KR20150014415A - Chip electronic component and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a magnetic material paste composite for chip electronic component, to a chip electronic component, and to a method for manufacturing the same, and more specifically, to a chip electronic component for allowing the electronic component to maintain its thinness and be manufactured in a thin film type, miniaturizing the electronic component, and preventing the degradation of efficiency according to the loss of magnetic properties on high frequency and at high current. The chip electronic component can indicate high permeability, high efficiency, and high Isat value by improving filling rate.

Description

TECHNICAL FIELD The present invention relates to a chip electronic component and a manufacturing method thereof,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a chip electronic component, and more particularly, to a chip electronic component provided in an IT device or the like to remove noise.

An inductor, which is one of chip electronic components, is a typical passive element that removes noise by forming an electronic circuit together with a resistor and a capacitor. The inductor amplifies a signal of a specific frequency band in combination with a capacitor using electromagnetic characteristics A resonance circuit, a filter circuit, and the like.

On the other hand, as electronic devices such as mobile phones, notebook PCs, and multimedia products have become smaller and lighter and thinner, various inductors have been rapidly converted to chips capable of automatic surface mounting with a small size and high density. A thin film type inductor formed by mixing a magnetic powder with a resin on a coiled lead wire by plating has been developed.

(LF) or fine capacitance, a high quality factor (Q), a high self resonant frequency (SRF), a low direct current resistance (Rdc), and a high inductance A product having a rated current is required.

 In order to obtain a high inductance at a predetermined unit volume, a material having a high permeability is required. Normally, a magnetic substance having a large grain size is used in order to obtain such a high magnetic permeability.

However, such a large particle has a problem that the efficiency according to the magnetic loss (core loss) deteriorates when the frequency and the used current become large. Therefore, it is necessary to reduce the particle size in order to prevent the decrease in the efficiency at high frequencies.

However, when small particles are used, there is a problem that the inductance is reduced because the permeability is lower than that of the large particles, so it is essential to increase the permeability by increasing the filling rate. FIG. 1 is a cross-sectional view of a conventional thin-film type inductor. Since a uniform magnetic particle is used, the filling rate is low and a sufficient permeability can not be obtained.

The following Patent Document 1 discloses a coil device using a magnetic layer of a metallic magnetic powder having a particle size distribution of 5 to 30 탆. However, since the invention of Patent Document 1 is composed of magnetic particles having a uniform particle size, a sufficient filling rate can not be ensured and there is a limitation in improving the permeability.

Japanese Patent Application Laid-Open No. 2008-166455

An object of one embodiment according to the present invention is to provide a chip electronic component having a high permeability, a high efficiency and a high Isat value and a method of manufacturing the chip electronic component by making it thin and maintaining a thin thickness,

In order to solve the above-described problems, according to one embodiment of the present invention,

A magnetic body body including an insulating substrate; And an inner conductor pattern portion formed on at least one surface of the insulating substrate, wherein the magnetic body main body includes first magnetic particles and second magnetic particles, wherein the first magnetic particles and the second magnetic particles are made of iron (Fe Wherein the first magnetic particles have a major axis length of at least 15 mu m and the second magnetic particles have a minor axis length of at most 5 mu m and the density of the magnetic body ) Provides a chip electronic component that is 80% or more.

The chip electronic component according to one embodiment of the present invention can be manufactured in a thin film shape to maintain a thin thickness and can be downsized, and can prevent a decrease in efficiency due to magnetic loss even at a high frequency and a high current. Isat value can be indicated.

1 is a cross-sectional view of a conventional chip electronic component.
2 is a perspective view of a chip electronic component according to an embodiment of the present invention.
3 is a sectional view taken along the line II 'shown in FIG.
Fig. 4 is a view schematically illustrating a method of manufacturing the chip electronic component of Fig. 2;
FIG. 5 is a photograph of a chip electronic component according to an embodiment of the present invention, which is observed at an enlarged size of 2,000 times in an SEM (Scanning Electron Microscope) section in the WT direction.
Fig. 6 is a photograph of a chip electronic component according to an embodiment of the present invention, which is observed at an enlarged size of 2,000 times in an SEM (Scanning Electron Microscope) section in the WT direction.

Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to enable those skilled in the art to more fully understand the present invention.

The same reference numerals are used to designate the same components in the same reference numerals in the drawings of the embodiments.

