KR101438182B1 - Attachment for controlling the flow rate and temperature of brine - Google Patents

Attachment for controlling the flow rate and temperature of brine Download PDF

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Publication number
KR101438182B1
KR101438182B1 KR1020140079090A KR20140079090A KR101438182B1 KR 101438182 B1 KR101438182 B1 KR 101438182B1 KR 1020140079090 A KR1020140079090 A KR 1020140079090A KR 20140079090 A KR20140079090 A KR 20140079090A KR 101438182 B1 KR101438182 B1 KR 101438182B1
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South Korea
Prior art keywords
brine
pipe
temperature
outlet
heat exchanger
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KR1020140079090A
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Korean (ko)
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김태현
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(주)제이티에스코리아
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Priority to KR1020140079090A priority Critical patent/KR101438182B1/en
Application granted granted Critical
Publication of KR101438182B1 publication Critical patent/KR101438182B1/en
Priority to PCT/KR2015/006328 priority patent/WO2015199399A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Other Air-Conditioning Systems (AREA)

Abstract

The present invention relates to an apparatus for stably controlling the processing temperature during a semiconductor process or the like and, more specifically, to an attachment for controlling the flow and the temperature of brine, which is installed near semiconductor equipment and can accurately control the temperature of brine supplied to the semiconductor equipment from a chiller using a freezing cycle. An attachment for controlling the flow and the temperature of brine of the present invention cools brine by exchanging heat with a coolant in an operating mode at high temperature. Therefore, power consumption due to unnecessary refrigerant cycle operation of the chiller can be reduced. Also, a heater operation to maintain the temperature of brine required for semiconductor processing equipment can be minimized by controlling the flow of the coolant even in the case of heat-exchanging with the coolant. In addition, the attachment for controlling the flow and the temperature of brine of the present invention can be easily installed in the existing semiconductor processing equipment. Moreover, the attachment for controlling the flow and the temperature of brine of the present invention can control not only the temperature of brine but also the flow.

Description

[0002] Attachment for controlling the flow rate and temperature of brine [

The present invention relates to a device used for stable process temperature control in a semiconductor process or the like, and more particularly, to a device that can be installed close to a semiconductor device to precisely control the temperature of a brine supplied to a semiconductor device from a chiller using a refrigeration cycle And an additional device for controlling the brine temperature and the flow rate.

Chiller is a temperature control device for stable process control in semiconductor device manufacturing process.

Typically, the semiconductor process is performed in accordance with a predetermined order in a process chamber of each unit process, and various kinds of auxiliary devices are configured so that a normal process can be performed in the process chamber.

In addition, the semiconductor process includes a process environment requiring a high temperature such as an oxidation process. Alternatively, each component or ancillary equipment installed to perform a semiconductor process may be self-generated.

In order to proceed with a normal semiconductor process, both the former and the latter must be cooled to a certain temperature or below, and a coolant circulation system is configured in the semiconductor process facility.

Therefore, a chiller is required for stable process control in a semiconductor device manufacturing process. In particular, in the semiconductor device manufacturing process, chiller is mainly used in etching and exposure processes in various processes. By maintaining the temperature of the electrode plate and chamber where excessive heat is generated during the process, the wafer is damaged and productivity And the like.

A conventional chiller for absorbing heat generated during the process of equipment used in a semiconductor process is configured as shown in Fig.

4, the conventional chiller apparatus 10 includes a path 12 of a refrigerant cooled through a refrigeration cycle and a path 12 of a brine which is a fluid circulating inside the semiconductor processing facility 1 Is superimposed on the chiller heat exchanger 13 to lower the temperature of the brine, and then the brine is heated again using the heater 18 to keep the temperature of the brine constant.

Hereinafter, the circulation path of the refrigerant will be described first, and then the circulation path of the brine will be described.

The refrigerant changed from the compressor (14) to the high temperature and high pressure state is condensed while releasing heat from the condenser (15). The refrigerant that has released heat is decompressed through the expansion valve 16 after being liquefied, and becomes a low-temperature and low-pressure liquid state. The refrigerant which has passed through the expansion valve 16 absorbs heat in the chiller heat exchanger 13 and evaporates.

