 LD1).

Next, using the alignment camera 13, the alignment mark 29 formed on the ball surface 3a of the sealed substrate 3 is detected in the long-side direction and the short-side direction, and the coordinate position is measured. The number of detection of the alignment mark 29 is arbitrarily determined according to the size of the sealed substrate 3 and the number of the electronic parts P. [ Based on the coordinate positions of the detected alignment mark 29, the positions of virtual cutting lines 30S and 30L for cutting the sealed substrate 3 are set in the short side direction and the long side direction, respectively (see PA1 ).

Next, the cutting table 8A is moved from the substrate placing portion 10 to the substrate cutting portion 11. Next, In the substrate cutting section 11, the sealed substrate 3 is cut by rotary blades 15A and 15B provided on the two spindle units 14A and 14B. First, the cutting table 8A is moved toward the spindle units 14A and 14B (+ Y in Fig. 1) with the long side direction of the sealed substrate 3 being arranged parallel to the X direction Direction). The sealed substrate 3 is moved along the cutting lines 30S (see FIG. 2) along the short side direction of the sealed substrate 3 by advancing the sealed substrate 3 toward the rotary blades 15A and 15B Cut it. At the time of cutting, cutting water is sprayed from the cutting accommodating nozzles 16A and 16B to the processing point at which the rotary blades 15A and 15B and the sealed substrate 3 are in contact with each other. In the substrate cutting section 11, the positions of the cutting table 8A (see Fig. 1) and the like indicated by chain double-dashed lines indicate the positions after cutting is performed.

Next, the cutting table 8A is rotated 90 degrees, and the sealed substrate 3 is cut along each of the cutting lines 30L (see Fig. 2) along the long side direction of the sealed substrate 3. Then, In this manner, the encapsulated substrate 3 disposed on the cutting table 8A is cut along each of the cutting lines 30S and each of the cutting lines 30L to form the respective regions 31. Then, This region 31 becomes an individualized electronic component P (CT1 in Fig. 3).

In the above-described operation, first, the sealed substrate 3 is cut along each of the cutting lines 30S along the short side direction of the sealed substrate 3, and then sealed along each cutting line 30L along the long side direction The completed substrate 3 was cut. The sealing substrate 3 is cut along each cutting line 30L along the long side direction and then the sealing substrate 3 is cut along each cutting line 30S along the short side direction It may be cut.

Next, the cutting table 8A is moved from the substrate cutting portion 11 to the substrate cleaning portion 12 in a state in which the aggregates 18 composed of a plurality of individualized electronic components P are collectively adsorbed. In the substrate cleaning section 12, the ball surface of the electronic component P is cleaned and dried (WD1 in FIG. 3). Hereinafter, the ball surface of the electronic part P is referred to as the ball surface 3a which is the same as that of the sealed substrate 3.

After the cleaning and drying of the ball surface 3a of the electronic component P is completed, the cutting table 8A is moved from the substrate cleaning part 12 to the substrate placement part 10. [ The process up to this step is carried out with the surface 3a of the mold surface 3b facing upward in a state in which the mold surface 3b is attracted to the cutting stage 9A.

Next, the unloader 19 is lowered at the substrate placing section 10 to collectively collect the ball faces 3a of the electronic parts P arranged on the cutting stage 9A. The aggregate 18 of the electronic components P sucked by the unloader 19 is conveyed to the cleaning unit D (UL1 in Fig. 3).

The operation described so far is carried out in such a manner that the first sealed substrate 3 arranged on the cutting table 8A with the ball surface 3a facing upward is separated into the next cleaning unit D, To the time when the process is completed. That is, by performing the steps from the load LD1 to the prealignment PA1 to the cutout CT1 to the cleaning and drying WD1 to the unloading UL1, the sealed substrate 3 is held by the plurality of electronic parts P, And is collectively conveyed to the next step.

