KR20140108959A - Pump down system and method of temperature controlling apparatus of gas chiller for semiconductor and LCD manufacturing process - Google Patents

Abstract

The present invention relates to a system and a method of collecting the cooling medium of a temperature controlling apparatus of semiconductor and LCD manufacturing equipment by the medium of gas. The system of collecting the cooling medium of a temperature controlling apparatus of semiconductor and LCD manufacturing equipment by the medium of gas according to one embodiment of the present invention includes process equipment (100); a main body part (200) having a compressor (210) which increases the pressure of a working fluid, a condenser (220) which condenses the working fluid, and a liquid receiver (230); and a first electronic expansion valve (310).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a refrigerant recovery system and method for a temperature control device,

The present invention relates to a system and a method for recovering refrigerant in a semiconductor and LCD manufacturing facility temperature control apparatus, and more particularly to a system and method for controlling the temperature of at least one semiconductor and a LCD manufacturing process facility using a gas without using a liquid cooling fluid And more particularly, to a refrigerant recovery system and method in a semiconductor and LCD manufacturing facility facility temperature control apparatus using gas as a medium that can be stably recovered while minimizing the leakage of refrigerant filled in the flow path when the temperature control apparatus is shut down.

Generally, in the process of manufacturing semiconductors and LCDs, the internal temperature of the electrostatic chuck, the heater, and the chamber must be kept constant at all times, The equipment that plays the role of maintenance is called a chiller.

Such semiconductor and LCD process equipments are subjected to thermal load during the manufacturing process of semiconductors and the temperature rises. Semiconductor and LCD chillers are used to circulate the cooling fluid inside electrostatic chuck, heater and chamber by using a pump The heat load is removed by chiller to remove heat.

In this case, the semiconductor and LCD chiller can be classified into a low-temperature chiller and a high-temperature chiller according to the target cooling temperature of the cooling fluid recovered to the main body, and the low-temperature chiller generally uses a cooling cycle using a freon gas, And a high temperature chiller (or a heat exchanger type chiller) is a system for cooling a cooling fluid by using a predetermined refrigerant.

FIG. 1 is a view showing an example of a conventional temperature control system for semiconductor and LCD manufacturing process equipment using gas as a medium.

Referring to FIG. 1, a conventional temperature control system for a semiconductor and LCD manufacturing process facility using gas as a medium comprises components including at least a process facility 10, a main body unit 20, and a temperature control unit 30 , Which will be described in detail as follows.

First, the process facility 10 refers to a process facility used in a manufacturing process of an LCD, a semiconductor, etc., such as an electrostatic chuck, a heater, and a chamber.

The process facility 10 controls the temperature of the process facility 10 by circulating a predetermined working fluid, wherein the working fluid is a refrigerant gas or a liquid brine (R404a) ).

The main body 20 includes a compressor 21 for compressing the working fluid to high temperature and high pressure, a condenser 22 for condensing the working fluid, and a receiver 23 for temporarily storing the working fluid.

The temperature control unit 30 includes a first electronic expansion valve 31 and a second electronic expansion valve 32.

The opening degree of the first electronic expansion valve 31 and the second electronic expansion valve 32 is adjusted based on the temperature sensed by the main temperature sensor T1 installed in the process facility 10.

That is, in the case of the first electronic expansion valve 31, the temperature of the process facility 10 is controlled by a low-temperature working fluid (gas refrigerant) of less than about 30 ° C, and the second electronic expansion valve 32 And controls the temperature of the process facility 10 with a working fluid (brine) at normal temperature of about 30 캜 or more.

Here, the receiver 23 condenses the high-temperature, high-pressure working fluid supplied from the compressor 21 to the PCW (Process Cooling Water) in the condenser 22, and then supplies the working fluid to the first electronic expansion valve (10) is operated by using one compressor (21), and a disturbance such as a set temperature conversion of a different process facility or a change of a cooling load is applied It is possible to stabilize the overall refrigeration cycle system.

Hereinafter, a temperature control method of a conventional semiconductor and LCD manufacturing process equipment using a gas as a medium will be described with reference to FIG.

