KR20140114724A - 반도체발광소자를 구비한 조명기구 - Google Patents

반도체발광소자를 구비한 조명기구 Download PDF

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Publication number
KR20140114724A
KR20140114724A KR1020130092366A KR20130092366A KR20140114724A KR 20140114724 A KR20140114724 A KR 20140114724A KR 1020130092366 A KR1020130092366 A KR 1020130092366A KR 20130092366 A KR20130092366 A KR 20130092366A KR 20140114724 A KR20140114724 A KR 20140114724A
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KR
South Korea
Prior art keywords
semiconductor light
light emitting
led
base member
conductive
Prior art date
Application number
KR1020130092366A
Other languages
English (en)
Korean (ko)
Inventor
토오루 와가쓰마
히로미쓰 쿠리모토
테루아키 노노야마
Original Assignee
교우세라 커넥터 프로덕츠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 교우세라 커넥터 프로덕츠 가부시키가이샤 filed Critical 교우세라 커넥터 프로덕츠 가부시키가이샤
Publication of KR20140114724A publication Critical patent/KR20140114724A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
KR1020130092366A 2013-03-19 2013-08-05 반도체발광소자를 구비한 조명기구 KR20140114724A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013055997A JP5904671B2 (ja) 2013-03-19 2013-03-19 半導体発光素子を備える照明器具
JPJP-P-2013-055997 2013-03-19

Publications (1)

Publication Number Publication Date
KR20140114724A true KR20140114724A (ko) 2014-09-29

Family

ID=51552285

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130092366A KR20140114724A (ko) 2013-03-19 2013-08-05 반도체발광소자를 구비한 조명기구

Country Status (4)

Country Link
JP (1) JP5904671B2 (ja)
KR (1) KR20140114724A (ja)
CN (1) CN104064661A (ja)
TW (1) TWI580901B (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19918370B4 (de) * 1999-04-22 2006-06-08 Osram Opto Semiconductors Gmbh LED-Weißlichtquelle mit Linse
US7456499B2 (en) * 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
KR100947454B1 (ko) * 2006-12-19 2010-03-11 서울반도체 주식회사 다단 구조의 열전달 슬러그 및 이를 채용한 발광 다이오드패키지
JP2009218434A (ja) * 2008-03-11 2009-09-24 Sharp Corp 光空間伝送デバイス
WO2009148543A2 (en) * 2008-05-29 2009-12-10 Cree, Inc. Light source with near field mixing
US7932529B2 (en) * 2008-08-28 2011-04-26 Visera Technologies Company Limited Light-emitting diode device and method for fabricating the same
RU2011144370A (ru) * 2009-04-02 2013-05-10 Конинклейке Филипс Электроникс Н.В. Рефлектор со смесительной камерой
US10546846B2 (en) * 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
CN202839730U (zh) * 2010-12-28 2013-03-27 松下电器产业株式会社 发光装置、发光模块及灯

Also Published As

Publication number Publication date
JP2014182908A (ja) 2014-09-29
TW201437557A (zh) 2014-10-01
CN104064661A (zh) 2014-09-24
TWI580901B (zh) 2017-05-01
JP5904671B2 (ja) 2016-04-20

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