After the load LD1 of the cutting table 8A is completed, the load LD2, the prealignment PA2, the cut CT2, the cleaning and drying WD2, and the unloading (UL2) are started. However, the cutting table 8B can not proceed to that step until the processing in each step of the cutting table 8A is completed. 3, after the completion of the prealignment PA2 in the cutting table 8B, the waiting time until the cutting CT1 in S1 of the cutting table 8A is completed WT2). In other words, immediately after the cutting (CT1) of the cutting table 8A is completed, the cutting (CT2) starts on the cutting table 8B. As described above, until the cutting (CT) is completed in one cutting table, the waiting time (WT) occurs in the other cutting table.

3, the cutting table 8A is returned from the substrate cleaning section 12 to the substrate placement section 10, and the unloader 19 is moved to the position where the electronic parts P ). &Lt; / RTI > The cutting table 8A and the cutting stage 9A returned to the substrate placement section 10 maintain substantially the same temperature as the state where they are cooled by the cutting water and the cooling water. As shown in S3 of Fig. 3, a new sealed substrate 3 is placed on the cutting table 8A (LD3) in the substrate arranging portion 10. The sealed substrate 3 placed on the cutting table 8A is subjected to pre-alignment (PA3) under an ambient temperature atmosphere. However, since the other cutting table 8B is cutting (CT2), the cutting table 8A waits for the cutting (CT3) (WT3) until the cutting (CT2) is completed.

According to the conventional technique, during the waiting time WT3, the sealed substrate 3 is cooled (cooled) by thermal conduction to the cutting table 8A and the cutting stage 9A in the cooled state at the cutting CT1 And is contracted. The position of the actual cutting lines 30S and 30L deviates from the positions of the cutting lines 30S and 30L set at the time of the prealignment PA3. The displacement amount of the cutting lines 30S and 30L becomes larger as the waiting time WT3 becomes longer.

According to the conventional technique, for example, in the embodiment of Fig. 3, the load LD is 10 seconds, the prealignment PA 30 seconds, the cutting CT 120 seconds, the cleaning & drying WD 30 seconds, Unload (UL) requires 10 seconds. Then, in the process of S3, the waiting time WT3 becomes 40 seconds, and the sealed substrate 3 is cooled and shrunk therebetween. In recent years, the number of the sealed substrates 3 is increased, the number of electronic parts P is increased, and the length of the entire cutting lines is increased, so that the waiting time WT also tends to become longer. Therefore, the amount of shrinkage of the sealed substrate 3 shrinks, and the amount of displacement of the cutting lines 30S and 30L also increases.

On the other hand, according to the present invention, the sealed substrate 3 is pre-cooled so that the displacement of the cutting line does not occur during the waiting time WT3 in the step S3. That is, before the seal-completed substrate 3 is pre-aligned, the sealed substrate 3 is cooled to the set temperature (T ° C) of the cutting water. By doing so, it is possible to always maintain the temperature of the sealed substrate 3 at the same set temperature as the number of cuts, from the time of the prealignment to the time of cutting. Therefore, after the pre-alignment, the substrate is not thermally deformed in accordance with the temperature change, and the position of the cutting line set on the sealed substrate 3 does not occur during the period from the time of prealignment to the time of cutting. Further, when the temperature of the cutting water differs from the temperature of the cooling water, the sealed substrate 3 is cooled to a lower set temperature than either of them.

Thus, in the cutting tables 8A and 8B, the shrinkage after the pre-alignment can be prevented by always cooling the sealed substrate 3 to the set temperature of the cutting water before the pre-alignment. Therefore, the positions of the cutting lines 30S and 30L set on the sealed substrate 3 can be accurately cut along the cutting lines 30S and 30L, since they do not deviate from the time of prealignment to the time of cutting .

The temperature at which the sealed substrate 3 is cooled may not be the temperature which is strictly equal to the set temperature T ° C of the cutting water. The shrinkage amount of the sealed substrate 3 due to the temperature difference alpha DEG is smaller than the shrinkage amount of the cutting lines 30S and 30L due to the temperature difference alpha C (for example, (T + The amount of shift should not be substantially affected. The permissible value of the displacement of the cutting lines 30S and 30L may be determined in advance according to the dimensions and characteristics of the electronic components.