First, as described above, a conventional temperature control method of a semiconductor and LCD manufacturing process facility using a gas as a medium has a first circulation path for controlling a temperature at a low temperature and a second circulation path for controlling a temperature at a relatively high temperature do.

Herein, the first circulation path will be described. A predetermined working fluid discharged from the process facility 10 flows into the compressor 21 through the first transfer line 11. [0034] FIG.

Subsequently, the working fluid that has flowed into the compressor (21) and pressurized at high temperature and high pressure is discharged and flows into the condenser (22) through the second transfer line (24).

Then, the working fluid that has flowed into the condenser 22 and condensed is discharged, is introduced into the receiver 23 through the third transfer line 25, and temporarily stored.

Then, the working fluid flowing into the receiver (23) and temporarily stored therein flows into the first electronic expansion valve (31) through the fourth transfer line (26).

Then, the working fluid which flows into the first electronic expansion valve (31) and is thermally expanded is introduced into the process facility (10) through the fifth transfer line (34).

The working fluid pressurized at the high temperature and high pressure fed through the second transfer line 24 is branched and transferred through the sixth transfer line 27 to the second electronic expansion valve (32).

Then, the working fluid introduced into the second electronic expansion valve 32 is transferred through the seventh transfer line 35 to the fifth transfer line 34.

(0001) Korean Utility Model Publication No. 20-2008-0004784 (published on October 22, 2008) (0002) Korean Registered Patent No. 10-1109728 (issued on January 18, 2012) (0003) Korean Registered Patent No. 10-1109730 (issued on February 24, 2012) (0004) Korean Patent Registration No. 10-0927391 (published on Nov. 19, 2009)

Disclosure of the Invention Problem to be solved by the Invention The present invention is directed to a system and method for controlling a temperature control apparatus using gas as a refrigerant in at least one semiconductor and LCD manufacturing process facility, And to provide a refrigerant recovery system and method of a temperature control device for semiconductor and LCD manufacturing processes.

It is a further object of the present invention to provide a semiconductor and LCD manufacturing method capable of easily maintaining a temperature control device using gas as a refrigerant in semiconductor and LCD manufacturing process facilities and minimizing the leakage of refrigerant, And to provide a refrigerant recovery system and method of a process facility temperature control apparatus.

The present invention also provides a separate storage tank connected to the compressor, wherein each valve is controlled when the operation of the temperature control device is stopped, and finally, the refrigerant of the flow path is guided to the storage tank, And to provide a system and a method for recovering refrigerant in an apparatus temperature control apparatus for a semiconductor and LCD manufacturing process.

According to an aspect of the present invention, there is provided a method for controlling a flow rate of a working fluid discharged from a processing facility through a first transfer line including a first electronic control valve and a first pressure sensor, A condenser for condensing the working fluid introduced from the compressor through a second transfer line having a second electronic control valve and a second pressure sensor, a condenser for condensing the working fluid introduced from the compressor, Through a fourth transfer line including a fourth electronic control valve and a fourth pressure sensor, and a second liquid supply line through which the influent A first electronic expansion valve for controlling the amount of the working fluid to supply the working fluid to the processing facility through a fifth transfer line including a fifth electronic control valve and a fifth pressure sensor, The working fluid fed through the feed line is diverged to control the amount of the working fluid flowing from the compressor through the sixth feed line having the sixth and sixth pressure sensors, And a second electronic expansion valve for supplying the working fluid to the fifth transfer line through a seventh transfer line, wherein the main body includes an eighth transfer line having an eighth electronic control valve And a storage tank in which the working fluid flowing from the compressor is stored.

And a heater is further provided on the sixth conveyance line.

And the temperature control unit is located closer to the process facility than the main body unit.