The brine circulating in the semiconductor process facility 1 flows into the heat exchanger through the brine inlet 2. [ The brine having undergone the heat exchange with the refrigerant in the chiller heat exchanger 13 is heated by the heating heater 18 and then flows into the semiconductor processing facility 1 through the brine outlet 3 again.

In the conventional chiller 10, when the temperature of the brine required in the semiconductor processing facility 1 is relatively high, the brine cooled by the heat exchange with the refrigerant is heated again through the heater 18, (1), there is a problem that unnecessary power consumption is excessively large.

It is an object of the present invention to provide an attachment capable of minimizing the power consumption of a chiller using a refrigeration cycle and controlling the temperature and flow rate of the brine. Another object of the present invention is to provide an additional device for brine temperature and flow control, which can be easily installed between existing process equipment and chiller without changing the existing process equipment and the structure of the chiller.

In order to achieve the above object, a brine temperature and flow rate control device according to the present invention is installed between a process facility where a brine is used for process temperature control and a chiller.

This device is supplied to the first inlet, which is a path through which the brine circulating process equipment is introduced, the second inlet which is a passage through which the brine passes through the chiller, the first outlet which is a passage through which the brine supplied to the chiller is discharged, And a second outlet which is a passage through which the brine is discharged.

It is also possible to supply cooling water to the second heat exchanger and the first heat exchanger configured to cause heat exchange between the brine cooled by the chiller and the brine supplied from the process facility so that heat exchange takes place between the cooling water and the brine And a cooling water pipe.

The first brine pipe forming a path connecting the first inlet, the first heat exchanger and the first outlet, and the second brine pipe forming a path connecting the second inlet, the second heat exchanger and the first brine pipe, A third brine pipe forming a path connecting the pipe, the first brine pipe, the second heat exchanger and the second outlet; and a third brine pipe provided between the second inlet side second brine pipe and the second outlet side third brine pipe And a brine pipe having a first bypass pipe and configured to allow the brine to flow.

A first three-way valve installed in the first brine pipe and configured to connect the first brine pipe and the third brine pipe, and a second three-way valve installed in the first brine pipe and configured to connect the first brine pipe and the second brine pipe, And a third three-way valve installed in the second brine pipe and configured to connect the second brine pipe and the first bypass pipe.

In the high temperature operation mode, the brine introduced through the first inlet is discharged to the first outlet after the heat exchange with the cooling water in the first heat exchanger, and the brine introduced through the second inlet is discharged to the second outlet, , The second three-way valve and the third three-way valve are controlled. In the low-temperature operation mode, the brine introduced through the first inlet is discharged to the second outlet after heat exchange with the brine cooled in the chiller in the second heat exchanger, And a controller configured to control the first three-way valve, the second three-way valve, and the third three-way valve so that the cooled brine introduced through the first heat exchanger is discharged to the first outlet after heat exchange with the brine supplied from the process facility in the second heat exchanger .

The above-described brine temperature and flow control addition apparatus preferably further includes a cooling water flow rate control valve provided in the cooling water pipe. It is also preferable to further include a first brine flow rate control valve provided in the second brine pipe.

It is preferable to further include a second bypass pipe provided between the first inlet-side first brine pipe and the second outlet-side third brine pipe, and a second brine flow rate control valve provided in the second bypass pipe . Here, the third brine pipe is provided with a flow rate sensor, and the controller is preferably configured to receive the brine flow rate data from the flow rate sensor and to control the second brine flow rate control valve.

It is further preferred that the apparatus further comprises temperature sensors respectively installed in the first inlet, the second inlet, the first outlet, and the brine pipe adjacent to the second outlet.

The apparatus may further include a brine storage tank installed in a third brine pipe between the second heat exchanger and the second outlet.

The brine temperature and flow control addition device according to the present invention cools the brine through heat exchange with the cooling water in the high temperature operation mode. Therefore, it is possible to reduce the power consumption due to the operation of the refrigerant cycle of the unnecessary chiller. Further, by controlling the flow rate of the cooling water even in the heat exchange with the cooling water, heater operation for maintaining the brine temperature required in the semiconductor processing facility can be minimized.