4 is a schematic configuration diagram showing the configurations of the transport mechanism and the cool air generation mechanism according to the embodiment. A mechanism for cooling the sealed substrate 3 will be described in detail with reference to Fig. The compressed air is supplied from the compressed air supply mechanism 6 to the compressed air supply port 32 of the cool air generating mechanism 7. [ The cold generating mechanism 7 shown here is called a so-called vortex tube. The compressed air is converted into warm air and cold air by finally moving the inside of the cool air generating mechanism 7 in a complicated manner. The warm air is discharged from the warm air discharge port 33, and the cool air is discharged from the cold air discharge port 34 and supplied to the loader 5 as a transport mechanism. The cool air is supplied to the loader 5 from the cool air generating mechanism 7 via the movable pipe.

The loader 5 is composed of a fixing portion 35 for holding and fixing the sealed substrate 3 and a cooling portion 36 for cooling the sealed substrate 3. The cooling section 36 is provided with a cooling passage 38 through which the cool air supplied from the cooler generating mechanism 7 flows, . The cooling passage 38 is formed in the cooling section 36 as a rectangular or mesh passage and the entire surface of the sealed substrate 3 adsorbed by the fixing section 35 and the fixing section 35 is uniformly cooled . The loader 5 can move in the X direction and the Z direction as shown in Fig. 1 by adsorbing the sealed substrate 3. Further, the loader 5 may be configured to be rotatable in the &thetas; direction as necessary.

In the loader 5, the sealed substrate 3 adsorbed by the fixing portion 35 is cooled by the cooling air flowing in the cooling passage 38 formed in the cooling portion 36. [ The temperature of the cold air is controlled by the controller CTL (see Fig. 1) so that the temperature of the sealed substrate 3 becomes the same as the set temperature of the cutting water. The sealed substrate 3 is cooled to a set temperature that is the same as that of the cutting water, so that it shrinks at a normal temperature. In this way, the sealed substrate 3 is transported to the cutting tables 8A and 8B in a state where the substrate 5 is cooled by the loader 5 to a set temperature that is the same as the number of cuts and contracted. Therefore, the cooling section 36 of the loader 5 functions as the first cooling mechanism.

In the substrate placement position 10, the sealed substrate 3 is pre-aligned in a cooled and contracted state. Therefore, in the sealed substrate 3, the positions of the cutting lines 30S and 30L are set in a state in which they are cooled and contracted. By doing this, even if a waiting time occurs until the sealed substrate 3 is cut, the cooling by the loader 5 and the cutting tables 8A and 8B cooled by the cutting water or the cooling water, By the heat conduction to the stages 9A and 9B, the sealed substrate 3 is maintained at the same set temperature as the number of cuts. Therefore, thermal fluctuation is eliminated during the period from the point of time of free alignment to the point of cutting, and no thermal deformation occurs. In this way, since the positions of the cutting lines 30S and 30L set on the sealed substrate 3 do not deviate from the time of prealignment to the time of cutting, it is possible to accurately cut along the cutting lines 30S and 30L .

As the first cooling mechanism for cooling the sealed substrate 3, the sealed substrate 3 may be cooled using a Peltier element using the Peltier effect. The sealed substrate 3 may be cooled through the loader 5 by directly supplying a cooling medium such as water or air to the cooling portion 38 of the loader 5 without using a vortex tube. Further, the cooling medium may be jetted onto the hermetically sealed substrate 3 in the loader 5.

In addition, a mechanism for cooling the sealed substrate 3 may be added to the cutting tables 8A and 8B or the cutting stages 9A and 9B. In this case also, the sealed substrate 3 can be cooled by using a vortex tube, a Peltier element, a cooling medium, or the like in the same manner as the loader 5. [ In the cutting stages 9A and 9B, the cooling medium may be sprayed onto the hermetically sealed substrate 3.

In addition, a cooling bath BT (see Fig. 1) can be provided in the cutting apparatus 1. Fig. Cooling water set at the same set temperature as the number of cuts is supplied to the cooling bath BT. The sealed substrate 3 is cooled to the same set temperature as the number of cuts by immersing the sealed substrate 3 in the cooling bath BT before disposing the sealed substrate 3 on the pre-stage 4. The sealed substrate 3 cooled in the cooling bath BT may be transferred to the cutting tables 8A and 8B with the configuration in which the loader 5 can be moved in the Y direction as well. The cooling water supplied to the cooling bath BT can be recovered by cutting water jetted from the cutting nozzles 16A and 16B and reused. A cooling plate having the same configuration as the cooling section 36 of the loader 5 may be used instead of the cooling tank BT.

