KR20140097710A - Scribe apparatus - Google Patents

Abstract

Provided in the present invention is a scribing apparatus which comprises an apparatus body with a stage in which a substrate with unit substrates formed with a cutting line as a boundary; a pushing unit installed on the apparatus body to be lifted to be located on the upper stage, and selectively pushing the cutting line formed on the substrate by being lifted; and a separation unit installed on the apparatus body to be lifted to be located on the upper stage, and separating the unit substrates from the cutting line by twisting by being lifted.

Description

[0001] SCRIBE APPARATUS [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a scribe apparatus, and more particularly, to a scribe apparatus capable of simultaneously picking up and tilting unit substrates.

Generally, an LCD, an organic EL panel, an inorganic EL panel, a transmissive projector substrate, a reflective projector substrate, and the like, which are used as a flat panel display, are made of a glass substrate, such as a moth glass panel (MOTHER GLASS PANEL) Panel.

The cutting of the unitary glass panel may be performed by a scribing step of forming a scribe line by pressing a scribe wheel made of a material such as diamond along a line to be cut on the surface of the panel to form a scribe line, Lt; / RTI >

In recent years, development of a low-bezel substrate has been required. When such a substrate is separated by unit substrates, a scribe line for dividing a unit substrate is used as a cutting line, So that the unit substrates are separated upward while being attracted upward.

However, when the unit substrate is simply adsorbed on the substrate requiring the narrow bezel as described above and the substrate is lifted upward to separate the unit substrate, further crack propagation in the cutting line is not smoothly formed, There is a problem that the unit substrate itself is broken.

In addition, in the case of a scribe on seal (SOS) type substrate, since the sealing line is included in the cutting line, there is a problem that the seal line is not normally separated when the unit substrate is separated in the above manner.

A prior art related to the present invention is Korea Unexamined Patent Application Publication No. 10-2010-0058037 (Publication Date: 06/03/2010), which discloses an apparatus for braking a substrate.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a scribe device capable of simultaneously separating unit substrates formed with a cutting line as a boundary while preventing picking up and tilting.

It is another object of the present invention to provide a scribe device capable of effectively separating a seal line along a cutting line when a seal line is formed around a unit substrate including a cutting line.

In a preferred aspect, the present invention provides an apparatus comprising: a device body having a stage on which a substrate on which unit substrates are to be formed is bounded by a cutting line; A pressing unit installed on the apparatus body so as to be positioned above the stage and selectively pressing the cutting line formed on the substrate when the substrate is lifted or lowered; And a separating unit that is vertically installed on the apparatus main body so as to be positioned at an upper portion of the stage, and separates the unit substrate from the cutting line by tilting the unit substrate as the pressing unit is lowered and pressed down after the cutting line is pressed A scribe device is provided.

Preferably, a seal line surrounding each of the unit substrates is formed on the substrate, and the seal line is formed to include the cutting line.

The separating unit may include a second elevating part mounted on the apparatus main body, a grip part holding one of the unit substrates, and a rotating part provided on the second elevating part and rotating the grip part, And the tilting is performed through the rotation of the grip part to separate the unit substrate picked up by the grip part.

Preferably, the separation unit controls the rotation of the rotary unit to be interlocked with the lifting and lowering of the second lift unit.

The grip portion includes a support member connected to the rotation portion and configured to support a plurality of support points, a plurality of nozzles provided at the plurality of support points, the plurality of nozzles being provided with a vacuum from the outside, , And a plurality of vacuum nozzles having an adsorption plate for adsorbing the upper surface of the unit substrate using the vacuum.

Wherein the second lifting unit includes a support member to which a plurality of support points are set, and a plurality of nozzles provided at the plurality of support points, the plurality of nozzles being provided with a vacuum from the outside, And a plurality of adsorption plates for adsorbing and adsorbing the upper surface of the unit substrate using the vacuum.

It is preferable that a suction point on the upper surface of the unit substrate through the plurality of suction plates forms a multipoint point on the side corresponding to the cutting line so as to be linear at a position spaced from the center of the unit substrate.

The present invention has the effect of simultaneously picking up and tilting unit substrates formed at the boundary of a cutting line, thereby preventing cracks from occurring.