The second electronic control valve installed on the second transfer line is shut off and the eighth electronic control valve installed on the eighth transfer line is opened so that the working fluid compressed through the compressor flows into the storage tank A fourth electronically controlled valve installed on the fourth transfer line when the pressure of the working fluid sensed by the second pressure sensor installed on the second transfer line drops below a predetermined value, A sixth pressure sensor installed on the fourth conveyance line, and a sixth pressure sensor provided on the sixth conveyance line, respectively, A fifth step of interrupting the seventh electronic control valve provided on the fifth electronically controlled valve and the seventh transfer line provided on the fifth transfer line when the pressure of the working fluid drops below a predetermined value, Installed on A fourth step of blocking the first electromagnetic control valve installed on the first conveyance line when the pressure of the working fluid sensed by the pressure sensor falls below a predetermined value, A fifth step wherein the eighth electronic control valve installed on the eighth conveyance line is shut off when the pressure of the working fluid sensed by the sensor drops below a predetermined value, and a sixth step wherein the operation of the compressor is interrupted .

The present invention has the effect of recovering the refrigerant charged in the flow path to a separate storage tank when shutting down the temperature control apparatus using gas as a refrigerant in at least one semiconductor and LCD manufacturing process facility.

In addition, the present invention facilitates maintenance of a temperature control device using gas as a refrigerant in semiconductor and LCD manufacturing process facilities, and minimizes leakage of refrigerant.

In addition, the present invention provides a separate storage tank connected to the compressor, so that each valve is controlled when the operation of the temperature control device is stopped, and the refrigerant of the flow path is finally guided to the storage tank and stored.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate preferred embodiments of the invention and, together with the description, serve to further the understanding of the technical idea of the invention, And shall not be construed as interpretation.
FIG. 1 is a view showing an example of a conventional temperature control system for semiconductor and LCD manufacturing process facilities using gas as a medium,
FIG. 2 is a view illustrating an example of a refrigerant recovery system of an equipment temperature control apparatus for semiconductor and LCD manufacturing processes using a gas as a medium according to an embodiment of the present invention;
FIG. 3 is a view illustrating an example of a refrigerant recovery system of an equipment temperature control apparatus for semiconductor and LCD manufacturing processes using a gas as a medium according to another embodiment of the present invention.
4 is a flowchart showing a refrigerant recovery method of an equipment temperature control apparatus for semiconductor and LCD manufacturing processes using gas as a medium according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the present embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.

FIG. 2 is a view illustrating an example of a refrigerant recovery system of an equipment temperature control apparatus for semiconductor and LCD manufacturing processes using a gas as a medium according to an embodiment of the present invention, and FIG. 3 is a cross- 4 is a flowchart showing a refrigerant recovery method of an apparatus temperature control apparatus for semiconductor and LCD manufacturing process using gas as a medium according to an embodiment of the present invention. to be.

2 to 4, a refrigerant recovery system of an equipment temperature control apparatus for semiconductor and LCD manufacturing processes using a gas as a medium according to a preferred embodiment of the present invention includes a process facility 100, a main body unit 200, (300), which will be described in detail as follows.

First, the process facility 100 refers to a process facility used in a manufacturing process of an LCD, a semiconductor, etc., such as an electrostatic chuck, a heater, and a chamber.

The process facility 100 controls the temperature of the process facility 100 by circulating a predetermined working fluid, wherein the working fluid is a refrigerant gas or a liquid brine (R404a) ).

The main body 200 includes a compressor 210 for compressing the working fluid to high temperature and high pressure, a condenser 220 for condensing the working fluid, and a receiver 230 for temporarily storing the working fluid.

The temperature control unit 300 includes a first electronic expansion valve 310 and a second electronic expansion valve 320.

It is preferable that the temperature control unit 300 is located closer to the process facility 100 than the main body 200. That is, the first electronic expansion valve 310 and the second electronic expansion valve 320 is located near the process facility 100, there is an advantage of increasing the accuracy of the temperature control of the working fluid flowing into the process facility 100 and controlling the temperature.

That is, by separating the main body 200, which occupies a large space, and the temperature controller 300, which is relatively small in volume and occupies less space, the space can be efficiently utilized and the temperature can be controlled more precisely .