As described so far, in the cutting apparatus 1 of the twin cut table type, waiting time is generated in the other cutting mechanism until one cutting mechanism completes cutting. According to the conventional technique, during this waiting time, the sealed substrate 3 is cooled by the heat conduction to the cutting tables 8A and 8B and the cutting stages 9A and 9B cooled by the cutting water or the cooling water. By this influence, the sealed substrate 3 is shrunk due to thermal deformation during the waiting time. Therefore, the positions of the virtual cutting lines 30S and 30L of the sealed substrate 3 set at the time of prealignment are shifted.

According to the present invention, the cool air supplied from the cool air generating mechanism 7 flows in the cooling passage 38 formed in the cooling section 36 of the loader 5, whereby the fixing section 35 and the fixing section 35 The substrate 3 is cooled. By the loader 5, the sealed substrate 3 is cooled and shrunk before pre-alignment. By cooling the sealed substrate 3 so as to be equal to the set temperature of the cutting water, the sealed substrate 3 keeps the shrunk state until the cutting is completed. By doing so, it is possible to accurately cut along the cutting lines 30S and 30L so that the positions of the cutting lines 30S and 30L of the sealed substrate 3 set at the time of prealignment do not deviate. Therefore, breakage or deterioration of the electronic part P can be prevented.

In recent years, the size of the sealed substrate 3 is gradually increased, and the number of the electronic parts P formed by one sealed substrate 3 is increasing, so that the length of the entire cutting line is increased. Particularly, in the twin cut table type cutting apparatus, the time required for cutting one sealed substrate 3 is increased by increasing the length of the cut line. Therefore, the waiting time also tends to be high. In such a situation, it is important to accurately grasp the amount of displacement of the cutting line caused by thermal deformation occurring from the time of prealignment until immediately before cutting. Therefore, it is very effective to prevent the positional deviation of the cutting lines 30S and 30L by performing pre-alignment in the same state as the cutting state by cooling the sealed substrate 3 in advance, as in the present invention Method.

The present invention can also be applied to a single-cut table type cutting apparatus having one cutting table. The present invention can be applied even when the cutting apparatus 1 has three or more cutting tables.

As the material to be cut, a semiconductor wafer other than the sealed substrate 3 may be used. Since the electronic circuit is assembled in each region of the semiconductor wafer, the portion corresponding to each region corresponds to the electronic component P (semiconductor chip) after the cutting.

According to the present invention, by previously cooling the sealed substrate, the position of the cutting line in the cutting state can be set at the time of prealignment. Therefore, the present invention contributes greatly to the improvement of the yield, the improvement of the reliability, and the improvement of the productivity, and it is industrially highly valuable.

Further, the present invention is not limited to the above-described embodiments, and can be appropriately combined, changed, or selected as needed within the scope of the present invention.

1: Cutting device 2:
3: Sealed substrate (cut material) 3a:
3b: mold side 4: free stage
5: Loader (conveying mechanism, first cooling mechanism)
6: Compressed air supply mechanism 7: Cold air generation mechanism
8A, 8B: Cutting table
9A and 9B: cutting stage (stage, first cooling mechanism)
10: substrate placing part 11: substrate cutting part
12: Substrate washing section 13: Alignment camera
14A, 14B: Spindle unit (cutting mechanism)
15A, 15B:
16A, 16B: Cutting and receiving nozzle (injection mechanism)
17: Camera for checking cuff
18: an aggregate consisting of a plurality of electronic parts
19: unloader 20: cleaning device
21: cleaning roller 22: inspection stage
23: camera for inspection 24: index table
25: Feed mechanism 26: Good tray
27: substrate portion 28: sealing resin portion
29: alignment mark 30, 30S, 30L: cutting line
31: area 32: compressed air supply port
33: warm air outlet 34: cold air outlet
35: fixing part 36: cooling part (first cooling mechanism)
37: adsorption furnace 38: cooling passage (passage)
A: Receiving unit B: Supply unit
C: cutting unit D: cleaning unit
E: Inspection unit F: Receiving unit
BT: Cooling tank (second cooling mechanism) P: Electronic parts
CTL: Control LD: Load
PA: Pre Alignment
CT: Cut WD: Wash & Dry
UL: Unload WT: Wait
S: Steps