It is another object of the present invention to provide a scribe device capable of effectively separating a seal line along a cutting line when a seal line is formed around a unit substrate including a cutting line.

1 is a view showing a configuration of a scribe apparatus according to a first embodiment of the present invention.
FIG. 2 is a view showing an example of a substrate to be charged by a scribing apparatus according to the present invention.
3 is a view showing another example of a substrate to be put in by a scribing apparatus according to the present invention.
4A is a view showing a state before the operation of the pressing unit and the separating unit according to the present invention.
4B is a plan view showing a state before the operation of the pressing unit and the separating unit according to the present invention.
5A is a view showing the post-operation state of the pushing unit and the separation unit according to the present invention.
Fig. 5B is a plan view showing the operating state of the pressing unit and the separating unit according to the present invention. Fig.
6 is a view showing a configuration of a scribe apparatus according to a second embodiment of the present invention.
7A is a view showing a state before the operation of the pressing unit and the separating unit according to the present invention.
Fig. 7B is a plan view showing the state before the operation of the pressing unit and the separating unit according to the present invention. Fig.
8A is a view showing the post-operation state of the pushing unit and the separation unit according to the present invention.
Fig. 8B is a plan view showing the operating state of the pressing unit and the separating unit according to the present invention. Fig.

Hereinafter, a scribe apparatus will be described with reference to the accompanying drawings.

First Embodiment

1 is a view showing a configuration of a scribe apparatus according to a first embodiment of the present invention.

Referring to Fig. 1, the scribing apparatus of the present invention is largely composed of a device body, a pressing unit, and a separating unit.

In the apparatus main body 100,

The apparatus main body 100 has a stage 110. The substrate 10 is placed on the stage 110.

Referring to FIG. 2, the substrate 10 to be introduced into the present invention is a glass, and a plurality of unit substrates 11 are formed in parallel, and a scribe wheel is formed between each unit substrate 11 through a scribe wheel The processed cutting line CL is formed.

In addition, a seal ring SL having a predetermined thickness is formed around the unit substrates 11. The seal line SL is separated from the cutting line CL by a distance of 0.3 mm or less.

Referring to FIG. 3, the substrate 10 may be a SOS (Scribe on Seal) type.

That is, a plurality of unit substrates 11 are sequentially formed on the substrate 10, and a cutting line CL is formed between the unit substrates 11.

Here, a seal liner SL is formed around each unit substrate 11, and the seal liner SL is formed to include a cutting line CL. Here, the thickness of the seal liner SL may be 0.5 to 0.7 mm.

The substrate 10 configured as described above is seated on the upper end of the stage 110 provided in the apparatus body 100.

In the pressing unit 200,

Referring to FIG. 1, the pressing unit 200 includes a first elevating part 210, a pressing part, and a first XY driving part 230.

The first elevating part 210 can be elevated and lowered to the apparatus main body 100 and the first elevating part 210 can be an elevating cylinder having a shaft 211 that can be elevated along the Z axis. The elevating cylinder receives the control signal from the control unit 500 and lifts the shaft 211.

The pressing part has a pressing member 220 connected to the shaft 211 of the first elevating part 210.

The pressing member 220 is formed to have a predetermined length along the width direction of the substrate 10, and the lower end of the pressing member 220 has a sharp end.

The pointed portion of the lower end of the pressing member 220 is directly contacted with the cutting line CL formed on the substrate 10 to press the cutting line CL and can be read.

The first elevating part 210 is installed in the apparatus main body 100 and is connected to the first XY driving part 230 to move the first elevating part 210 along the XY direction.

The separation unit 300,

The separation unit 300 includes a second elevation part 310, a grip part 320, a first rotation part 330, and a second XY driving part 340.

The second elevating part 310 can be elevated and lowered to the apparatus main body 100 and the second elevating part 310 can be an elevating cylinder having a shaft 311 that can be elevated along the Z axis. The elevating cylinder receives the control signal from the control unit 500 and lifts the shaft 311.

The first rotating part 330 may include a rotating body 331 and a rotating motor 332.