The first electronic expansion valve 310 and the second electronic expansion valve 320 are respectively adjusted in opening degree based on a temperature sensed by a main temperature sensor (not shown) installed in the process facility 100 .

That is, in the case of the first electronic expansion valve 310, the temperature of the processing facility 100 is controlled by a low-temperature working fluid (gas refrigerant) of less than about 30 ° C, and the second electronic expansion valve 320 And controls the temperature of the process facility 100 with a working fluid (brine) at normal temperature of about 30 ° C or more.

Here, the receiver 230 condenses the high-temperature, high-pressure working fluid supplied from the compressor 210 to the PCW (Process Cooling Water) in the condenser 220, (Not shown) for storing a certain amount of time before being sent to the compressor 310, in which at least one process facility 100 is operated using one compressor 210, It is possible to stabilize the overall refrigeration cycle system by reducing the fluctuation range of the condensation pressure generated.

The main body 200 includes a storage tank 240 in which the working fluid flowing from the compressor 210 is stored.

Hereinafter, a refrigerant recovery system and method of an equipment temperature control apparatus for semiconductor and LCD manufacturing processes using a gas as a medium according to an embodiment of the present invention will be described with reference to FIG. 2 and FIG.

As described above, according to the preferred embodiment of the present invention, the system and method for recovering refrigerant in a semiconductor and LCD manufacturing facility facility temperature control apparatus using gas as a medium include a first circulation path for controlling a temperature at a low temperature, And a second circulation path for controlling the temperature of the exhaust gas.

Here, the first circulation path will be described. A predetermined working fluid discharged from the process facility 100 flows into the compressor 210 through the first transfer line 110.

At this time, a first electromagnetic control valve 111 and a first pressure sensor 112 are installed in the first transfer line 110 and are discharged from the process facility 100 through the first transfer line 110 The working fluid can be blocked by the first electromagnetic control valve 111 and the pressure of the working fluid inside the first transfer line 110 is sensed by the first pressure sensor 112.

Then, the working fluid which flows into the compressor 210 and is pressurized at high temperature and high pressure is discharged and flows into the condenser 220 through the second transfer line 250.

A second electromagnetic control valve 251 and a second pressure sensor 252 are installed in the second conveyance line 250 and are operated through the second conveyance line 250 The fluid can be blocked by the second electromagnetic control valve 251 and the pressure of the working fluid inside the second transfer line 250 is sensed by the second pressure sensor 252.

A storage tank 240 is provided in which the working fluid flowing from the compressor 210 is stored through an eighth transfer line 290 having an eighth electronic control valve 291.

That is, when the working fluid flowing through the second conveying line 250 is blocked by the second electromagnetic control valve 251, the eighth electromagnetic control valve 291 is opened and the eighth conveying line 290 is opened, The working fluid flows into the storage tank 240 through the first and second openings.

Then, the condensed working fluid flowing into the condenser 220 is discharged and flows into the receiver 230 through the third conveyance line 260, and temporarily stored.

Then, the working fluid flowing into the receiver (230) and temporarily stored therein flows into the first electronic expansion valve (310) through the fourth transfer line (270).

At this time, a fourth electromagnetic control valve 271 and a fourth pressure sensor 272 are installed in the fourth conveyance line 270 and are discharged from the receiver 230 through the fourth conveyance line 270 The working fluid can be blocked by the fourth electromagnetic control valve 271 and the pressure of the working fluid inside the fourth transfer line 270 is sensed by the fourth pressure sensor 272.

Then, the working fluid which flows into the first electronic expansion valve 310 and is thermally expanded is introduced into the processing facility 100 through the fifth transfer line 330.

A fifth electronic control valve 331 and a fifth pressure sensor 332 are installed on the fifth transfer line 330 and are connected to the first electronic expansion valve 310 through the fifth transfer line 330. [ And the pressure of the working fluid inside the fifth transfer line 330 is sensed by the fifth pressure sensor 332. The pressure of the working fluid in the fifth transfer line 330 is detected by the fifth pressure sensor 332. [

The working fluid pressurized at the high temperature and high pressure fed through the second conveying line 250 is branched to the second conveying line 250 through the second conveying line 280, (320).