Further, the brine temperature and flow control device according to the present invention can be easily installed in a conventional semiconductor process facility.

In addition, the brine temperature and flow control device according to the present invention can control not only the temperature of the brine but also the flow rate.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a configuration diagram showing a state in which an additional device for controlling brine temperature and flow rate according to the present invention is installed between a refrigeration chiller and a process facility.
Figs. 2 and 3 are flowcharts of the brine temperature and flow control device shown in Fig. 1. Fig.
4 is a flow diagram of a conventional refrigeration chiller.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a configuration diagram showing a state in which an additional device for controlling brine temperature and flow rate according to the present invention is installed between a refrigeration chiller and a process facility. Figs. 2 and 3 are flowcharts of the brine temperature and flow control device shown in Fig. 1. Fig.

1, the brine circulating the process facility 1 is supplied to the brine temperature and flow rate controlling device 20 through the first inlet 21. [ The brine supplied to the brine temperature and flow rate control device 20 is supplied to the chiller 10 through the first outlet 22. The brine having passed through the chiller 10 is supplied to the brine temperature and flow rate controlling device 20 through the second inlet 23. The brine having passed through the brine temperature and flow control addition device 20 is again supplied to the process facility 1 through the second outlet 24.

The brine temperature and flow rate controlling additional device 20 and the brine temperature and flow rate controlling additional device 20 and the freezing chiller 10 are connected by communication lines 35 and 37 respectively. The set temperature value transmitted from the process facility 1 is transmitted to the brine temperature and flow rate control device 20 and the brine temperature and flow rate control device 20 controls the temperature of the refrigeration chiller 10 and the brine temperature, And controls the flow control adding device 20.

In the low temperature processing mode in which the brine setting temperature of the process facility 1 is low, the brine temperature and flow rate controlling device 20 operates the freezing chiller 10 and does not operate in the high temperature operating mode in which the set temperature is high.

Figs. 2 and 3 are flowcharts of the brine temperature and flow control device shown in Fig. 1. Fig. Hereinafter, referring to FIGS. 2 and 3, a more detailed description will be given.

2 and 3, the brine temperature and flow control addition device 20 includes a first heat exchanger 25, a second heat exchanger 26, a cooling water pipe 27, a brine pipe 28, a brine A storage tank 29 and a controller 30. [

In the first heat exchanger (25), heat exchange occurs between the cooling water and the brine supplied from the process facility (1). As the first heat exchanger 25, various types of heat exchangers such as a coil type, a double tube type and a multi-tube type can be used.

In the second heat exchanger (26), heat exchange occurs between the brine cooled by the chiller (10) and the brine supplied from the process facility (1). The second heat exchanger 26 may also use various types of heat exchangers.

The cooling water pipe 27 supplies cooling water (PCW) of about 23 ° C. to the first heat exchanger 25 and forms a path for recovering the cooling water that has been heat-exchanged with the brine supplied from the processing facility 1. The cooling water pipe 27 is provided with a cooling water flow rate control valve 34 for controlling the flow rate of the cooling water.

The brine piping 28 forms a path through which the brine supplied from the process facility 1 and the cooled brine supplied from the chiller 10 flows. The brine pipe 28 includes a first brine pipe 28-1, a second brine pipe 28-2 and a third brine pipe 28-3. The first brine pipe 28-1 forms a path connecting the first inlet 21, the first heat exchanger 25 and the first outlet 22. [ A first three-way valve 31 and a second three-way valve 32 are provided in the first brine pipe 28-1.

The second brine pipe 28-2 forms a path connecting the second inlet port 23, the second heat exchanger 26 and the second three-way valve 32 of the first brine pipe 28-1. A third three-way valve 33 is provided in the second brine pipe 28-2. Further, a first brine flow rate control valve 38 capable of controlling the flow rate of the brine cooled in the chiller 10 is provided.

The third brine pipe 28-3 forms a path connecting the first three-way valve 31, the second heat exchanger 26, and the second outlet 24.

