KR101523228B1 - System and method for charging refrigerant of temperature control system for semiconductor manufacturing process facilities using an intermediation of gas - Google Patents

Abstract

The present invention relates to a refrigerant charging system and a method for charging a refrigerant in a semiconductor manufacturing system using gas as a mediator, and more particularly, to a refrigerant charging system using a process facility in which refrigerant gas is circulated, A compressor for increasing the pressure of the refrigerant gas flowing out of the process facility through a first transfer line having a pressure sensor and a second transfer line including a second electronic control valve and a second pressure sensor, A condenser for condensing the refrigerant gas and a liquid receiver for temporarily storing the refrigerant gas flowing from the condenser through the third transfer line; The amount of the refrigerant gas flowing from the receiver through the fourth transfer line having the sensor is controlled so that the process equipment through the fifth transfer line having the fourth electronic control valve and the fourth pressure sensor And a refrigerant gas flowed through the second transfer line is branched into a refrigerant flowing from a compressor through a sixth transfer line having a fifth electronic control valve and a fifth pressure sensor, And a second electronic expansion valve for controlling the amount of gas to supply the refrigerant gas to the fifth transfer line through a seventh transfer line having a sixth electronic control valve, And a supply line having an eighth electronic control valve for supplying a refrigerant gas from a supply tank to the fifth transfer line, wherein each of the pressure sensors And a control unit for integrally controlling each of the electronic control valves, wherein the control unit is configured to set a reference pressure value of a pressure sensed through each of the pressure sensors, And a refrigerant charging system of a gas-mediated semiconductor manufacturing plant construction cost temperature control system.
According to the present invention, it is possible to check whether or not the refrigerant filled in the flow path of the temperature control system for controlling the temperature of the semiconductor manufacturing process facility by using gas is used, without using a liquid cooling fluid, There is an effect to be charged.

Description

Technical Field [0001] The present invention relates to a refrigerant charging system for a temperature control system and a refrigerant charging method using the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a refrigerant charging system of a semiconductor manufacturing system, and more particularly to a system for charging a refrigerant in a temperature control system that uses a gas to control the temperature of a semiconductor manufacturing process facility And more particularly, to a refrigerant charging system and a charging method of a semiconductor manufacturing facility temperature control system using a gas as a medium capable of charging a refrigerant at a high speed in a short time while checking whether or not the refrigerant leaks.

Generally, in the process of manufacturing semiconductors and LCDs, the internal temperature of the electrostatic chuck, the heater, and the chamber must be kept constant at all times, The equipment that plays the role of maintenance is called a chiller.

Such semiconductor and LCD process equipments are subjected to thermal load during the manufacturing process of semiconductors and the temperature rises. Semiconductor and LCD chillers are used to circulate the cooling fluid inside electrostatic chuck, heater and chamber by using a pump The heat load is removed by chiller to remove heat.

In this case, the semiconductor and LCD chiller can be classified into a low-temperature chiller and a high-temperature chiller according to the target cooling temperature of the cooling fluid recovered to the main body, and the low-temperature chiller generally uses a cooling cycle using a freon gas, And a high temperature chiller (or a heat exchanger type chiller) is a system for cooling a cooling fluid by using a predetermined refrigerant.

The purpose of using the refrigerant of the temperature control system applied to the conventional semiconductor manufacturing process facility is to use the cooling of the brine (or coolant) used for the secondary refrigeration for the primary refrigeration cycle, Was pressurized and filled with a constant pressure inside the chiller.

However, since the present invention uses the refrigerant as the secondary refrigerant, it directly affects the temperature of the object to be controlled.

Therefore, decomposition and assembly are more frequent than when it is used in the existing primary refrigeration, and since it is directly related to temperature control, there is a need for a method that can be refined in a more precise and improved manner.

Korean Utility Model Publication No. 20-2008-0004784 (published on October 22, 2008) Korean Registered Patent No. 10-1109728 (issued on January 18, 2012) Korean Registered Patent No. 10-1109730 (issued on February 24, 2012) Korean Registered Patent No. 10-0927391 (published on Nov. 19, 2009)

It is an object of the present invention to provide a temperature control system for controlling the temperature of a semiconductor manufacturing process facility using a gas without using a liquid cooling fluid while checking whether or not the refrigerant charged in the flow path of the temperature control system is leaking, And a method for charging a refrigerant and a method for charging the refrigerant in a semiconductor manufacturing system using a gas capable of being charged.