A sixth electromagnetic control valve 281 and a sixth pressure sensor 282 are installed on the sixth transfer line 280 so that the working fluid branched through the sixth transfer line 280 flows through the sixth electron The pressure of the working fluid inside the sixth transfer line 280 is sensed by the sixth pressure sensor 282. [

Here, a heater 400 may be further installed on the sixth transfer line 280.

That is, the heater 400 is preferably installed on the sixth transfer line 280 of the second circulation step for controlling the temperature of the processing facility 100 at a relatively high temperature.

The first electronic expansion valve 310 and the second electronic expansion valve 320 may control the temperature of the working fluid for controlling the temperature of the process facility 100 to about -20 to 60 ° C. However, by applying the heater 400, the temperature can be raised to about 60 ° C or more.

That is, a high-temperature high-pressure working fluid through the compressor 210 and a low-temperature high-pressure working fluid through the condenser 220 are supplied to the first and second electronic expansion valves 310, The temperature of the process facility 100 is controlled so that the low temperature control through the first electronic expansion valve 310 is easy but the operation fluid of high temperature and high pressure (about 100 ° C) When the refrigerant passes through the expansion valve 320, the temperature of the refrigerant is lowered to a temperature of about 60 ° C. In order to raise the working fluid to a high temperature of about 60 ° C. or more, a heater 400 is additionally provided on the sixth transfer line 280 will be.

Next, the working fluid introduced into the second electronic expansion valve 320 is transferred through the seventh transfer line 340 to the fifth transfer line 330.

At this time, a seventh electronically controlled valve 341 is provided on the seventh transfer line 340, and a working fluid discharged from the second electronic expansion valve 320 through the seventh transfer line 340 flows through the seventh transfer line 340, 7 electronically controlled valve 341. [0060]

In the case of the first circulation path, the gaseous refrigerant is circulated to the working fluid for the low temperature control and in the case of the second circulation path, the working fluid which is a liquid brine for the high temperature control is circulated .

Hereinafter, a refrigerant recovery method of an equipment temperature control apparatus for semiconductor and LCD manufacturing processes using gas as a medium according to an embodiment of the present invention will be described with reference to FIG.

First, when a program command for stopping the operation of the facility temperature control device of the semiconductor and LCD manufacturing process of the present invention is inputted, the second electronic control valve 251 installed on the second transfer line 250 is shut off, The eighth electronic control valve 291 installed on the transfer line 290 is opened and a working fluid compressed through the compressor 210 flows into the storage tank 240 and is stored do.

At this time, the compressor 210 continuously operates until the operation of the compressor 210, which will be described later, is stopped, and the working fluid flows into the storage tank 240.

Then, when the pressure of the working fluid sensed by the second pressure sensor 252 installed on the second conveyance line 250 is lower than a predetermined value, the fourth conveyance line 270, The sixth electronic control valve 281 provided on the electronic control valve 271 and the sixth transfer line 280 is blocked (step S200).

The pressure of the working fluid sensed by the fourth pressure sensor 272 installed on the fourth transfer line 270 and the sixth pressure sensor 282 provided on the sixth transfer line 280 The fifth electronic control valve 331 provided on the fifth conveyance line 330 and the seventh electronic control valve 341 provided on the seventh conveyance line 340 are turned off S300).

Then, when the pressure of the working fluid sensed by the fifth pressure sensor 332 installed on the fifth conveyance line 330 drops below a predetermined value, The electronic control valve 111 is shut off (step S400).

Then, when the pressure of the working fluid sensed by the first pressure sensor 112 installed on the first transfer line 110 drops below a predetermined value, The eighth electronic control valve 291 is interrupted (step S500).

Finally, the operation of the compressor 210 is stopped (step S600).

Here, it is a matter of course that pressure sensors are disposed on the transfer line in each of the above-described operation processes to provide continuity of operation, and a controller (control section) for controlling a series of operations of the above- It is also a fact that it is equipped.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, And such variations and modifications are intended to fall within the scope of the appended claims.