The brine pipe 28 is connected to the first brine pipe 28-3 disposed between the second brine pipe 28-2 on the second inlet 24 side and the third brine pipe 28-3 on the second inlet 24 side. A second bypass pipe 28-2 provided between the first brine pipe 28-1 on the side of the first inlet 21 and the third brine pipe 28-3 on the side of the second outlet 24, -5). A second brine flow rate control valve 39 is provided in the second bypass piping 28-5. The flow rate of the brine supplied to the process facility 1 through the second outlet 24 decreases as more of the second brine flow control valve 39 is opened.

The first three-way valve 31 is connected to the brine temperature and flow control device 20 through the first inlet 21 through the first heat exchanger 25 connected to the first heat exchanger 25, To the third brine pipe (28-3) connected to the brine pipe (28-1) or the second heat exchanger (26). That is, it plays a role of determining whether to send the brine to the first heat exchanger 25 or the second heat exchanger 26.

The second three-way valve 32 serves to deliver the brine passing through the first heat exchanger 25 or the second heat exchanger 26 to the first brine pipe 28-1 connected to the first outlet.

The third three-way valve 33 is connected to the second brine via the second inlet 23 connected to the second heat exchanger 26 via the second inlet 23, To the second bypass pipe 28-5 connected to the pipe 28-2 or the second outlet 24. [

A pump 41 and a brine storage tank 29 are provided in the third brine pipe 28-3. Further, a flow rate sensor 40 is provided on the side of the second outlet 24 of the third brine pipe 28-3.

The controller 30 receives the temperature from the temperature sensors 42 provided in the brine piping 28 adjacent to the first inlet 21, the second inlet 23, the first outlet 22 and the second outlet 24 to the brine temperature And receives the brine flow rate data that is discharged from the flow sensor 40 to the second outlet 24. [ The cooling water flow rate control valve 34, the first brine flow rate control valve 38, the second brine flow rate control valve 39, the first three-way valve 31, The second three-way valve 32, and the third three-way valve 33, respectively. In addition, the compressor and the heater of the chiller 10 can also be controlled.

The controller 30 can control the temperature of the brine discharged from the first heat exchanger 25 by controlling the flow rate of the cooling water flowing in the cooling water pipe 27 by controlling the cooling water flow rate control valve 34. [ In addition, by controlling the first brine flow control valve 38 to regulate the flow rate of the brine cooled by the chiller 10, which flows into the second brine pipe 28-2, the flow rate of the brine discharged from the second heat exchanger 26 The temperature of the brine can be adjusted. Further, by controlling the second brine flow rate control valve 39 to control the flow rate of the brine to be bypassed, the flow rate of the brine discharged to the process facility 1 can also be controlled.

Hereinafter, the operation of the brine temperature and flow control device 20 in the high temperature operation mode with a high set temperature will be described with reference to FIG.

If the brine setting temperature of the process facility 1 is high, that is, if the brine at the set temperature can be supplied to the process facility 1 without activating the cooling cycle of the chiller 10, 10 are turned off. The brine introduced into the brine temperature and flow rate control device 20 from the process facility 1 through the first inlet 21 flows into the first heat exchanger 25 through the first brine pipe 28-1 . Exchanged with the cooling water in the first heat exchanger (25), then discharged through the first outlet (22) through the first brine pipe (28-1), and then supplied to the freezing chiller (10). The controller 30 controls the flow rate of the cooling water based on the temperature data received from the temperature sensors 42 provided in the first brine piping 28-1 near the first inlet 21 and the first outlet 22 34 to control the temperature of the brine.

The brine supplied to the freezing chiller 10 passes through the freezing chiller 10 and then flows back to the brine temperature and flow rate controlling device 20 through the second inlet 23. At this time, since the refrigeration cycle of the chiller 10 does not operate, the temperature of the brine does not greatly change in the state of being cooled by the heat exchange with the cooling water. And is supplied to the process facility 1 through the third three-way valve 33, the first bypass pipe 28-4, and the second outlet 24. [ The controller 30 receives the flow rate data measured by the flow rate sensor 40 provided on the side of the second outlet 24 of the third brine pipe 28-3 and outputs the second brine flow rate control valve 39 . The controller 30 controls the amount of brine discharged through the second outlet 24 by controlling the second brine flow control valve 39. [ The brine not discharged through the second outlet 24 is supplied to the first brine pipe 28-1 through the second bypass pipe 28-5.