The rotating body 331 is provided at the center of the supporting member 321 to be described later and the rotating motor 332 receives the control signal from the control unit 500 and rotates the rotating body 331 up and down to rotate the supporting member 321, As shown in Fig.

The grip portion 320 is connected to the first rotation portion 330.

The grip portion 320 includes a support member 321 and a plurality of vacuum nozzles 322.

The support member 321 is connected to the first rotation unit 330 and has a rectangular rim shape. Support points are formed at the four corners of the rectangular frame shape. Thus, in this case, the support points can be four.

The plurality of vacuum nozzles 322 are fixed to the respective support points.

Each of the vacuum nozzles 322 includes a nozzle 322a provided with a vacuum from the outside and a suction plate 322b connected to the lower end of the nozzle 322a to form a vacuum.

Here, the attraction plate 322b provided on each of the vacuum nozzles 322 is used to vacuum-absorb the upper surface of the unit substrate 11. [

The second elevation part 310 is connected to a second XY driving part 340 installed in the apparatus main body 100. The second XY driving part 340 may move the second elevating part 310 along the XY direction by receiving a control signal from the controller 500. [

Coordinate information of the cutting line CL formed on the substrate 10 and absorption coordinate information on the upper surface of the unit substrate 11 may be previously set in the control unit 500. [

Next, the operation of the scribing apparatus according to the first embodiment of the present invention constructed as described above will be described with reference to Figs. 4A to 5B.

4A and 4B show the state before the operation of the pressing unit and the separating unit.

Referring to FIGS. 4A and 4B, the substrate 10 as shown in FIGS. 2 and 3 may be seated on the stage 110. Here, the substrate 10 is formed with a cutting line CL for dividing the unit substrates 11 by scribing wheels.

The pushing unit 200 and the separating unit 300 are in a standby state on the upper part of the stage 110.

Here, the pressing unit 200 is positioned above the cutting line CL formed on the substrate 10. That is, the control unit 500 uses the first XY drive unit 230 to position the pusher so as to be located in the coordinate information of the cutting line CL.

The separation unit 300 is positioned on the upper surface of the unit substrate 11. That is, the control unit 500 moves the grip unit 320 by using the second XY driver 340 so as to be positioned in the absorption coordinate information.

Figures 5a and 5b show the post-actuation state of the pushing unit and the separating unit.

5A and 5B, the pressing unit 200 is positioned above the cutting line CL of the substrate 10 and is queued.

The control unit 500 descends the shaft 211 of the first elevating unit 210 using the first elevating unit 210 so that the end of the pressing member 220 contacts the cutting line CL.

Here, it is preferable that the controller 500 descend the shaft 211 so as to have a predetermined falling distance. In addition, the descent distance can be variably set in the control unit 500. [

Next, the control unit 500 uses the separation unit 300 to pick up the unit substrate 11 positioned on the side of the cutting line CL and tilt the unit substrate 11 so as to form a predetermined angle.

That is, the control unit 500 descends the axis of the second elevation part 310 so that the adsorption plates 322b of the grip part 320 can adsorb the upper surface of the unit substrate 11.

Here, the controller 500 may lower the shaft 311 of the second lifting unit 310 to a predetermined lowering distance. In addition, the descent distance can be variably set in the control unit 500. [

At the same time, since each of the vacuum nozzles 322 is supplied with vacuum from an external vacuum supply (not shown), a vacuum suction force is formed on each suction plate 322b.

Therefore, the upper surface of the unit substrate 11 can be vacuum-adsorbed by the respective adsorption plates 322b.

Here, the attracting plates 322b may have a rectangular multi-point VP, and the upper surface 4 of the unit substrate 11 may be vacuum-absorbed and fixed.

In this state, the control unit 500 elevates the shaft 311 of the second elevation part 310 and controls the first rotation part 330 to rotate the grip part 320 at an upward angle .

Therefore, in a state where the cutting line CL of the substrate 10 is pressed in a state in which the cutting line CL is in line contact with the end of the pushing member 220, the unit substrate 11 of the side portion is pressed by the second lift portion 310 and the first rotation portion The unit substrate 11 is tilted at an angle set upward with respect to the cutting line CL.

Accordingly, the tilted unit substrate 11 can be easily lifted and tilted, and further cracks can be easily developed in the pressed cutting line CL, so that the unit substrate 11 can be easily separated.