100: Process equipment 110: 1st transfer line
111: first electronic control valve 112: first pressure sensor
200: main body 210: compressor
220: condenser 230: receiver
240: Storage tank 250: Second transfer line
251: second electronic control valve 252: second pressure sensor
260: third conveyance line 270: fourth conveyance line
271: fourth electronic control valve 272: fourth pressure sensor
280: sixth transfer line 281: sixth electronically controlled valve
282: sixth pressure sensor 290: eighth conveyance line
291: Eighth electronic control valve 300: Temperature control unit
310: first electronic expansion valve 320: second electronic expansion valve
330: fifth transfer line 331: fifth electronically controlled valve
332: fifth pressure sensor 340: seventh conveyance line
341: seventh electronic control valve 400: heater

Claims (4)

A process facility 100 in which a predetermined working fluid is circulated;
A compressor 210 for increasing the pressure of the working fluid flowing out of the processing facility 100 through a first conveying line 110 having a first electronic control valve 111 and a first pressure sensor 112; )Wow,
A condenser 220 for condensing the working fluid flowing from the compressor 210 through a second conveyance line 250 having a second electromagnetic control valve 251 and a second pressure sensor 252, ,
A main body 200 having a liquid receiver 230 in which the working fluid introduced from the condenser 220 is temporarily stored through a third transfer line 260; And
The amount of the working fluid flowing from the receiver (230) through the fourth transfer line (270) including the fourth and fifth pressure sensors (271, 272) A first electronic expansion valve 310 for supplying the working fluid to the process facility 100 through a fifth transfer line 330 having a first pressure sensor 331 and a fifth pressure sensor 332,
The working fluid delivered through the second transfer line 250 is diverted to the compressor 210 through a sixth transfer line 280 having a sixth electronic control valve 281 and a sixth pressure sensor 282. [ ) For supplying the working fluid to the fifth transfer line (330) through a seventh transfer line (340) having a seventh electronic control valve (341) by controlling the amount of the working fluid flowing from the first transfer line And a temperature control unit 300 having an expansion valve 320,
The main body 200 further includes a storage tank 240 in which the working fluid introduced from the compressor 210 is stored through an eighth transfer line 290 having an eighth electronic control valve 291 And a refrigerant recovery system of an apparatus temperature control apparatus. The method according to claim 1,
And a heater (400) is further installed on the sixth transfer line (280). The method according to claim 1,
Wherein the temperature control unit (300) is located closer to the process facility (100) than the main unit (200). a) The eighth electronic control valve 291 installed on the eighth conveyance line 290 is opened while the second electronic control valve 251 installed on the second conveyance line 250 is shut off and the compressor 210 to the storage tank 240 and storing the working fluid;
and b) a fourth electron (e) disposed on the fourth transfer line (270) when the pressure of the working fluid sensed by the second pressure sensor (252) installed on the second transfer line (250) A second step of blocking the sixth control valve 281 provided on the control valve 271 and the sixth transfer line 280, respectively;
c) the pressure of the working fluid sensed by the fourth pressure sensor 272 installed on the fourth transfer line 270 and the sixth pressure sensor 282 installed on the sixth transfer line 280, The fifth electronically controlled valve 331 disposed on the fifth conveyance line 330 and the seventh electronically controlled valve 341 provided on the seventh conveyance line 340 when the temperature of the third conveyance line 340 is lower than the predetermined value, step;
d) when the pressure of the working fluid sensed by the fifth pressure sensor (332) installed on the fifth transfer line (330) drops below a predetermined value, the first electron A fourth step in which the control valve 111 is shut off;
e) when the pressure of the working fluid sensed by the first pressure sensor (112) installed on the first transfer line (110) falls below a predetermined value, the eighth transfer line (290) 8 is a fifth step in which the electronic control valve 291 is shut off; And
and f) stopping the operation of the compressor (210). A method of recovering refrigerant in an apparatus for controlling temperature of a semiconductor and LCD manufacturing process, comprising:

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