According to an aspect of the present invention, there is provided a method for controlling a pressure of a refrigerant gas flowing out of the processing facility through a first transfer line having a first electronic control valve and a first pressure sensor, A condenser for condensing the refrigerant gas introduced from the compressor through a second transfer line having a second electronic control valve and a second pressure sensor, and a condenser for condensing the refrigerant gas flowing through the third transfer line A main body including a liquid receiver for temporarily storing the refrigerant gas introduced from the condenser, a second inlet for receiving the refrigerant introduced from the receiver through a fourth transfer line having a third electronic control valve and a third pressure sensor, A first electronic expansion valve for controlling the amount of refrigerant gas to supply the refrigerant gas to the process facility through a fifth transfer line including a fourth electronic control valve and a fourth pressure sensor, Wherein the refrigerant gas flowing through the sixth electronic control valve and the fifth pressure sensor is branched to control the amount of the refrigerant gas flowing from the compressor through the sixth transfer line including the fifth and fifth pressure sensors, And a second electronic expansion valve for supplying the refrigerant gas to the fifth transfer line through the seventh transfer line, wherein the seventh electronic control valve is branched from the process facility and the first electronic control valve, And a supply line having an eighth electronic control valve for supplying the refrigerant gas from the supply tank to the fifth transfer line, wherein the pressure value sensed by each of the pressure sensors is received, And a control unit for integrally controlling each of the electronic control valves, wherein the main control unit includes a setting unit for setting a reference pressure value of a pressure sensed by each of the pressure sensors, And a roller portion.

The main body includes a reservoir tank in which the refrigerant gas introduced from the compressor is stored through an eighth conveyance line having a ninth electronic control valve and a reservoir tank branched from the first conveyance line, And a vacuum pump installed in the transfer line.

And the temperature control unit is disposed closer to the process facility than the main body unit.

According to another aspect of the present invention, there is provided a method of controlling an electronic apparatus, comprising: setting a reference sensed value of a first to a fifth pressure sensor by a setting unit of a main controller unit; The first to sixth and the tenth electronic control valves are opened by the control unit of the main controller unit, the seventh to ninth electronic control valves are shut off by the control unit, Wherein the tenth electronic control valve is interrupted by the control unit when the reception unit of the main controller unit receives the reference sensed value of the first through fifth pressure sensors preset by the setting unit, When the control valve is further opened and the receiving unit receives the reference value more than the reference sensed value of the first to fifth pressure sensors predetermined by the setting unit, It comprises a step of claim 9 the material blocking electromagnetic control valve.

The present invention relates to a temperature control system for controlling the temperature of a semiconductor manufacturing process facility using a gas without using a liquid cooling fluid while checking whether or not the refrigerant charged in the flow path of the temperature control system is leaked and at the same time, It is effective.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate preferred embodiments of the invention and, together with the description, serve to further the understanding of the technical idea of the invention, And shall not be construed as interpretation.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing an example of a system for charging a refrigerant in a gas control system for a semiconductor manufacturing plant according to an embodiment of the present invention;
FIG. 2 is a flowchart illustrating a method of charging a refrigerant in a semiconductor manufacturing system using a gas medium according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a refrigerant charging system and a charging method of a gas-mediated semiconductor manufacturing plant construction cost temperature control system according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a view illustrating an example of a system for filling a refrigerant in a semiconductor manufacturing system using a gas medium according to an embodiment of the present invention. FIG. 2 is a schematic view of a gas- FIG. 2 is a flowchart showing a method of charging a refrigerant in a cost temperature control system. FIG.

1 and 2, a refrigerant charging system of a gas-mediated semiconductor manufacturing plant construction cost control system according to a preferred embodiment of the present invention includes a processing facility 100, a main body 200, a temperature controller 300 And a main controller 400, which will be described in detail as follows.

First, the process facility 100 refers to a process facility used in a manufacturing process of a semiconductor, such as an electrostatic chuck, a heater, and a chamber.

The process facility 100 controls the temperature of the process facility 100 while circulating the refrigerant gas.

The main body 200 includes a compressor 210 for compressing the refrigerant gas at high temperature and high pressure, a condenser 220 for condensing the refrigerant gas, and a receiver 230 for temporarily storing the refrigerant gas.

The temperature control unit 300 includes a first electronic expansion valve 310 and a second electronic expansion valve 320.

It is preferable that the temperature control unit 300 is located closer to the process facility 100 than the main body 200. That is, the first electronic expansion valve 310 and the second electronic expansion valve 320 is located near the process facility 100, there is an advantage in that the accuracy of temperature control of the coolant gas flowing into the process facility 100 and controlling the temperature is improved.

That is, by separating the main body 200, which occupies a lot of space, and the temperature controller 300, which is relatively small in volume and occupying less space, the space can be efficiently utilized and the temperature can be controlled more precisely .