Chip electronic components

FIG. 2 is a schematic perspective view of a chip electronic component according to an embodiment of the present invention, and FIG. 3 is a sectional view taken along a line I-I 'shown in FIG.

2 and 3, a thin film type inductor 10 used in a power supply line of a power supply circuit as an example of a chip electronic component is disclosed. The chip electronic component may be suitably applied to chip beads, chip filters, etc. in addition to chip inductors.

The thin film type inductor 10 includes a magnetic body 50 and an insulating substrate 23. Internal conductor pattern portions 42 and 44, and an external electrode 80. [

The magnetic body 50 may be in the form of a hexahedron, and L, W and T shown in FIG. 2 indicate the longitudinal direction, the width direction, and the thickness direction, respectively.

The magnetic body 50 may include both end faces in the thickness direction, both end faces in the longitudinal direction, and both end faces in the width direction. The magnetic body 50 may have a rectangular parallelepiped shape whose length in the longitudinal direction is greater than the length in the width direction.

The insulating substrate 23 formed inside the magnetic body 50 is not particularly limited as long as it can be formed by electroplating to form the inner conductor pattern portions 42 and 44. For example, And the like can be formed as a thin film.

An inner conductor pattern portion 42 having a coil shape pattern may be formed on one surface of the insulating substrate 23 and an inner conductor pattern portion 44 having a coil shape pattern may be formed on the opposite surface of the insulating substrate 23 May be formed. One end of the internal conductor pattern portion 42 formed on one surface of the insulating substrate 23 may be exposed at one end in the longitudinal direction of the magnetic body 50 and may be formed on the opposite surface of the insulating substrate 23 One end of the inner conductor pattern portion 44 may be exposed in the other end surface in the longitudinal direction of the magnetic body 50.

The internal conductor pattern portions 42 and 44 formed on the opposite surface of the insulating substrate 23 may be electrically connected to each other via the via electrode 46 formed on the insulating substrate 23.

A hole penetrating the insulating substrate may be formed at the center of the insulating substrate 23 and the hole may be filled with a magnetic material such as a metal soft magnetic material forming the magnetic body to form the core portion 71. The inductance can be improved by forming the core portion 71 filled with the magnetic substance.

External electrodes 80 may be formed on both end surfaces in the longitudinal direction of the magnetic body 50 so as to be connected to the exposed internal conductor pattern portions 42 and 44. The internal conductor pattern portions 42 and 44, the via electrode 46 and the external electrode 80 may be formed of a metal having excellent electrical conductivity and may be formed of a metal such as silver (Ag), copper (Cu), nickel Ni), aluminum (Al), an alloy thereof, or the like.

The first magnetic particles 52 and the second magnetic particles are made of iron (Fe), and the first magnetic particles 52 and the second magnetic particles 53, Wherein the first magnetic particle has a major axis length of at least 15 mu m and the second magnetic particle has a minor axis length of at most 5 mu m.

3, which is a cross-sectional view of the thin film inductor 10 according to one embodiment of the present invention, the magnetic body 50 includes a first magnetic particle 52 and a first magnetic particle 52, And the second magnetic particles 53 are mixed and formed.

By forming the magnetic body 50 by mixing the first magnetic particles 52 and the second magnetic particles 53 having different particle size distributions as described above, there is an effect of improving the filling rate. Thus, the magnetic permeability is remarkably improved and the inductance and Isat The value can be improved.

The first magnetic particles 52 and the second magnetic particles 53 may be amorphous metals including at least three or more metals in addition to iron (Fe).

As well as the first magnetic particles 52 of the coarse particles and the second magnetic particles 53 of the fine particles are also formed of amorphous metal, the effect is advantageous for improving the performance such as inductance. When the amorphous metal is used, It can also be effective for improvement.

The first magnetic particles 52 and the second magnetic particles 53 may be formed of at least one of iron (Fe), silicon (Si), boron (B), chromium (Cr), nickel (Ni), cobalt Al), and may be an amorphous metal including at least three metals selected from the group consisting of Fe-Si-B-Cr amorphous metals.

The first magnetic particles 52 and the second magnetic particles 53 may be the same kind of amorphous metal or different kinds of amorphous metals may be selected.

The first particle size distribution D ₅₀ of the magnetic particle elements 52 may be larger second 4 to 13.5-fold compared to the particle size distribution D ₅₀ of the magnetic particles (53).