In addition, when the substrate 10 shown in FIG. 3 is used, the cutting line CL including the seal line SL is pressed in line contact with the lower end of the pointed pushing member 220, 11 can be easily elevated and tilted so that additional cracks can be easily developed from the cutting line CL to stably separate the seal liner SL.

Second Embodiment

Referring to FIG. 5, the scribing apparatus of the present invention comprises a device body 100, a pressing unit 200, and a separation unit 400.

Since the apparatus main body 100 and the pushing unit 200 are substantially the same as those of the first embodiment, the description of the constitution will be omitted below.

The separation unit 400 includes a second elevation part 410, a grip part 420, a second rotation part 430, and a second XY driving part 440.

A support member 411 is provided on the shaft 410a of the second lifting unit 410 to set a plurality of support points.

Here, the support member 411 is formed in a linear shape and has a linear shape, and the support points 411 are formed on the support member 411.

The plurality of support points are provided with a plurality of nozzles 412 provided with a vacuum from the outside.

The second rotating part 430 includes a rotating body 431, a rotating shaft 432, and a rotating motor 433.

The rotating body 431 is installed at the lower end of each nozzle 412, and the rotating body 431 connects the respective rotating shafts 432. The rotation motor 433 receives the control signal from the control unit 500 and rotates the rotating bodies 431 at the same time.

Suction plates 421 are installed on the rotating bodies 431 provided at the lower ends of the respective nozzles 412.

The adsorption plates 421 are connected to the respective nozzles 412 through a tube to be vacuumed to form a vacuum adsorption force.

The adsorption position on the upper surface of the unit substrate 11 through the plurality of adsorption plates 421 is spaced apart from the center of the unit substrate 11 on the side corresponding to the cutting line CL formed on the substrate 10 Point VP to form a linear shape at the position.

On the other hand, as in the first embodiment, coordinate information of the cutting line CL formed on the substrate 10 and adsorption coordinate information on the upper surface of the unit substrate can be set in advance in the controller 500.

Next, the operation of the scribing apparatus according to the second embodiment of the present invention constructed as above will be described with reference to Figs. 7A to 8B.

7A and 7B show the state before the operation of the pushing unit and the separating unit.

Referring to Figs. 7A and 7B, the substrate 10 as shown in Figs. 2 and 3 can be seated on the stage 110. Fig. Here, the substrate 10 is formed with a cutting line CL for dividing the unit substrates 11 by scribing wheels.

The pushing unit 200 and the separating unit 400 are placed on the upper side of the stage 110.

Here, the pressing unit 200 is positioned above the cutting line CL formed on the substrate 10. That is, the control unit 500 uses the first XY drive unit 230 to position the pusher so as to be located in the coordinate information of the cutting line CL.

The separating unit 400 is positioned on the unit substrate 11. That is, the control unit 500 moves the grip unit 420 by using the second XY driver 440 so as to be located in the absorption coordinate information.

8A and 8B show the post-operation state of the pressing unit and the separating unit.

8A and 8B, the pressing unit 200 is positioned above the cutting line CL of the substrate 10 and is queued.

The control unit 500 descends the shaft 211 of the first elevating unit 210 using the first elevating unit 210 so that the end of the pressing member 220 contacts the cutting line CL.

Here, it is preferable that the controller 500 descend the shaft 211 so as to have a predetermined falling distance. In addition, the descent distance can be variably set in the control unit 500. [

Next, the control unit 500 uses the separation unit 400 to pick up the unit substrate 11 positioned on the side of the cutting line CL and tilt the unit substrate 11 so as to form a predetermined angle.

That is, the control unit 500 descends the shaft 410a of the second elevation part 410 so that the adsorption plates 421 of the grip part 420 can adsorb the upper surface of the unit substrate 11.

Here, the controller 500 may lower the shaft 410a of the second lifting unit 410 to a predetermined lowering distance. In addition, the descent distance can be variably set in the control unit 500. [

At the same time, since each of the nozzles 412 is provided with vacuum from the external vacuum supply, a vacuum attraction force is formed on each suction plate 421.