The first electronic expansion valve 310 and the second electronic expansion valve 320 may be connected to the process facility 100 or to the second electronic expansion valve 320 through the first and second electronic expansion valves 310 and 320, Respectively.

That is, in the case of the first electronic expansion valve 310, the temperature of the processing facility 100 is controlled through the relatively low-temperature refrigerant gas, and the second electronic expansion valve 320 is controlled by the refrigerant gas The temperature of the process facility 100 is controlled.

That is, for example, the refrigerant controlling the low temperature passes through the first electronic expansion valve 310 at a high pressure and a low temperature and is transformed to a temperature of about minus 20 degrees or less to control the low temperature and the refrigerant for controlling the high temperature, ) To the second electronic expansion valve (320) and is thermally turned to a temperature of about 70 to 80 degrees to control the high temperature.

Here, the receiver 230 condenses the high-temperature and high-pressure refrigerant gas supplied from the compressor 210 to the PCW (Process Cooling Water) in the condenser 220, and then supplies the refrigerant gas to the first electronic expansion valve And is stored temporarily before being sent to the compressor 310. When at least one process facility is operated using one compressor 210, a disturbance such as a set temperature conversion of a different process facility or a change in a cooling load is applied It is possible to stabilize the overall refrigeration cycle system.

The main body 200 includes a reservoir tank 240 in which the refrigerant gas flowing from the compressor 210 is stored, and a reservoir tank 240 for removing impurities such as air or other foreign matter remaining in the respective transfer lines. And a vacuum pump 290 for removing impurities by making vacuum.

Further, a discharge line 350 and a supply line 360 for supplying the refrigerant gas from the supply tank 370 may be further provided.

The main controller 400 includes a receiving unit 410, a setting unit 420, and a control unit 430.

The receiving unit 410 receives pressure values sensed through the respective pressure sensors.

The setting unit 420 sets a reference pressure value of the pressure sensed through each of the pressure sensors.

The control unit 430 integrally controls each of the electronic control valves.

Hereinafter, a refrigerant charging system and a charging method in a semiconductor manufacturing facility air conditioning system for controlling the temperature of a gas medium according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG.

As described above, the refrigerant charging system and the charging method of the gas-mediated semiconductor manufacturing system temperature control system according to the preferred embodiment of the present invention include a first circulation path for controlling the temperature at a low temperature, And a second circulation path for temperature control.

The refrigerant gas discharged from the process facility 100 flows into the compressor 210 through the first transfer line 110. In the first circulation path,

At this time, a first electromagnetic control valve 111 and a first pressure sensor 112 are installed in the first transfer line 110 and are discharged from the process facility 100 through the first transfer line 110 The refrigerant gas can be shut off by the first electronic control valve 111 and the refrigerant gas pressure inside the first transfer line 110 is sensed by the first pressure sensor 112.

Then, the refrigerant gas that flows into the compressor 210 and is pressurized at a high temperature and a high pressure is discharged and flows into the condenser 220 through the second transfer line 250.

A second electromagnetic control valve 251 and a second pressure sensor 252 are installed in the second conveyance line 250 and the refrigerant discharged from the compressor 210 through the second conveyance line 250 The gas can be shut off by the second electromagnetic control valve 251 and the refrigerant gas pressure inside the second transfer line 250 is detected by the second pressure sensor 252.

Here, a reservoir tank 240 in which the refrigerant gas flowing from the compressor 210 is stored is provided through an eighth conveyance line 242 having a tenth electronic control valve 241.

That is, when the refrigerant gas flowing through the second transfer line 250 is blocked by the second electromagnetic control valve 251, the ninth electromagnetic control valve 241 is opened and the eighth transfer line 242 is opened, And the refrigerant gas is introduced into the reservoir tank 240 through the refrigerant passage.

Then, the refrigerant gas flowing into the condenser 220 and condensed therein is discharged, is introduced into the receiver 230 through the third transfer line 260, and temporarily stored.

The refrigerant gas flowing into the receiver (230) and temporarily stored therein is then introduced into the first electronic expansion valve (310) through the fourth transfer line (270).

At this time, a third electromagnetic control valve 271 and a third pressure sensor 272 are installed on the fourth conveyance line 270 and are discharged from the receiver 230 through the fourth conveyance line 270 The refrigerant gas can be shut off by the third electromagnetic control valve 271 and the refrigerant gas pressure inside the fourth transfer line 270 is detected by the third pressure sensor 272.

Then, the refrigerant gas that flows into the first electronic expansion valve 310 and is thermally expanded is introduced into the process facility 100 through the fifth transfer line 330.