Here, the particle size distribution D ₅₀ is When the area per field of view of the SEM (Scanning Eletron Microscope) photograph taken at 1,000 times was taken as 12.5 占 퐉 ² , the particle sizes of the magnetic particles corresponding to 50 fields of view were obtained and the particle sizes were listed in ascending order of size, The particle size of the order of 50% of the total was defined as the particle size distribution D ₅₀ in that field of view.

When the first distribution D ₅₀ particle size of the magnetic particles 52 to the second magnetic particles larger 53 4 to 13.5 times the size compared with the distribution D ₅₀ of the filling rate is remarkably improved, and the permeability is increased by an effect of the inductance is remarkably improved have. (See Table 3)

More specifically, the first particle size distribution D ₅₀ of the magnetic particle 52 may be a second 15 particle size distribution than the D ₅₀ of the magnetic particle 53 to 18 ㎛ large. If the difference between the particle size distribution D ₅₀ of the first magnetic particles 52 and the second magnetic particles 53 is less than 15 탆 or exceeds 18 탆, the effect of improving the filling factor is insufficient and the improvement of the inductance can be reduced.

The first magnetic particles 52 may have a particle size distribution D ₅₀ of 18 to 22 μm. When the particle size distribution D ₅₀ of the first magnetic particles 52 is in the range of 18 to 22 탆, a high magnetic permeability can be ensured with a small magnetic loss at a high frequency. If the particle size distribution D ₅₀ of the first magnetic particles 52 is less than 18 탆, a sufficient magnetic permeability can not be secured. If the particle size distribution exceeds ₅₀ 탆, the efficiency at a high frequency and at a high current may be significantly reduced.

In addition, the second magnetic particles 53 may have a particle size distribution D ₅₀ of 2 to 4 탆. When the particle size distribution D ₅₀ of the second magnetic particles 53 is in the range of 2 to 4 탆, the second magnetic particles 53 are mixed with the first magnetic particles 52, and the filling ratio can be remarkably improved and the magnetic permeability can be remarkably improved. If the particle size distribution D ₅₀ of the second magnetic particles 53 is less than 2 탆 or more than 4 탆, there is a problem that the improvement of the filling ratio is insufficient and the permeability is decreased.

The first magnetic particles and the second magnetic particles may be mixed at a weight ratio of 6: 4 to 8: 2 to form the magnetic body 50.

At this time, when the magnetic substance body 50 is broken and one end surface is observed, the cross-sectional area ratio of the first magnetic particles 52 and the second magnetic particles 53 may be 10: 1 to 18: 1. When the cross-sectional area ratios of the first magnetic particles 52 and the second magnetic particles 53 within the above range are shown, the filling rate can be remarkably improved and high permeability can be exhibited.

The magnetic body 50 according to the embodiment of the present invention can satisfy a density of 80% or more.

Particle size distribution D ₅₀ According to one embodiment of the present invention, the first magnetic particles having a particle size distribution D ₅₀ of 20 탆 and the particle size distribution (particle size distribution) When the second magnetic particles having a distribution D ₅₀ of 3 탆 were mixed and formed at a weight ratio of 7: 3 (Example 5), the packing density was improved to 76.1% by about 14% or more. (See Table 1)

Accordingly, the thin film type inductor 10 according to one embodiment of the present invention can realize high permeability, high efficiency, and high Isat value. (See Table 2)

Method of manufacturing chip electronic components

Fig. 4 is a view schematically illustrating a method of manufacturing the chip electronic component of Fig. 2;

Referring to FIG. 4 (a), inner conductor pattern portions 42 and 44 are formed on one surface and the opposite surface of the insulating substrate 23. The inner conductor pattern portions 42 and 44 may be formed by plating, etching, printing, transfer, or the like, which are used in the manufacturing process of the printed wiring board, Plating is preferable for forming. The internal conductor pattern portions 42 and 44 may be formed of a metal having excellent electrical conductivity and may be formed of a metal such as silver (Ag), copper (Cu), nickel (Ni), aluminum (Al) As shown in FIG.

A via hole may be formed in a part of the insulating substrate 23 and a conductive material may be filled to form a via electrode 46. The via hole 46 may be formed on the opposite surface of the insulating substrate 23 The internal conductor pattern portions 42 and 44 can be electrically connected.

A hole 70 may be formed in the center of the insulating substrate 23 to penetrate the insulating substrate. The hole 70 may be formed by performing a drill, laser, sand blast, punching, or the like, but is not limited thereto.

Referring to FIG. 4 (b), the inner conductor pattern portions 42 and 44 formed on one surface and the opposite surface of the insulating substrate 23 can be covered with the insulating layer 27.