In summary, in the high temperature operation mode, the brine temperature and flow rate control device 20 controls the flow rate of the cooling water supplied to the first heat exchanger 25 and the amount of brine flowing through the second bypass pipe 28-5 Thereby adjusting the temperature and flow rate of the brine supplied to the process facility 1.

Hereinafter, the operation of the brine temperature and flow control device 20 in the low temperature operation mode in which the set temperature is low will be described with reference to FIG.

When the brine setting temperature of the process facility 1 is low, the controller 30 operates the compressor of the refrigeration chiller 10. The brine introduced into the brine temperature and flow rate control device 20 through the first inlet 21 in the process facility 1 passes through the first three-way valve 31 of the first brine pipe 28-1, And flows to the brine pipe 28-3. The brine is then subjected to heat exchange with the brine cooled to a low temperature in the second chiller (10) in the second heat exchanger (26). When the heat exchange is completed, the refrigerant is stored in the brine storage tank 290, flows again along the third brine pipe 28-3, is discharged through the second outlet 24, and flows into the process facility 1. At this time, Controls the second brine flow control valve 39 to adjust the amount of brine discharged through the second outlet 24. [

The cold brine introduced into the brine temperature and flow rate control device 20 from the freezing chiller 10 through the second inlet 23 flows through the third three-way valve 33 of the second brine pipe 28-2, Flows into the second heat exchanger (26) through the brine flow control valve (38). The cold brine in the second heat exchanger (26) performs heat exchange with the brine introduced from the process facility (1). And goes to the second three-way valve 32 along the second brine pipe 28-2. The brine having passed through the second three-way valve 32 is discharged to the first outlet 21 via the first brine pipe 28-1. The discharged brine flows into the freezing chiller 10 again. The controller 30 controls the first brine flow control valve 38 to adjust the flow rate of the cold brine. Through which the temperature of the brine discharged to the process facility 1 is regulated.

In summary, in the low temperature operation mode, the brine temperature and flow rate control device 20 controls the flow rate of the cold brine supplied to the second heat exchanger 26 and the flow rate of the brine flowing through the second bypass pipe 28-5 Thereby adjusting the temperature and flow rate of the brine supplied to the process facility 1. [

In the high temperature operation mode, a brine circulating through the process facility 1 flows back to the process facility 1 through both the brine temperature and flow control addition device 20 and the chiller 10. However, in the low temperature operation mode, the brine circulating in the process facility 1 flows into the process facility 1 immediately after the heat exchange in the brine temperature and flow rate control device 20, and the brine circulating the chiller 10 is operated at the brine temperature And flows back to the chiller 10 immediately after the heat exchange in the flow control adding device 20.

This embodiment is different from the conventional example shown in Fig. 4 in that the brine cooled by the chiller 10 in the low temperature operation mode is used for temperature control of the brine supplied from the second heat exchanger 26 to the processing facility 1 There is a big difference from the method. In this embodiment, there is an advantage that the temperature of the brine is precisely controlled again through the heat exchange in the additional device 20 installed close to the process facility 1. [ In addition, there is an advantage that the brine temperature as well as the flow rate are controlled.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

1: Process equipment 10: Chiller
20: Additional device for brine temperature and flow control
21: first inlet 22: first outlet
23: second inlet 24: second outlet
25: first heat exchanger 26: second heat exchanger
27: cooling water piping 28: brine piping
29: brine storage tank 30: controller
31: first three-way valve 32: second three-way valve
33: third three-way valve 34: cooling water flow control valve
35, 37: communication line 38: first brine flow rate control valve
39: second brine flow rate control valve 40: flow rate sensor
41: pump 42: temperature sensor

Claims (7)