Claims

A transport mechanism for transporting the material to be cut,
A stage on which the workpiece is placed,
An aligning mechanism for aligning and setting a position of a cutting line of the object to be cut disposed on the stage,
A cutting mechanism for cutting the workpiece along the cutting line using a rotary blade,
And a jetting mechanism for jetting a cutting water at a predetermined temperature to a working point at which the rotary blade and the workpiece are in contact with each other,
And a first cooling mechanism provided in at least one of the transport mechanism and the stage to cool the object to be cut,
The object to be cut is cooled to the predetermined temperature by the first cooling mechanism,
And the position of the cutting line in the workpiece cooled to the predetermined temperature is set by the alignment mechanism.

The method according to claim 1,
A plurality of stages are provided,
Wherein the to-be-cut object conveyed by the conveying mechanism is cooled while the to-be-cut object disposed on one stage of the plurality of stages is being cut, or the to-be- And is cooled.

3. The method of claim 2,
And the material to be cut is cooled by a cooling medium flowing in a path formed in at least one of the transport mechanism and the stage.

3. The method of claim 2,
Wherein the object to be cut is cooled by ejecting the cooling medium to the object to be cut arranged on at least one of the conveying mechanism and the stage.

3. The method of claim 2,
Wherein the first cooling mechanism has a Peltier element.

6. The method according to any one of claims 1 to 5,
And a second cooling mechanism for cooling the material to be cut before being delivered to the transporting mechanism.

The method according to claim 1,
Wherein the object to be cut is a sealed substrate on which a chip of an electronic component mounted on a circuit board is resin-sealed with a cured resin.

The method according to claim 1,
Wherein the object to be cut is a semiconductor wafer on which an electronic circuit is assembled.

A step of delivering the material to be cut to a transporting mechanism,
Transporting the workpiece to the stage using the transport mechanism;
Disposing the object to be cut on the stage;
A step of positioning and setting a position of a cutting line of the object to be cut arranged on the stage,
Cutting the object to be cut disposed on the stage along a cutting line using a rotary blade;
And a step of spraying a cutting water having a predetermined temperature to a work point at which the workpiece and the rotary blade are in contact with each other,
And cooling the material to be cut up to the predetermined temperature for at least a part of the period up to the setting step,
Wherein in the setting step, the position of the cutting line is set on the object to be cut that has been cooled to the predetermined temperature.

10. The method of claim 9,
A plurality of stages are provided,
Wherein in the cutting step, the to-be-cut material disposed on one of the plurality of stages is cut,
Wherein the cooling step comprises cooling the workpiece to be cut different from the workpiece being cut while the workpiece arranged on one of the stages is being cut.

11. The method of claim 10,
Wherein in the cooling step, the object to be cut is cooled by causing a cooling medium to flow in a passage formed in at least one of the transport mechanism and the stage.

11. The method of claim 10,
Wherein the cooling step includes cooling the material to be cut by spraying a cooling medium on the material to be cut disposed on at least one of the transport mechanism and the stage.

11. The method of claim 10,
Characterized in that in the cooling step, the object to be cut is cooled using a Peltier element provided on at least one of the transport mechanism and the stage.

14. The method according to any one of claims 9 to 13,
Characterized in that in the cooling step, the material to be cut is cooled in a step before the object to be cut is delivered to the transporting mechanism.

10. The method of claim 9,
Wherein the object to be cut is a sealed substrate on which a chip of an electronic component mounted on a circuit board is resin-sealed with a cured resin.

10. The method of claim 9,
Wherein the object to be cut is a semiconductor wafer on which an electronic circuit is assembled.