4 (c), the magnetic substance body 50 can be formed by laminating magnetic material layers on the upper and lower surfaces of the insulating substrate 23 on which the internal conductor patterns 42 and 44 are formed. The magnetic substance layers can be laminated on both sides of the insulating substrate 23 and pressed together by lamination or hydrostatic pressing to form the magnetic substance body 50. [ At this time, the core portion 71 can be formed by allowing the hole 70 to be filled with a magnetic material.

Here, the magnetic body 50 includes first magnetic particles and second magnetic particles, the first magnetic particles and the second magnetic particles are amorphous metals including iron (Fe), and the first magnetic particles have a long axis The length of the second magnetic particle is 15 m or more, and the length of the major axis of the second magnetic particle is 5 m or less.

The detailed description of the first magnetic particles and the second magnetic particles, which are similarly applied to the method of manufacturing a chip electronic component according to one embodiment of the present invention, will be omitted hereunder.

Finally, referring to FIG. 4 (d), the thin film type inductor 10 can be manufactured by forming the external electrodes 80 on both end surfaces of the magnetic body 50 in the longitudinal direction. The external electrode 80 is connected to the ends of the internal conductor patterns 42 and 44 and may be formed by dipping or the like. The external electrode may be formed of a metal having excellent electrical conductivity. For example, the external electrode may be formed of silver (Ag), copper (Cu), nickel (Ni), aluminum (Al)

The following Tables 1 and 2 are tables showing the results of the filling factor, the permeability and the inductance value of the thin film type inductor according to the mixing weight ratio of the first magnetic particles and the second magnetic particles which are Fe-Si-B-Cr amorphous metals.

Mixing weight ratio Filling rate (%)
Permeability (μ)
The first magnetic particle
(D ₅₀ = 20 탆) The second magnetic particle
(D ₅₀ = 3 탆) Example 1 3 7 67.7 17.6 Example 2 5 5 72.9 23.8 Example 3 6 4 76.0 27.7 Example 4 6.6 3.4 75.6 27.7 Example 5 7 3 76.1 30.2 Example 6 7.6 2.4 75.0 27.6 Comparative Example 1 0 10 62.7 13.3 Comparative Example 2 10 0 67.4 20.7

1MHz 3MHz 9MHz Ls (uH) Q Rs Ls (uH) Q Rs Ls (uH) Q Rs Example 1 0.78 41.00 0.12 0.78 58.33 0.24 0.78 45.53 1.01 Example 2 0.97 48.20 0.13 0.97 53.54 0.34 0.96 27.55 2.02 Example 3 1.09 51.99 0.14 1.09 48.13 0.41 1.09 22.84 2.73 Example 4 1.11 50.89 0.14 1.10 46.25 0.43 1.10 22.14 2.83 Example 5 1.18 54.93 0.14 1.18 47.15 0.47 1.18 20.33 3.34 Example 6 11 51.85 0.13 1.09 45.71 0.45 1.09 21.18 2.96 Comparative Example 1 0.63 31.20 0.12 0.62 61.41 0.19 0.62 87.97 0.41 Comparative Example 2 0.92 45.12 0.13 0.91 45.18 0.38 0.91 24.03 2.18

Table 3 below is a table showing the results of the filling factor, the magnetic permeability and the inductance value according to the particle size ratio of the first magnetic particles and the second magnetic particles which are Fe-Si-B-Cr amorphous metals.

The first magnetic particle (D ₅₀ ) / the second magnetic particle (D ₅₀ ) Mixing weight ratio
(First magnetic particles: second magnetic particles) Filling rate (%) Permeability (μ) Ls (uH) Example 7 8.0 7: 3 80 33 1.15 Example 8 6.0 7: 3 75 30 1.0 Example 9 4.0 7: 3 74 28 0.9 Example 10 6.7 7: 3 76 28 0.9 Example 11 13.3 7: 3 84 33 1.15 Example 12 4.6 7: 3 65 25 0.75 Example 13 9.3 7: 3 78 29 0.95 Example 14 7.3 7: 3 76 28 0.9 Comparative Example 3 3μm alone - 63 13 0.6 Comparative Example 4 4μm alone - 64 15 0.65 Comparative Example 5 5μm alone - 64 17 0.68 Comparative Example 6 11μm alone - 65 18 0.70 Comparative Example 7 14μm alone - 66 19 0.75 Comparative Example 8 20μm alone - 67 20 0.78 Comparative Example 9 24㎛ alone - 68 23 0.8

The present invention is not limited to the above-described embodiment and the accompanying drawings, but is intended to be limited by the appended claims.