A device installed between a chiller and a process facility where a brine is used for process temperature control,
The first inlet, which is the passage through which the brine circulating the process equipment flows, the second inlet which is the passage through which the brine passes through the chiller, the first outlet which is the passage through which the brine supplied to the chiller is discharged, A second outlet,
A first heat exchanger configured to cause heat exchange between the cooling water and the brine,
A second heat exchanger configured to cause heat exchange between the brine cooled by the chiller and the brine supplied from the process facility,
A cooling water pipe configured to supply cooling water to the first heat exchanger,
A first brine pipe forming a path connecting the first inlet, the first heat exchanger and the first outlet, and a second brine pipe forming a path connecting the second inlet, the second heat exchanger and the first brine pipe, A third brine pipe forming a path connecting the first brine pipe, the second heat exchanger and the second outlet, and a third brine pipe forming a path connecting the second brine pipe, the second outlet pipe, A brine pipe provided with a bypass pipe and configured to flow brine,
A first three-way valve installed in the first brine pipe and configured to connect the first brine pipe and the third brine pipe, a second three-way valve installed in the first brine pipe, and configured to connect the first brine pipe and the second brine pipe, A third three-way valve installed in the second brine pipe and configured to connect the second brine pipe and the first bypass pipe,
In the high temperature operation mode, the brine introduced through the first inlet is discharged to the first outlet after heat exchange with the cooling water in the first heat exchanger, and the first three-way valve, In the low temperature operation mode, the brine introduced through the first inlet is discharged to the second outlet after the heat exchange with the brine cooled in the chiller in the second heat exchanger, and the second inlet And a controller configured to control the first three-way valve, the second three-way valve and the third three-way valve so that the cooled brine introduced through the second heat exchanger is discharged to the first outlet after heat exchange with the brine supplied from the process facility in the second heat exchanger Apparatus for temperature and flow control. The method according to claim 1,
And a cooling water flow rate control valve provided in the cooling water pipe. The method according to claim 1,
And a first brine flow rate control valve provided in the second brine pipe. The method according to claim 1,
A second bypass pipe provided between the first brine piping of the first inlet side and the third brine pipe of the second outlet side and a second brine flow rate control valve provided on the second bypass pipe, Additional device. 5. The method of claim 4,
A flow sensor is installed in the third brine pipe,
And the controller is configured to receive the brine flow rate data from the flow rate sensor and to control the second brine flow rate control valve. The method according to claim 1,
Further comprising temperature sensors respectively installed in the first inlet, the second inlet, the first outlet, and the second outlet and the brine pipe adjacent to the brine. The method according to claim 1,
And a brine storage tank installed in a third brine pipe between the second heat exchanger and the second outlet.
KR1020140079090A 2014-06-26 2014-06-26 Attachment for controlling the flow rate and temperature of brine KR101438182B1 (en)

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KR1020140079090A KR101438182B1 (en) 2014-06-26 2014-06-26 Attachment for controlling the flow rate and temperature of brine
PCT/KR2015/006328 WO2015199399A1 (en) 2014-06-26 2015-06-22 Attachment for controlling temperature and flow rate of brine

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101948084B1 (en) * 2018-12-04 2019-02-14 홍석진 Water box system for semiconductor wafer manufacturing

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004014617A (en) 2002-06-04 2004-01-15 Daikin Ind Ltd Semiconductor manufacturing apparatus
JP2006253454A (en) 2005-03-11 2006-09-21 Tokyo Electron Ltd Temperature control system and substrate processor
KR100725720B1 (en) 2005-11-07 2007-06-08 유니셈(주) Chiller apparatus for semiconductor process device
KR100754842B1 (en) 2006-11-01 2007-09-04 (주)피티씨 Chiller apparatus for semiconductor equipment and method controlling the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004014617A (en) 2002-06-04 2004-01-15 Daikin Ind Ltd Semiconductor manufacturing apparatus
JP2006253454A (en) 2005-03-11 2006-09-21 Tokyo Electron Ltd Temperature control system and substrate processor
KR100725720B1 (en) 2005-11-07 2007-06-08 유니셈(주) Chiller apparatus for semiconductor process device
KR100754842B1 (en) 2006-11-01 2007-09-04 (주)피티씨 Chiller apparatus for semiconductor equipment and method controlling the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101948084B1 (en) * 2018-12-04 2019-02-14 홍석진 Water box system for semiconductor wafer manufacturing

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