Therefore, the upper surface of the unit substrate 11 can be vacuum-adsorbed by the respective adsorption plates 421.

Here, the adsorption plates 421 may have a vertex (VP) having a rectangular shape, and the upper surface 4 of the unit substrate 11 may be fixed by vacuum adsorption.

In this state, the control unit 500 moves the shaft 410a of the second elevation unit 410 and controls the second rotation unit 440 to rotate the grip unit 420 at an upward angle .

That is, the cutting line CL of the substrate 10 is pressed in a state of being in line contact with the end of the pushing member 220, and the unit substrate 11 of the side portion is in contact with the suction plates (421).

The supporting member 411 is raised by the second elevating part 410 and the second rotating part 430 and each attracting plate 421 is rotated upward so that the elevating and tilting are simultaneously performed, 11 may be bent at an angle set upward by the boundary of the cutting line CL.

Accordingly, the tilted unit substrate 11 can be easily lifted and tilted, and further cracks can be easily developed in the pressed cutting line CL, so that the unit substrate 11 can be easily separated.

3, in a state in which the cutting line CL including the seal liner SL is pressed in line contact with the lower end of the pointed pushing member 220, The additional cracks can be easily developed in the cutting line CL and the seal liner SL including the unit substrate 11 can be stably separated by elevating and tilting the substrate 11.

Although a specific embodiment of the scribing apparatus of the present invention has been described above, it is apparent that various modifications are possible within the scope of the present invention.

Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by the scope of the appended claims and equivalents thereof.

It is to be understood that the foregoing embodiments are illustrative and not restrictive in all respects and that the scope of the present invention is indicated by the appended claims rather than the foregoing description, It is intended that all changes and modifications derived from the equivalent concept be included within the scope of the present invention.

10: substrate 11: unit substrate
100: Device body 110: Stage
200: pressing unit 210: first elevating part
220: pressing member 230: first XY driving part
300, 400: Separation unit 310, 410:
320, 420: grip portion 321, 411:
322: vacuum nozzle 322a, 412: nozzle
322b, 421: attracting plate 330, 430: second rotating part
340, 440: second XY driver 500:
CL: Cutting line SL: Seal line

Claims (7)

An apparatus main body having a stage on which a substrate on which unit substrates are formed is bounded by a cutting line;
A pressing unit installed on the apparatus body so as to be positioned above the stage and selectively pressing the cutting line formed on the substrate when the substrate is lifted or lowered; And
And a separating unit that is vertically installed on the apparatus main body so as to be positioned on the upper part of the stage and tilts the unit substrate as it is lifted and lowered from the cutting line after the pressing unit is lowered and the cutting line is pressed Characterized in that the scribe device comprises:
The method according to claim 1,
Wherein a seal line surrounding each of the unit substrates is formed in the substrate,
Wherein the seal line is formed to include the cutting line.
The method according to claim 1,
Wherein the separation unit comprises:
A second elevating part installed to be elevated on the apparatus main body,
A grip portion for holding one of the unit substrates;
And a rotating part installed at the second lifting part to rotate the grip part to tilt the grip part by rotating the grip part to separate the unit substrate picked up by the grip part.
The method of claim 3,
Wherein the separation unit comprises:
And controls the rotation of the rotary unit to be interlocked with the elevation of the second lift unit.
The method of claim 3,
The grip portion
A support member connected to the rotation unit and having a plurality of support points,
A plurality of nozzles provided at the plurality of support points and provided with a vacuum from the outside and a plurality of vacuum chambers provided at the ends of the plurality of nozzles and having an attracting plate for attracting the upper surface of the unit substrate using the vacuum, Wherein the scribe device comprises a nozzle.
6. The method of claim 5,
The second elevation portion
A plurality of support points to which a plurality of support points are set; a plurality of nozzles provided at the plurality of support points,
Wherein the grip portion is a plurality of suction plates installed at the ends of the plurality of nozzles and holding the upper surface of the unit substrate by using the vacuum.
The method according to claim 5 or 6,
The adsorption position on the upper surface of the unit substrate through the plurality of adsorption plates is
Wherein a plurality of points are formed on the side corresponding to the cutting line so as to be linear at positions separated from the center of the unit substrate.

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