A fourth electromagnetic control valve 331 and a fourth pressure sensor 332 are installed in the fifth conveyance line 330 and are connected to the first electronic expansion valve 310 through the fifth conveyance line 330. [ The refrigerant gas pressure in the fifth transfer line 330 is sensed by the fourth pressure sensor 332. The refrigerant gas pressure in the fifth transfer line 330 is detected by the fourth pressure sensor 332. [

The refrigerant gas pressurized at the high temperature and high pressure fed through the second conveyance line 250 is branched through the sixth conveyance line 280 to the second electronic expansion valve (320).

A fifth electromagnetic control valve 281 and a fifth pressure sensor 282 are installed in the sixth conveyance line 280 so that the refrigerant gas branched through the sixth conveyance line 280 flows into the fifth electron The pressure of the refrigerant gas inside the sixth transfer line 280 is sensed by the fifth pressure sensor 282.

The refrigerant gas flowing into the second electronic expansion valve 320 is then transferred through the seventh transfer line 340 to the fifth transfer line 330.

A sixth electronic control valve 341 is installed on the seventh transfer line 340 so that refrigerant gas discharged from the second electronic expansion valve 320 through the seventh transfer line 340 flows through the seventh transfer line 340, 6 electromagnetic control valve 341. [0156]

In the case of the first circulation path, the refrigerant for the temperature control of the high temperature is circulated for the low temperature control, and in the case of the second circulation path, the refrigerant for the high temperature control is circulated.

A discharge line 350 branched from the process facility 100 and the first electronic control valve 111 and having a seventh electronic control valve 351; And a supply line 360 supplying the gas from the supply tank 370 with an eighth electronic control valve 361.

A receiving unit 410 receives a pressure value sensed by each of the pressure sensors and a sensed value of the level sensor 371, and a setting unit that sets a reference pressure value of a pressure sensed through each of the pressure sensors And a main controller 400 having a control unit 430 for integrally controlling each of the electronic control valves.

Hereinafter, a method of charging a refrigerant in a system for controlling the temperature of a semiconductor manufacturing facility using a gas as a medium according to an embodiment of the present invention will be described with reference to FIG.

For example, the reference sensing values of the first to fifth pressure sensors 112, 252, 272, 332, and 282 are set by the setting unit 420 of the main controller 400 (step S100).

Then, the control unit 430 of the main controller 400 cuts off the seventh to ninth electronic control valves 351, 361, and 241 (step S200).

Then, the vacuum pump 290 installed in the ninth transfer line 292 having the tenth electronic control valve 291 is driven (step S300).

Next, the first to sixth and tenth electronic control valves 111, 251, 271, 331, 281, 341 and 291 are opened by the control unit 430 (step S400).

Next, the reception unit 410 of the main controller unit 400 is set below the reference sensing values of the first to fifth pressure sensors 112, 252, 272, 332, and 282 set by the setting unit 420, The control unit 430 disconnects the tenth electronic control valve 291 (step S500).

Then, the control unit 430 further opens the ninth electromagnetic control valve 241 (step S600).

Finally, when the receiving unit 410 receives the reference sensed values of the first to fifth pressure sensors 112, 252, 272, 332, and 282 set by the setting unit 420, The ninth electromagnetic control valve 241 is shut off again (step S700).

That is, after mounting the process facility 100, the seventh to ninth electronic control valves 351, 361, and 241 are shut off, and then the vacuum pump 290 is operated, and the first to sixth and eighth electronic control The valves 111, 251, 271, 331, 281, 341 and 291 are opened to pump the transfer line through which the refrigerant gas is passed, the pressure of the residual refrigerant gas in the transfer line is pumped to be less than a predetermined value, When the ninth electronic control valve 241 is opened and the tenth electronic control valve 291 on the pump 290 side is shut off and the refrigerant gas stored in the reservoir tank 240 of the temperature control system is supplied to the compressor 210, The pressure of the pressure sensor installed at the electronic control valve side of each conveying line flowing into each electronic control valve of the conveying line 220, the receiver 230, the process facility 100 and the conveying line is equal to or more than a preset value, The ninth electronic control valve 241 on the side of the reservoir tank 240 is shut off so that the operation of the temperature control system is ready It will be charges.

It consists of an electronic control valve and a pressure sensor between each module and the module, so that the gas refrigerant can be charged without any leakage after checking the desired pressure in the flow path.

Also, there is a method to charge the refrigerant quickly during PM (ESC replacement) and a method to safely charge the refrigerant at the time of installation or set up, so that the method of charging the refrigerant gas according to the condition of the line and equipment can be selected have.

