KR20150005616A - 웨이퍼 위치 검출 장치 및 방법 - Google Patents

웨이퍼 위치 검출 장치 및 방법 Download PDF

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Publication number
KR20150005616A
KR20150005616A KR1020147031930A KR20147031930A KR20150005616A KR 20150005616 A KR20150005616 A KR 20150005616A KR 1020147031930 A KR1020147031930 A KR 1020147031930A KR 20147031930 A KR20147031930 A KR 20147031930A KR 20150005616 A KR20150005616 A KR 20150005616A
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KR
South Korea
Prior art keywords
wafer
chuck
image
position detection
image data
Prior art date
Application number
KR1020147031930A
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English (en)
Korean (ko)
Inventor
지안 왕
유 자오
유펑 후앙
푸파 첸
후에이 왕
Original Assignee
에이씨엠 리서치 (상하이) 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 에이씨엠 리서치 (상하이) 인코포레이티드 filed Critical 에이씨엠 리서치 (상하이) 인코포레이티드
Publication of KR20150005616A publication Critical patent/KR20150005616A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020147031930A 2012-05-02 2012-05-02 웨이퍼 위치 검출 장치 및 방법 KR20150005616A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2012/074966 WO2013163791A1 (en) 2012-05-02 2012-05-02 Apparatus and method for detecting position of wafer

Publications (1)

Publication Number Publication Date
KR20150005616A true KR20150005616A (ko) 2015-01-14

Family

ID=49514173

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147031930A KR20150005616A (ko) 2012-05-02 2012-05-02 웨이퍼 위치 검출 장치 및 방법

Country Status (3)

Country Link
KR (1) KR20150005616A (zh)
CN (1) CN104396003B (zh)
WO (1) WO2013163791A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190046121A (ko) * 2017-10-25 2019-05-07 삼성전자주식회사 웨이퍼 위치 검사 장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111403318B (zh) * 2020-03-19 2023-05-16 北京北方华创微电子装备有限公司 工艺腔室内晶圆状态的检测方法及装置
JP2024060690A (ja) * 2022-10-20 2024-05-07 株式会社Ｓｃｒｅｅｎホールディングス 位置判定方法、および、位置判定装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100573471B1 (ko) * 2003-12-30 2006-04-24 동부아남반도체 주식회사 디지털 이미지를 이용한 웨이퍼 얼라인 방법
KR20060094146A (ko) * 2005-02-23 2006-08-29 삼성전자주식회사 웨이퍼 얼라인장치 및 얼라인 방법
KR20090057426A (ko) * 2006-09-29 2009-06-05 램 리써치 코포레이션 기판을 포지셔닝 및 검사하기 위한 오프셋 정정 방법 및 장치
KR20110019243A (ko) * 2009-08-19 2011-02-25 세메스 주식회사 기판 처리 장치 및 방법, 그리고 그의 기판 안착 상태를 모니터링하기 위한 모니터링 시스템 및 그 방법
KR101098980B1 (ko) * 2009-08-14 2011-12-28 세메스 주식회사 기판 연마 장치 및 그의 기판 슬립 감지 방법

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JP2560042B2 (ja) * 1987-09-04 1996-12-04 日東電工株式会社 半導体ウエハのマウント装置
JPH02130910A (ja) * 1988-11-11 1990-05-18 Canon Inc 位置合わせ方法
KR20000044563A (ko) * 1998-12-30 2000-07-15 김영환 웨이퍼의 중심정렬장치 및 방법
US6778258B2 (en) * 2001-10-19 2004-08-17 Asml Holding N.V. Wafer handling system for use in lithography patterning
KR100824617B1 (ko) * 2001-12-26 2008-04-24 동부일렉트로닉스 주식회사 웨이퍼 정렬 방법
JP4176372B2 (ja) * 2002-05-08 2008-11-05 株式会社ニデック アライナ装置及びこれを備えるウエハ検査装置
JP5000944B2 (ja) * 2006-08-02 2012-08-15 株式会社ディスコ レーザー加工装置のアライメント方法
CN101523182A (zh) * 2006-09-29 2009-09-02 朗姆研究公司 用于基板定位的偏移校正方法
CN100508158C (zh) * 2007-09-18 2009-07-01 深圳市矽电半导体设备有限公司 晶圆片定位装置的定位方法
US8060330B2 (en) * 2008-12-12 2011-11-15 Lam Research Corporation Method and system for centering wafer on chuck
CN101498897B (zh) * 2008-12-17 2011-11-30 上海微电子装备有限公司 边缘曝光装置及其控制方法
JP2010186863A (ja) * 2009-02-12 2010-08-26 Disco Abrasive Syst Ltd 位置合わせ機構、加工装置および位置合わせ方法
CN102157421B (zh) * 2010-02-11 2013-01-16 上海微电子装备有限公司 一种硅片预对准装置及预对准方法
CN102169822B (zh) * 2011-02-09 2012-07-04 沈阳芯源微电子设备有限公司 双整定精确定位硅片圆心的方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100573471B1 (ko) * 2003-12-30 2006-04-24 동부아남반도체 주식회사 디지털 이미지를 이용한 웨이퍼 얼라인 방법
KR20060094146A (ko) * 2005-02-23 2006-08-29 삼성전자주식회사 웨이퍼 얼라인장치 및 얼라인 방법
KR20090057426A (ko) * 2006-09-29 2009-06-05 램 리써치 코포레이션 기판을 포지셔닝 및 검사하기 위한 오프셋 정정 방법 및 장치
KR101098980B1 (ko) * 2009-08-14 2011-12-28 세메스 주식회사 기판 연마 장치 및 그의 기판 슬립 감지 방법
KR20110019243A (ko) * 2009-08-19 2011-02-25 세메스 주식회사 기판 처리 장치 및 방법, 그리고 그의 기판 안착 상태를 모니터링하기 위한 모니터링 시스템 및 그 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190046121A (ko) * 2017-10-25 2019-05-07 삼성전자주식회사 웨이퍼 위치 검사 장치

Also Published As

Publication number Publication date
CN104396003A (zh) 2015-03-04
WO2013163791A1 (en) 2013-11-07
CN104396003B (zh) 2019-05-17

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