It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

10: thin film type inductor 46: via electrode
50: magnetic body body 27: insulating layer
52: first magnetic particle 70: hole
53: second magnetic particle 71: core part
23: insulating substrate 80: external electrode
42, 44: inner conductor pattern portion

Claims (18)

A magnetic body body including an insulating substrate; And
And an internal conductor pattern portion formed on at least one surface of the insulating substrate,
Wherein the magnetic body body includes first magnetic particles and second magnetic particles,
The first magnetic particles and the second magnetic particles are amorphous metals including iron (Fe)
Wherein the first magnetic particles have a major axis length of 15 m or more,
Wherein the second magnetic particle is made of a fine powder having a major axis length of 5 m or less,
Wherein the magnetic substance body has a density of 80% or more.
The method according to claim 1,
Wherein the first magnetic particles and the second magnetic particles are amorphous metals further comprising at least three or more metals in addition to iron (Fe).
The method according to claim 1,
Wherein the first magnetic particles and the second magnetic particles are made of a material selected from the group consisting of iron (Fe) and silicon (Si), boron (B), chromium (Cr), nickel (Ni), cobalt (Co) Wherein the amorphous metal comprises at least three selected metals.
The method according to claim 1,
Wherein the first magnetic particles and the second magnetic particles are Fe-Si-B-Cr amorphous metals.
The method according to claim 1,
Wherein when observing one end surface of the magnetic body body, the first magnetic particles and the second magnetic particles Wherein the cross-sectional area ratio is 10: 1 to 18: 1.
The method according to claim 1,
The particle size distribution D ₅₀ of the first magnetic particles is a particle size distribution D ₅₀ Wherein the chip electronic component is 4 to 13.5 times larger than that of the chip.
The method according to claim 1,
The first magnetic particles have a particle size distribution D ₅₀ Is 18 to 22 占 퐉.
The method according to claim 1,
The particle size distribution D ₅₀ of the first magnetic particles is a particle size distribution D ₅₀ And 15 to 18 占 퐉 larger than that of the chip.
The method according to claim 1,
The second magnetic particle has a particle size distribution D ₅₀ Is 2 to 4 占 퐉.
The method according to claim 1,
Wherein the first magnetic particles and the second magnetic particles are mixed at a weight ratio of 6: 4 to 8: 2.
Forming an internal conductor pattern on at least one surface of the insulating substrate; And
Forming a magnetic body body by laminating and pressing the magnetic body layers on the upper and lower surfaces of the substrate on which the internal conductor pattern is formed; / RTI >
Wherein the magnetic body body is formed by mixing first magnetic particles and second magnetic particles,
The first magnetic particles and the second magnetic particles are amorphous metals including iron (Fe)
Wherein the first magnetic particles have a major axis length of 15 m or more,
Wherein the second magnetic particle is made of a fine powder having a major axis length of 5 m or less,
Wherein a density of the magnetic body body is 80% or more.
12. The method of claim 11,
Wherein the first magnetic particles and the second magnetic particles are made of a material selected from the group consisting of iron (Fe) and silicon (Si), boron (B), chromium (Cr), nickel (Ni), cobalt (Co) Wherein the amorphous metal comprises at least three selected metals.
12. The method of claim 11,
Wherein the first magnetic particles and the second magnetic particles are Fe-Si-B-Cr amorphous metals.
12. The method of claim 11,
Wherein the first magnetic particles and the second magnetic particles are mixed at a mixing weight ratio of 6: 4 to 8: 2.
12. The method of claim 11,
The first particle size distribution D ₅₀ of the magnetic particle production method of the chip electronic component, characterized in that from 4 to 13.5 times larger than the particle size distribution D ₅₀ of the second magnetic particles.
12. The method of claim 11,
Wherein the first magnetic particles have a particle size distribution D ₅₀ of 18 to 22 탆.
12. The method of claim 11,
The first particle size distribution D ₅₀ of the magnetic particle production method of the chip electronic component, characterized in that a second large size distribution of 15 to 18 ㎛ than the D ₅₀ of the magnetic particle.
12. The method of claim 11,
Wherein the second magnetic particles have a particle size distribution D ₅₀ of 2 to 4 탆.

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