By not using the expensive liquid refrigerant, the cost reduction effect can be obtained.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, And such variations and modifications are intended to fall within the scope of the appended claims.

100: Process equipment
110: 1st transfer line
111: first electronic control valve
112: first pressure sensor
200:
210: compressor
220: condenser
230: Receiver
240: reservoir tank
241: the ninth electronic control valve
242: Eighth conveyance line
250: 2nd transfer line
251: second electronic control valve
252: second pressure sensor
260: Third transfer line
270: Fourth transfer line
271: third electronic control valve
272: Third pressure sensor
280: Sixth transfer line
281: fifth electronically controlled valve
282: fifth pressure sensor
290: Vacuum pump
291: 10th electronically controlled valve
292: Ninth conveying line
300: Temperature controller
310: first electronic expansion valve
320: second electronic expansion valve
330: fifth transfer line
331: fourth electronically controlled valve
332: Fourth pressure sensor
340: seventh transfer line
341: Sixth electronically controlled valve
350: exhaust line
351: seventh electronically controlled valve
360: Supply line
361: Eighth electronic control valve
370: Supply tank
400: main controller unit
410:
420: Setting section
430:

Claims (4)

A process facility 100 in which refrigerant gas is circulated;
A compressor 210 for increasing the pressure of the refrigerant gas flowing out of the processing facility 100 through a first transfer line 110 having a first electronic control valve 111 and a first pressure sensor 112, )Wow,
A condenser 220 for condensing the refrigerant gas introduced from the compressor 210 through a second transfer line 250 having a second electronic control valve 251 and a second pressure sensor 252, ,
A main body 200 having a liquid receiver 230 for temporarily storing the refrigerant gas flowing from the condenser 220 through a third transfer line 260;
It is possible to control the amount of the refrigerant gas flowing from the receiver 230 through the fourth transfer line 270 having the third and the third pressure sensors 271 and 272, A first electronic expansion valve 310 for supplying the refrigerant gas to the process facility 100 through a fifth transfer line 330 having a first pressure sensor 331 and a fourth pressure sensor 332, The refrigerant gas delivered through the line 250 is branched and flows from the compressor 210 through a sixth transfer line 280 having a fifth electronic control valve 281 and a fifth pressure sensor 282 A second electronic expansion valve 320 for controlling the amount of the refrigerant gas to supply the refrigerant gas to the fifth transfer line 330 through a seventh transfer line 340 having a sixth electronic control valve 341 And a temperature control unit 300,
A discharge line 350 branched from the process facility 100 and the first electronic control valve 111 and having a seventh electronic control valve 351; And a supply line (360) supplied from a supply tank (370) and having an eighth electronic control valve (361)
A setting unit 420 for setting a reference pressure value of a pressure sensed by each of the pressure sensors, And a main controller (400) having a control unit (430) for integrally controlling the valves,
The main body 200 includes a reservoir tank 240 in which the refrigerant gas flowing from the compressor 210 is stored through an eighth conveyance line 242 having a ninth electronic control valve 241, And a vacuum pump (290) installed in a ninth transfer line (292) branched from the first transfer line (110) and having a tenth electronic control valve (291). Refrigerant charging system of temperature control system. delete The method according to claim 1,
Wherein the temperature control unit (300) is disposed closer to the process facility (100) than the main body unit (200). A refrigerant charging method using a refrigerant charging system of a semiconductor manufacturing system,
a) a first step in which the reference sensing values of the first to fifth pressure sensors 112, 252, 272, 332, and 282 are preset by the setting unit 420 of the main controller unit 400;
b) blocking the seventh to ninth electromagnetic control valves 351, 361, and 241 by the control unit 430 of the main controller unit 400;
c) a third step of driving a vacuum pump 290 installed in a ninth transfer line 292 having a tenth electronic control valve 291;
d) opening the first to sixth and tenth electronic control valves 111, 251, 271, 331, 281, 341 and 291 by the control unit 430;
and e) the receiving unit 410 of the main controller unit 400 receives the reference sensed values of the first through fifth pressure sensors 112, 252, 272, 332, and 282 set by the setting unit 420 A fifth step in which the tenth electronic control valve 291 is blocked by the control unit 430;
f) further opening the ninth electromagnetic control valve (241) by the control unit (430); And
g) When the receiving unit 410 receives the reference sensed values of the first to fifth pressure sensors 112, 252, 272, 332, and 282 set by the setting unit 420, And a seventh step of re-interrupting the ninth electronic control valve (241) by means of the third electronic control valve (241).

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